JPH0810741B2 - Method for manufacturing semiconductor device - Google Patents
Method for manufacturing semiconductor deviceInfo
- Publication number
- JPH0810741B2 JPH0810741B2 JP62111851A JP11185187A JPH0810741B2 JP H0810741 B2 JPH0810741 B2 JP H0810741B2 JP 62111851 A JP62111851 A JP 62111851A JP 11185187 A JP11185187 A JP 11185187A JP H0810741 B2 JPH0810741 B2 JP H0810741B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor device
- mold
- external
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 14
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 238000000034 method Methods 0.000 title claims description 5
- 238000005452 bending Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体装置の製造方法に関し、特に樹脂封止
型半導体装置の外部リードの曲げ方法に関する。The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a method for bending an external lead of a resin-sealed semiconductor device.
従来、樹脂封止型半導体装置（以下、モールドICと呼
ぶ）の外部リードのリード成形は、第２図に示すように
モールドIC1の封止樹脂部と外部リード８の曲げ成形す
る位置を上下からリード成形用ダイ3,4Aにより支持固定
させて、外部リード２を成形するポンチローラ５を外部
リード２の成形する位置（以下、リード成形肩と呼ぶ）
７より、外部リードを曲げる方向へ動かして外部リード
２を形成していた。Conventionally, the lead molding of the external leads of the resin-encapsulated semiconductor device (hereinafter referred to as the mold IC) is performed by bending the encapsulating resin portion of the mold IC1 and the external leads 8 from above and below as shown in FIG. A position at which the punch roller 5 for forming the outer lead 2 supported and fixed by the lead forming dies 3 and 4A is formed on the outer lead 2 (hereinafter referred to as a lead forming shoulder).
7, the outer lead 2 was formed by moving the outer lead in the bending direction.
しかしながら、上述した従来の外部リードの成形方法
においては、外部リード２の成形状態が一定にならず、
第３図に示したように、外部リード２の先端部2Aが外方
向にもどって開き、その幅はリード成形肩７の幅Ｗより
広くなる。However, in the above-described conventional external lead molding method, the molding state of the external lead 2 is not constant,
As shown in FIG. 3, the tip portion 2A of the outer lead 2 returns outward and opens, and its width becomes wider than the width W of the lead forming shoulder 7.
このため、モールドIC1をプリント基板等に実装する
場合、モールドIC1の内部及び外部リード２に無理な力
が加わり、実装が不均一になると共に、モールドICの品
質を低下させるという問題点がある。Therefore, when the mold IC1 is mounted on a printed circuit board or the like, there are problems that unreasonable force is applied to the inside and the external leads 2 of the mold IC1, the mounting becomes uneven, and the quality of the mold IC is deteriorated.
本発明の目的は、外部リードが均一に曲げられ、プリ
ンド基板等への実装が容易な高品質の半導体装置の製造
方法を提供することにある。An object of the present invention is to provide a method of manufacturing a high quality semiconductor device in which external leads are evenly bent and can be easily mounted on a printed board or the like.
本発明の半導体装置の製造方法は、上下のダイにより
半導体装置の封止樹脂部と外部リードの根元部とを支持
固定し、回転ローラにより前記外部リードを根元部より
下方向に曲げる工程を有する半導体装置の製造方法にお
いて、前記外部リードは外部リードの両面を挟み下方向
へ回転移動する回転ローラにより曲げられるものであ
る。A method of manufacturing a semiconductor device according to the present invention includes a step of supporting and fixing a sealing resin portion of a semiconductor device and a root portion of an external lead with upper and lower dies, and bending the external lead downward from the root portion with a rotating roller. In the method of manufacturing a semiconductor device, the outer lead is bent by a rotating roller that sandwiches both sides of the outer lead and rotates downward.
次に、本発明について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
第１図は本発明の一実施例を説明するためのモールド
IC近傍の断面図である。FIG. 1 is a mold for explaining an embodiment of the present invention.
It is a cross-sectional view near the IC.
第１図において、モールドIC1の外部リード部２をリ
ード成形する際、リード成形用のダイ３と４によりモー
ルドIC1を支持固定する。次でリード成形用ポンチロー
ラ５と６により外部リード部２の両面を挾み込み、リー
ド成形する方向へ下降させて、外部リード２を曲げて成
形する。In FIG. 1, when the external lead portion 2 of the mold IC1 is lead-molded, the mold IC1 is supported and fixed by the lead molding dies 3 and 4. Next, both sides of the outer lead portion 2 are sandwiched by the lead forming punch rollers 5 and 6, and are lowered in the lead forming direction to bend and form the outer lead 2.
このようにして成形されたモールドIC1の外部リード
２はダイ3,4により押えられながら曲げられるため、リ
ード成形肩７から確実に曲げられるためにもどりが少
く、リード先端部2A間の幅はリード成形肩７の幅Ｗと比
べてほとんど変わらず一定になる。The external leads 2 of the molded IC 1 molded in this way are bent while being pressed by the dies 3 and 4, so that the leads are reliably bent from the lead forming shoulders 7 so that there is little reversion. Compared with the width W of the molding shoulder 7, it remains almost unchanged.
以上説明したように本発明は、モールドIC1の外部リ
ードの両面を回転ローラで挾み込んでリード成形するた
めに、外部リードはリード成形肩より、精度良く確実に
曲げられて、リード先端部の位置が一定になる。従って
半導体装置をプリント基板等に実装する際、半導体装置
及び外部リードに無理な力が掛からず、スムーズに実装
でき品質を向上させることが出来る効果がある。As described above, according to the present invention, since both sides of the external lead of the mold IC1 are sandwiched by the rotating rollers to form the lead, the external lead is accurately and surely bent from the lead forming shoulder, and the lead tip portion The position becomes constant. Therefore, when the semiconductor device is mounted on a printed circuit board or the like, it is possible to smoothly mount the semiconductor device and the external leads without applying excessive force, and it is possible to improve the quality.
第１図は本発明の一実施例を説明するためのモールドIC
近傍の断面図、第２図及び第３図は従来の半導体装置の
製造方法を説明するためのモールドICの断面図及び側面
図である。 １……モールドIC、２……外部リード、2A……先端部、
3,4,4A……ダイ、5,6……ポンチローラ、７……リード
成形肩。FIG. 1 is a mold IC for explaining one embodiment of the present invention.
2 and 3 are a cross-sectional view and a side view of a mold IC for explaining a conventional method for manufacturing a semiconductor device. 1 ... Mold IC, 2 ... External lead, 2A ... Tip,
3,4,4A ... die, 5,6 ... punch roller, 7 ... lead molding shoulder.
Claims (1)
と外部リードの根元部とを支持固定し、回転ローラによ
り前記外部リードを根元部より下方向に曲げる工程を有
する半導体装置の製造方法において、前記外部リードは
外部リードの両面を挟み下方向へ回転移動する回転ロー
ラにより曲げられることを特徴とする半導体装置の製造
方法。1. A method of manufacturing a semiconductor device, comprising a step of supporting and fixing a sealing resin portion of a semiconductor device and a root portion of an external lead by upper and lower dies, and bending the external lead downward from the root portion by a rotating roller. 2. The method for manufacturing a semiconductor device according to claim 1, wherein the outer lead is bent by a rotating roller that sandwiches both surfaces of the outer lead and rotates downward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62111851A JPH0810741B2 (en) | 1987-05-07 | 1987-05-07 | Method for manufacturing semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62111851A JPH0810741B2 (en) | 1987-05-07 | 1987-05-07 | Method for manufacturing semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63275154A JPS63275154A (en) | 1988-11-11 |
| JPH0810741B2 true JPH0810741B2 (en) | 1996-01-31 |
Family
ID=14571751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62111851A Expired - Lifetime JPH0810741B2 (en) | 1987-05-07 | 1987-05-07 | Method for manufacturing semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0810741B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4949107A (en) * | 1972-09-18 | 1974-05-13 | ||
| JPS618962A (en) * | 1984-06-23 | 1986-01-16 | Mitsubishi Electric Corp | Lead-terminal bending device of semiconductor device |
-
1987
- 1987-05-07 JP JP62111851A patent/JPH0810741B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63275154A (en) | 1988-11-11 |
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