JPH0812154B2 - Solder surface appearance inspection method - Google Patents

Description

TECHNICAL FIELD The present invention relates to a solder surface appearance inspection method used when a solder surface of an object to be inspected is imaged and the solder surface is inspected.

[Prior Art] As an appearance inspection apparatus using a conventional solder surface appearance inspection method, there is an apparatus disclosed in JP-A-62-123339. This device creates inspection data corresponding to each inspected object such as a wiring board, and it is necessary to adjust the subtle position and shape in order to improve the judgment accuracy. Took a long time to create. Therefore, when the inspection data is created in the inspection line, it is necessary to stop the inspection line for a long time at the time of creating the data, and in order to solve this problem, the data creation outside the process is required.

[Problems to be Solved by the Invention] However, in the apparatus using the solder surface appearance inspection method disclosed in JP-A-62-123339, there are the following problems in producing inspection data off-line. It was

That is, since the shape of the land of the wiring board that is the object to be inspected differs at each point of each wiring board, it is necessary to include the land shape data in the inspection data of each point in order to improve the determination accuracy. Since there is a feature in the soldering method depending on the position above, it is necessary to create data on the soldering method.

If the above data is created off-line, it takes time to create the data for creating the inspection data, which is not feasible.

Further, as shown in FIG. 3, the solder surface appearance inspection method in which the mask B is applied to the inspection surface A of the object to be inspected and the inspection determination is performed by the data in the mask is changed to form an optimum mask pattern by changing the shape and size of the mask. It is necessary to use a standard pattern outside the line
It is created from the position information of CAD data and is corrected while looking at the actual image of the object A to be inspected by the imaging camera C within the line, but the above-mentioned land shape and soldering data There was no big difference from the case of creating data online from the beginning because of the need to create.

The present invention has been made in view of the above points, and its purpose is to create inspection data of an inspection object,
It is an object of the present invention to provide a solder surface appearance inspection method capable of minimizing the stop time of the inspection line.

[Means for Solving the Problems] A solder surface appearance inspection method of the present invention stores data of an image captured by an apparatus for inspecting a solder surface of an object to be inspected and an image of the captured image in an external storage device. , The data stored in this external storage device is called and loaded into a teaching device equipped with an image processing unit, a frame memory, a keyboard and a monitor, the loaded data is played back as an image on the monitor, and a replayed image is created. Based on this, inspection data of the solder surface is created.

[Operation] When creating inspection data, an image of the solder surface of the object to be inspected is taken by using the device for inspecting the solder surface, and the image data is stored in the external storage device.

Next, the above-mentioned data stored from this external storage device is called by using a device outside the line, an image is reproduced on a monitor, and inspection data of the solder surface is created based on this reproduced image. In other words, inspection data can be created outside the line.

[Examples] The present invention will be described below with reference to Examples.

FIG. 1 shows a circuit configuration of an appearance inspection apparatus for inspecting a solder surface of an object to be inspected in a line by using the solder surface appearance inspection method of the present invention. An imaging camera 1 for taking an image of the solder surface of the object to be inspected. And the analog image signal obtained by imaging
An A / D conversion unit 2 that performs A / D conversion to convert to, for example, 8-bit binarized image data, a frame memory unit 3 that temporarily stores changed image data, and an image stored in the frame memory unit 3. A D / A conversion unit 4 for D / A converting data to create an analog image signal, a monitor 5 for reproducing an original image by the converted analog image signal, and each unit in the device while controlling the original unit. An image stored in the frame memory unit 3 which is controlled by the CPU unit 6 having a calculation control function for performing a visual inspection of the solder surface and a floppy disk control unit (not shown) by the CPU unit 6. A floppy disk drive that stores data in an external storage device, for example, an 8-inch floppy disk 8 and calls the inspection data from the floppy disk 8 in which inspection data described later is stored. It is composed of a.
Of course, the external storage device may be a floppy disk other than the 8-inch floppy disk, or may be used as an external storage device composed of another storage medium.

FIG. 2 shows a circuit configuration of a so-called teaching device for creating inspection data outside a line using the solder surface appearance inspection method of the present invention. In this device, control of each part of the device and calculation are performed. The CPU unit 10, the floppy disk drive 9 for calling the stored data from the floppy disk 8 in which the image data is stored by the appearance inspection device and writing the created inspection data, and the floppy disk drive 9 are the CPU Floppy disk control unit 11 that controls based on control data from unit 10
And a CRT / KB control unit 15 for controlling an image processing unit 12 required for image processing, a frame memory 13, a keyboard 17 for data input, and a monitor 14 for image reproduction.
And another memory 16.

Thus, when the inspection data is created by using the apparatus shown in FIGS. 1 and 2 using the embodiment of the solder surface appearance inspection method of the present invention, the inspection of the solder surface is shown in FIG. After setting data such as sequence data, binarization level data, and position correction data corresponding to the type of the object to be inspected in the apparatus, the image is picked up by the image pickup camera 1, further binarized, and temporarily stored in the frame memory 3. The stored image data of the object to be inspected is labeled on the image No., product type, etc., and then stored in the image storing floppy disk 8 in the floppy disk drive 7.

After that, the floppy disk 8 is taken out from the floppy disk driving device 7, and the image data stored in the floppy disk driving device 9 of the teaching device shown in FIG. Then, the stored image data is D / A converted by the functions of the image processing unit 12 and the CRT / K control unit 15, and then the image is reproduced on the monitor 14.
The data of the mask (window) pattern that determines the processing range is input by operating the keyboard 17 and the like to edit and create while viewing the reproduced image. Similarly, data such as marking is created, and after creating these data, the created data is saved in the floppy disk 8. By loading the stored data into the apparatus shown in FIG. 1, the inspection data can be used as new inspection data.

[Effects of the Invention] The present invention stores data of an image picked up by an apparatus for inspecting a solder surface of an object to be inspected and inspecting the solder surface by the image in an external storage device, and stores the data in the external storage device. The above data is called and loaded into a teaching device equipped with an image processing unit, a frame memory, a keyboard and a monitor, the loaded data is reproduced as an image on the monitor, and inspection data of the solder surface is obtained based on the reproduced image. Since the inspection data is created outside the inspection line, the time during which the inspection line is stopped can be shortened and the inspection efficiency can be improved.

[Brief description of drawings]

FIG. 1 is a block diagram of an apparatus for inspecting the appearance of a solder surface used in an embodiment of the solder surface appearance inspection method of the present invention, FIG. 2 is a block diagram of a teaching apparatus used in the same, and FIG. 3 is a description of a conventional example. It is a figure. 8 ... Floppy disk, 12 ... Image processing unit, 13 ...
A frame memory, 14 ... monitor, 17 ... keyboard.

Claims (1)

[Claims] 1. Data of an image taken by using an apparatus for inspecting a solder surface of an object to be inspected and inspecting the solder surface by the image is stored in an external storage device and stored in the external storage device. Calling data and loading it into a teaching device equipped with an image processing unit, frame memory, keyboard and monitor, playing back the loaded data as an image on the monitor, and creating solder surface inspection data based on the played back image. A visual inspection method for the solder surface.