JPH0812893B2 - Lead terminal pressing method and lead terminal pressing apparatus - Google Patents

Description

Detailed Description of the Invention

[0001]

The present invention relates to a pressing process of the lead terminals protruding from the semiconductor element, and a pressing device for the lead terminal.

[0002]

2. Description of the Related Art FIG. 6 (a) is a perspective view showing a semiconductor element before pressing, FIG. 6 (b) is a perspective view showing a semiconductor element after pressing, and FIGS. 7 (a) and 7 (b) are conventional. Lead terminal
FIG. 3 is a cross-sectional view of a main part of a press device for press. Semiconductor device 101
6 has three straight lead terminals A, B, C protruding from one end of the resin mold 102 as shown in FIG. 6A. Then, of the lead terminals A, B, C, the center lead terminal B is bent into a crank shape by a lead terminal pressing device (FIG. 6 (b)), and each lead terminal A, B,
The tip of C is brazed to the printed board, and the resin mold 102 is fixed to the heat radiation section on the printed board with screws.

[0003] Thus, the press method (press apparatus) of the lead terminal B, the lead end as shown in FIG. 7 (a)
The lead terminals A, B, and C of the semiconductor element 101 are placed horizontally on the processing surface 104a of the lower die 104 of the child pressing device 103, and the upper die 105 is lowered from above the lead terminals A, B, and C as shown in FIG. 7B. Processed surfaces 104a, 105 of the mold 105 and the lower mold 104
Pressing the lead terminal B with a, the lead terminal B made of metal
Is to plastically deform the crank.

[0004]

The conventional pressing method is as follows.
Since the processed surfaces 104a and 105a are applied from the direction orthogonal to the length direction of the lead terminals A, B, and C, as shown in FIG.
As shown in (b), the bending point O of the lead terminal B and the contact position of the processed surface 105a can be displaced by the length t. Then, the lead terminals B were rubbed and scratched or stretched thinly by the amount of this deviation, so that about 50% of the semiconductor elements 101 had defects. Such a defective semiconductor element 101 may cause a malfunction from the beginning when it is incorporated into a product, or may malfunction due to a malfunction in the future, and thus a strict check is required. As described above, the conventional pressing method (pressing device) has a problem in that defects occur in almost one in two, and moreover, a great deal of labor is required to extract defective products.

The present invention has been made in view of the above problems, and an object thereof is to bend it efficiently and efficiently.
DOO is to provide a press method and flop <br/> less device lead terminal of the lead terminal that can.

[0006]

In order to achieve the above-mentioned object, the present invention can be performed by setting the working surfaces of the upper die and the lower die at an angle.
The lead terminal of the semiconductor element between the upper mold and the lower mold , and diagonally with respect to the length direction of the lead terminal on the processed surface of both molds.
In the pressing method of the lead terminal that pressurizes and deforms from the direction , the resin mold is placed between the upper mold and the lower mold.
So that the semiconductor element is set in
In addition, first, the lead terminals are
Clamp the base end of the resin mold and then
The free end side of the lead terminal while pressing
Provided is a method of pressing a lead terminal that is shaped .

Further, the lead terminal pressing device is provided with an upper die.
Place the resin mold between the lower molds with the top facing up
Do not set the body element, and further, of the upper mold and the lower mold
Clamp the resin mold side base end of the lead terminal on the unprocessed surface.
It is characterized in that the free end side of the lead terminal is pressed and deformed .

[0008]

By tilting the machined surfaces of the upper die and the lower die, as shown in FIG. 5A, the machined surfaces can be brought into close contact with the bending point O. Almost no rubbing or pulling as in a press machine occurs. Also on
Clamp the base end on the resin mold side between the unprocessed surfaces of the mold and lower mold.
To fix the lead terminals during bending
Do not apply excessive force between the resin mold and the lead terminals.
Yes. Furthermore, the resin mold is on top between the upper mold and the lower mold.
Did you set the semiconductor element in the correct orientation?
The semiconductor element can be replaced smoothly.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. 1 is a vertical cross-sectional view of a main part of the lead terminal pressing device, FIG. 2 is an enlarged vertical cross-sectional view of a main part of the lead terminal pressing device showing a pressed state, FIG. 3 is an exploded perspective view of a lower mold, and FIG. FIG. 5A and FIG. 5B are enlarged cross-sectional views of a main part in comparison with the related art, in which the upper mold is looked up from below. The semiconductor element 101 before and after processing is the same as that described with reference to FIGS. 6A and 6B.

The lead terminal pressing device 1 comprises a fixed base 2, a lower die 3 fixed to the base 2 and an upper die 4 mounted on the base 2 so as to be vertically slidable. The base 2 is configured by combining a metal horizontal plate 5 and a vertical plate 6 in a side L shape.

As shown in FIG. 3, the lower mold 3 includes a fixed pedestal 7, a receiving member 8 vertically movably fitted in the fixed pedestal 7, and a lower mold loosely fitted in the receiving member 8. Body 9 and
It is composed of two coil springs 10 and 10 for urging the receiving member 8 upward. Fixed base 7 and lower body 9
Are fixed to the base 2 with bolts 11. on the other hand,
The receiving member 8 is in a position where it is lifted to a height substantially flush with the upper end of the lower mold body 9 as shown in FIG. 1 by the bias of the coil springs 10, 10.

A rectangular through hole 12 is formed at the center of the receiving member 8, and a lower mold body 9 is inserted into the through hole 12. Further, the concave portion 1 is formed on the edge of the upper end surface of the receiving member 8.
3 is provided, and the semiconductor element 101 is provided in the recess 13.
The resin mold 102 is set. The top of the lower die body 9 is a processed surface 3a, and the width thereof is approximately the same as the length from the side end of the lead terminal A to the side end of the lead terminal C. Then, the press protrusion 14 is provided in a protruding manner at a portion corresponding to the center lead terminal B.

Therefore, the upper surface of the receiving member 8 and the processed surface 3a of the lower mold body 9 are formed obliquely at an angle of 15 degrees with respect to the horizontal plane. Therefore, the semiconductor element 101 is made of resin.
With the mold 102 set in the recess 13, the resin mold
The field 102 is tilted so that it faces upward.

The upper die 4 has a machined surface 4a at the bottom as shown in FIG. The processing surface 4a is provided with a press groove 15 at the center and is formed obliquely at an angle of 15 degrees with respect to the horizontal plane, and coincides with the processing surface 3a of the lower die 3. Further, as shown in FIG. 1, the upper mold 4 is vertically slidably mounted through vertical bolts 16 in vertical grooves 16 provided in the vertical plate 6 of the base 2. The elevating shaft 18 is connected to the top of the upper die 4, and the elevating operation of the elevating shaft 18 causes the upper die 4 to move up and down. The elevating shaft 18 may be manually operated by using a well-known link device (for example, a toggle joint), or may be operated by hydraulic power or power such as a motor. May be.

Next, a method of pressing the lead terminal B of the semiconductor element 101 using the above lead terminal pressing device 1 will be described. As shown in FIG. 1, with the upper die 4 of the lead terminal pressing device 1 in the raised position, the receiving member 8 of the lower die 3 is elevated by the bias of the coil springs 10 and 10, and the lower die main body 9 The upper end of the press protrusion 14 and the upper surface of the receiving member 8 are substantially flush with each other. So first,
As shown by the alternate long and short dash line in FIG. 1, the resin mold 102 of the semiconductor element 101 is set in the recess 13 of the receiving member 8. This and
When the receiving member 8 and the press protrusion 14 are viewed from the operator side,
Since it is inclined downward, place the tips of the lead terminals A to C there.
If you place it on the slide, it will slide naturally and be positioned
To be done. Therefore, it is easy and quick to set the semiconductor element 101.
You can be fast. Lead terminals A in this set state, B, C faces the top of the working surface 3a of the lower mold body 9, and the lead terminals A to the horizontal plane, B, C is rather inclined obliquely. If the outer shape of the receiving member 8 is rounded as in the embodiment, the recess 13 is formed.
When the resin mold 102 is set in, the fingers are less likely to come into contact with the outer periphery of the receiving member 8 and workability is good.

Next, the upper die 4 is moved downward. Then,
Figure 1 As shown by the chain double-dashed line, resin resin for lead terminals A, B, C
The non-machined surface of the upper die 4 contacts the base end portion on the side of the shield 102 .
As a result , the base ends of the lead terminals A, B, and C are first cleared.
And the semiconductor element 101 is securely fixed. Then, the upper mold 4 is further moved as it is. Then,
As shown in FIG. 2, the receiving member 8 is pushed down, and the lead terminal B at the center is pushed up by the press protrusion 14 of the lower mold body 9 and bent into the press groove 15 of the upper mold 4. next,
The lead terminals B are pressed and deformed by the processed surfaces 3a, 4a of the lower mold 3 and the upper mold 4, and then the upper mold 4 is raised to the position shown by the solid line in FIG. Then, the receiving member 8 rises due to the urging of the coil springs 10, 10, and the processed semiconductor element 10
Since 1 is lifted, it is removed like a slide from the recess 13 of the receiving member 8 and the next semiconductor element 101 is set. Similarly, the lead terminals B of the semiconductor element 101 are pressed.

The present invention has been described with reference to the embodiments.
Of course, the present invention is not limited to the above embodiment. For example, in the embodiment, the lead terminal B at the center is bent in a crank shape, but if the upper mold 4 and the lower mold body 9 are replaced with those as shown in FIG. 8, as shown in FIG. Arched lead terminal B, lead terminals A and C on both sides
It can also be bent into a crank shape. Lead like this
When bending terminals A to C into complicated shapes, the upper and lower mold
The structure that clamps the base end side of the lead terminal on the processed surface is special.
Is effective for. Further, in the embodiment, the inclination angle of the machined surfaces 3a and 4a is set to 15 degrees, but an optimum angle may be selected according to the shape of the lead terminal.

[0018]

The conventional lead terminal pressing apparatus is shown in FIG.
As shown in (b), there is a deviation of length t between the contact point between the bending point O and the machined surface, and it is considered that the lead terminal was rubbed and scratched or extended by this deviation. . On the other hand, according to the present invention, by bending the processing surfaces of the upper die and the lower die, as shown in FIG.
Since the machined surface can be brought into close contact with,
There is almost no friction or pulling unlike the conventional lead terminal press machine. Therefore, the plating on the bent part is less likely to be scratched,
Further, the material does not grow thin, the defect occurrence rate, which has been around 50% in the past, can be almost eliminated, and the reliability of the product can be remarkably improved.

In addition, the lead terminals are formed on the non-machined surfaces of the upper die and the lower die.
Clamp the resin mold base end of
Therefore, during bending, the space between the resin mold and the lead terminals
To the resin mold and the leads.
There is no danger of damaging both terminals. Furthermore, with upper mold
With the resin mold facing up between the lower molds, the semiconductor element
Since I was trying to set the child, hold the resin mold
The natural operation of sliding the lead terminals
The replacement work can be carried out, and therefore the replacement of the semiconductor element
Can be performed smoothly, greatly improving work efficiency.
It has the effect of increasing.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional view of a main part of a lead terminal pressing device.

FIG. 2 is an enlarged vertical cross-sectional view of a main part of the lead terminal pressing device showing a pressed state.

FIG. 3 is an exploded perspective view of a lower mold.

FIG. 4 is a perspective view of the upper die as seen from below.

5 (a) and 5 (b) are enlarged cross-sectional views of essential parts comparing the present invention with the prior art.

6A is a perspective view showing a semiconductor element before press working, and FIG. 6B is a perspective view showing a semiconductor element after press working.

7A and 7B are cross-sectional views of a main part of a conventional lead terminal pressing device.

FIG. 8 is a perspective view of an upper mold body and a lower mold body showing another embodiment.

FIG. 9 is a perspective view of a semiconductor device showing another embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Pressing device for lead terminals 3 ... Lower mold 3a ... Machining surface 4 ... Upper mold 4a ... Machining surface 101 ... Semiconductor elements A, B, C ... Lead terminals

Claims (2)

[Claims] 1. When the processing surfaces of the upper die and the lower die are set obliquely
In both cases, the lead terminals of the semiconductor element are exposed between the upper mold and the lower mold , and the processing surface of both molds is inclined with respect to the length direction of the lead terminals.
In the pressing method of the lead terminal that pressurizes and deforms from the direction , place the resin mold between the upper mold and the lower mold so that the resin mold faces up.
Do not set the semiconductor element, and
The resin mold side base end of the lead terminal on the unprocessed surface of the mold and lower mold
Clamp the part and then keep the clamped state.
The method of pressing a lead terminal is characterized in that the free end side of the lead terminal is pressed and deformed . 2. When the processing surfaces of the upper die and the lower die are set obliquely
In both cases, the lead terminals of the semiconductor element are exposed between the upper mold and the lower mold , and the processing surface of both molds is inclined with respect to the length direction of the lead terminals.
In the press device for lead terminals , which is configured to pressurize and deform from the direction , the resin mold is placed between the upper mold and the lower mold so that the resin mold faces upward.
The semiconductor element is not set, and the upper die
On the non-machined surface of the lower die, fix the base end of the lead terminal on the resin mold side.
Clamp and press and deform the free end side of the lead terminal.
Press device lead terminals, characterized in that as that.