JPH0814601B2 - Tape carrier inspection device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Object of the Invention (Field of Industrial Application) The present invention relates to a tape carrier inspection device.

(Prior art) In recent years, IC packaging is tape carrier because it is necessary to implement smaller, thinner, and lighter weight watches, calculators, computer memories, etc., and also for special shaped devices such as cameras and OA equipment. The method has entered the stage of full-scale practical use. The tape carrier is one in which a lead pattern matching the electrode arrangement of the IC chip is formed on a plastic film having sprocket holes and device holes. Such a tape carrier is continuously formed in a tape shape, and an IC chip is bonded to each device hole portion by, for example, a bump method. There is a demand for an apparatus in which a lead pattern of this tape carrier and each electrode pad of an IC chip are connected to each other by pitch-feeding them in a tape form to sequentially inspect the electrical characteristics of each chip. Also, as mentioned above,
Attach the IC chip to the tape carrier and leave the tape in the IC
A device for inspecting the electrical characteristics of chips is Japanese Patent Publication No. 62-575.
No. 6,086,045. An apparatus for inspecting the tape carrier as described above is disclosed in JP-A-53-27364.

(Problems to be Solved by the Invention) Here, it is required to improve the operating rate of a device for inspecting a tape carrier having an IC and to promote automation thereof.

However, according to the above-mentioned publication, a mark is added by ink or the like to a defective product determined by the inspection result of each IC mounted on the tape carrier, and the mark is pattern-recognized in the subsequent process. It was judged visually whether it was good or bad. With such a configuration, it is necessary to provide a marking mechanism in the tape carrier inspection device, the size of the device itself becomes large, a lot of time is spent for marking, and if a marking error or marking failure occurs, There is a risk that the non-defective product may be determined as a defective product or the defective product may be determined as a non-defective product, resulting in a decrease in yield and reliability. In addition, a mechanism for recognizing the presence / absence of marking is required also in the subsequent process, which lacks versatility.

The present invention has been made to solve the above problems, and can reduce the size of the apparatus itself, improve the operation rate of the inspection and automate the inspection, and further improve the reliability and reliability of the inspection. An object of the present invention is to provide a tape carrier inspection device capable of improving the yield and grasping the inspection required time and effectively preparing for the next process.

[Structure of Invention]

(Means for Solving the Problems) A tape carrier inspection apparatus according to the present invention is an apparatus for sequentially inspecting electrical characteristics of a large number of electronic components mounted on a tape carrier, wherein the electronic components mounted on the tape carrier. Storage mechanism for storing the inspection result of all electronic components and each electronic component, a display mechanism for displaying the inspection result stored by this storage mechanism, and an inspection end time for displaying the expected end time of the inspection on this display mechanism. End time predicting means for predicting, and the end time predicting means counts the inspection required time of each electronic component stored in the storage mechanism and accumulates the time, and the time counter The inspected number counter that sequentially accumulates the counted electronic components, the accumulated count number by the inspected number counter, and the time count And a calculating means for calculating a required inspection time of the remaining electronic components based on the total time of the electronic components and the total number of the electronic components to obtain a predicted inspection end time.

According to the present invention, when the electrical characteristics of a large number of electronic components mounted on the tape carrier are sequentially inspected, when the inspection of each electronic component is completed, the inspection result is stored in the storage mechanism. The inspection result stored by this storage mechanism is displayed on the display mechanism. Further, this display mechanism can display the expected inspection end time. The end time predicting means operates to predict the end time. That is, when the inspection is started, the time counter counts the time required to inspect each electronic component one by one and accumulates the time. Further, in parallel with this, the inspected number counter counts each inspected electronic component one by one and sequentially accumulates the counted number. Next, the calculation means calculates the time required to inspect the remaining electronic components based on the accumulated count value by the inspected number counter, the accumulated time by the time counter, and the total number of electronic components stored in the storage device to calculate the estimated inspection end time. Ask for. Then, the expected completion time of the inspection is displayed on the display mechanism each time.

Therefore, according to the present invention, when inspecting the electronic component mounted on the tape carrier, the inspection result is sequentially stored in the storage mechanism and the result is displayed on the display mechanism, so that the apparatus itself does not need the marking mechanism. Can be downsized, the inspection operation rate can be improved, and the inspection can be automated, and the inspection reliability and yield can be improved, and the inspection required time can be grasped to prepare for the next process. Etc. can be effectively performed.

(Examples) Hereinafter, the present invention will be described based on examples shown in Figs. 1 to 4.

As shown in FIG. 2, a tape carrier (2) which is an object to be inspected in the probe device (1) has a plastic film such as a polyimide film, for example, a width of 35 mm and a thickness of 125.
On both side edges (2a) in the longitudinal direction of .mu.m, a plurality of rectangular through holes having the same size, for example, square sprocket holes (3) are provided at predetermined fixed intervals. Further, device holes (not shown), which are through holes, are also provided at predetermined fixed intervals at the central band position in the longitudinal direction, that is, the mounting position of the IC chip (4). Each electrode terminal (5) of the IC chip (4) mounted corresponding to this device hole is printed on the tape carrier (2), and between the electrode pad (5) and the terminal of the IC chip (4). A lead pattern (6) is formed so as to connect to each other.
An IC chip (4), which is a semiconductor element of an electronic component, is attached to each of the device holes of the tape carrier (2) by an inner lead bonding method or the like. At this time, each electrode of the IC chip (4) is attached. The pads and the corresponding lead patterns (6) are wired. As above
The structure of the probe device (1) for inspecting the tape carrier (2) having the IC chip (4) mounted thereon will be described below.

In this probe device (1), as shown in FIG. 1, a tape carrier (2) having an IC chip (4) as an object to be inspected is wound around a rotation shaft (8) of a supply reel (7). There is.

The tape carrier (2) wound around the supply reel (7) is rotatably provided around the rotation shaft (11) via the tape carrier feeding sprocket (9) and the inspection unit (10). It is wound on a reel (12). The sprocket (9) is connected to a motor (not shown), which is a driving device, and the sprocket (9) is rotated in a desired rotation direction by allowing the motor to selectively rotate in forward and reverse directions. It is possible. The sprocket (9) is mounted on a slide body (not shown) slidably provided in the central axis direction together with the motor. Such a sprocket (9) has, as shown in FIG.
A protrusion, for example, a tractor (13) is provided at a corresponding position of the sprocket hole (3) of the tape carrier (2). The tractor (13) is inserted into the sprocket hole (3) so as to be engaged with each other. The tractor (13) has a feeding direction (14) side and the sprocket hole (3) feeding direction (14) side. Is a shape that can be fed while aligning. The sprocket (9) is provided, for example, in two systems before and after the inspection unit (10). As shown in FIG. 3, the inspection unit (10) has
First, the ITV camera (15) is installed above the tape carrier (2) in the order of the feeding direction (14) of the tape carrier (2). Image processing alignment by pattern recognition is performed by this ITV camera (15). Next, the probe unit (16) is arranged. This probe unit (16) has a large number of probe bodies, such as probe needles (17), corresponding to the arrangement pattern of the electrode terminals (5) formed on the tape carrier (2) on a so-called printed circuit board. The array is installed. Each probe needle (1
From the mounting position of 7), printed wiring is connected so as to be connected to a tester (not shown) in an insulated state. Such a probe unit (16) is engaged with an elevating mechanism (not shown) and is movable in the vertical direction with respect to the tape carrier (2). A mounting table (18) for mounting and fixing the tape carrier (2) is installed below the tape carrier (2) at a position facing the probe unit (16). A vacuum hole (not shown) is provided on the upper surface of the mounting table (18) so that the tape carrier (2) can be vacuum-sucked. Further, the mounting table (18) is engaged with an elevating mechanism (not shown) and is movable in the vertical direction with respect to the tape carrier (2).
Further, it is slidable in the horizontal direction at a right angle to the feeding direction (14) of the tape carrier (2). Further, when the tape carrier (2) to which the IC chip (4) is mounted and connected is wound around the supply reel (7) and the storage reel (12), the IC chip (4) and the tape carrier (2) are protected. For the purpose of, a spacer (19) is wound between the tape carriers (2). This spacer (19)
It is provided with the same width as the tape carrier (2), for example, 35 mm, and projections are alternately provided on both sides of the spacer (19), that is, at positions corresponding to the sprocket holes (3) of the tape carrier (2). Has been. This projection prevents the tape carrier (2) from coming into contact with the IC chip (4) when the tape carrier (2) is wound around the supply reel (7) and the storage reel (12). or,
The spacer (19) leaves the tape carrier (2) in accordance with the movement of the tape carrier (2) and is transferred from the supply reel (7) to the storage reel (12) via guide rollers (20) provided at, for example, two places. Being rolled up. At the time of this winding, the spacer (19) is again connected to the inspected tape carrier (2) for protection.

The operation of the probe device (1) as described above is controlled by a built-in CPU, and when setting the operation of the probe device (1), it is possible to input a key from an operation panel (not shown). There is. Also, the above CPU
A storage mechanism (not shown), such as a floppy disk or RAM, is connected to the storage device, and it is possible to store the inspection result of the IC chip (4) mounted on the tape carrier (2), such as good or bad, and the function level. Has been done. The inspection results stored in the storage mechanism can be displayed as a table (map) on the display mechanism provided in the probe device (1), for example, the TV monitor (21), via the CPU. It is also possible to print out with a printer (not shown).

As described above, the tape carrier (2) having the IC chip (4) mounted thereon is transported by the reel-to-reel system,
A device for inspecting the electrical characteristics of the IC chip (4) is configured.

Next, a method of inspecting the IC chip (4) mounted on the tape carrier (2) by the probe device (1) described above will be described.

The probe device (1) operates according to a program stored in a CPU incorporated in the probe device (1). First, the sprocket (9) for feeding the tape carrier and the storage reel (12) rotate together. By this,
The tape carrier (2) is transferred to the inspection unit (10) at the same speed. The tape carrier (2) transferred to the inspection unit (10) is aligned by the ITV camera (15).
In this alignment, the tape carrier (2) installed at the image pickup position of the ITV camera (15) is imaged, and this imaged output is compared with reference data stored in advance. Performs so-called pattern recognition. After this alignment, the tape carrier (2) is pitch-fed by a predetermined amount in the feed direction (14), and the IC chip (4) mounted on the tape carrier (2)
Perform the inspection of. This inspection is performed by vacuum suction and fixing on the upper surface of the mounting table (18) on the back surface of the sent tape carrier (2). In this fixed state, each probe body, for example, the probe needle array of the probe unit (16) and the electrode terminal (5) of the tape carrier (2) on which the IC chip to be inspected is mounted are aligned by the above alignment. Next, the probe unit (16) and the mounting table (18) are relatively moved in the vertical direction. For example, the probe unit (16) is lowered by a predetermined amount. As a result, each probe needle (17) and each electrode terminal (5) of the tape carrier (2)
Is connected. In this state, the tester and the probe needle (17) are in the conductive state, and therefore the electrical characteristic test is executed by the tester. The inspection result is stored in the storage mechanism via the CPU incorporated in the probe device (1). The stored contents are the IC chip (4) mounted on the tape carrier (2).
When the inspection is performed up to the functional level, the information is stored up to the good / bad of the above, and the determined functional level is stored. The inspection result for each IC chip (4) thus stored can be displayed on the TV monitor (21) provided in the probe device (1) or printed out by a printer (not shown) when desired. At this time, each IC chip (4) mounted on the tape carrier (2) is displayed in a map format, and the yield can be displayed at the same time from the number of non-defective products and defective products. After the connection inspection, the probe unit (16) is raised by a predetermined amount to bring the probe needles (17) and the electrode terminals (5) into a non-connected state. Furthermore, the vacuum suction fixation of the tape carrier (2) by the mounting table (18) is released. At this time, in order to prevent the generation of dust and the like, it is desirable to lower the mounting table (18) so that the mounting table (18) and the tape carrier (2) are surely brought into a non-contact state. In this state,
The tape carrier (2) is pitch-fed by a predetermined amount, and each IC chip (4) is sequentially inspected, and the inspection result is stored in a storage mechanism.

In this way, after the pass / fail of each IC chip mounted on the tape carrier is stored in the storage mechanism, the stored contents are provided to the next process equipment and related equipment. As a method of providing this, when the storage mechanism can carry in and out a floppy disk, a magnetic disk, an optical disk, etc., the operator manually exchanges the disk with each device, and RA
For those fixedly installed in the probe device such as M, the data is exchanged by connecting to other devices through an interface. Based on the provided information, each related device performs processing. In this way, if the information of the inspection result of the storage mechanism is provided to other related equipment, it is not necessary to provide the marking device in the probe device and it is not necessary to provide the related device with the marking decoding device. The miniaturization of each device can be realized and the work efficiency can be improved. Further, in order to further improve the operation rate of the probe device, the expected inspection end time can be displayed on the TV monitor (21) so that the inspection end time can be determined in advance. Therefore,
The tape carrier inspection apparatus of this embodiment is provided with an end time predicting means for predicting the inspection end time in order to display the expected end time of the inspection on the display mechanism. The end time predicting means counts the inspection time required for each IC chip (4) input by this input means and the input means for inputting the total number of IC chips (4) to the storage mechanism, and accumulates the time. Time counter, an inspected number counter for sequentially accumulating each IC chip (4) counted by the time counter, an accumulated count number by the inspected number counter, an accumulated time by the time counter, and the IC chip (4). And a calculation means for calculating the time required for the inspection of the remaining IC chips (4) based on the total number of the above to obtain the expected inspection end time. Then, this expected inspection end time is calculated as shown in FIG. 4 by using the end time predicting means. For example, the number of mounted IC chips (4) mounted on the tape carrier (2) is input to the CPU of the probe device (1) before the inspection (A). Next, the inspection is started according to a predetermined program (B). The elapsed time from the start of the inspection to the inspection, such as the tape carrier feeding time, the alignment time, and the inspection time due to the connection of the probe needle (17), is counted (C). At the same time as this elapsed time, the number of inspected IC chips (4) is counted (D). Calculation is performed (E) from the conditions of the number of IC chips to be inspected (A), the elapsed time (C), and the number of inspected IC chips (D). This operation (E) is obtained by dividing the elapsed time (C) by the number of inspected IC chips (D) and subtracting the number of inspected IC chips (D) from the number of inspected IC chips (A). It is a thing. That is, when expressed by an equation, Becomes

The value derived from the above formula is the expected end time (F). This estimated end time (F) is the probe device (1)
The image is displayed on a TV monitor (21) provided on the computer or on a liquid crystal display panel not shown. The expected inspection end time, which is derived once by the above formula, is subtracted from the calculated time point, for example, every second, and the above calculation is performed every time the inspected IC chip is counted, and is displayed until then. If there is an error in the expected end time, correct it as needed and display the almost accurate expected end time. It is more effective to display the estimated end time based on this estimated end time.

As described above, by displaying the expected finish time of the tape carrier with a large number of IC chips to be inspected, it is possible to judge the inspection time in advance and effectively prepare for the next process. Becomes

The present invention is not limited to the above embodiment, and a storage mechanism may be provided separately from the probe device for system management. As another storage mechanism, a magnetic disk, an optical disk, a magnetic tape, etc. can be written and read. Any item will do. Further, the method of calculating the expected inspection end time is not limited to the above embodiment, and any method may be used.
Further, when the expected end time reaches within a predetermined time, a warning sound such as a buzzer may be emitted.

[Brief description of drawings]

FIG. 1 is an explanatory view of a probe device used in one embodiment of the method of the present invention, and FIG. 2 is an IC to be inspected by the probe device of FIG.
FIG. 3 is an explanatory view of a tape carrier in which is mounted, FIG. 3 is an enlarged view of an inspection portion of the probe device of FIG. 1, and FIG. 4 is a block diagram illustrating calculation of the expected inspection end time of FIG. 1 ... Probe device, 2 ... Tape carrier, 4 ... IC chip, 10 ... Inspection section, 21 ... TV monitor

Claims (5)

[Claims] 1. An apparatus for sequentially inspecting electrical characteristics of a large number of electronic components mounted on a tape carrier, and a storage mechanism for storing the total number of electronic components mounted on the tape carrier and the inspection result of each electronic component. , A display mechanism for displaying the inspection result stored by the storage mechanism, and an end time predicting means for predicting the inspection end time so as to display the expected end time of the inspection on the display mechanism. The means includes a time counter that counts the inspection required time of each electronic component stored in the storage mechanism and accumulates the time, and an inspected number counter that sequentially accumulates the electronic components counted by the time counter. , The total number of counts by this inspected number counter,
An inspection device for a tape carrier, comprising: arithmetic means for calculating an inspection required time for the remaining electronic components based on the total time of the time counter and the total number of the electronic components to obtain an estimated inspection end time. 2. The tape carrier inspection device according to claim 1, wherein the results stored in said storage mechanism are displayed in a table. 3. The tape carrier inspection device according to claim 1, wherein the electronic component is an IC. 4. The tape carrier inspection device according to claim 1, wherein the electronic components are selected based on the inspection result stored in the storage mechanism. 5. The tape carrier inspection device according to claim 1, wherein the storage mechanism stores the inspection result according to whether the inspection result is good or bad.