JPH0817273B2 - Multilayer ceramic substrate and manufacturing method thereof - Google Patents

Description

Detailed Description of the Invention 【Overview】

Regarding a multilayer ceramic substrate and a method for manufacturing the same, an object thereof is to provide a multilayer ceramic substrate and a method for manufacturing the same that can obtain a reliable thick film-thin film bonding. In a multilayer ceramic substrate in which a thick film wiring layer of a base material inner layer is connected via a via, the base material has a plurality of position measuring dummy vias, and the measurement coordinate data of the position measuring dummy vias is also stored. And the formation position of the thin film wiring pattern in the vicinity of the thin film wiring pattern is determined, the thin film pad in the thin film wiring pattern is arranged on the via, and the manufacturing method is based on stacking and firing a plurality of green sheets. In the method for manufacturing a multilayer ceramic substrate in which a thin film wiring pattern is formed using a mask on a material, a plurality of position measuring dummy is provided on the green sheet. After forming the vias, the mask data is created by arranging a thin film wiring pattern in the vicinity based on the measurement coordinate data obtained by measuring the position of the dummy vias for position measurement after baking. The thin film wiring pattern is formed by etching the sputtered layer on the base material using the mask created from the above.

[Industrial applications]

The present invention relates to a multilayer ceramic substrate and a method for manufacturing the same. Generally, in electronic devices such as large-scale computers that require high-speed and large-capacity processing, high-density wiring and high-speed wiring are required at the same time, and multilayer ceramic substrates are frequently used to meet these demands.

[Prior art]

FIG. 6 shows a cross-section of the surface layer portion of a conventional multilayer ceramic substrate, in which signal wiring or power supply wiring of an inner layer (not shown) in the base material 2 is drawn out to the surface layer via the via 3 and connected to the thin film wiring pattern 1. To be done. The thin film wiring pattern 1 is formed on the surface layer of the base material 2 after stacking and firing a plurality of green sheets, and absorbs the variation in the position of the via 3 due to shrinkage during firing, and the via 3 and the thin film. In order to securely connect the wiring pattern 1 and to absorb the shrinkage deviation from the arrangement pitch of the I / O pins of the semiconductor element, for example, the thick film-thin film bonding is performed by using the thin film pad 5 having a predetermined area. Is done through.

[Problems to be Solved by the Invention]

However, the mask used for forming the thin film wiring pattern 1 including the thin film pad 5 on the above-mentioned multilayer ceramic substrate is required to have high speed and high density because the pattern shape and its position over the front surface of the substrate are determined in advance. If the thin film wiring pattern 1 becomes fine with, the displacement of all the vias 3 positions within the absorbable size of the thin film pad 5 can be obtained by only shifting the mask setting position in anticipation of shrinkage during firing. Unable to pay,
It has a drawback that thick film-thin film bonding cannot be performed. The present invention has been made to solve the above-mentioned drawbacks, and an object of the present invention is to provide a multilayer ceramic substrate and a method for manufacturing the same that can achieve reliable thick film-thin film bonding.

[Means for Solving the Problems]

According to the present invention, as described above, the object is to have a thin film wiring pattern 1 on the surface layer and to provide the thin film wiring pattern 1 and the thick film wiring layer of the inner layer of the substrate 2 as shown in FIG. 1 corresponding to the embodiment. In the multilayer ceramic substrate formed by connecting vias 3, the base material 2 has a plurality of position measuring dummy vias 4,
Based on the measurement coordinate data of the position measuring dummy via 4, the formation position of the thin film wiring pattern 1 in the vicinity thereof is determined, and the thin film pad 5 in the thin film wiring pattern 1 is connected to the via 3
This is accomplished by providing a multilayer ceramic substrate disposed on top. In this case, the position measuring dummy vias 4 can also be made to correspond to the sections 6 that are grouped in units of several mounted parts,
Further, as shown in FIG. 4, the thin film pads 5 in the thin film wiring pattern 1 may be formed in multiple layers to gradually absorb the shrinkage dimension error due to firing of the base material 2. The multilayer ceramic substrate as described above is a multilayer ceramic substrate manufacturing method in which a thin film wiring pattern 1 is formed using a mask on a base material 2 obtained by stacking and firing a plurality of green sheets. Is formed by forming a plurality of dummy vias 4 for position measurement and then firing, and arranging the thin film wiring pattern 1 in the vicinity based on the measurement coordinate data obtained by measuring the positions of the dummy vias 4 for position measurement after firing. It is possible to manufacture by forming mask data by using the mask data and etching the sputter layer on the base material 2 with the mask created from the mask data to form the thin film wiring pattern 1.

[Action]

Based on the above configuration, the thin film wiring pattern 1 in the present invention is developed with reference to the position measuring dummy vias 4. Since this position measuring dummy via 4 directly reflects the shrinkage of the base material 2 during the firing process, the thin film pad 5 in the thin film wiring pattern 1 is surely arranged on the via 3 and the thick film-thin film bonding is performed. Is done.

【Example】

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 shows an embodiment of the present invention, in which 2 is a base material made of a ceramic material obtained by laminating and firing a plurality of green sheets, and 3 is a thick film as an inner layer of the base material 2. The vias are connected to the power supply layer and the signal layer, which are not shown and are formed in the inner layer. Reference numeral 5 denotes a thin film pad formed on the surface layer of the base material 2. The thin film wiring pattern 1 including the thin film pad 5 is formed by first polishing the surface of the base material 2 after firing and then sputtering a conductive metal on the front surface. Then, the substrate surface is covered with a mask corresponding to the thin film wiring pattern 1, and etching is performed. Reference numeral 4 denotes a position measuring dummy via formed on the base material 2, which is formed by filling a conductive metal into a via hole punched in the green sheet as in the other vias 3. The position measuring dummy vias 4 are arranged at the four corners of each partition 6 when the ceramic substrate is virtually partitioned into units of a fixed number of parts mounted on the substrate. By measuring the position, shrinkage data for each section 6 due to firing of the green sheet can be obtained. The mask for forming the thin film wiring pattern 1 is formed on the basis of contraction data by the position measuring dummy vias 4 and is adjusted so that each thin film pad 5 is developed on the corresponding via 3. FIG. 2 shows this adjusting method. First, after firing the substrate, the positions of the dummy vias 4 for position measurement of each section 6 are measured and the Z position of the centroid thereof is calculated. On the other hand, the controller previously stores the pattern arrangement data 7 for each unit of section 6, and the mask is generated by expanding the centroid Z ′ of the pattern arrangement data 7 so as to match the centroid Z position of the firing substrate. The overall pattern layout information is formed, and the mask is created based on this information. In this example, the case where the patterns of the sections 6, 6 ... Which divide the ceramic substrate are all the same is shown, but when they are different, the pattern arrangement data 7 corresponding to the type is shown. Is stored in the control device, and is developed by the above-described procedure based on the type information of each section 6, 6. FIG. 3 shows another adjustment method, and shows a case where initial normal data of the entire surface of the relevant substrate is stored in advance in the control device. This initial regular data is configured as a set of a plurality of pattern arrangement data 7 corresponding to the section 6 of the substrate, and the relative position between the pattern arrangement data 7 can be changed. Therefore, in this case, first, the dummy vias 4 for position measurement are used.
Position, the centroid Z is calculated, and after comparison with the centroid Z position of each section 6 in the initial normal data, the position information of the pattern arrangement data 7 of the initial normal data is changed to create a mask. Data is obtained. FIG. 4 shows another embodiment of the present invention, in which another thin film pad 5'is further added on top of the thin film pad 5, and the two thin film pads 5 are laminated with the insulating layer 8 interposed therebetween. ,
5'are connected to each other through a thin film interlayer connection via 9. This embodiment is effective when a constant pitch dimension is required between parts such as an I / O pin connected to a connector or the like, and the positions of the two-layer thin film pads 5 and 5'are gradually increased. By shifting it, it is returned to the normal position corresponding to the I / O pin. Note that if the deviation from the normal position is large, correction can be freely performed using the thin film pads 5 of three layers or more, and in this case, as shown in FIG.
If the thin film interlayer connection via 9 is also shifted to a position close to the regular position on the data, the correction effect is increased.

【The invention's effect】

As is clear from the above description, according to the multilayer ceramic substrate of the present invention, thick film-thin film connection failure can be reliably prevented.

[Brief description of drawings]

FIG. 1 shows an embodiment of the present invention. (A) is a plan view, (b) is a sectional view, FIG. 2 is a view showing alignment of thin film pads, and FIG. 3 is another thin film pad. FIG. 4 is a diagram showing a positioning method, FIG. 4 is a diagram showing another embodiment of the present invention, FIG. 5 is a diagram showing a modified example, and FIG. 6 is a diagram showing a conventional example. In the figure, 1 ... Thin film wiring pattern, 2 ... Base material, 3
…… Via, 4 …… Dummy via for position measurement, 5 …… Thin film pad, 6 …… Section.

Claims (4)

[Claims] 1. A multi-layer structure comprising a thin film wiring pattern (1) on a surface layer, and the thin film wiring pattern (1) and a thick film wiring layer as an inner layer of a substrate (2) are connected via a via (3). In the ceramic substrate, the base material (2) is a plurality of position measuring dummy vias (4).
And the formation position of the thin film wiring pattern (1) in the vicinity thereof is determined based on the measurement coordinate data of the position measuring dummy via (4), and the thin film pad (1) in the thin film wiring pattern (1) ( A multilayer ceramic substrate in which 5) is arranged on the via (3). 2. The multilayer ceramic substrate according to claim 1, wherein the position measuring dummy vias (4) correspond to sections (6, 6 ...) Collected in units of several mounted parts. 3. The multilayer ceramic substrate according to claim 1, wherein the thin film pads (5) in the thin film wiring pattern (1) are formed in multiple layers and gradually absorb shrinkage dimension error due to firing of the base material (2). . 4. A method for manufacturing a multilayer ceramic substrate, wherein a thin film wiring pattern (1) is formed on a base material (2) obtained by laminating and firing a plurality of green sheets, and a plurality of green sheets are provided on the green sheets. After forming the position measuring dummy vias (4), baking is performed, and the thin film wiring pattern (1) in the vicinity is formed based on the measurement coordinate data obtained by measuring the position of the position measuring dummy vias (4) after baking. A method for manufacturing a multilayer ceramic substrate, which is arranged to create mask data, and the thin film wiring pattern 1 is formed by etching the sputter layer on the substrate (2) with a mask created from the mask data.