JPH0818125B2 - Laser soldering equipment - Google Patents
Laser soldering equipmentInfo
- Publication number
- JPH0818125B2 JPH0818125B2 JP1259161A JP25916189A JPH0818125B2 JP H0818125 B2 JPH0818125 B2 JP H0818125B2 JP 1259161 A JP1259161 A JP 1259161A JP 25916189 A JP25916189 A JP 25916189A JP H0818125 B2 JPH0818125 B2 JP H0818125B2
- Authority
- JP
- Japan
- Prior art keywords
- laser
- soldering
- preheating
- half mirror
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating processes for reflow soldering
Landscapes
- Laser Beam Processing (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、レーザーによりはんだ付する方法に関し、
特にプリント基板に電子部品をはんだ付するためのレー
ザーはんだ付方法に関する。The present invention relates to a method of soldering by laser,
In particular, it relates to a laser soldering method for soldering electronic components to a printed circuit board.
従来、この種のレーザーはんだ付方法はレーザーを使
って予備加熱することなく直接レーザーを照射してはん
だ付する方法となっていた。Conventionally, this type of laser soldering method has been a method of directly irradiating a laser and soldering without preheating with a laser.
上述した従来のレーザーはんだ付方法は、レーザーで
予備加熱することなく直接レーザーを照射してはんだ付
する方法となっているのでプリント基板に与える局所的
な熱ストレスが大きく、プリント基板を焼損させたり、
急加熱によるはんだボールやはんだがリード線に吸い上
がって未はんだが多発するといった欠点がある。The above-mentioned conventional laser soldering method is a method in which the laser is directly applied to the solder without preheating with the laser to perform soldering, so that the local thermal stress applied to the printed circuit board is large and the printed circuit board may be burned out. ,
There is a drawback that solder balls and solder due to rapid heating are sucked up by the lead wires and many unsolders occur.
本発明のレーザはんだ付け装置は、トの字形の筒状の
レーザはんだ付け装置であって、一端から入力される照
射径の小さいはんだ付け用レーザと、前記一端と垂直の
角度をなす他の一端から入力される照射径の大きい予備
加熱用レーザと、前記はんだ付け用レーザからのレーザ
光と前記予備加熱用レーザからのレーザ光とを同一光軸
上に反射するハーフミラーと、このハーフミラーからの
レーザ光を集光するレンズとを含んで構成される。The laser soldering device of the present invention is a V-shaped cylindrical laser soldering device, wherein a soldering laser having a small irradiation diameter input from one end and another end forming a vertical angle with the one end. From the laser for preheating with a large irradiation diameter input from the laser, a half mirror for reflecting the laser light from the laser for soldering and the laser light from the laser for preheating on the same optical axis, and from this half mirror And a lens that condenses the laser light.
次に、本発明について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
第１図は本発明の一実施例の縦断面図である。 FIG. 1 is a vertical sectional view of an embodiment of the present invention.
照射径及び出力の異なる予備加熱用レーザー１とはん
だ付用レーザー２をトの字形の筒４にネジ３で各々固定
し、トの字形の筒４中に設けたハーフミラー５に各々の
レーザーを矢印の方向から照射し、ハーフミラー５を反
射又は透過して来たレーザー光をレンズ６で集光させ、
プリント基板10上に実装した表面実装部品７のリード９
の部分及びクリームはんだ８の部分へ同時に照射する。
レンジ６の集光で第１図に破線で示す予備加熱用レーザ
ー１からのレーザーはリード９及びクリームはんだ８の
部分の広い範囲に照射され二点鎖線で示すはんだ付用レ
ーザー２からのレーザーは中心の狭い範囲に集中させて
照射される。はんだ付用レーザー２でクリームはんだ８
の中心を加熱して溶融させ、はんだ付用レーザー２が照
射される部分の周囲を予備加熱用レーザー１で同時に照
射して予備的に加熱してはんだ付を実施する。A laser 1 for preheating and a laser 2 for soldering, which have different irradiation diameters and outputs, are respectively fixed to a V-shaped tube 4 with screws 3, and each laser is attached to a half mirror 5 provided in the V-shaped tube 4. Laser light emitted from the direction of the arrow and reflected or transmitted through the half mirror 5 is condensed by the lens 6,
Lead 9 of surface mount component 7 mounted on printed circuit board 10
And the portion of the cream solder 8 are simultaneously irradiated.
The laser from the preheating laser 1 shown by the broken line in FIG. 1 is focused on the range 6, and the laser from the soldering laser 2 shown by the chain double-dashed line is irradiated onto a wide area of the lead 9 and the cream solder 8. Irradiation is concentrated on a narrow area in the center. Laser solder 2 for cream solder 8
The center of is heated and melted, and the periphery of the portion irradiated with the soldering laser 2 is simultaneously irradiated with the preheating laser 1 and preheated to perform soldering.
以上説明したように本発明の予備加熱付レーザーはん
だ付方法はレーザーで予備加熱を行うと同時に他のレー
ザーではんだ付する方法を実施することによりプリント
基板に与える局所的な熱ストレスを緩和でき、プリント
基板を焼損させることが無く、かつ、急加熱すること無
くはんだ付する為、はんだボールや未はんだの発生を防
止することが可能となりはんだ接続信頼性及び製造品質
信頼性を向上することができるといった効果がある。As described above, the preheating laser soldering method of the present invention can alleviate the local heat stress applied to the printed circuit board by performing the method of preheating with a laser and soldering with another laser at the same time, Since the printed circuit board is soldered without burning and without rapid heating, it is possible to prevent the generation of solder balls and unsoldered solder, and it is possible to improve solder connection reliability and manufacturing quality reliability. There is an effect such as.
第１図は本発明のレーザーはんだ付方法の一実施例を示
す縦断面図である。 １……予備加熱用レーザー、２……はんだ付用レーザ
ー、３……ネジ、４……トの字形の筒、５……ハーフミ
ラー、６……レンズ、７……表面実装部品、８……クリ
ームはんだ、９……リード、10……プリント基板。FIG. 1 is a longitudinal sectional view showing an embodiment of the laser soldering method of the present invention. 1 ... Preheating laser, 2 ... Soldering laser, 3 ... Screw, 4 ... V-shaped tube, 5 ... Half mirror, 6 ... Lens, 7 ... Surface mount component, 8 ... ... Cream solder, 9 ... Lead, 10 ... Printed circuit board.
Claims (1)
おいて、 一端から入力される照射径の小さいはんだ付け用レーザ
と、 前記一端と垂直の角度をなす他の一端から入力される照
射径の大きい予備加熱用レーザと、 前記はんだ付け用レーザからのレーザ光と前記予備加熱
用レーザからのレーザ光とを同一光軸上に反射するハー
フミラーと、 このハーフミラーからのレーザ光を集光するレンズとを
含むことを特徴とするレーザはんだ付け装置。1. A V-shaped tubular laser soldering apparatus, wherein a soldering laser having a small irradiation diameter input from one end and an irradiation diameter input from another end forming an angle perpendicular to the one end. A large preheating laser, a half mirror that reflects the laser light from the soldering laser and the laser light from the preheating laser on the same optical axis, and the laser light from the half mirror is condensed. A laser soldering device, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1259161A JPH0818125B2 (en) | 1989-10-03 | 1989-10-03 | Laser soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1259161A JPH0818125B2 (en) | 1989-10-03 | 1989-10-03 | Laser soldering equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03124368A JPH03124368A (en) | 1991-05-27 |
| JPH0818125B2 true JPH0818125B2 (en) | 1996-02-28 |
Family
ID=17330199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1259161A Expired - Fee Related JPH0818125B2 (en) | 1989-10-03 | 1989-10-03 | Laser soldering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0818125B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11453076B2 (en) | 2017-04-28 | 2022-09-27 | Musashi Engineering, Inc. | Laser soldering method and device |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004288350A (en) * | 2003-03-03 | 2004-10-14 | Shinka Jitsugyo Kk | Method and apparatus for manufacturing magnetic head device, and magnetic head device |
| JP4522752B2 (en) * | 2004-06-10 | 2010-08-11 | 三菱電機株式会社 | Terminal joining method by soldering |
| WO2009057367A1 (en) | 2007-11-02 | 2009-05-07 | Waseda University | Method of preparing air foam stabilizing liquid and method of air foam drilling work |
| EP3276655A1 (en) * | 2016-07-26 | 2018-01-31 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Method and system for bonding a chip to a substrate |
| DE102017104097A1 (en) | 2017-02-28 | 2018-08-30 | Pac Tech-Packaging Technologies Gmbh | Method and laser arrangement for melting a solder material deposit by means of laser energy |
| KR20230163832A (en) * | 2022-05-24 | 2023-12-01 | 레이저쎌 주식회사 | Dual laser optic module of turntable type probe pin bonding apparatus |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62173074A (en) * | 1986-01-24 | 1987-07-29 | Nippon Les-The-:Kk | Method and device for fine soldering |
| JPS6449368U (en) * | 1987-09-14 | 1989-03-27 |
-
1989
- 1989-10-03 JP JP1259161A patent/JPH0818125B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11453076B2 (en) | 2017-04-28 | 2022-09-27 | Musashi Engineering, Inc. | Laser soldering method and device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03124368A (en) | 1991-05-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080228 Year of fee payment: 12 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090228 Year of fee payment: 13 |
|
| LAPS | Cancellation because of no payment of annual fees |