JPH081455B2 - IC performance test method - Google Patents

Description

TECHNICAL FIELD The present invention relates to an IC performance test method, and more specifically to a test method in which each process of a thermal acceleration test and a temperature test is improved.

[Prior Art] ICs mass-produced in a factory are subjected to a long-term thermal acceleration test (aging) in which bad conditions are accelerated to maintain constant quality, and a short-time temperature test as an environment resistance test. Sorted into good products and defective products.

In the thermal acceleration test, several sets of aging boards with inserted ICs are put into the furnace in units of several sets, usually heated at 125 ° C for 72 hours and then taken out, and each IC is extracted from the socket for inspection. .

The temperature test tests whether the IC can maintain normal characteristics in tropical regions and cold regions.
In the low temperature test at 100 ℃, it is performed in a few seconds to tens of seconds under the environment of -40 ℃, and an IC test handler is usually used for this test.

The conventional IC test handler is a loader that extracts the IC from the magazine and flows it into the transport path, a constant temperature tank that keeps each IC at high or low temperature, a test board that measures IC data, and an IC.
It consists of an unloader that collects water, and the thermostatic chamber and each equipment are sealed to exclude outside air and moisture.

However, in the conventional temperature test, a dedicated test handler corresponding to the type of IC is used, or in order to handle with one handler, the loader, transfer system, and unloader must be replaced and adjusted. For this reason, a method has been proposed in which a socket board or a carrier plate corresponding to each IC is prepared in advance, and a temperature test is performed by one handler (Japanese Patent Laid-Open No. Sho 61-96).
64-80035).

[Problems to be Solved by the Invention] However, in the above-described invention, after completion of the thermal acceleration test,
It is difficult to move the IC from the aging board to the socket board, and the IC type may become unknown during that time.

Also, in the case of a low temperature test, if jamming, i.e., clogging of the IC occurs, it is necessary to open a part of the constant temperature bath to remove the jam, but if the -40 ° C bath is opened suddenly, moisture will enter from the outside and Frost adheres to the IC, carrier system and each device. For this reason, conventionally, the cooler is stopped and the temperature in the tank is gradually raised to room temperature to remove the jam, and the handler stop time is extremely long.

The present invention has been made in view of such circumstances,
It is an object of the present invention to provide an IC performance test method that can simplify each test process, do not confuse the IC type, and can remove jams in a short time.

[Means for Solving the Problems] In order to achieve the above object, in the performance test method of the present invention, a thermal acceleration test in which an IC is in a high temperature state for a long time and then inspected by a tester, and a short time in a high temperature or low temperature state are used. Prepare a common heat insulating socket board for the temperature test inspected by the test handler, attach an index according to the type of IC etc. to a part of the socket board, and during the thermal acceleration test, attach it to each socket on the socket board After inserting the IC and storing it in a high temperature furnace for a long time, measure the data of each IC with a tester while the IC is still inserted in each socket on the socket board. Is covered with a heat insulating lid to form a heat insulating case, and temperature control gas is supplied into the case to measure data of each IC.

[Operation] By performing the thermal acceleration test and the temperature test on the common socket board, it is not necessary to repeatedly insert and remove the IC, and the occurrence of jams is reduced. The index of the socket board can always check the IC type and the like, and can add necessary data to the index. Further, there is a possibility that a jam may occur before the gas or the like is injected into the heat insulating case, so that the jam can be immediately eliminated without worrying about frost even during the low temperature test.

[Example] Fig. 1 shows a heat insulating case 1 used in the test method of the present invention. The case 1 has a heat insulating socket board 2 as a lower box and a heat insulating lid for covering the upper side. It consists of three.

A large number of sockets 4 for receiving ICs are provided inside the socket board 2, and as shown in FIG. 2, the sockets 4 can be electrically connected to the pogo pins 7 on the test board 6 through the through holes 5 at the bottom. Has become.

Further, a claw 8 that elastically engages with the lid 3 is formed in the opening of the socket board 2, and an index 9 for displaying the type of IC, data, etc. is provided on the outer surface of the board 2. It is desirable that the index 9 can be automatically read by a reader or an image sensor like a bar code.

The lid 3 has an inlet 10 for temperature adjusting gas in the center, and a check valve 11 is provided in the inlet 10. Correspondingly, a plurality of gas discharge ports 12 are formed on the socket board 2 side, and each discharge port 12 is opened by a pressure valve 13 when the internal pressure exceeds a certain level. If the IC has no legs, it may move in the socket 4 during transportation.
As shown in FIG. 2, a spring 14 and a pressing plate 15 are attached to the back side of the lid 3 to fix the IC from above. Although not shown, if a heater is incorporated in the holding plate 15, the IC can be heated in a short time during a high temperature test by heat conduction.

A ridge 3a is formed on the upper edge of the lid 3 to prevent the condensed water generated during the low temperature test from dripping downward, and a similar ridge 2a is formed around the bottom surface of the socket board 2. .

As shown in FIG. 2, the test board 6 is installed below a pair of fixed rails 16 (only one is shown), and the rail 16a at the measurement position is separated from the rails 16 on both sides and the lower surface is provided with a return spring 17. It is supported.

A gas supply nozzle 18 and a bifurcated pusher 19 are installed above the measurement position. The gas supply nozzle 18 causes the inside of the heat insulating case 1 to have a predetermined temperature, and in the high temperature test, high temperature air is jetted, and in the low temperature test, nitrogen gas or cold air is jetted.

Next, the test method of the present invention will be described with reference to the simplified process diagram of FIG.

First, in the thermal acceleration test, an IC is inserted into each socket 4 of the socket board 2, and several tens of such boards 2 are housed in the furnace 20 and heated at about 125 ° C. for 72 hours. After aging, ICs are
Predetermined data is measured in, and if there is a defective product, it is removed in this step.

Next, in the temperature test, first, the lid 3 is put on the socket board 2 in which the IC is still stored, and then the heat insulating case 1 is intermittently moved on the fixed rail 16 by a conveyor (not shown). In the case of the low temperature test, it is desirable to supply nitrogen gas or the like at room temperature from the inlet 10 to expel moisture in order to prevent the formation of frost.

Next, when the heat insulating case 1 is sent to the measurement position, the upper nozzle 18 descends and gas of a predetermined temperature is injected into the case 1 through the inlet 10, and the pusher 19 integrates the heat insulating case 1 with the rail 16a. Push downwards. As shown in FIG. 2, each pogo pin 7 is inserted into the through hole 5 at the bottom of the case, and the IC data is measured on the test board 6 side through the socket 4, the through hole 5 and the pogo pin 7.

Next, in the heat insulating case 1, the lid 3 is opened in the next step, and the IC inside is automatically taken out by an unloader or the like. these
The ICs are sorted into good products and defective products or by data as in the conventional case, and are stored in a predetermined magazine or pallet (not shown). Since each socket board 2 is provided with an index 9, the type of IC can be checked at all times.
Data processing can also be performed automatically.

During the high temperature test, if a high temperature gas is injected from the nozzle 18 and the heater of the holding plate 15 is also used, the IC
The temperature can be increased. Also, during the low temperature test,
As shown by the phantom line in FIG. 2, the nozzle 18 is composed of a double tube of an inner tube 18a and an outer tube 18b, and the low-temperature gas leaked at the inlet 10 is taken as an outer tube
If collected at 18b, it is possible to reliably prevent frost formation on the lid 3. Further, in the above embodiment, the temperature test is performed after the thermal acceleration test, but the present invention is also effective when the both are performed in reverse order.

[Effects of the Invention] As described in detail above, according to the test method of the present invention, since the common socket board is used for both tests, the number of IC insertion / extraction steps is reduced and the type of IC is not confused. The effect is that the jam can be removed in a short time.

[Brief description of drawings]

FIG. 1 is a perspective view of a socket board and a lid of a heat insulating case, FIG. 2 is an enlarged cross-sectional view of an IC measurement portion, and FIG. 3 is a simplified diagram showing each IC test process. 1 ... Insulation case, 2 ... Socket board, 3 ... Lid, 4 ... Socket, 6 ... Test board, 7 ... Pogo pin, 9 ... Index, 10 ... Gas inlet, 12 ... Gas outlet, 18 ... Gas supply nozzle

Claims (1)

[Claims] 1. A heat insulating socket board common to a thermal acceleration test in which an IC is in a high temperature state for a long time and then inspected by a tester and a temperature test in which a high temperature or a low temperature state is briefly inspected by a test handler are prepared. An index according to the type of IC is attached to a part of the socket board, and at the time of thermal acceleration test, it is attached to each socket on the socket board.
After inserting the IC and storing it in a high temperature furnace for a long time, measure the data of each IC with a tester with the IC still inserted in each socket on the socket board. Is covered with a heat-insulating lid to form a heat-insulating case, and temperature control gas is supplied into the case to measure data of each IC.