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JPH0817262B2 - Single wavelength oscillation semiconductor laser device - Google Patents
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JPH0817262B2 - Single wavelength oscillation semiconductor laser device - Google Patents

Single wavelength oscillation semiconductor laser device

Info

Publication number
JPH0817262B2
JPH0817262B2 JP1213553A JP21355389A JPH0817262B2 JP H0817262 B2 JPH0817262 B2 JP H0817262B2 JP 1213553 A JP1213553 A JP 1213553A JP 21355389 A JP21355389 A JP 21355389A JP H0817262 B2 JPH0817262 B2 JP H0817262B2
Authority
JP
Japan
Prior art keywords
diffraction grating
semiconductor laser
laser device
wavelength oscillation
single wavelength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1213553A
Other languages
Japanese (ja)
Other versions
JPH0376291A (en
Inventor
裕二 大倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1213553A priority Critical patent/JPH0817262B2/en
Priority to CA002023510A priority patent/CA2023510C/en
Priority to US07/568,889 priority patent/US5238785A/en
Priority to EP90115836A priority patent/EP0413365B1/en
Priority to DE69018336T priority patent/DE69018336T2/en
Publication of JPH0376291A publication Critical patent/JPH0376291A/en
Priority to US08/058,371 priority patent/US5386433A/en
Publication of JPH0817262B2 publication Critical patent/JPH0817262B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は単一波長で発振する半導体レーザ装置に関
するものである。
The present invention relates to a semiconductor laser device that oscillates at a single wavelength.

〔従来の技術〕[Conventional technology]

第2図は例えば技術雑誌光学の第15巻第2号115〜121
頁に示された従来の単一波長発振半導体レーザ装置の断
面図で、図において、(1)はn型InP基板、(2)は
中央部に位相シフト領域を持つ回折格子、(3)はInGa
AsPガイド層、(4)はInGaAsP活性層、(5)はP型In
P、(7)は電極金属、(8)は無反射コーテイング膜
である。
FIG. 2 is, for example, Volume 15 No. 2, 115-121 of Technical Journal Optics.
FIG. 1 is a cross-sectional view of a conventional single-wavelength oscillation semiconductor laser device shown in page, in which (1) is an n-type InP substrate, (2) is a diffraction grating having a phase shift region in the center, and (3) is InGa
AsP guide layer, (4) InGaAsP active layer, (5) P-type In
P, (7) is an electrode metal, and (8) is a non-reflective coating film.

次に動作について説明する。半導体レーザ装置におい
ては、n型InP(1)中の電子およびP型InP(5)中の
ホールは共にInGaAsP活性層(4)に注入され発光再結
合を起こす。活性領域に位相シフト領域を有する回折格
子(2)を持つ分布帰還型(DFB)レーザ装置では、発
光再結合により生じた光は回折格子(2)により反射さ
れ、素子内を往復することによりレーザ発振に至る。
Next, the operation will be described. In the semiconductor laser device, both electrons in n-type InP (1) and holes in P-type InP (5) are injected into the InGaAsP active layer (4) to cause radiative recombination. In a distributed feedback (DFB) laser device having a diffraction grating (2) having a phase shift region in the active region, the light generated by radiative recombination is reflected by the diffraction grating (2) and reciprocates within the device to produce a laser beam. Leads to oscillation.

回折格子(2)は波長λ=2neffΛ/n(neffは等価屈
折率、Λは回折格子(2)のピツチ間隔、nは整数)で
表わされる光を効率的に反射することから、発振波長は
λ=2neffΛ/nで表わされる波長のうち、活性領域での
利得が最も大きい波長となる。発振波長λがn=1で表
わされる場合、回折格子を1次の回折格子と呼び、n=
2の場合は2次の回折格子と呼ぶ。
Since the diffraction grating (2) efficiently reflects light represented by the wavelength λ = 2n eff Λ / n (n eff is the equivalent refractive index, Λ is the pitch of the diffraction grating (2), and n is an integer), The oscillation wavelength is the wavelength having the largest gain in the active region among the wavelengths represented by λ = 2n eff Λ / n. When the oscillation wavelength λ is represented by n = 1, the diffraction grating is called a first-order diffraction grating, and n =
The case of 2 is called a secondary diffraction grating.

第2図に示された構造の単一波長発振半導体レーザ装
置では、光は活性領域内の回折格子(2)のみにより反
射され、素子内部に閉じ込められるため素子中央部にお
ける光の密度が高くなり、ホールバーニング等の影響で
光出力の注入電流に対する直線性および単一波長発振の
安定性が低下するという問題がある。
In the single wavelength oscillation semiconductor laser device having the structure shown in FIG. 2, light is reflected only by the diffraction grating (2) in the active region and is confined inside the device, so that the density of light in the central part of the device becomes high. However, there is a problem that the linearity of the optical output with respect to the injection current and the stability of single wavelength oscillation are deteriorated due to the influence of hole burning and the like.

〔発明が解決しようとする課題〕[Problems to be Solved by the Invention]

従来の単一波長発振半導体レーザ装置は以上のように
構成されていたので、素子中央部の光の密度が高くな
り、光出力の注入電流に対する直線性および単一波長発
振の安定性が低いという問題点があつた。
Since the conventional single-wavelength oscillation semiconductor laser device is configured as described above, the density of light in the central portion of the device is high, and the linearity of the optical output with respect to the injection current and the stability of single-wavelength oscillation are low. There was a problem.

この発明は上記のような問題点を解消するためになさ
れたもので、光出力の注入電流に対する直線性および単
一波長発振の安定性に優れた単一波長発振半導体レーザ
装置を得ることを目的とする。
The present invention has been made to solve the above problems, and an object thereof is to obtain a single-wavelength oscillation semiconductor laser device having excellent linearity of optical output with respect to injection current and stability of single-wavelength oscillation. And

〔課題を解決するための手段〕[Means for solving the problem]

この発明に係る単一波長発振半導体レーザ装置は、素
子中央部の回折格子を共振器端面近傍の回折格子より高
次のものにしたものである。
In the single-wavelength oscillation semiconductor laser device according to the present invention, the diffraction grating in the central portion of the element is of a higher order than the diffraction grating near the end face of the resonator.

〔作用〕[Action]

この発明における単一波長発振半導体レーザ装置は、
素子中央部の回折格子を共振器端面近傍の回折格子より
高次のものにしたので、優れた光出力の注入電流に対す
る直線性および単一波長発振の安定性が得られる。
The single wavelength oscillation semiconductor laser device according to the present invention is
Since the diffraction grating at the center of the device is of a higher order than the diffraction grating near the end face of the resonator, excellent linearity of the optical output with respect to the injection current and stability of single wavelength oscillation can be obtained.

〔実施例〕〔Example〕

以下、この発明の一実施例を図について説明する。第
1図はこの発明の一実施例である単一波長発振半導体レ
ーザ装置の断面図で、図中、(1)はn型InP、(3)
はInGaAsPガイド層、(4)はInGaAsP活性層、(5)は
P型InP、(9)は共振器端面近傍に設けられた1次の
回析格子、(10)は素子中央部に設けられ中央部に位相
シフト領域を持つ2次の回折格子である。
An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view of a single wavelength oscillation semiconductor laser device according to an embodiment of the present invention, in which (1) is n-type InP and (3)
Is an InGaAsP guide layer, (4) is an InGaAsP active layer, (5) is P-type InP, (9) is a primary diffraction grating provided near the end face of the resonator, and (10) is provided at the center of the device. It is a second-order diffraction grating having a phase shift region in the center.

次に動作について説明する。回折格子による光の反射
は低次の回折格子の方が効率よく行なわれる。従つて、
第1図に示したように素子中央部の回折格子(10)を共
振器端面近傍の回折格子(9)より高次のものにするこ
とにより、素子中央部での光の反射強度を共振器端面近
傍では光の反射強度より小さくすることができる。その
結果、活性層(4)で発生した光が素子中央部の回折格
子(10)により、素子中央部のみに閉じ込められること
なく大部分の光は共振器端面近傍まで進行し、そこでの
回折格子により反射される。
Next, the operation will be described. Reflection of light by the diffraction grating is more efficiently performed by the low-order diffraction grating. Therefore,
As shown in FIG. 1, by making the diffraction grating (10) at the center of the element higher than that of the diffraction grating (9) near the end face of the resonator, the reflection intensity of light at the center of the element is increased. In the vicinity of the end face, it can be made smaller than the light reflection intensity. As a result, the light generated in the active layer (4) is not confined only in the central portion of the element by the diffraction grating (10) in the central portion of the element, but most of the light proceeds to the vicinity of the end face of the resonator, and the diffraction grating there. Is reflected by.

従つて、光の密度が素子中央部でのみ高くなることは
なく、素子全体にわたり均一な光の密度となり、ホール
バーニングが生じにくくなり、光出力の注入電流に対す
る直線性および単一波長発振の安定性に優れた単一波長
発振半導体レーザ装置が得られる。
Therefore, the light density does not increase only in the central part of the device, and the light density becomes uniform over the entire device, hole burning is less likely to occur, the linearity with respect to the injection current of the optical output and the stabilization of single wavelength oscillation are achieved. A single-wavelength oscillation semiconductor laser device having excellent properties is obtained.

〔発明の効果〕〔The invention's effect〕

以上のようにこの発明によれば、素子中央部の回折格
子を共振器端面近傍の回折格子より高次のものにしたの
で、光出力の注入電流に対する直線性および単一波長発
振の安定性に優れた単一波長発振半導体レーザ装置が得
られる効果がある。
As described above, according to the present invention, since the diffraction grating in the central portion of the element is of a higher order than the diffraction grating near the end face of the resonator, the linearity of the optical output with respect to the injection current and the stability of single wavelength oscillation are improved. There is an effect that an excellent single wavelength oscillation semiconductor laser device can be obtained.

【図面の簡単な説明】[Brief description of drawings]

第1図はこの発明の一実施例による単一波長発振半導体
レーザ装置を示す断面側面図、第2図は従来の単一波長
発振半導体レーザ装置を示す断面側面図である。 図において、(1)はn型InP基板、(3)はInGaAsPガ
イド層、(4)はInGaAsP活性層、(5)はP型InP、
(6)は共振器端面、(7)は電極金属、(8)は無反
射コーテイング膜、(9)は共振器端面近傍に設けられ
た1次の回折格子、(10)は素子中央部に設けられた2
次の回折格子である。 なお、図中、同一符号は同一または相当部分を示す。
FIG. 1 is a sectional side view showing a single wavelength oscillation semiconductor laser device according to an embodiment of the present invention, and FIG. 2 is a sectional side view showing a conventional single wavelength oscillation semiconductor laser device. In the figure, (1) is an n-type InP substrate, (3) is an InGaAsP guide layer, (4) is an InGaAsP active layer, (5) is P-type InP,
(6) is a resonator end face, (7) is an electrode metal, (8) is a non-reflective coating film, (9) is a first-order diffraction grating provided in the vicinity of the resonator end face, and (10) is in the central part of the element. Provided 2
The next diffraction grating. In the drawings, the same reference numerals indicate the same or corresponding parts.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】中央に位相シフト領域を持つ回折格子を活
性領域に有する半導体レーザ装置において、素子中央部
の回折格子を共振器端面近傍の回折格子より高次のもの
としたことを特徴とする単一波長発振半導体レーザ装
置。
1. A semiconductor laser device having a diffraction grating having a phase shift region in the center in the active region, wherein the diffraction grating at the central portion of the element is of a higher order than the diffraction grating near the end face of the resonator. Single wavelength oscillation semiconductor laser device.
JP1213553A 1989-08-18 1989-08-18 Single wavelength oscillation semiconductor laser device Expired - Lifetime JPH0817262B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP1213553A JPH0817262B2 (en) 1989-08-18 1989-08-18 Single wavelength oscillation semiconductor laser device
CA002023510A CA2023510C (en) 1989-08-18 1990-08-17 Single wavelength oscillating semiconductor laser device and method for manufacturing diffraction grating
US07/568,889 US5238785A (en) 1989-08-18 1990-08-17 Method of manufacturing a diffraction grating for a semiconductor laser
EP90115836A EP0413365B1 (en) 1989-08-18 1990-08-17 Method of manufacturing a diffraction grating
DE69018336T DE69018336T2 (en) 1989-08-18 1990-08-17 Method of making a diffraction grating.
US08/058,371 US5386433A (en) 1989-08-18 1993-05-10 Semiconductor laser including periodic structures with different periods for producing a single wavelength of light

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1213553A JPH0817262B2 (en) 1989-08-18 1989-08-18 Single wavelength oscillation semiconductor laser device

Publications (2)

Publication Number Publication Date
JPH0376291A JPH0376291A (en) 1991-04-02
JPH0817262B2 true JPH0817262B2 (en) 1996-02-21

Family

ID=16641112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1213553A Expired - Lifetime JPH0817262B2 (en) 1989-08-18 1989-08-18 Single wavelength oscillation semiconductor laser device

Country Status (1)

Country Link
JP (1) JPH0817262B2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3180725B2 (en) 1997-08-05 2001-06-25 日本電気株式会社 Distributed feedback semiconductor laser
JP4884081B2 (en) * 2006-05-30 2012-02-22 ルネサスエレクトロニクス株式会社 Distributed feedback laser diode
US10326257B2 (en) 2014-04-25 2019-06-18 Sumitomo Electric Device Innovations, Inc. Semiconductor laser device and manufacturing method of the same
JP6657537B2 (en) * 2014-04-25 2020-03-04 住友電工デバイス・イノベーション株式会社 Semiconductor laser device and method of manufacturing semiconductor laser device
EP3317931B1 (en) * 2015-06-30 2025-08-27 Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik Laser diode having distributed feedback and method for production

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61125187A (en) * 1984-11-22 1986-06-12 Fujitsu Ltd Semiconductor light-emitting device
JPS61214589A (en) * 1985-03-20 1986-09-24 Hitachi Ltd Semiconductor laser device
JP2768940B2 (en) * 1987-07-08 1998-06-25 三菱電機株式会社 Single wavelength oscillation semiconductor laser device

Also Published As

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JPH0376291A (en) 1991-04-02

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