JPH0818230B2 - Polishing method - Google Patents
Polishing methodInfo
- Publication number
- JPH0818230B2 JPH0818230B2 JP62061311A JP6131187A JPH0818230B2 JP H0818230 B2 JPH0818230 B2 JP H0818230B2 JP 62061311 A JP62061311 A JP 62061311A JP 6131187 A JP6131187 A JP 6131187A JP H0818230 B2 JPH0818230 B2 JP H0818230B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- bond grindstone
- abrasive grains
- grindstone
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005498 polishing Methods 0.000 title description 26
- 238000000034 method Methods 0.000 title description 12
- 239000007788 liquid Substances 0.000 claims description 162
- 238000002156 mixing Methods 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 16
- 239000002245 particle Substances 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 239000006061 abrasive grain Substances 0.000 description 42
- 239000000047 product Substances 0.000 description 27
- 238000007906 compression Methods 0.000 description 15
- 230000006835 compression Effects 0.000 description 15
- 239000000203 mixture Substances 0.000 description 13
- 239000000654 additive Substances 0.000 description 10
- 230000000996 additive effect Effects 0.000 description 10
- 238000005452 bending Methods 0.000 description 9
- 238000000748 compression moulding Methods 0.000 description 9
- 238000001035 drying Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 238000000465 moulding Methods 0.000 description 7
- 238000007517 polishing process Methods 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 238000005469 granulation Methods 0.000 description 6
- 230000003179 granulation Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000005507 spraying Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000003208 petroleum Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 235000002492 Rungia klossii Nutrition 0.000 description 2
- 244000117054 Rungia klossii Species 0.000 description 2
- 229920002472 Starch Polymers 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 229910001651 emery Inorganic materials 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000008107 starch Substances 0.000 description 2
- 235000019698 starch Nutrition 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229920003169 water-soluble polymer Polymers 0.000 description 2
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000011553 magnetic fluid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Description
【発明の詳細な説明】 〈産業上の利用分野〉 本発明は硬脆材、金属材、合成樹脂材などの被研磨材
を精密研磨仕上げするようにした研磨方法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION <Field of Industrial Application> The present invention relates to a polishing method in which a material to be polished such as a hard brittle material, a metal material, and a synthetic resin material is precisely polished.
〈従来の技術〉 液体ボンド砥石は砥粒に少量の液体を加えて均一に混
合し、型枠に入れて圧縮成形したもので、この液体ボン
ド砥石を利用して硬脆材、金属材、合成樹脂材などの被
研磨材を精密研磨仕上げするようにした技術は、『谷,
河田「液体ボンド砥石を用いた高能率研磨法の開発」日
本機械学会論文集50巻471号,昭和60−11』、『谷,河
田「液体ボンド砥石を用いた高能率研磨法の開発」生産
研究37巻7号,1985,7』、『谷,河田「液体ボンド砥石
の境面研磨への適用」昭和60年度精機学会秋季大会学術
講演会論文集』、『谷,河田「液体ボンド砥石によるシ
リコンウエハの高能率研磨」昭和61年度精密工学会春季
大会学術講演会論文集』に発表されている。<Prior art> A liquid bond grindstone is one in which a small amount of liquid is added to the abrasive grains, mixed evenly, placed in a mold, and compression-molded. The technique of precision polishing finishing of the material to be polished such as resin material is "valley,
Kawada "Development of high-efficiency polishing method using liquid bond grindstone" Proceedings of the Japan Society of Mechanical Engineers, Volume 50, 471, Showa 60-11, "Tani, Kawada" Development of high-efficiency polishing method using liquid bond grindstone "Production Research Vol. 37, No. 7, 1985, 7 ”,“ Tani, Kawada “Application of Liquid Bonded Grinding Wheel to Surface Polishing” Proc. High-efficiency polishing of silicon wafer "Proceedings of 1987 Precision Engineering Society Spring Conference Academic Lecture Proceedings".
〈発明が解決しようとする問題点〉 しかし、上記した文献に記載の方法は砥粒と液体とを
混合比を、ペンドラー域とファニキュラー域との間にあ
るように設定し、混合、圧縮、成形等の操作をすると、
液体の混合比が小さいので混合物の流動性が乏しく、砥
粒と液体とを均一に混合するのが難しいので、不均一に
なる。そして、砥粒と液体とが不均一な混合状態で圧縮
成形すると、成形された砥石の密度や硬さにばらつきを
生じ、研磨の際に部分的に砥石が崩壊したり、研磨の仕
上りにむらが生じることになる。<Problems to be solved by the invention> However, the method described in the above-mentioned literature, the mixing ratio of the abrasive grains and the liquid, set so as to be between the Pendler region and the funicular region, mixing, compression, When you perform operations such as molding,
Since the mixing ratio of the liquid is small, the fluidity of the mixture is poor, and it is difficult to uniformly mix the abrasive grains and the liquid, resulting in non-uniformity. When the abrasive grains and the liquid are compression-molded in a non-uniform mixed state, the density and hardness of the molded grindstone vary, the grindstone partially collapses during polishing, and the polishing finish is uneven. Will occur.
ペンドラー域とファニキュラー域との間になるような
砥粒と液体との混合比は、砥粒や液体の種類、砥粒の粒
径、形状等により異なるので一定ではないが、一般に単
位空間内を占める液体の割合が砥粒に比べてはるかに小
さく、通常で砥粒の10〜20%程度にしか過ぎない。この
ため、液体ボンド砥石を構成する液体を、この液体より
揮発し易い液体で希釈し、この希釈液体を過剰に砥粒と
混合した後に、過剰分の液体を蒸発除去する方法も提案
されている。しかし、この希釈液体はヘキサンとかアル
コールを使用するので、引火性が高くて毒性が強い等の
性質を有し、取り扱いに特別の配慮をしなければならな
い。The mixing ratio of the abrasive particles and the liquid such that it is between the pendular area and the funicular area is not constant because it varies depending on the type of the abrasive particles and the liquid, the particle diameter of the abrasive particles, the shape, etc. The proportion of the liquid that occupies is much smaller than that of the abrasive grains, and is usually only about 10 to 20% of the abrasive grains. Therefore, a method has been proposed in which the liquid constituting the liquid bond grindstone is diluted with a liquid that is more volatile than the liquid, the diluted liquid is excessively mixed with the abrasive grains, and then the excess liquid is removed by evaporation. . However, since this diluting liquid uses hexane or alcohol, it has properties such as high flammability and strong toxicity, and special care must be taken in handling.
また、仮に砥粒と液体との混合比を適正に、かつ均一
にして混合したとしても、液体ボンド砥石に使用する液
体は水やオイルのようなそれ自身が放置されると蒸発す
る性質を有するものが多いため、成形された液体ボンド
砥石は保存安定性に乏しい。そして、砥粒と液体の混合
物を成形後、直ちに研磨処理作業をしないと、液体の蒸
発により経時的に砥粒と液体との比率に変化を来たすか
ら、研磨条件が研磨時により変動することになり、研磨
の能率や精度を一定に保つのが難しいのが実情である。Further, even if the mixing ratio of the abrasive grains and the liquid is properly and uniformly mixed, the liquid used in the liquid bond grindstone has a property of evaporating when itself left as water or oil. Since there are many things, the formed liquid bond grindstone has poor storage stability. Then, after the mixture of the abrasive grains and the liquid is molded, if the polishing process is not performed immediately, the ratio of the abrasive grains to the liquid changes with time due to the evaporation of the liquid, so that the polishing conditions vary depending on the polishing. In reality, it is difficult to keep polishing efficiency and accuracy constant.
また、液体ボンド砥石は砥粒の結合媒体が液体である
から、圧縮成形しても物理的強度に乏しく、被研磨材を
強く押圧すると崩壊することなるし、この液体ボンド砥
石を持ち運んだり研磨装置に固定する場合に破損し易
い。このため、液体ボンド砥石は常に強固な容易に収納
した状態で運搬したり装置に固定し、研磨しなければな
らないので、著しく作業性が悪い。In addition, since the liquid bond grindstone has a liquid binding medium for the abrasive grains, it has poor physical strength even when compression-molded, and will collapse if the material to be polished is pressed strongly. It is easily damaged when fixed to. For this reason, the liquid bond grindstone must always be transported in a strong and easily housed state, or fixed to a device and polished, resulting in extremely poor workability.
さらに、液体ボンド砥石を使用した研磨処理作業中に
おいて、加工の摩擦熱による被研磨材の温度上昇を抑制
したり、液体ボンド砥石の表面に付着する切り子を除去
するため、液体ボンド砥石の表面に水その他の冷却液体
を流したり噴霧するのが望ましいが、液体ボンド砥石を
軟化させたり消耗を早めることになるし、しばしば崩壊
の原因になるので、容易に実施することができない。Further, during the polishing process using the liquid bond grindstone, the temperature rise of the material to be polished due to the frictional heat of processing is suppressed, and the facets of the liquid bond grindstone are removed to remove the facets on the surface of the liquid bond grindstone. It is desirable to flush or atomize water or other cooling liquid, but this is not easy to do because it will soften and accelerate wear on the liquid bond wheels and often cause collapse.
〈問題点を解決するための手段〉 本発明は上記に鑑み提案されたもので、砥粒と液体と
を混合して砥粒間に液体を存在させ、液体の表面張力も
しくは粘着力により砥粒を保持して圧縮成形してなる液
体ボンド砥石の液体含有量を減少させた後、この液体ボ
ンド砥石の表面に液体を存在させて被研磨材を押圧しな
がら研磨するようにしたことを特徴とするものである。<Means for Solving Problems> The present invention has been proposed in view of the above, in which the abrasive grains and the liquid are mixed to allow the liquid to exist between the abrasive grains, and the abrasive grains are generated by the surface tension or the adhesive force of the liquid. After reducing the liquid content of the liquid bond grindstone formed by holding and holding the liquid bond, the liquid is present on the surface of the liquid bond grindstone so that the material to be polished is pressed and polished. To do.
本発明の研磨方法で使用する液体ボンド砥石の砥粒と
しては、ダイヤモンド、コランダム、エメリ、ザクロ
石、珪石、トリボリ、焼成ドロマイト、熔融アルミナ、
人造エメリ、炭化ケイ素、炭化ホウ素、酸化鉄、焼成ア
ルミナ、酸化クロム、酸化セリウム、酸化ジルコニウ
ム、酸化マグネシウム、炭酸カルシウム、炭酸マグネシ
ウム、シリカ、シラス等通常の砥粒として使用できるも
のであればどのようにものでもよい。そして、上記砥粒
の粒径はおよそ30μm以下のものを使用する。As the abrasive grains of the liquid bond grindstone used in the polishing method of the present invention, diamond, corundum, emery, garnet, silica, tribolite, calcined dolomite, fused alumina,
Artificial emery, silicon carbide, boron carbide, iron oxide, calcined alumina, chromium oxide, cerium oxide, zirconium oxide, magnesium oxide, calcium carbonate, magnesium carbonate, silica, shirasu, etc. It can be a stuff. And, the grain size of the above-mentioned abrasive grains is about 30 μm or less.
また、本発明の研磨方法に使用する液体ボンド砥石の
液体は、水、アルカリ溶液、酸溶液、その他多くの塩類
の水溶液、高分子溶液、油状液体、磁性流体等である。The liquid of the liquid bond grindstone used in the polishing method of the present invention is water, an alkaline solution, an acid solution, an aqueous solution of many other salts, a polymer solution, an oily liquid, a magnetic fluid, or the like.
〈作用〉 本発明における液体ボンド砥石を成形する場合の砥粒
と液体との混合比は、混合、圧縮、成形等の操作に都合
のよい状態になるように任意に設定することができる。
そして、砥粒と液体との混合に際しては、流動性をもた
らせるために一般的には砥粒より液体が過剰になるが、
仮に液体が過剰であったとしても、乾燥その他の処理に
より液体の含有量を減少させるのである。したがって、
砥粒と液体との混合比は、成形以前の段階では特に考慮
する必要がないから、この混合処理が容易で、成形物の
密度や硬さにむらを生じることがない。また、混合物の
流動性を高めるために、混合物を適当な大きさに造粒し
て圧縮成形すると、成形物の密度や硬さはさらに均一に
なる。そして、造粒の操作を行なう場合には、液体と砥
粒との混合割合は、造粒操作に都合のよい状態に設定す
ることができる。<Operation> When the liquid bond grindstone according to the present invention is molded, the mixing ratio of the abrasive grains and the liquid can be arbitrarily set so as to be in a state convenient for operations such as mixing, compression and molding.
Then, when the abrasive particles and the liquid are mixed, the liquid is generally in excess of the abrasive particles in order to provide fluidity,
Even if the liquid is excessive, the liquid content is reduced by drying or other treatment. Therefore,
The mixing ratio of the abrasive grains and the liquid does not need to be particularly taken into consideration in the stage before molding, so that this mixing process is easy and unevenness in the density and hardness of the molded product does not occur. Further, in order to increase the fluidity of the mixture, when the mixture is granulated into an appropriate size and compression molded, the density and hardness of the molded product become more uniform. When performing the granulation operation, the mixing ratio of the liquid and the abrasive particles can be set to a state convenient for the granulation operation.
上記のように、砥粒と液体と液体とを成形に最適な状
態の混合比で混合したら、この混合物を圧縮成形する。
この圧縮成形に要する圧力はおよそ100kg/cm2以上、望
ましくは300kg/cm2以上である。As described above, when the abrasive grains, the liquid, and the liquid are mixed at a mixing ratio in an optimum state for molding, this mixture is compression molded.
The pressure required for this compression molding is about 100 kg / cm 2 or more, preferably 300 kg / cm 2 or more.
上記のようにして砥粒と液体との混合物を圧縮成形し
たら、この成形物に含有する液体を減少処理する。この
液体の減少方法としては、乾燥処理したり、吸液剤を接
触させて行なうが、この処理は圧縮成形の前に、また造
粒処理が加わる場合には造粒時に若くは造粒された混合
物に対して行なってもよい。After the compression molding of the mixture of the abrasive grains and the liquid as described above, the liquid contained in the molded product is reduced. As a method for reducing this liquid, a drying treatment or a contact with a liquid absorbent is carried out, but this treatment is carried out before compression molding or, if granulation treatment is added, at the time of granulation or at the time of granulation. May be done to.
このようにして、成形物に含有する液体を減少すると
物理的強度が増して被研磨材を強く押圧しても容易に崩
壊したり破損しないし、運搬や研磨装置への取付けに際
しても容易になり、効果的な液体ボンド砥石となる。In this way, if the liquid contained in the molded product is reduced, the physical strength increases, and even if the material to be polished is strongly pressed, it will not easily collapse or break, and it will be easy to carry or attach to the polishing device. , Becomes an effective liquid bond grindstone.
上記した成形物の液体含有量が減少して砥粒に対する
液体の混合状態がペンドラー域の下限程度になると、含
有する液体の大部分が砥粒の表面に吸着された状態にあ
り、このような吸着液は容易に蒸発しないから成形物を
長期間保存可能にするし、液体の含有量が経時的に変化
することが少なく、安定性が著しく良好になる。When the liquid content of the above-mentioned molded product is reduced and the mixed state of the liquid with respect to the abrasive grains becomes about the lower limit of the Pendler region, most of the contained liquid is in the state of being adsorbed on the surface of the abrasive grains. Since the adsorbed liquid does not easily evaporate, the molded product can be stored for a long period of time, the content of the liquid hardly changes with time, and the stability becomes remarkably good.
また、上記した成形物の物理的強度は、砥粒と液体の
種類によって差異が有るが、上記の成形方法による成形
物でもなお強度が不足する場合にはあらかじめ液体ボン
ド砥石を構成する液体のなかに、液体に容易に溶解した
り混合することができ、しかも液体中の濃度が高い状態
では砥粒同志を固着させる機能を有する成分(以下添加
成分という)を添加することもできる。この添加成分
は、前記した成形物の乾燥処理により濃縮され、砥粒同
志を強固に固着させるから、成形物の物理的強度を著し
く強固にする。Further, the physical strength of the above-mentioned molded product is different depending on the types of the abrasive grains and the liquid, but if the strength of the molded product by the above-mentioned molding method is still insufficient, then the liquid that composes the liquid-bonded grindstone can be prepared in advance. In addition, a component (hereinafter referred to as an additional component) which can be easily dissolved or mixed in a liquid and has a function of fixing the abrasive grains to each other when the concentration in the liquid is high can be added. This additive component is concentrated by the above-mentioned drying treatment of the molded product and firmly fixes the abrasive grains to each other, so that the physical strength of the molded product is remarkably strengthened.
そして、上記した添加成分は、被研磨材の研磨処理時
に表面に液体を噴霧しても、その液体との接触、混合な
どによって、容易に溶解したり膨潤して乾燥前の液状に
近い状態になるものでなくてはならない。例えば、噴霧
する液体が水であれば添加成分としては水ガラスや水溶
性高分子有機物が効果的であり、噴霧する液体がオイル
であれば、添加成分としては油溶性高分子有機物を使用
することができる。Then, the above-mentioned additive component, even if a liquid is sprayed on the surface during the polishing process of the material to be polished, is easily dissolved or swollen due to contact with the liquid, mixing, etc. to be in a state close to the liquid state before drying. It must be. For example, if the liquid to be sprayed is water, water glass or a water-soluble polymer organic substance is effective as the additive component, and if the liquid to be sprayed is oil, an oil-soluble polymer organic substance should be used as the additive component. You can
しかし、成形物を加熱乾燥して含有液体を減少する場
合には、上記した添加成分は種類によって熱重合し、次
の研磨処理において液体を噴霧したり流したときに容易
に乾燥前の状態に戻らないことがある。したがって、添
加成分の選択や加熱乾燥処理条件の設定には充分に注意
する必要があるし、砥粒と液体とを混合して成形した
後、経時的に変質が進み、液体に対する溶解、膨潤、混
合などの速度に変化を生じるような添加成分も使用しな
いほうがよい。However, when the molded product is dried by heating to reduce the contained liquid, the above-mentioned additional components are thermally polymerized depending on the type, and easily become the state before drying when spraying or flowing the liquid in the next polishing treatment. It may not return. Therefore, it is necessary to pay sufficient attention to the selection of the additive component and the setting of the heat drying treatment condition, and after the abrasive grains and the liquid are mixed and molded, the deterioration proceeds with time, the dissolution in the liquid, the swelling, It is better not to use an additive component that causes a change in mixing speed.
しかし、添加成分に変質が有ったとしても、その変質
の程度が液体ボンド砥石として悪影響のない程度であれ
ば実施できる場合がある。例えば、添加成分として水溶
性高分子有機物を使用し、この有機物が加熱により重合
して水不溶性になると、研磨時に噴霧したり流す液体と
して水不溶性になった物質を溶解するような溶剤を使用
することにより、本発明を実施することができる。ま
た、添加成分が多過ぎると、以下のような欠点を生じる
恐れがあるので望ましくない。すなわち、添加成分を速
やかに液状とするため、乾燥後の液体ボンド砥石を使用
して研磨処理する場合に大量の液体を噴霧する必要を生
じ、液体ボンド砥石の砥粒と液体との混合状態がファニ
キュラー域を超える可能性が有るからである。However, even if the additive component is altered, it may be possible to implement it if the degree of alteration is such that it does not adversely affect the liquid bond grindstone. For example, a water-soluble polymer organic substance is used as an additive component, and when this organic substance is polymerized by heating to become water-insoluble, a solvent that dissolves the water-insoluble substance is used as a liquid that is sprayed or flushed during polishing. Therefore, the present invention can be implemented. Further, if the added component is too much, the following defects may occur, which is not desirable. That is, in order to quickly make the added component into a liquid state, it is necessary to spray a large amount of liquid when performing a polishing process using the liquid bond grindstone after drying, and the mixed state of the abrasive grains of the liquid bond grindstone and the liquid is generated. This is because there is a possibility of exceeding the funicular range.
したがって、添加成分の添加量は、砥粒、液体及び添
加成分の種類により一定しないが、一般的には砥粒に対
して1重量%以下である。Therefore, the addition amount of the additive component is not constant depending on the type of the abrasive grains, the liquid, and the additive component, but is generally 1% by weight or less with respect to the abrasive grains.
上記のようにして成形された成形物、すなわち液体ボ
ンド砥石は、研磨装置に取付けて表面に液体を噴霧した
り流し掛けながら存在させ、被研磨材を押圧して液体ボ
ンド砥石と被研磨材とを相対的に摺動させる。これによ
り、上記液体は液体ボンド砥石の砥粒の微細間隔内に浸
透し、砥粒と液体との混合状態が砥粒相互の接触点を中
心に液体が環状に付着する態様であって、不連続の状態
である。この状態はペンドラー域であるが、液体をさら
に液体ボンド砥石の表面に噴霧したり流し掛けると、砥
粒相互の接触点を含む面で液体が閉止し、液体が連続的
に存在するファニキュラー域に変換する。したがって、
液体ボンド砥石の表面に供給する液体の量を調整する
と、液体ボンド砥石として最も好ましい砥粒と液体との
混合状態を設定することができる。また、液体ボンド砥
石用としての成形物が研磨処理に使用されないで長期間
保存されていても、液体含有量が大きく変化しないの
で、液体ボンド砥石の表面に供給する液体の量が常に一
定で足り、安定した研磨処理をすることができる。The molded product molded as described above, that is, the liquid bond grindstone is attached to a polishing device and is present while spraying or pouring a liquid on the surface, and pressing the material to be polished with the liquid bond grindstone and the material to be polished. Slide relatively. As a result, the liquid permeates into the fine gaps of the abrasive grains of the liquid bond grindstone, and the mixed state of the abrasive grains and the liquid is a mode in which the liquid is attached in an annular shape around the contact points of the abrasive grains, It is a continuous state. This state is the Pendler region, but when the liquid is further sprayed or poured on the surface of the liquid bond grindstone, the liquid closes at the surface including the contact points of the abrasive grains, and the funicular region where the liquid continuously exists. Convert to. Therefore,
By adjusting the amount of liquid supplied to the surface of the liquid bond grindstone, it is possible to set the most preferable mixed state of the abrasive grains and the liquid as the liquid bond grindstone. Further, even if the molded product for a liquid bond grindstone is not used in the polishing process and is stored for a long period of time, the liquid content does not change significantly, so that the amount of liquid supplied to the surface of the liquid bond grindstone is always constant. A stable polishing process can be performed.
また、液体ボンド砥石の表面に供給する液体は噴霧し
たり流し掛けるため、液体ボンド砥石のペンドラー域か
らファニキュラー域への変換は液体ボンド砥石の表面か
ら始まって次第に内部へ移行する。すなわち、研磨処理
中の液体ボンド砥石は、表面に液体が多い状態で推移す
るから、被研磨材が接触する液体ボンド砥石の表面部分
において摩擦熱による温度上昇が抑制されるし、切削屑
の排出にも悪影響を与えない。しかし、液体ボンド砥石
の内部は表面部分に比較して液体が少ない状態で推移す
るので、液体ボンド砥石全体としての物理的強度が高く
なり、たとえば被研磨材を10kg/cm2程度の圧力を加えて
研磨しても崩壊することがなく、高い加工圧で効率よく
研磨処理することができる。Further, since the liquid supplied to the surface of the liquid bond grindstone is sprayed or poured, the conversion of the liquid bond grindstone from the pendular region to the funicular region starts from the surface of the liquid bond grindstone and gradually shifts to the inside. That is, since the liquid bond grindstone during the polishing process has a large amount of liquid on the surface, the temperature rise due to frictional heat is suppressed in the surface portion of the liquid bond grindstone with which the material to be polished contacts, and the discharge of cutting chips Does not adversely affect. However, because the liquid inside the liquid bond grindstone changes with less liquid compared to the surface portion, the physical strength of the liquid bond grindstone as a whole becomes high.For example, applying a pressure of about 10 kg / cm 2 to the material to be polished. It does not disintegrate even if it is abraded and can be efficiently abraded at a high processing pressure.
〈実施例〉 以下に本発明の実施例を説明する。<Examples> Examples of the present invention will be described below.
実施例 1 砥粒Q#3000を1kgと、でんぷんとウレタンの混合水
溶液2kgを十分に撹拌混合したペースト状混合物を金型
に流し込んだ。このペースト状混合物は、砥粒と液体と
の混合状態において、液体の量が著しく多く、空気相が
ほとんど存在しないので、ファニキュラー域をはるかに
越えている。この混合物を60℃、12時間、強制乾燥する
と、液体含有量は17%に低下し、混合物は連続、不連続
の空気相を含んで、液体ボンド砥石となった。Example 1 1 kg of abrasive grains Q # 3000 and 2 kg of a mixed aqueous solution of starch and urethane were sufficiently stirred and mixed, and a paste-like mixture was poured into a mold. This paste-like mixture has a significantly large amount of liquid and almost no air phase in the mixed state of the abrasive grains and the liquid, and thus far exceeds the funicular range. When this mixture was forced to dry at 60 ° C. for 12 hours, the liquid content dropped to 17%, and the mixture contained a continuous and discontinuous air phase, and became a liquid bonded wheel.
こうして得られた液体ボンド砥石の物性を測定する
と、硬度72、曲げ強度0.1kg/cm2以下、圧縮強度0.1kg/c
m2以下であった。When the physical properties of the liquid bond grindstone thus obtained are measured, the hardness is 72, the bending strength is 0.1 kg / cm 2 or less, and the compressive strength is 0.1 kg / c.
It was less than m 2 .
この液体ボンド砥石をさらに60℃,24時間、強制乾燥
すると、硬度80、曲げ強度4kg/cm2、圧縮強度7kg/cm2と
なり、物理的強度が著しく向上した。When this liquid bond grindstone was further dried at 60 ° C. for 24 hours, it had a hardness of 80, a bending strength of 4 kg / cm 2 , and a compressive strength of 7 kg / cm 2 , and the physical strength was remarkably improved.
実施例 2 砥石粒C#3000と、液体5%CMC水溶液を重量比1:0.9
で混合し、金型容器に充填して圧縮成型機で圧縮成形
し、厚さ約10mmの液体ボンド砥石とした。この時の圧縮
荷重200〜300kg/cm2、圧縮比は約3.3であった。得られ
た液体ボンド砥石は、金型容器から取り出すと、手で持
ち上げただけで崩れてしまうような、きわめて物理的強
度に乏しい状態にあり、その物性を測定すると、硬度9
0、曲げ強度0.1kg/cm2以下、圧縮強度0.1kg/cm2以下で
あった。Example 2 A grindstone C # 3000 and a liquid 5% CMC aqueous solution were mixed at a weight ratio of 1: 0.9.
Was mixed, filled in a mold container and compression-molded by a compression molding machine to obtain a liquid bond grindstone having a thickness of about 10 mm. The compression load at this time was 200 to 300 kg / cm 2 , and the compression ratio was about 3.3. The obtained liquid bond grindstone is in a state of extremely poor physical strength, such that it will collapse when just picked up by hand when taken out from the mold container.
The bending strength was 0, the bending strength was 0.1 kg / cm 2 or less, and the compression strength was 0.1 kg / cm 2 or less.
上記と同じように調整した液体ボンド砥石を金型容器
から取り出し、乾燥して液体含有量を砥石重量の5%程
度に低下させると、成型物の物理的強度は著しく向上
し、硬度98、曲げ強度10kg/cm2、圧縮強度kg/cm2とな
り、持ち運んだり、研磨機にセットしても、欠けたり崩
れたりすることがなかった。この乾燥状態にある成型物
は、液体ボンド砥石を構成する液体の中の、揮発成分が
ほとんどなくなっているから、砥粒と、液体との混合状
態において、不揮発成分のみが砥粒の接触点を中心にし
て僅かに付着し、残留している状態、すなわちペンドラ
ー域の下限を形成しているとみなされる。When the liquid bond grindstone prepared in the same manner as above is taken out from the mold container and dried to reduce the liquid content to about 5% of the grindstone weight, the physical strength of the molded product is remarkably improved, the hardness is 98, and the bending is The strength was 10 kg / cm 2 , and the compressive strength was kg / cm 2 , and it did not chip or break even when carried or set in a polishing machine. The molded product in this dry state has almost no volatile components in the liquid constituting the liquid bond grindstone, so in the mixed state of the abrasive grains and the liquid, only the non-volatile component causes the contact point of the abrasive grains to rise. It is considered that it is slightly attached to the center and remains, that is, forms the lower limit of the Pendler region.
ついで乾燥した成型物の表面に、成型物表面1cm2当り
約0.02mlの水を噴霧すると、表面が軟化して、表面から
の深さが1mm以上の範囲が、ナイフなどで容易に削り取
れる状態になったが、表面からの深さが1mm以上の部位
には、軟化が認められなかった。Then, when about 0.02 ml of water is sprayed onto the surface of the dried molded product per cm 2 of the molded product, the surface softens and the depth of 1 mm or more from the surface can be easily scraped off with a knife. However, no softening was observed at the site where the depth from the surface was 1 mm or more.
さらに水の噴霧を続けると、成型物の軟化層はさらに
深くなり、成型物表面1cm2当り約1.8mlの噴霧量におい
て、軟化層の深さは成型物の底部にまで達した。この軟
化した成型物の物性を測定すると、硬度91、曲げ強度0.
1kg/cm2以下、圧縮強度01,kg/cm2以下であり、ほゞ乾燥
前の液体ボンド砥石としての物性であった。When the spraying of water was further continued, the softened layer of the molded product became deeper, and the depth of the softened layer reached the bottom of the molded product at a spraying amount of about 1.8 ml per cm 2 of the surface of the molded product. When the physical properties of this softened molded product were measured, hardness 91, bending strength 0.
It was 1 kg / cm 2 or less and the compressive strength was 01, kg / cm 2 or less, and it was a physical property as a liquid bond grindstone before drying.
実施例 3 砥粒Q#3000を1.0kgに対して、液体30%アクリルエ
マルション溶液90mlを、少量ずつ滴下しながら、混合造
粒機により粒径50〜250μm程度に混合、造粒し、この
混合造粒物を圧縮成型機に供給して圧縮成型し、液体ボ
ンド砥石とした。この液体ボンド砥石の液体含有量は20
%、硬度87、曲げ強度0.1kg/cm2以下、圧縮強度0.1kg/c
m2以下であったが、これを3週間室内に貯蔵したとこ
ろ、液体含有量3.6%、硬度93、曲げ強度10kg/cm2、圧
縮強度22kg/cm2となり、著しく液体含有量や、物性に変
化を生じた。Example 3 1.0 ml of abrasive grains Q # 3000 was mixed with 90 ml of a liquid 30% acrylic emulsion solution little by little while being mixed and granulated by a mixing granulator to a particle size of about 50 to 250 μm, and this mixture was mixed. The granulated material was supplied to a compression molding machine and compression molded to obtain a liquid bond grindstone. The liquid content of this liquid bond grindstone is 20
%, Hardness 87, bending strength 0.1 kg / cm 2 or less, compression strength 0.1 kg / c
Although it was less than m 2, when it was stored in the room for 3 weeks, the liquid content was 3.6%, the hardness was 93, the bending strength was 10 kg / cm 2 , and the compression strength was 22 kg / cm 2 , which markedly affects the liquid content and physical properties. A change has occurred.
一方、上記と同じように圧縮成型した液体ボンド砥石
を、70℃の加熱機のなかに置き、12時間、強制乾燥した
成型物の液体含有量は2.8%、硬度99、曲げ強度15、圧
縮強度30であったが、この成型物を3週間室内に貯蔵し
たのち、測定した結果は、液体含有量も物性も、乾燥直
後とまったく変化がなく、貯蔵安定性に優れていた。On the other hand, a liquid bond grindstone that was compression molded in the same manner as above was placed in a heating machine at 70 ° C, and for 12 hours, the liquid content of the molded product was 2.8%, hardness 99, bending strength 15, compression strength. Although the value was 30, the molded product was stored in the room for 3 weeks, and the measurement result showed that the liquid content and the physical properties did not change at all immediately after drying, and the storage stability was excellent.
実施例 4 砥粒WA#3000、1kgに対して、液体として石油樹脂25g
を溶解したキシレン溶液150mlを滴下しながら、混合造
粒機で混合、造粒し、圧縮成型機に供給して荷重350〜4
00kg/cm2、圧縮比2.7で成形し、液体ボンド砥石とし
た。この液体ボンド砥石の硬度を測定したところ、砥石
表面の測定部位により、硬度に大きなばらつきがあり、
最低値72、最高値77、平均値が73であった。Example 4 Petroleum resin 25 g as a liquid for 1 kg of abrasive grain WA # 3000
While dropping 150 ml of xylene solution in which was dissolved, mix and granulate with a mixing granulator, supply to a compression molding machine and load 350 to 4
A liquid bond grindstone was formed by molding at 00 kg / cm 2 and a compression ratio of 2.7. When the hardness of this liquid bond grindstone was measured, there was a large variation in hardness depending on the measurement site on the surface of the grindstone,
The lowest value was 72, the highest value was 77, and the average value was 73.
一方、砥粒WA#3000、1kgに対して、液体として石油
樹脂25gを溶解したキシレン溶液180mlを滴下しながら、
混合造粒機で混合、造粒し、圧縮成型機にかけて上と同
様に350〜400kg/cm2、圧縮比2.5で成型し、液体ボンド
砥石とした。この液体ボンド砥石を、いったん加熱乾燥
して液体含有量を5%以下としたのち、乾燥物の表面に
石油樹脂を含まないキシレン30mlを流し掛けて、再び元
の液体ボンド砥石に戻した。この液体ボンド砥石の硬度
は、砥石表面のどの位置で測定してもほとんどはらつき
がなく、最低値74、最高値75、平均値74.5であった。On the other hand, to 1 kg of abrasive grains WA # 3000, while dropping 180 ml of xylene solution in which 25 g of petroleum resin was dissolved as a liquid,
The liquid-bonded grindstone was prepared by mixing and granulating with a mixing granulator and then molding it with a compression molding machine at 350 to 400 kg / cm 2 at a compression ratio of 2.5 in the same manner as above. This liquid bond grindstone was once dried by heating to a liquid content of 5% or less, then 30 ml of xylene containing no petroleum resin was poured onto the surface of the dried product, and the liquid bond grindstone was returned to the original liquid bond grindstone. Hardness of this liquid bond grindstone showed almost no fluctuations at any position on the grindstone surface, with a minimum value of 74, a maximum value of 75, and an average value of 74.5.
実施例 5 砥粒としてのQ#3000に、液体として45%アクリルエ
マルション溶液、および3%でんぷん溶液を滴下しなが
ら、混合造粒機で混合、造粒し、この混合造粒物を金型
容器に充填して圧縮成型機に供給し、荷重400〜500kg/c
m2、圧縮比2.1で圧縮成型して液体オンド砥石とした。
ついでこの液体ボンド砥石が入った金型容器を、平面ラ
ップ盤の回転テーブルの上に置き、スライスしたシリコ
ーンウエーハ表面を砥石表面に押しつけ、純水を10ml/m
inの割合で、連続的に砥石表面に噴霧しながら摺動させ
た。加工荷重3kg、相対回転速度30m/minにおける加工能
率は、3μ/min、研磨延び時間20minにおける液体ボン
ド砥石の減耗量は、7mmであった。Example 5 While dropping 45% acrylic emulsion solution and 3% starch solution as liquids into Q # 3000 as abrasive grains, they were mixed and granulated by a mixing granulator, and the mixed granulation product was placed in a mold container. And then supply it to the compression molding machine with a load of 400 to 500 kg / c.
A liquid-ond whetstone was obtained by compression molding with m 2 and a compression ratio of 2.1.
Then, the mold container containing this liquid bond grindstone was placed on the rotary table of the flat lapping machine, the sliced silicone wafer surface was pressed against the grindstone surface, and pure water was added to 10 ml / m.
At a ratio of in, the surface of the grindstone was continuously slid while being sprayed. At a processing load of 3 kg and a relative rotation speed of 30 m / min, the processing efficiency was 3 μ / min, and the wear amount of the liquid bond grindstone at a polishing extension time of 20 min was 7 mm.
シリコーンウエーハの研磨を継続して、26minを経過
した時点で、液体ボンド砥石は崩壊して、研磨の継続が
不能となった。When 26 minutes passed after continuing the polishing of the silicone wafer, the liquid bond grindstone collapsed and the polishing could not be continued.
一方、上記と同様に調整した液体ボンド砥石を金型か
ら取り出し、金熱機に入れて50℃、24hrの条件で強制乾
燥した。この乾燥成型物を、平面ラップ盤の上に接着し
てスライスしたシリコーンウエーハ表面を成型物表面に
押しつけ、純水を15ml/minの割合で、連続的に砥石表面
に噴霧しながら摺動させた。上記と同一の研磨条件で研
磨を行ったところ、加工能率は3μ/minと変わらなかっ
たが、研磨延べ時間20minにおける砥石の減耗率は0.6mm
に止まり、しかも研磨を継続して、35minを経過して
も、砥石が崩壊することはなかった。On the other hand, the liquid bond grindstone prepared in the same manner as above was taken out of the mold, placed in a metal heating machine, and forcibly dried under the conditions of 50 ° C. and 24 hours. This dry molded product was adhered on a flat lapping machine, and the sliced silicone wafer surface was pressed against the molded product surface, and pure water was slid while continuously spraying the grindstone surface at a rate of 15 ml / min. . When polishing was carried out under the same polishing conditions as above, the processing efficiency was 3 μ / min, but the wear rate of the grindstone at a polishing total time of 20 min was 0.6 mm.
The grinding stone did not disintegrate even after 35 minutes had passed after polishing was continued.
Claims (1)
在させ、液体の表面張力若しくは粘着力により砥粒を保
持して圧縮変形してなる液体ボンド砥石の液体含有量を
減少させた後、この液体ボンド砥石の表面に液体を介在
させて被研磨材を押圧しながら研磨するようにしたこと
を特徴とする研磨方法。1. A liquid content of a liquid bond grindstone obtained by mixing abrasive particles and a liquid to allow a liquid to exist between the abrasive particles, holding the abrasive particles by the surface tension or adhesive force of the liquid, and compressively deforming the abrasive particles. After the amount is reduced, a liquid is interposed on the surface of the liquid bond grindstone to polish the material to be polished while pressing the material to be polished.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62061311A JPH0818230B2 (en) | 1987-03-18 | 1987-03-18 | Polishing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62061311A JPH0818230B2 (en) | 1987-03-18 | 1987-03-18 | Polishing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63229253A JPS63229253A (en) | 1988-09-26 |
| JPH0818230B2 true JPH0818230B2 (en) | 1996-02-28 |
Family
ID=13167491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62061311A Expired - Fee Related JPH0818230B2 (en) | 1987-03-18 | 1987-03-18 | Polishing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0818230B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2079276C (en) * | 1991-10-01 | 1999-09-21 | Jie Xu | Polishing process for optical connector assembly with optical fiber and polishing apparatus |
| JP3187480B2 (en) * | 1991-10-01 | 2001-07-11 | 古河電気工業株式会社 | Polishing apparatus and method for polishing a combined body of optical fiber and optical connector |
| JP5304439B2 (en) * | 2009-05-26 | 2013-10-02 | 信越半導体株式会社 | Wheel selection method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS525082A (en) * | 1975-07-01 | 1977-01-14 | Inoue Japax Res Inc | Polishing method |
| JPS60141469A (en) * | 1983-12-29 | 1985-07-26 | Omron Tateisi Electronics Co | Bubble working machine |
-
1987
- 1987-03-18 JP JP62061311A patent/JPH0818230B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63229253A (en) | 1988-09-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |