JPH0799799B2 - Electronic component automatic insertion machine - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an electronic component automatic insertion machine for automatically inserting various electronic components into a printed circuit board, and in particular, it is also possible to teach the electronic component insertion position. Electronic component automatic insertion machine.

[Prior art]

Fixed resistor, capacitor, I supplied from the component supply device
Various electronic components such as C are gripped by the insertion head, and the printed circuit board (hereinafter also simply referred to as "the circuit board") is rotated according to the insertion direction, and automatically at the specified insertion position on the circuit board. There is an automatic electronic component insertion machine for inserting.

The component insertion program for each board by such an electronic component automatic insertion machine is usually created by the programmer based on the drawing of the board, or by using the board itself by a dedicated program creator and directly using the keyboard. Input is made using punch tape or magnetic tape.

In addition, since it is uneconomical to have a dedicated program maker separately, by providing a program creation function to the entire electronic component automatic insertion machine and teaching the insertion position and insertion direction of each component to the board, Some have made it possible to create insert programs.

[Problems to be solved by the invention]

However, in such a conventional automatic electronic component inserting machine, there are some which require the insertion head or the substrate to be mounted and the table to be rotated according to the insertion direction of the component when teaching the component insertion position, which makes the operation troublesome. Atsuta

Even when the board is fixed, when the insertion position of the IC component S with respect to the board P is taught as shown in FIG. 2, for example, conventionally, the IC component S is always at a diagonal position as shown in FIG. Detect the insertion holes of two pins (shown by black dots), or, as shown in (C), one insertion hole at a different position with respect to the board depending on the insertion direction of the IC component, as shown in the figure. In the above example, the insertion holes at the lower left end are detected when the IC component insertion directions are 0 ° and 180 °, and at the lower right end when they are 90 ° and 270 °.

In this way, it takes time to teach the positions of the two lead wire insertion holes for each part, and the machine is inoperative for a long time, resulting in poor productivity.

In addition, teaching the insertion holes at different positions depending on the insertion direction of the component is confusing, and thus a mistake is likely to occur.

The present invention solves such a conventional problem, the teaching operation is simple, and each component to be inserted into the board is irrelevant to the insertion direction of the component S as shown in FIG. 2 (A), for example. One pin having a specific positional relationship with the board P detects only one insertion hole (in the example shown, the pin positions a to d at the lower left end closest to the origin O of the board). It is an object of the present invention to provide an electronic component automatic inserting machine that can teach a component insertion position in a short time.

[Means for solving problems]

In order to achieve this object, the present invention is an electronic component in which an electronic component supplied from a component supply device is gripped by an insertion head, and a printed circuit board is rotated according to the insertion direction to be automatically inserted into the substrate. In the automatic insertion machine, as shown in the functional block diagram of FIG. 1, of the many insertion holes provided in the printed circuit board, one specific insertion hole designated corresponding to each component insertion position is photoelectrically converted. Insertion hole detecting means A for detecting the position, coordinate reading means B for reading the coordinate position of the insertion hole detected by the insertion hole detecting means A with respect to the coordinate origin of the printed circuit board, and each component to be inserted into the printed circuit board. Data input means C for inputting the component data and insertion direction data, insertion data storage means D for storing the data input by the data input means C, and coordinate reading means B. First arithmetic means E for calculating the coordinates of the insertion head center on the printed circuit board from the read coordinate data, the component data of the component to be inserted at the coordinate position stored in the insertion data storage means D, and the insertion direction data. And a second calculation means F for calculating the rotation angle of the printed circuit board at the time of component insertion and the board positioning coordinates after the rotation from the coordinates calculated by the first calculation means E and the data of the insertion direction. It is provided with a positioning data storage means G for sequentially storing each data of the rotation angle of the printed board and the board positioning coordinates calculated by the second computing means.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS.

FIG. 3 is an external perspective view showing an example of an electronic component automatic inserting machine embodying the present invention.

This electronic component inserting machine includes an electronic component inserting device 1, a substrate supplying device 2 for supplying a substrate for inserting an electronic component into the electronic component inserting device 1, and a substrate unloading for ejecting a substrate on which an electronic component is inserted. And device 3.

The electronic component insertion apparatus 1 has a component insertion mechanism section and a component insertion control section built into the main body of the apparatus, and has two IC sequencers 4 and 5 on the upper surface side.

One of the IC sequencers 4 is, for example, a 0.6 inch DIP type IC.
Can store a plurality of IC cassettes 6 each containing a plurality of stacks, and the other IC sequencer 5 can store, for example,
Can hold multiple IC cassettes 7 containing multiple 0.3-inch DIP type IC stacks.

The electronic component insertion device 1 also includes an operation panel 8 having a withdrawable keyboard 8a, a CRT display 9 for displaying input data, errors, warnings, etc., and an indicator light 10 for operator call.

The operation panel 8 has four operation keys 8b for moving a board mounting table to be described later in the X and Y directions by manual control.
The keyboard 8a is provided with various operation keys including a part code such as a part code of each part to be inserted, dimensions, and the number of pins, and insertion direction data. In this embodiment, a plurality of insertion heads are selected. It is equipped with a key group for inputting various data such as the code of the insertion head to be used.

FIG. 4, FIG. 5 and FIG. 6 show this electronic component insertion device 1
FIG. 5 is a front view, a plan view and a right side view showing the component insertion mechanism section of FIG.

First, an outline of the operation of this electronic component inserting apparatus will be described.

In this electronic component inserting apparatus 1, the board P is supplied from the board supply apparatus 2 by a board carry-in mechanism section 11 to move the board P.
It is carried in and mounted on 12 substrate mounting tables 13.

Then, the substrate moving mechanism unit 12 has a circular substrate mounting table 13
5 is moved in the X direction and the Y direction in FIG. 5 and is rotated in the θ direction around the central axis thereof to position the component insertion position on the board P at a predetermined position Q below the insertion head.

On the other hand, electronic parts are supplied from the IC sequencers 4 and 5, the axial lead component supply device 14 (FIG. 6), and a component supply device such as a radial lead component supply device (not shown).

Then, as shown in FIG. 4, the electronic components supplied by any one of the plurality of insertion heads 51 mounted via the insertion spindles 52 to the upper tray 15 provided above the board mounting table 13, respectively. Is grasped and inserted into the substrate P. At that time, the lead wire of the electronic component inserted in the board is bent on the back side by one of a plurality of clinch heads (not shown) attached to the lower turret 16 provided below the board mounting table 13. Do not pull out.

After the components are inserted, the board P is pulled out from the board mounting table 13 by the board carry-out mechanism section 17 to carry out the board carry-out device 3
Transport to.

Next, the details of each of these parts will be described together with their operation.

The substrate carry-in mechanism unit 11 carries in the substrate supplied from the magazine (not shown) by the substrate supply device 2 in FIG. 3 by the carry-in conveyor 21 shown in FIGS. 4 and 5, and drives it by the drive chain 22. The driven pushing rod 23 pushes the substrate P into the substrate frame 25 fixed in the X-axis direction on the substrate mounting table 13 in the substrate moving mechanism 12 as shown in FIG.

Then, on the board mounting table 13, a locking claw formed at the tip of a lever 27 fixed to a rod 26 axially supported in the same direction as the board frame 25 is fitted into a positioning reference hole formed in the board P, The P is positioned and locked on the board mounting table 13.

The substrate mounting table 13 is mounted on an X frame 31 movable in the X direction on the base frame 30 and rotatably mounted on a Y frame 32 movable in the Y direction.

The X frame 31 is slidably mounted on a pair of parallel guides 33, 33 fixed on the base frame 30 in the X-axis direction, and a feed screw rotated by a DC servo motor 34.
It is reciprocated in the X direction by 35.

In addition, the Y frame 32 has Y on both sides on the X frame 31.
It is slidably mounted on axially fixed guideways 36, 36, and is reciprocally moved in the Y direction by a feed screw 38 rotated by a DC servomotor 37.

Further, as shown in FIG. 5, the substrate mounting table 13 has its outer peripheral portion rotatably fitted into the grooves of four grooved guide rollers 39 pivotally supported at the four corners of the Y frame 32. A pinion 41, which is rotatably supported and rotated by a stepping motor 40, and a ring gear 13a, which is formed under the substrate mounting table 13 itself that meshes with the pinion 41, are used to center a central axis (θ axis) not shown. Is driven to rotate.

Therefore, the respective motors 34, 37, 40 are NC controlled according to a predetermined program created in advance, and the board mounting table 13 is moved in the X direction and the Y direction according to the insertion position and the insertion direction of the component. The component insertion position of the substrate P is positioned at the fixed position Q by moving and rotating it about the central axis (θ axis) from the reference position by a desired angle, for example, 90 °, 180 ° or 270 °.

The IC parts are supplied on the board mounting table as shown in FIG.
Mounted on the IC sequencer 4 or 5 provided on both sides of 13.
The required ICs are selectively carried out from the IC cartridges 6 and 7 (Fig. 3), guided to the shout 46 by the conveyor 45, and while lowering the shout 46, the IC component supply direction is changed by the additional function device 47. Checking, posture correction, etc. are carried out and the result is supplied to the parts standby position at the exit of the shout 46.

In addition, lead parts such as resistors and capacitors are
As shown in the figure, the reel 48 wound with the taped lead parts is wound by the axial lead part supply device 14 and the radial lead part supply device (not shown) provided behind the board mounting table 13, or the carton is folded and stored.
Supplied sequentially from 49.

The upper turret 15 has a plurality of insertion spindles 52 each having an insertion head 51 according to the type of an insertion component at the tip thereof, which is attached to the outer surface of a turret table 50 rotatably arranged in the shape of a truncated pyramid.

The insertion head 51 is provided with different structures and sizes depending on the type of insertion parts such as axial lead parts, radial lead parts, 0.6 inch DIP type IC, 0.3 inch DIP type IC.

DIP type ICs have different lengths of parts depending on the number of pins, but this is inserted with a common insertion head in order not to increase the number of insertion heads. At this time, the center of the insertion head and the center position of the insertion part (DIP type IC) may differ, but the position of the insertion head should be adjusted so that the center of the insertion head is offset from the part insertion position depending on the number of pins. By compensating for, the insertion head is standardized.

On the other hand, the lower retlet 16 also has a plurality of clinch heads (not shown) depending on the type of the insertion part.

Therefore, after selecting the insertion head 51 of the upper tartlet 15 and the clinch head of the lower tart 16 according to the parts to be inserted and positioning them at the fixed position Q, the insertion head 51 and the clinch head holding the supplied parts are moved together. Then, the lead wire of the component is inserted into the insertion hole of the substrate P and the tip of the lead wire is bent and fixed.

After inserting all the components, the rod 26 on the board mounting table 13 is engaged with the release tool 55, and the lever 27 is rotated to release the locking claws to unlock the board P.

Then, the substrate unloading mechanism unit 17 engages the pull-out claw 58 attached to the tip of the pull-out rod 57 driven by the drive chain 56 with the pushing-side edge of the substrate P, and the substrate mounting table 13
The substrate P is pulled out from the substrate P, is carried out to the substrate carry-out device 3 by the carry-out conveyor 59, and is carried to the substrate carry-out device 3 by the carry-out conveyor 59.

Next, the insertion hole detecting means A used when teaching the component insertion position with respect to the substrate P by using this electronic component automatic inserting machine itself will be described with reference to FIGS. 7 and 8.

FIG. 7 is a schematic side view showing a mounting state of a light source and an optical sensor which constitute the insertion hole detecting means A.

As mentioned above, the turret stand 50 of the upper turret 15
A plurality of insertion spindles 52, each holding a different insertion head 51 selected according to the type of parts to be inserted on the pyramid-shaped peripheral surface, are radially attached to the shaft, and the turret table 50 is attached to a motor (not shown). Therefore, by performing indexing rotation about the axis L ₁ , any one of the insertion spindles 52 becomes a position vertical to the substrate P mounted on the substrate mounting table 13 as shown in the drawing, and the insertion head 51 of the insertion head 51 is rotated. The center of the insertion head is positioned at the predetermined position Q in FIG.

A supporting arm 44 fixed to a fixing portion (not shown) is vertically extended from above in the vicinity of the upper tray let 15, and a guide member 61 and an air cylinder 62 are provided at the lower end portion thereof in a vertical direction of about 45 °, respectively. Mounted at an angle of °.

The guide member 61 guides and holds the slide member 63 slidably in the direction of the arrow, and the slide member 63 holds a cylindrical light source 65 vertically by a holder 64 attached to the tip. The light source 65 is a spot light source such as a semiconductor laser light source, and irradiates the substrate P with spot light having a diameter sufficiently larger than the diameter of the lead wire insertion hole H of the substrate P as indicated by the optical axis l.

The slide member 63 that holds the light source 65 is connected to the tip of a piston rod 67 of the air cylinder 62 via a bracket 66.

Accordingly, when compressed air is introduced into the air cylinder 62 from the air inlet / outlet 68a, the piston rod 67 extends and moves the slide member 63 and the light source 65 held by the slide member 63 to the use position indicated by the solid line. At this time, the turret stand
Since the insertion head 51 is rotated by 1/2 pitch from the insertion head positioning state to escape the insertion head 51, the light source 65 is inserted into the gap between the two insertion heads 51.

When compressed air is introduced into the air cylinder 62 from the air inlet / outlet 68b, the piston rod 67 contracts and the slide member
63 and the light source 65 held by it are retracted to the positions shown by phantom lines to insert the head when the turret table 50 is rotated.
51 or interference with the insertion spindle 52 is prevented.

The light source support moving device 60 is constituted by these.
Although not shown, a stopper is provided to regulate the forward end position and the backward end position of the slide member 63.

On the other hand, on the lower side of the substrate P, as described above, there is provided the lower turret 16 in which a large number of clinch heads 53 selected according to the type of parts to be inserted are arranged along the circumferential direction of the turret board 54. The turret board 54 is indexed and rotated about the axis L ₂ by a motor (not shown) to position the center of any one of the clinch heads 53 at a predetermined position Q in FIG.

A bracket 71 is fixedly attached to a fixed portion (not shown) in the vicinity of the lower turret 16, and a guide member 72 is fixed to the bracket at an angle of about 45 ° with respect to the vertical direction.

The guide member 72 guides and holds a slide member 73 slidably in the direction of the arrow, and the slide member 73 holds an optical sensor 75 with a light receiving surface horizontal by a holder 74 attached to the tip. ing.

Further, the slide member 73 has a rack 76 fixed along its sliding direction, and the rack 76 is fixed to the rack 76.
The pinion gear 77 pivotally supported by the gear meshes with.

A toothed pulley 79 is integrally connected to the pinion gear 77 by a shaft 78, and a toothed belt 82 is provided between the pinion gear 77 and a toothed pulley 81 fixed to the shaft of a rotary reactor 80 such as a motor or a rotary solenoid. It is upholstered.

Therefore, when the rotary actuator 80 rotates, the toothed belt 82, the pinion gear 77,
The slide member 73 and the optical sensor 75 held by the slide member 73 are moved to the solid line position or the phantom line position via the rack 76 and the like.

A light shielding plate 83 is attached to the slide member 73, and when the light shielding plate 83 is detected by the forward end detection sensor 84 or the backward end detection sensor 85, the rotation of the rotary reactor 80 is stopped.

By these, the optical sensor support moving device 70 is configured.

When the optical sensor 75 is moved to the position shown by the solid line by the optical sensor supporting and moving device 70, the turret board 54 of the lower turret 16 and the turret board 54 of the lower turret 16 are rotated at the same time as the 1/2 pitch rotation of the turret base 50 of the above-mentioned upper turret 15. From the positioning state, rotate only 11/2 pitch to turn the clinch head
Since the light sensor 53 is missed, the light sensor 75 is inserted into the gap between the two clinch heads 53, and its center is aligned with the optical axis l.
It opposes 65 and retracts to the position shown in the phantom line when the turret board 54 rotates for indexing to prevent interference with the clinch head 53.

In this way, when the insertion hole of the substrate P is detected, the light source 65 and the optical sensor 75 can be positioned and detected at the same positions as the insertion head 51 and the clinch head 53 at the time of component insertion.

Here, an example of the optical sensor circuit for accurately detecting the configuration of the optical sensor 75 and the position of the insertion hole is shown in FIG.

The optical sensor 75 is configured by arranging light source elements 75a to 75d, such as phototransistors or photodiodes, having uniform characteristics in respective parts obtained by dividing the light receiving surface into four parts symmetrically with respect to the center of the light receiving surface.

Then, the x-x line and the y-y line in the figure are attached so as to coincide with the X direction and the Y direction in FIG. Note that well-known circuits such as a bias applying circuit and a detection signal amplifying circuit for each photoelectric element are not shown.

The optical sensor circuit 90 includes photoelectric devices 75a and 75b of the optical sensor 75.
The detection signal from the photoelectric elements 75c and 75d is added by the addition circuit 86, the detection signal by the photoelectric elements 75a and 75d is added by the addition circuit 88, and the detection signals by the photoelectric elements 75b and 75c are added by the addition circuit 89. Add each.

Further, the difference detector 91 obtains the difference between the output signals of the adder circuits 86 and 87, so that the signal (0, +) indicating the direction and magnitude of coincidence (pass range) or deviation in the X direction with respect to the insertion hole H is obtained. , −) Is obtained. Similarly, the difference detector 92 calculates the difference between the output signals of the adder circuits 88 and 89 to obtain the insertion hole H.
A signal (0, +,-) indicating the direction and magnitude of the coincidence (pass range) or deviation in the Y direction with respect to is obtained.

When it is considered that the brightness of the light source 65 varies, the difference between the output signals from the difference detectors 91 and 92 is divided by the total amount of light received by the photoelectric elements 75a to 75d, and a signal indicating the magnitude of the deviation is further obtained. Be accurate.

Therefore, the substrate P of FIG. 7 is moved so that the specified specific insertion hole to be taught is illuminated by the light source 65, and the output signals of the difference detectors 91 and 92 of FIG. If both are set to 0, the center of the insertion hole H coincides with the center of the light receiving surface of the optical sensor 75, and the position (XY coordinate) of the insertion hole H at this time is the X direction from the origin and the Y direction. It can be accurately detected by reading the distance in the direction.

Next, with reference to FIG. 9, the configuration of the control section related to the present invention in this electronic component automatic insertion machine and the operation during teaching will be described.

This control unit consists of four operation keys on the operation panel shown in FIG.
A signal from the manual control means 18 including 8b and an X direction control circuit 100 for inputting signals in the X direction from the optical sensor circuit 90 of the insertion hole detection means in FIG. The Y direction control circuit 200, a storage unit 300 including a ROM and a RAM, an arithmetic unit 400 including a CPU, and the like.

The X-direction control circuit 100 includes a switching circuit 101, a sensor signal detection circuit 102, and a servo motor control circuit 103.
101 normally outputs a signal in the X direction from the manual control means 18 to the servo motor control circuit 103 to control the servo motor 34 for moving the X frame shown in FIG.

After the reading start signal is input from the operation panel 8 to the sensor signal detection circuit 102, when the detection signal in the X direction is input from the optical sensor circuit 90, the sensor signal detection circuit 102 outputs the switching signal S ₁ , The switching circuit 101 is switched to output the detection signal in the X direction from the optical sensor circuit 90 to the servo motor control circuit 103.

Then, when the detection signal in the X direction from the optical sensor circuit 90 becomes 0, the sensor signal detection circuit 102 outputs the read command signal S ₂ to the calculation unit 400.

Similarly, the Y-direction control circuit 200 also includes a switching circuit 201, a sensor signal detection circuit 202, and a servo motor control circuit 203. The switching circuit 201 normally outputs a signal in the Y direction from the manual control means 18 to the servo motor control circuit 203. To control the servo motor 37 for moving the Y frame shown in FIG.

After the reading start signal is input to the sensor signal detection circuit 202 from the operation panel 8 and the detection signal in the Y direction is input from the optical sensor circuit 90, the sensor signal detection circuit 202 outputs the switching signal S ₃ , The switching circuit 201 is switched to output the detection signal in the Y direction from the optical sensor circuit 90 to the servo motor control circuit 203.

Then, when the detection signal in the Y direction from the optical sensor circuit 90 becomes 0, the sensor signal detection circuit 202 outputs the read command signal S ₄ to the calculation unit 400.

Therefore, when teaching one of the many lead wire insertion holes formed in the substrate, the manual control means 18 is used.
The four operating keys 8b are used to specify the moving direction of the substrate P in the X and Y directions, and the substrate is reached to a position where spot light from the light source 65 in FIG. After moving, press a reading start key (not shown) and make fine adjustments so that the spot light illuminates the insertion hole H.
After that, the minute movement of the substrate is automatically controlled by the detection signal from the optical sensor circuit 90. That is, the servo motors 34 and 37 are driven so that the detection signals from the four photoelectric elements 75a to 75d of the optical sensor 75 shown in FIG.

When the signals from the four light receiving elements 75a to 75d are all equal, the signals in the X and Y directions from the optical sensor circuit 90 are both 0, and at the same time the servo motors 34 and 37 stop, a read command is issued. Signals S ₂ and S ₄ are output.

Encoders 104 and 204 are connected to the servo motors 34 and 37, respectively, for generating a pulse each time a predetermined angle is rotated and detecting the rotation direction thereof. The generated pulses are respectively counted by the counting circuits 105 and 205 according to the rotation direction. The coordinate reading means B is constructed by measuring the amount of movement of the table 13 (FIG. 5) on which the substrate P is mounted from the coordinate origin in the X and Y directions by counting up or down.

The storage unit 300 includes a mechanical system coordinate storage unit 310 and an insertion data storage unit.
320, a parts table storage unit 330, and a table positioning data (XYθ) storage unit 340.

The mechanical system coordinate storage unit 310 stores in advance correction data such as table turning center coordinates, insertion head center coordinates, optical sensor center coordinates, offset amounts between the insertion chuck center and the insertion part center, which are peculiar to the machine.

The insertion data storage means D comprises an insertion data storage section 320 and a parts table storage section 330, and the insertion data storage section 320 is provided with the keyboard 8a of FIG. While storing the part code indicating the part name or the part symbol of each part to be inserted, the insertion head code for specifying the insertion head used when inserting each part, and the data of the insertion direction of the part, etc., The XY coordinate data of each component insertion position calculated by the calculation unit 400 is stored.

In the parts table storage unit 330, parts data such as dimensions, lead wire intervals and numbers for each part code of each part to be inserted which is input from the keyboard 8a or from an external data source by means of punch tape or the like. Memorize

The table positioning data storage unit 340 (data storage unit G) matches the rotation angle θ of the board mounting table 13 calculated by the calculation unit 400 and the component insertion position of the board to the center of the insertion head after the rotation. The XY coordinate data for positioning the board mounting table is stored in.

The arithmetic unit 400 is a coordinate reading arithmetic unit 410 (coordinate reading means B).
And an insertion head center coordinate calculation unit 420 (first calculation unit E) and a table positioning data calculation unit 430 (second calculation unit F).

The coordinate reading calculation unit 410 counts the count value of the count circuit 105 when the read command signal S ₂ is input from the X direction control circuit 100 and the count value of the count circuit 205 when the read command signal S ₄ is input from the Y direction control circuit 200. The value is read, the difference between the center coordinate of the optical sensor stored in the mechanical system coordinate storage unit 310 and the center coordinate of the insertion head is corrected, and the XY coordinates of the detected insertion hole with respect to the coordinate origin of the printed circuit board are calculated.

The XY coordinates of the substrate read and calculated by the coordinate reading calculation unit 410 are input to the insertion head center coordinate calculation unit 420 and are also stored in the insertion data storage unit 320.

Note that the XY coordinates of this board are the XY coordinates of the specified insertion hole of the insertion part, and without using this reading function, the XY coordinates are directly input as insertion data from the keyboard 8a and the insertion data storage unit 320 Can be stored in.

The insertion head center coordinate calculation unit 420 inserts the XY coordinates of this board and the part code of the part to be inserted at the coordinate position, the part data corresponding to this part code and the insertion head to be used, the insertion direction data of the part, and the like. The coordinates of the insertion head center are calculated by reading from the storage unit 320 and the parts table storage unit 330.

Particularly, in the case of an IC component, the XY coordinates of the board are corrected by calculating the offset amount of the center position of the component and the center coordinate of the insertion head from the insertion direction and the number of pins.

From the insertion head center coordinates calculated in this manner and the insertion direction data of the part stored in the insertion data storage unit 320, the table positioning data calculation unit 430 rotates the printed circuit board rotation angle θ and the The XY coordinates for positioning the insertion head center with respect to the component insertion position of the rotated board are calculated.

At that time, a necessary correction is made based on the table turning center coordinates and the insertion head center coordinates stored in the mechanical system coordinate storage unit 310, and the component data, the insertion head number and the like data stored in the component table storage unit 330. To do.

Then, the data calculated by the table positioning data calculation unit 430 is sequentially stored in the table positioning data storage unit 340 of the storage unit 300.

At the time of actual component insertion, the component is selected according to the component code stored in the insertion data storage unit 320, is supplied to the insertion head selected by the insertion head code, and is stored in the table positioning data storage unit 340. The printed circuit board rotates and moves according to the coordinates and the insertion angle θ to insert the component into the printed circuit board.

In this way, for example, as shown in FIG.
The position of the insertion hole of the pin closest to the origin of the board of each component S to be inserted into the board P is sequentially detected by the optical sensor 75, and the component code and insertion direction data are sequentially input from the keyboard 8a. Then, a component insertion program can be created in this electronic component automatic insertion machine.

〔The invention's effect〕

As described above, the electronic component automatic insertion machine according to the present invention detects the specific insertion hole of the printed circuit board, reads the coordinate position, and uses the separately input component data and the insertion direction data. Since it has a function of calculating and storing the rotation angle of the printed circuit board at the time of component insertion and the board positioning coordinate after rotation, the machine itself can create a component insertion program by teaching.

Moreover, at that time, it is not necessary to rotate the insertion head or the board mounting table, so that the operation is simple and the teaching can be performed efficiently.

Furthermore, for each component (particularly an IC component) to be inserted in the printed circuit board, a specific pin insertion hole that is predetermined for the circuit board (closest to the coordinate origin of the circuit board) regardless of the insertion direction into the circuit board. Since only the position of is taught, there is no risk of making a mistake and the work can be completed quickly, so that the non-operation time of the machine can be shortened.

[Brief description of drawings]

FIG. 1 is a functional block diagram showing the configuration of a basic embodiment of the present invention, and FIG. 2 (A) is a specific insertion when teaching the insertion position of an IC component by the electronic component automatic insertion machine according to the present invention. It is explanatory drawing which shows a hole position, (B) and (C) are the same explanatory drawings which show the different example in the case of the conventional electronic component automatic insertion machine, and FIG. 3 is the electronic component automatic insertion machine which implemented this invention. FIG. 4, FIG. 5, FIG. 6 and FIG. 6 are front views, a plan view and a right side view showing the component insertion mechanism portion of the electronic component insertion device 1, and FIG. FIG. 8 is a schematic side view showing a mounting state of a light source and an optical sensor forming the detecting means, FIG. 8 is a circuit configuration diagram showing an example of the configuration of the optical sensor 75 and an optical sensor circuit for detecting the signal, and FIG. 9 is the present invention. FIG. 3 is a block diagram showing a configuration of a control unit relating to FIG. P ... Printed circuit board, S ... IC component 1 ... Electronic component insertion device, 2 ... Substrate feeding device, 3 ... Substrate unloading device, 4,5 ... IC sequencer 6,7 ... IC cassette, 8 ... … Operation panel 8a …… Keyboard (data input means) 8b …… Operation keys of manual control means 9 …… CRT display, 10 …… Indicator lamp 11 …… Board loading mechanism section, 12 …… Board moving mechanism section 13 …… Board mounting table 14 ...... Lead component supply device 15 …… Upper part let 16 …… Lower part let 17 …… Substrate unloading mechanism, 18 …… Manual control means 25 …… Substrate frame, 31 …… X frame 32 …… Y frame 34,37 ... DC servo motor 39 ... Guide roller, 40 ... Stepping motor 50 ... Turret base, 51 ... Insert head 52 ... Insert spindle, 53 ... Clinch head 54 ... Turret board, 60 ... … Light source support moving device 65 …… Light source, 70 …… Optical sensor Support moving device 75 …… Optical sensor, 90 …… Optical sensor circuit 100 …… X direction control circuit 200 …… Y direction control circuit 300 …… Storage unit (insertion data storage means, positioning data storage means) 410 …… Coordinates Read calculation unit (coordinate reading unit) 420 ... Insert head center coordinate calculation unit (first calculation unit) 430 ... Table positioning data calculation unit (second calculation unit)

Claims (1)

[Claims] 1. An electronic component automatic inserting machine for automatically grasping an electronic component supplied from a component supply device with an insertion head and automatically inserting the electronic component into the printed circuit board by rotating the printed circuit board according to the insertion direction. An insertion hole detecting means for photoelectrically detecting a specific one insertion hole designated corresponding to each component insertion position among a large number of insertion holes provided on the board, and the insertion hole detecting means. Coordinate reading means for reading the coordinate position of the ejected insertion hole with respect to the coordinate origin of the printed circuit board, data input means for inputting component data and insertion direction data of each component to be inserted in the printed circuit board, and the data input Inserted data storage means for storing data input by the means, coordinate data read by the coordinate reading means, and stored in the inserted data storage means. The first calculation means for calculating the coordinates of the center of the insertion head on the printed circuit board from the part data of the part to be inserted at the coordinate position and the insertion direction data, and the coordinates calculated by the first calculation means and the above Second calculating means for calculating the rotation angle of the printed board and the board positioning coordinates after the rotation when the component is inserted from the data of the inserting direction, and the rotation angle of the printed board calculated by the second calculating means. An automatic electronic component insertion machine comprising: a positioning data storage unit that sequentially stores each data of board positioning coordinates.