JPH08100288A - Manufacturing method of metal mesh foil - Google Patents
Manufacturing method of metal mesh foilInfo
- Publication number
- JPH08100288A JPH08100288A JP23702694A JP23702694A JPH08100288A JP H08100288 A JPH08100288 A JP H08100288A JP 23702694 A JP23702694 A JP 23702694A JP 23702694 A JP23702694 A JP 23702694A JP H08100288 A JPH08100288 A JP H08100288A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- foil
- drum
- mesh
- metal mesh
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrolytic Production Of Metals (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
(57)【要約】
【目的】 安価で長尺化が可能なメッシュパターンを有
する金属箔を製造すること。
【構成】 外周面に絶縁性材料を所定のパターンで埋設
した金属製ドラムに電気めっきによりめっき層を形成
し、該めっき層がめっき液中から空気中に出た所から剥
離界面までの範囲を0℃〜15℃の冷水でめっき層およ
び表面を洗浄することを特徴とする金属メッシュ箔の製
造方法。
(57) [Summary] [Purpose] To manufacture a metal foil having a mesh pattern that is inexpensive and can be elongated. [Structure] A plating layer is formed by electroplating on a metal drum in which an insulating material is embedded in a predetermined pattern on the outer peripheral surface, and the range from the place where the plating layer is exposed in the air to the peeling interface is formed. A method for producing a metal mesh foil, which comprises washing the plating layer and the surface with cold water at 0 ° C to 15 ° C.
Description
【0001】[0001]
【産業上の利用分野】本発明は、金属箔に所定のパター
ンで多数の孔を有する金属メッシュ箔の製造法に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a metal mesh foil having a large number of holes in a metal foil in a predetermined pattern.
【0002】[0002]
【従来の技術】従来、金属メッシュ箔を製造する方法と
して、(1) 金属箔をエッチングして孔を形成する方法。
(2) 絶縁基体上に導電性材料でマスターメッシュパター
ンを形成後、その上に電気めっきして金属メッシュ層を
形成し、該層を剥離することにより金属メッシュ箔を得
る方法。(3) 導電基体上にフォトレジスト等の絶縁性材
料で非めっきパターン部を形成後、電気めっきすること
により金属メッシュ層を形成し、該層を剥離することに
より金属メッシュ箔を得る方法。(4) 導電基体に凹部を
設け、凹部の中に絶縁性材料を充填することによりメッ
シュパターンを形成後、電気めっきすることにより金属
メッシュ層を形成し、該層を剥離することにより金属メ
ッシュ箔を得る方法等がある。2. Description of the Related Art Conventionally, as a method of manufacturing a metal mesh foil, (1) a method of forming holes by etching a metal foil.
(2) A method of forming a master mesh pattern of a conductive material on an insulating substrate, electroplating the master mesh pattern on the master mesh pattern to form a metal mesh layer, and peeling the layer to obtain a metal mesh foil. (3) A method of obtaining a metal mesh foil by forming a non-plated pattern portion of an insulating material such as photoresist on a conductive substrate and then electroplating the metal mesh layer to form a metal mesh layer, and peeling off the layer. (4) A metal mesh foil is formed by forming a concave portion on a conductive substrate, forming a mesh pattern by filling the concave portion with an insulating material, and then electroplating to form a metal mesh layer, and peeling off the layer. There is a method to obtain.
【0003】上述(1) の方法は、エッチング除去される
面積が少ない場合は特に有効な手段であるが、エッチン
グレジストやエッチング廃液の処理問題等により製造コ
ストが高い。(2) の方法は 400〜500 メッシュの金属箔
が製造可能であるが、金属箔を絶縁基体から剥離すると
き、マスターメッシュパターンが破壊され、次に箔を作
るためには、新たにパターンを形成し直す必要がある。
そのため、シート状の箔しか製造できず、かつ、高コス
トである。(3) の方法も(2) と同様の理由でシート状の
箔しかできず、かつ、高コストである。(4) の方法は絶
縁性材料の基体凹部に埋め込まれているため、箔の剥離
に伴うメッシュパターンの破壊は起こらない。よって、
容易に連続した(エンドレス)金属メッシュ箔が製造で
きる。しかし、箔を製造するうちに導電基体からメッシ
ュ層を剥離する時、埋め込まれた絶縁性材料がメッシュ
層にくっついたまま該基体から抜け落ち、メッシュ箔の
孔が塞がったものができたり、箔が破れたりする問題を
有している。The above method (1) is a particularly effective means when the area to be removed by etching is small, but the manufacturing cost is high due to the problems of processing etching resist and etching waste liquid. The method of (2) can produce a metal foil of 400 to 500 mesh, but when peeling the metal foil from the insulating substrate, the master mesh pattern is destroyed, and in order to make the foil next, a new pattern is required. It needs to be reformed.
Therefore, only sheet-shaped foil can be manufactured, and the cost is high. The method of (3) can produce only a sheet-like foil for the same reason as (2), and is expensive. In the method (4), the mesh pattern is not destroyed due to the peeling of the foil because it is embedded in the recess of the base of the insulating material. Therefore,
A continuous (endless) metal mesh foil can be easily manufactured. However, when the mesh layer is peeled off from the conductive substrate during the production of the foil, the embedded insulating material may fall out of the substrate while being stuck to the mesh layer, and the mesh foil may have pores clogged or the foil may not be formed. It has the problem of breaking.
【0004】[0004]
【発明が解決しようとする課題】本発明は上述(4) の課
題に鑑みてなされたものであり、連続した金属メッシュ
箔の長尺化を可能にし、かつ、安価な箔の製造方法を提
供することを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problem (4), and provides a method for producing a continuous metal mesh foil which is long and inexpensive. The purpose is to do.
【0005】[0005]
【課題を解決するための手段】本発明は、上記課題を解
決するための手段として、金属製ドラムの外周面に絶縁
性材料を所定のパターンに埋設し、該ドラムを一定のス
ピードで回転させ、電気めっきにより所定の厚さの金属
層を形成し、該金属層をドラム外周面から剥離すること
により金属メッシュ箔を製造する方法において、該金属
箔がめっき液中より空気中に出た所から箔とドラムとの
剥離界面までの範囲を0℃〜15℃の冷水で洗浄及び冷
却することを特徴とする金属メッシュ箔の製造法であ
る。As a means for solving the above-mentioned problems, the present invention embeds an insulating material in a predetermined pattern on the outer peripheral surface of a metal drum and rotates the drum at a constant speed. In the method for producing a metal mesh foil by forming a metal layer having a predetermined thickness by electroplating and peeling the metal layer from the outer peripheral surface of the drum, where the metal foil comes out of the plating solution into the air. The method for producing a metal mesh foil is characterized in that the range from to the peeling interface between the foil and the drum is washed and cooled with cold water at 0 to 15 ° C.
【0006】本発明によれば、電気めっき中に発熱した
金属製ドラム、絶縁性材料、及び金属箔が洗浄・冷却さ
れ、箔と絶縁性材料、箔とドラムの密着力が極端に小さ
くなり、剥離時に埋め込んだ絶縁性材料が抜け落ちるこ
とがなく金属メッシュ箔を連続的に、かつ、長期に渡り
製造できる。According to the present invention, the metal drum, the insulating material, and the metal foil that generate heat during electroplating are washed and cooled, and the adhesion between the foil and the insulating material and the foil and the drum is extremely reduced. It is possible to manufacture the metal mesh foil continuously and for a long time without the insulating material embedded at the time of peeling coming off.
【0007】以下、本発明の一例を図1により説明す
る。電解槽1の底部に陽極2を設け、その上部に絶縁性
材料を所定のパターンで埋設した金属製ドラム4が水平
回転できる様に配置される。該電解槽1にめっき液3が
所定の高さまで供給される。金属製ドラム4を一定のス
ピードで回転させながら、陰極として電流を流すと該ド
ラム4外周面にめっき液から還元された金属が所定の厚
さに析出する。該ドラム4の外周面と共にめっき液中か
ら空気中にでた金属メッシュ箔8は冷水シャワー6と該
冷水がめっき液に混入しないために設けられた遮蔽板7
の間で冷却及び洗浄され、巻き取られる。An example of the present invention will be described below with reference to FIG. An anode 2 is provided at the bottom of the electrolytic cell 1, and a metal drum 4 in which an insulating material is embedded in a predetermined pattern is arranged on the top of the anode 2 so as to be horizontally rotatable. The plating solution 3 is supplied to the electrolytic bath 1 to a predetermined height. When a current is passed as a cathode while rotating the metal drum 4 at a constant speed, the metal reduced from the plating solution is deposited to a predetermined thickness on the outer peripheral surface of the drum 4. The metal mesh foil 8 exposed from the plating solution to the air together with the outer peripheral surface of the drum 4 is a cold water shower 6 and a shielding plate 7 provided to prevent the cold water from mixing with the plating solution.
It is cooled and washed in between and wound up.
【0008】電気めっき中の発熱は一般に知られるとこ
ろであるが、本発明による冷水工程がない場合、電気め
っき中に発熱した金属製ドラム、絶縁性材料及び金属箔
は空気中にさらされている間でも温度があまり下がらな
い状態で金属箔がドラムより剥離される。めっき液が高
温のときは特に顕著である。絶縁性材料として一般にエ
ポキシ樹脂やビニル樹脂が使用されるが、該樹脂は金属
製ドラムとの密着力を得るため、高耐熱性樹脂は使用さ
れない。よって高温では軟化状態と考えられる。そして
金属めっき層は最初のうちは導電部に析出するが、めっ
き時間と共に絶縁部に浸出していき(めっきの回り込
み)、埋め込まれた樹脂の上に金属めっき層が被った様
な状態になる。樹脂が軟化状態にある場合、めっき層と
樹脂に隙間がなく非常に大きな密着力が働いている。そ
して、金属めっき層がドラム外周面より剥離される時、
前記密着力のために金属製ドラムからの樹脂抜け落ち現
象が起こる。Although heat generation during electroplating is generally known, without the cold water process of the present invention, the metal drum, insulating material and metal foil that generated heat during electroplating may be exposed to air. However, the metal foil is peeled off from the drum while the temperature does not drop so much. It is particularly remarkable when the plating solution is at a high temperature. Epoxy resin or vinyl resin is generally used as the insulating material, but the resin does not use high heat-resistant resin because it obtains adhesion to the metal drum. Therefore, it is considered to be in a softened state at high temperature. Then, the metal plating layer is initially deposited on the conductive portion, but it leaches into the insulating portion with the plating time (wrapping around), and the metal plating layer is overlaid on the embedded resin. . When the resin is in a softened state, there is no gap between the plating layer and the resin, and a very large adhesive force is exerted. When the metal plating layer is peeled off from the outer peripheral surface of the drum,
Due to the adhesion, the phenomenon of resin falling off from the metal drum occurs.
【0009】本発明の冷却・洗浄工程を設けると金属め
っき層の剥離時には樹脂と金属めっき層は急激に冷やさ
れており、互いの冷却速度の違いにより、めっき層と樹
脂の間に隙間を生じさせ、密着力の大幅な減少が達成で
き、埋め込まれた樹脂が金属製ドラムより抜け落ちるこ
とがなくなり、メッシュの孔が塞がることがない連続し
た金属メッシュ箔を長期に渡り、安価に製造できるよう
になった。When the cooling / washing step of the present invention is provided, the resin and the metal plating layer are rapidly cooled when the metal plating layer is peeled off, and a gap is generated between the plating layer and the resin due to the difference in the cooling rate between them. A large reduction in adhesion can be achieved, the embedded resin does not fall out of the metal drum, and the continuous metal mesh foil that does not block the mesh holes can be manufactured for a long time at low cost. became.
【0010】[0010]
実施例(1) 直径300mmのドラムを使用し、以下の条件で20μm
厚、40メッシュで六角形の孔を有するニッケルメッシ
ュ箔を得た。 ドラム回転スピード 25mm/min めっき液 スルファミン酸ニッケル 350g/l ほう酸 40g/l pH 5 温度 50℃ 電流密度 5A/dm2 冷水温度 15℃ 埋め込み樹脂 エポキシ樹脂 実施例(2) 実施例(1) のうち冷水温度のみ5℃とし、20μm 厚さ
のニッケルメッシュ箔を得た。 比較例(1) 実施例(1) のうち温度20〜25℃(室温)の水を使用
して、20μm 厚さのニッケルメッシュ箔を得た。 比較例(2) 実施例(1) のうち、冷水工程を除いた。Example (1) A drum having a diameter of 300 mm was used and 20 μm under the following conditions.
A nickel mesh foil having a thickness of 40 mesh and hexagonal holes was obtained. Drum rotation speed 25mm / min Plating solution Nickel sulfamate 350g / l Boric acid 40g / l pH 5 Temperature 50 ° C Current density 5A / dm 2 Cold water temperature 15 ° C Embedded resin Epoxy resin Example (2) Cold water of Example (1) Only the temperature was 5 ° C., and a nickel mesh foil having a thickness of 20 μm was obtained. Comparative Example (1) Using water having a temperature of 20 to 25 ° C. (room temperature) in Example (1), a nickel mesh foil having a thickness of 20 μm was obtained. Comparative Example (2) In Example (1), the cold water step was omitted.
【0011】上述した実施例及び比較例において、金属
製ドラムに埋設されたエポキシ樹脂がドラムより抜け落
ちるまでの箔長さを表1に示す。In the above-mentioned Examples and Comparative Examples, Table 1 shows the foil lengths until the epoxy resin embedded in the metal drum comes off from the drum.
【0012】[0012]
【表1】 [Table 1]
【0013】以上のように、本発明によれば埋設された
樹脂が抜け落ちにくいことがわかる。なお、本発明は電
気めっきできる全ての金属について応用可能であり、実
施例に拘束されるものではない。As described above, according to the present invention, it is understood that the embedded resin is unlikely to fall out. The present invention can be applied to all metals that can be electroplated, and is not limited to the examples.
【0014】[0014]
【発明の効果】冷水をかけることにより、金属めっき層
と絶縁性材料との密着力が減少し、埋設された絶縁性材
料が金属性ドラムから抜け落ちることなく、長尺の安価
な金属メッシュ箔が連続的に製造できる。By applying cold water, the adhesion between the metal plating layer and the insulating material is reduced, the embedded insulating material does not fall out of the metal drum, and a long and inexpensive metal mesh foil is obtained. It can be manufactured continuously.
【図1】本発明の実施例に係わる金属メッシュ箔製造装
置の垂直断面図である。FIG. 1 is a vertical sectional view of a metal mesh foil manufacturing apparatus according to an embodiment of the present invention.
1:電解槽 2:陽極 3:めっき液 4:金属製ドラム 5:絶縁性材料(エポキシ樹脂) 6:冷水供給装置 7:遮蔽板 8:金属メッシュ箔 1: Electrolytic tank 2: Anode 3: Plating solution 4: Metal drum 5: Insulating material (epoxy resin) 6: Cold water supply device 7: Shielding plate 8: Metal mesh foil
Claims (1)
埋設した金属製ドラムを一定のスピードで回転させなが
ら電気めっきすることにより金属めっき層を形成し、該
ドラム外周面から剥離することにより連続した金属メッ
シュ箔を製造する方法において、該金属めっき層がめっ
き液中から空気中に出た所からドラムより剥離される界
面までの範囲を0℃〜15℃の冷水で金属メッシュ層及
びドラム表面を洗浄することを特徴とする金属メッシュ
箔の製造法。1. A metal plating layer is formed by electroplating a metal drum having an insulating material embedded in a predetermined pattern on the outer peripheral surface while rotating at a constant speed, and peeling from the outer peripheral surface of the drum. In the method for producing a continuous metal mesh foil, the metal mesh layer and the drum are cooled with cold water at 0 ° C to 15 ° C in the range from the place where the metal plating layer is exposed to the air in the plating solution to the interface where it is peeled from the drum. A method for producing a metal mesh foil, which comprises cleaning the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23702694A JPH08100288A (en) | 1994-09-30 | 1994-09-30 | Manufacturing method of metal mesh foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23702694A JPH08100288A (en) | 1994-09-30 | 1994-09-30 | Manufacturing method of metal mesh foil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08100288A true JPH08100288A (en) | 1996-04-16 |
Family
ID=17009298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23702694A Pending JPH08100288A (en) | 1994-09-30 | 1994-09-30 | Manufacturing method of metal mesh foil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08100288A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002038834A1 (en) * | 2000-11-13 | 2002-05-16 | Matsushita Electric Industrial Co., Ltd. | Porous nickel foil for alkaline battery cathode, production method therefor and production device therefor |
| DE10229166A1 (en) * | 2002-06-28 | 2004-01-29 | Infineon Technologies Ag | Process for the production of galvanically separated antennas for RF-ID labels using selectively applied adhesive |
| KR100704685B1 (en) * | 2005-03-26 | 2007-04-06 | 한국기계연구원 | Continuous metal mesh manufacturing apparatus by mesh type rotary cathode drum plating |
| KR100822092B1 (en) * | 2007-02-07 | 2008-04-15 | 엘에스전선 주식회사 | Copper foil manufacturing method and apparatus for fine circuit, copper foil manufactured using same |
| KR101132339B1 (en) * | 2009-09-28 | 2012-04-05 | (주)이모트 | Apparatus and methode for continuous manufacturing of metal mesh |
| CN104993153A (en) * | 2015-07-13 | 2015-10-21 | 深圳市信宇人科技有限公司 | Production method of microporous copper foil, microporous copper foil and production device thereof |
-
1994
- 1994-09-30 JP JP23702694A patent/JPH08100288A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002038834A1 (en) * | 2000-11-13 | 2002-05-16 | Matsushita Electric Industrial Co., Ltd. | Porous nickel foil for alkaline battery cathode, production method therefor and production device therefor |
| US7998329B2 (en) | 2000-11-13 | 2011-08-16 | Panasonic Corporation | Porous nickel foil for negative electrode of alkaline battery, production method therefor and production device therefor |
| DE10229166A1 (en) * | 2002-06-28 | 2004-01-29 | Infineon Technologies Ag | Process for the production of galvanically separated antennas for RF-ID labels using selectively applied adhesive |
| WO2004003258A3 (en) * | 2002-06-28 | 2005-03-03 | Infineon Technologies Ag | Method for producing galvanically deposited antennae for rfid labels using an adhesive that is selectively applied |
| DE10229166B4 (en) * | 2002-06-28 | 2006-03-09 | Infineon Technologies Ag | Process for producing a structured metal layer |
| KR100704685B1 (en) * | 2005-03-26 | 2007-04-06 | 한국기계연구원 | Continuous metal mesh manufacturing apparatus by mesh type rotary cathode drum plating |
| KR100822092B1 (en) * | 2007-02-07 | 2008-04-15 | 엘에스전선 주식회사 | Copper foil manufacturing method and apparatus for fine circuit, copper foil manufactured using same |
| KR101132339B1 (en) * | 2009-09-28 | 2012-04-05 | (주)이모트 | Apparatus and methode for continuous manufacturing of metal mesh |
| CN104993153A (en) * | 2015-07-13 | 2015-10-21 | 深圳市信宇人科技有限公司 | Production method of microporous copper foil, microporous copper foil and production device thereof |
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