JPH0815237B2 - Electronic component automatic mounting device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component automatic mounting apparatus for automatically mounting electronic components on a printed circuit board, and particularly to a bare chip in which a semiconductor chip is not molded in a synthetic resin mold body with high work efficiency and high efficiency. The present invention relates to a device for automatically mounting a plurality of printed circuit boards with high accuracy.

[0002]

2. Description of the Related Art In recent years, various types of devices for automatically mounting electronic parts (generally called bare chips) on which semiconductor chips are not molded in a molded body have been proposed. There is an increasing demand for shortening the mounting time in order to mount electronic parts on a predetermined position of a substrate accurately and surely and to improve work efficiency.

FIG. 5 is a plan view of a conventional electronic component mounting apparatus, in which a printed circuit board 5 is conveyed on a board rail 67 and positioned at a position (m) below an adhesive application head 68. An adhesive supply device (hereinafter referred to as an epoxy unit) 27 is provided in front of the coating head 68, and the coating head 68 is held on the XY table 1. In this case, the XY table 1 is driven and the coating head 68 moves in the XY directions (directions of the arrow O), so that the adhesive agent of the epoxy unit 27 is applied to a predetermined position of the printed circuit board 5. In the figure, B1 to B4 are adhesives applied to the substrate 5.

Next, the printed circuit board 5 is conveyed in the M direction,
It is positioned at a position (n) below the transfer head 69. 7
Is a substrate holder. The transfer head 69 is also held on the XY table 1 and can move in the XY directions.

Electronic components 11 are provided on the side of the substrate holder 7.
A position deviation correcting device (hereinafter referred to as a pre-center) 71 for correcting the position deviation is provided, and an electronic component supply device 9 is provided on the side of the pre-center 71. The electronic component supply device 9 includes a jig 21 equipped with a wafer to which an electronic component 11 that is a bare chip is bonded. The jig 21 moves in the XY directions (arrow A directions) and the index device 12 is also provided. To rotate horizontally.

A rotating arm 72 is provided on the side of the pre-center 71 and the electronic component supplying device 9, and the jig 2 is rotated by rotating the rotating arm 72 in the direction of arrow P.
The sub-mounting head 70 at the tip of the rotating arm 72 picks up the electronic component 11 on the first electronic component 11, and the pre-center 71
Reprinted to. In the pre-center 71, the positional deviation of the electronic component 11 is corrected by pressing the position regulating claw 73 against the electronic component 11 from four directions. Next, the transfer head 69 moves in the direction of the arrow N to pick up the electronic component 11 on the pre-center 71 and transfer it onto the adhesives B1 to B4 previously applied to the substrate 5. The board 5 on which the electronic component 11 is mounted in this manner is carried out by the conveyor 17 in the L direction (arrow).

[0007]

According to the above conventional means, the substrate 5 is positioned at the coating position (m), the adhesive is applied to a plurality of points on the substrate 5 by the coating head 68, and then the substrate 5 is conveyed by the conveyor 67. The front transfer head 69
The electronic component 11 is transferred to the mounting position (n), and the substrate 5 is repositioned at the mounting position (n).

That is, in this conventional means, since the substrate 5 has to be positioned twice, the mechanism is complicated accordingly. Moreover, when the substrate 5 is positioned twice at the position (m) and the position (n), both positions (m),
In the case of (n), there is a problem that the relative displacement of the substrate 5 occurs, which makes it difficult to mount the electronic component 11 on the adhesives B1 to B4 with high positional accuracy.

The sub-transfer head 70 is the coating head 6
8 and the transfer head 60, and the conveyor 67 and the substrate holder 7 are provided on the opposite side to the electronic component 11 on the jig 21 due to the rotational movement of the rotational arm 72.
Since it is designed to be transferred and mounted on the pre-center 71, there is a problem that a large installation space is required.

Further, this device is provided with a plurality of types of electronic parts 11
However, since the substrate 5 cannot be moved in the XY directions, the sub transfer head 68 and the transfer head 69 are driven by the XY table 1 to move in the XY directions. Adhesives B1 to B4 on a plurality of points on the substrate 5
Or adhesives B1 to B
It is designed to be mounted on the 4. That is, in this product, the adhesives B1 to B4 are applied in advance to a plurality of points on the substrate 5 while the coating head 68 is moved in the XY directions, and then the substrate 5 is conveyed in the M direction and repositioned, and then the transfer head. While moving 69 in the XY direction, the adhesive B
1 to B4, a plurality of electronic components 11 are mounted one after another. In this way, the substrate 5 is placed at the position (m).
If the substrate 5 is moved to the position (n) after the adhesive is applied to the adhesive, the adhesives B1 to B4 applied to the substrate 5 easily flow out before the electronic component 11 is mounted. was there.

Therefore, an object of the present invention is to provide an electronic component automatic mounting apparatus capable of solving the problems of the above-mentioned conventional means.

[0012]

Means for Solving the Problems] The present invention To this end, base
Electricity for automatically mounting electronic components that are chips on the board
A child component automatic mounting device, which is an electronic component supply device, an electronic component position shift correction device, an XY direction moving device for positioning a substrate and moving the board in XY directions, and an adhesive agent.
The four devices of the adhesive supply device provided with the container are arranged side by side side by side, and reciprocally moved between the electronic component supply device and the positional deviation correction device, and the electronic device provided in the electronic component supply device is moved. a sub transfer head that adsorbs components to the nozzle transfers in the positional deviation correction apparatus, between the positional deviation correction apparatus and the XY direction moving device reciprocates the position correction in the positional deviation correction device made A transfer head for adsorbing the electronic component to a nozzle and transferring the electronic component onto a substrate positioned by the XY direction moving device ;
The adhesive stored in the container is moved back and forth between
Nozzle attached to the lower end of the substrate and transferred to the above substrate for application
3 heads of adhesive application head with
These three heads are installed side by side above the device of
While reciprocating in the lateral direction,
From the electronic component supply device to the misregistration correction device.
Transfer work to transfer the child parts and the above adhesive application head
The base of the adhesive stored in the container by the nozzle
Applying to the plate and position in the above position shift compensator
Mount the electronic components that have been corrected for misalignment using the above transfer head.
Three transfer operations to transfer onto the adhesive applied to the substrate
The work of is done in parallel at the same time .

[0013]

In the above structure, the sub transfer head moves between the electronic component supply device and the positional deviation correction device, and transfers the electronic component of the electronic component supply device to the positional deviation correction device. Also
The adhesive application head is an adhesive supply device and an XY direction moving device.
Moves back and forth between the upper substrates, and adhesive is applied to the substrates by the nozzle.
Is transferred and applied. Further, the transfer head picks up the electronic component whose positional deviation has been corrected by the positional deviation correcting device and transfers it onto the adhesive on the substrate of the XY direction moving device.
That is, picking up electronic components and second only
Misalignment correction work, adhesive application work, electronic component transfer work
Work such as work is performed in parallel at the same time.

In this case, the substrate is placed on the XY movement device 1
The positioning is required only once, and the substrate is moved in the XY directions by driving the XY direction movement device, and at the same stage, the adhesive is applied by the adhesive application head and the electronic parts are transferred onto the adhesive. Is done. Moreover, in this case, when the adhesive is transferred and applied to one point of the substrate by the nozzle of the adhesive application head , the electronic head is immediately transferred onto this adhesive by the transfer head immediately after each transfer.
Listed .

[0015]

Embodiments of the present invention will be described below with reference to the drawings.

In FIG. 2, reference numeral 1 is a transfer device, and a board stocker 4 on the back side of which a printed board 5 is stocked.
1, a lifter device (loader) 3, a pushing device 2 for pushing and supplying the printed circuit board 5, and a carry-in conveyor 6. An XY-direction moving device 7 that moves in the XY directions is provided in front of the carry-in conveyor 6 (FIG. 1).
See also). Reference numeral 8 is a transfer device.

The substrate 5 of the stocker 4 is conveyed on the conveyor 6 and positioned on the XY direction moving device 7. The board 5 on which the electronic component 11 is mounted on the XY direction moving device 7 is collected by the carry-out conveyor 17 and the carrying device 15 into the board stocker 4 held by the lifter device (unloader) 14.

1 to 4, an XY table 10 is provided in front of the center. An electronic component supply device 9 and an index device 12 are provided on the XY table 10. As shown in FIG. 1, this index device 1
The jig 21 is attached and fixed to the jig 2 with screws 22, and the electronic component 11 is attached to the jig 21. XY
When the table 10 is driven, the jig 21 moves in the XY directions, and when the index device 12 is driven, the jig 21 is moved.
Rotates horizontally.

In FIGS. 1 and 2, a push-up device 23 (hereinafter referred to as an ejector) having a push-up pin 24 for pushing up the electronic component 11 in the C direction (arrow) is provided below the jig 21. Further, on the side thereof, a positional deviation correcting device 13 for correcting the positional deviation of the electronic component 11 is provided.
(Hereinafter referred to as pre-center) is provided. This phone
As for the child parts, the semiconductor chip is molded in the mold body.
There is no so-called bare chip. 39 is the pre-center 13
It is a position control claw provided on the. Further, the XY-direction moving device 7 having a motor 26 for driving the X-axis and a motor 25 for driving the Y-axis is provided on its side, and moves the substrate 5 in the B-direction (XY direction).

Further, an adhesive supply device (hereinafter referred to as an epoxy unit) 27 is provided on the side thereof. This epoxy unit 27 is a container with a ring-shaped groove.
The ring 29 is provided with an adhesive agent. 28 is a motor, which horizontally rotates the ring 29.

The electronic component supply device 9 and the pre-center 1
3, the XY direction moving device 7, and the exhaust unit 27 are arranged side by side. Above these, the sub-transfer head 40a and the transfer head 40 of the transfer device 1 are arranged.
b, three heads of the adhesive application head 40c are located. Further, the carry-in conveyor 6 and the carry-out conveyor 17 are
It is arranged in a direction orthogonal to the side-by-side direction. By laying out the entire device in this manner, the entire device can be made compact. Next, a detailed structure of the transfer device 1 will be described.

In FIG. 1, the devices 9 and 1 are arranged side by side.
Blocks 31 are provided on the back surfaces of 3, 7, and 27. A guide rail 76 is provided on the block 31, and the plate 44 is inserted through the guide rail nut 38.
a and 44b are provided. A sub transfer head 40a is provided on the plate 44b. The sub transfer head 40a moves laterally along the guide rails 76, so that the electronic component supply device 9 and the pre-center 1 are moved.
3, the nozzle 73 moves up and down in the H direction to pick up the electronic component 11 pushed up by the pin 24 of the ejector 23, and transfers and mounts it on the pre-center 13. The sub transfer head 40a includes a motor 41 for correcting the angle of the electronic component 11 sucked by the nozzle 73.
Is provided.

The transfer head 40b is mounted on the plate 44a.
And an adhesive applying means 40c as an adhesive applying head is mounted. The transfer head 40b includes the guide rail 7
By moving in the lateral direction along 6, the electronic component 11 is reciprocated between the pre-center 13 and the XY-direction moving device 7, and the positional deviation is corrected in the pre-center 13.
Are transferred to and mounted on the substrate 5 positioned on the XY direction moving device 7. Similarly, the adhesive applying means 40c reciprocates between the epoxy unit 27 and the XY direction moving device 7 to apply the adhesive of the epoxy unit 27 to the nozzle 75.
This adhesive is applied to the substrate 5 by attaching it to the lower end of (Fig. 1).
Transfer and apply.

The transfer head 40b is provided with a plurality of nozzles 74 for adsorbing the electronic components 11, and by driving the motor 42 to rotate the nozzles 74, the nozzles 74 suitable for the size and shape of the electronic components 11 are obtained. select. Similarly to this, the adhesive applying means 40c also has a plurality of nozzles 75, and by driving and rotating the motor 43, the nozzles 75 conforming to the size and shape of the electronic component 11 are formed.
Select Then, only the selected nozzles 74 and 75 are moved up and down in the H direction by the up-and-down moving means (described later).

In FIG. 1, a bearing 66 mounted on the side surface of the block 31 is provided with a shaft 33 that rotates about its axis through the bearing. The sub transfer head 40 a and the transfer head 4 are attached to the shaft 33.
0b, a position where the adhesive applying means 40c stops, that is, above the pre-center 13, the XY direction moving device 7, and the epoxy unit 27, a lever as a vertical moving means for vertically moving each nozzle 73, 74, 75. 36, 37
Is provided. Reference numeral 35 is a plate attached to the lever 36, and 34 is a solenoid which operates independently in response to a trouble or the like. When the shaft 33 rotates about its axis, the levers 36 and 37 simultaneously swing to move the nozzles 73, 74 and 75 selected as described above up and down.

3 and 4, 54 is a motor, 55
Is a cam drive device, 56 is a rod that is driven by the cam drive device 55 to move up and down in the I direction, and 57 is a pin 58 centering on the J axis.
The lever 59 swings in the direction, and 59 is a rod driven by the lever 57 to reciprocate in the E direction. The plate 44
a and 44b are connected to this rod 59, so that when the motor 54 is driven, the sub transfer head 40
The transfer head 40b and the adhesive applying means 40c reciprocate in the lateral direction along the guide rail 76 as described above.

The shaft 33 is connected to a cam driving device 55 via a rod 60, a ball joint 64, and an arm 65. When the motor 54 is driven, the rod 60 moves up and down in the G direction and the shaft 33 moves. The levers 36, 37 swing and the nozzles 73, 74, 75 move up and down by rotating around the axis.

The ejector 23 includes the rod 6
1, a cam drive device 55 is connected via a lever 63 pivotally supported by a pin 62. When the motor 54 is driven,
The rod 61 reciprocates in the K direction, and the lever 63 moves to the pin 62.
The pin 24 moves up and down by swinging around, and pushes up the electronic component 11 on the jig 21. The sub transfer head 40a
Picks up the electronic component 11 pushed up by the pin 24 by adsorbing it to the nozzle 73.

As described above, in this apparatus, the sub-transfer head 40a, the transfer head 40b, and the adhesive applying means 40c are reciprocated in the lateral direction by the single motor 54, and the respective nozzles 7 are moved.
Vertical movement of 3,74,75 and pin 2 of the ejector 23
4 is moved up and down so as to simplify these drive systems and facilitate the timing of each operation. Particularly, by driving the push-up pin 24 and the nozzle 73 of the sub transfer head 40a by the same motor 54, the push-up timing of the pin 24 and the pick-up timing of the nozzle 73 can be surely matched, and the electronic component 11 due to the deviation of both timings. It has eliminated the pickup mistake.

The present apparatus has the above-mentioned structure, and its operation will be described below. The substrate 5 extruded from the stocker 4 by the extruding device 2 is X-passed by the carry-in conveyor 6.
It is sent to the Y-direction moving device 7 and is transferred to the XY-direction moving device 7.
Positioned on top. Then, by driving the motor 54, as shown in FIG. 3, the sub-transfer head 40a, the transfer head 40b, and the adhesive applying means 40c stop immediately above the ejector 23 and the pre-center 13XY direction moving device base 7, respectively. To do. In this state, when the shaft 33 rotates, the levers 36 and 37 swing, and the nozzles 73, 74 and 75 move up and down. At the same time, the pin 24 of the ejector 23 pushes up the electronic component 11 of the jig 21 from below, and the nozzle 73 sucks and picks up the electronic component 11 while moving up and down. The nozzle 74 of the transfer head 40b moves up and down to pick up the electronic component 11 whose positional deviation has been corrected by the pre-center 13, and the nozzle 75 of the adhesive application means 40c moves up and down to the lower end thereof. The adhered adhesive is applied to the substrate 5.

Then, as the motor 54 is further driven, as shown in FIG. 4, the sub transfer head 40a, the transfer head 40b, and the adhesive applying means 40c move to the right along the guide rail 76. Each pre-center 1
3. Stop right above the XY direction moving device 7 and the epoxy unit 27. Next, when the levers 36 and 37 swing, the nozzle 73 moves up and down, the electronic component 11 is transferred to the pre-center 13, and the nozzle 74 also moves up and down, and the electronic component 11 attracted to the lower end thereof. Is mounted on the adhesive previously applied to the substrate 5 as described above, and the nozzle 7
5 also moves up and down to attach the adhesive stored in the ring 29 to the lower end thereof. That is, this is applied to the substrate 5 by the adhesive application means 40c one by one, and immediately after each time, the transfer head 4 is immediately applied.
The electronic component 11 is adhered onto this adhesive by 0b.

Then, when the motor 54 is further driven, the sub transfer head 40a, the transfer head 40b, and the adhesive applying means 40c are moved to the left, and the ejector 23, the pre-center 13, and the XY direction moving device 7, respectively. And then returns to the state shown in FIG. Next, the nozzle 73 moves up and down to pick up the electronic component 11 on the jig 21, and the nozzle 74 moves the electronic component 1 on the pre-center 13.
1 is picked up, and the nozzle 75 applies the adhesive attached to the lower end of the nozzle 75 to the substrate 5.

As described above, the motor 54 is driven so that the sub-transfer head 40a, the transfer head 40b, and the adhesive applying means 40c simultaneously reciprocate laterally, so that the electronic component 11 on the jig 21 is moved. Transfer to pre-center 13,
The transfer of the electronic component 11 to the substrate 5 on the pre-center 13 and the application of the adhesive to the electronic component mounting position of the substrate 5 are repeatedly performed simultaneously as a series of operations. The sheets are conveyed to the carry-out conveyor 17 and collected in the stocker 4.

In this device, a plurality of types of electronic components 1 are provided on the substrate 5.
It is equipped with 1. Therefore, as shown in FIGS. 1 and 2, the electronic device supply device 9 includes the index device 1
2, a plurality of jigs 21 are arranged, and each jig 21 is equipped with various kinds of electronic components 11. Further, the index device 12 is the XY table 10
It is installed above and can be moved in the XY directions. Therefore, by driving the index device 12 to horizontally rotate each jig 21, the desired electronic component 1
The jig 21 equipped with 1 is positioned directly above the ejector 23. Further, in that state, the XY table 10 is driven to move the jig 21 in the XY directions, so that the predetermined electronic component 11 is stopped immediately above the pin 24 and picked up by the nozzle 73 of the sub transfer head 40a. .

The substrate 5 is also moved in the XY directions by being driven by the XY direction moving device 7, the adhesive is applied to the predetermined coordinate positions by the nozzle 75, and the transfer head is placed on the adhesive. The electronic component 11 attracted to the nozzle 74 of 40b is mounted.

[0036]

According to the present invention as described above, according to the present invention, Sa
The transfer head, transfer head, and adhesive application head
Corrects the misalignment between the head and the electronic component supply device
An XY direction moving device for positioning the device and the substrate and an adhesive
Reciprocating laterally above the four devices of the feeder
From the electronic component supply device by the sub transfer head while
Transfer work to transfer electronic parts to the misalignment correction device
Adhesive stored in the container by the nozzle of the adhesive coating head
Apply to the substrate of the
Electronic components that have been corrected for misalignment are transferred to the substrate by the transfer head.
Perform three operations of transfer operation to transfer on the applied adhesive
Since it is done in parallel at the same time,
Workability at the same time in parallel for various operations for automatically mounting on a board
It can often be done at high speed. Also, it is sufficient to position the board once, and while applying the adhesive one by one in that state, each time immediately after that, electronic parts are immediately mounted one after another, so that a plurality of electronic parts can be worked on the board. It can be mounted with good performance and position accuracy, and the entire configuration of the device for performing the above various operations
Ru can be configured in a compact.

[Brief description of drawings]

FIG. 1 is a perspective view of an electronic component automatic mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of the same.

FIG. 3 is a front view of the device.

FIG. 4 is a front view of the device.

FIG. 5 is a plan view of a conventional electronic component automatic mounting apparatus.

[Explanation of symbols]

 5 substrate 7 XY direction moving device 9 electronic component supply device 11 electronic component 13 pre-center (positional deviation correcting device) 40a sub transfer head 40b transfer head 40c adhesive applying means 73 nozzle 74 nozzle 75 nozzle

Claims (1)

[Claims] 1. An electronic component, which is a bare chip, is automatically mounted on a substrate.
An electronic component automatic mounting device for mounting, an electronic component supply device, an electronic component positional deviation correction device, an XY direction movement device for positioning a substrate and moving it in XY directions ,
The four adhesive supply devices including the container in which the adhesive is stored are horizontally arranged side by side, and reciprocally move between the electronic component supply device and the positional deviation correction device. A sub-transfer head that sucks an electronic component provided in the nozzle onto a nozzle and transfers the electronic component to the positional deviation correction device;
The electronic component whose position is corrected by the positional deviation correction device is reciprocally moved between the positional deviation correction device and the XY direction moving device, and the electronic component is adsorbed by the nozzle and transferred to the substrate positioned by the XY direction movement device. Transfer head and above
It reciprocates between the container and the substrate and is stored in the container.
Transfer the above adhesive to the substrate by attaching it to its lower end.
Of the adhesive application head with a nozzle for applying
Heads are installed side by side above the above four devices,
While reciprocating the three heads in the horizontal direction,
Position from the electronic component supply device by the transfer head
Transfer work to transfer electronic parts to the deviation correction device, and
Stored in the container by the nozzle of the adhesive coating head
Applying adhesive to the above substrate and correcting the misalignment
Move the electronic components that have been misaligned in the device
Transfer on the adhesive applied to the substrate by the mounting head
An electronic component automatic mounting device characterized in that it performs three transfer operations simultaneously in parallel .