JPH0818474B2 - Information card - Google Patents
Information cardInfo
- Publication number
- JPH0818474B2 JPH0818474B2 JP63023167A JP2316788A JPH0818474B2 JP H0818474 B2 JPH0818474 B2 JP H0818474B2 JP 63023167 A JP63023167 A JP 63023167A JP 2316788 A JP2316788 A JP 2316788A JP H0818474 B2 JPH0818474 B2 JP H0818474B2
- Authority
- JP
- Japan
- Prior art keywords
- information card
- spring
- metal cover
- resistor
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、情報カードにかかり、特に、外部からの静
電破壊を防止した情報カードに関する。TECHNICAL FIELD The present invention relates to an information card, and more particularly to an information card in which electrostatic breakdown from the outside is prevented.
従来、この種の情報カードの静電破壊防止対策として
は、外装部分を全プラスチック化するが、外部接続端子
に抵抗を入れていた。Conventionally, as a measure for preventing electrostatic breakdown of this type of information card, the exterior part is made entirely of plastic, but a resistor is inserted in the external connection terminal.
上述した従来の情報カードは、外装部分が全てプラス
チツクとなっているので、外部からの静電気に対して
は、若干の効果は見られるが、情報カードの曲げ，ねじ
れ等の機械的特性において弱いという欠点がある。又、
外部接続端子に抵抗を入れた情報カードにおいては、メ
モリーのアクセスタイムが遅くなるという欠点がある。The above-mentioned conventional information card has a plastic outer portion, so some effect can be seen against external static electricity, but it is weak in mechanical characteristics such as bending and twisting of the information card. There are drawbacks. or,
The information card having a resistor in the external connection terminal has a drawback that the memory access time is delayed.
又、両構造とも、静電気５〜10KVで破壊された。 Both structures were destroyed by static electricity of 5-10KV.
上述した従来の情報カードに対し、本発明は、カード
外装の表裏を金属カバーで構成し、該、表裏の金属カバ
ーが同電位となる様な構造を有し、静電対策を施したと
いう相違点を有する。In contrast to the above-mentioned conventional information card, the present invention has a structure in which the front and back of the exterior of the card are composed of metal covers, and the metal covers on the front and back have the same potential, and electrostatic countermeasures are taken. Have a point.
〔問題点を解決するための手段〕 本発明の情報カードは、内部に、半導体チップを搭載
したモジュール基板と、外部装置と接続する為のコネク
ターを有し、表裏を金属カバーにより外装され、該、表
裏の金属カバーの内壁間をカード内で、金属スプリング
等の導電性スプリングで電気的接合せしめ、同電位と
し、かつ、金属カバーがモジュール基板上のアースと抵
抗を介して、スプリングにより電気的接合を有してい
る。上記両スプリングはたがいに独立に異なるスプリン
グとすることができる。又、一方のスプリングの一部を
用いて他方のスプリングとすることもできる。[Means for Solving the Problems] The information card of the present invention has a module substrate on which a semiconductor chip is mounted and a connector for connecting to an external device, and the front and back surfaces are covered with a metal cover. , The inner walls of the front and back metal covers are electrically connected in the card with a conductive spring such as a metal spring to keep the same potential, and the metal cover is electrically connected to the ground on the module board via a resistor and electrically connected by the spring. Has a bond. The two springs can be independently different springs. Also, a part of one spring can be used as the other spring.
次に、本発明について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
第１図は、本発明の第１の実施例の斜視図、第２図
は、第１の実施例の断面図である。FIG. 1 is a perspective view of the first embodiment of the present invention, and FIG. 2 is a sectional view of the first embodiment.
内部に、半導体チップ25が、２層〜６層に積層された
厚さ0.2〜0.8mmtのモジュール基板24に搭載され、か
つ、外部装置と接続する為のコネクタ11が、該モジュー
ル基板24に半田付けされ、表裏を0.1〜0.3mm厚のステン
レス，アルミ等で加工された金属カバー22,23により外
装された情報カードの、該表金属カバー22と裏金属カバ
ー23間を径1.5〜2.5mmの金属スプリング27により電気的
接合せしめ、同電位とする。又、表金属カバー22がモジ
ュール基板24上のアースと抵抗26を介して、スプリング
28により電気的接合をする。Inside, a semiconductor chip 25 is mounted on a module board 24 having a thickness of 0.2 to 0.8 mm, which is laminated in two to six layers, and a connector 11 for connecting to an external device is soldered to the module board 24. Of the information card which is attached to the front and back of the information card and is covered with metal covers 22 and 23 which are processed with stainless steel, aluminum or the like having a thickness of 0.1 to 0.3 mm. The metal springs 27 are electrically connected to each other so that they have the same potential. In addition, the front metal cover 22 is connected to the ground on the module board 24 and the resistor 26,
Make electrical connection with 28.
第３図は、本発明の第２の実施例の断面図である。 FIG. 3 is a sectional view of the second embodiment of the present invention.
第１の実施例と同様に構成された情報カードのモジュ
ール基板34にスルホール電極39を設け、表金属カバー32
と裏金属カバー33の電気的接合及び、モジュール基板34
上のアースと抵抗36を介しての金属カバーとの電気的接
合を一つのスプリング37で行なうものである。A through hole electrode 39 is provided on a module substrate 34 of an information card having the same structure as that of the first embodiment, and a front metal cover 32 is provided.
And the back metal cover 33 and the module board 34
The electric connection between the upper ground and the metal cover via the resistor 36 is performed by one spring 37.
以上説明したように本発明は、表裏の金属カバー間を
同電位、かつ、モジュール基板のアースと抵抗を介して
電気的接合する構造により、静電気のカードへの放電が
あった場合、金属カバーに放電された静電気は抵抗を介
してアースへ流れる。この構造において、静電破壊試験
の結果、従来の情報カードでは、５〜10KVで不良が発生
したが、本構造のカードでは、15〜20KVでも静電破壊に
よる不良の発生は無かった。INDUSTRIAL APPLICABILITY As described above, the present invention has a structure in which the front and back metal covers are electrically connected to each other at the same potential, and the ground of the module substrate is electrically connected via a resistor. The discharged static electricity flows to the ground through the resistor. In this structure, as a result of the electrostatic breakdown test, the conventional information card had a defect at 5 to 10 KV, but the card of this structure had no defect due to electrostatic breakdown even at 15 to 20 KV.
第１図は本発明の第１の実施例の斜視図であり、第２図
は第１の実施例の一部断面図である。第３図は本発明の
第２の実施例の一部断面図である。 11……コネクター、12,22,32……表金属カバー、13,23,
33……裏金属カバー、24,34……モジュール基板、25,35
……半導体チップ、26,36……抵抗、27,37……スプリン
グ−１、28……スプリング−２、39……スルホール電
極。FIG. 1 is a perspective view of the first embodiment of the present invention, and FIG. 2 is a partial sectional view of the first embodiment. FIG. 3 is a partial cross-sectional view of the second embodiment of the present invention. 11 …… Connector, 12,22,32 …… Front metal cover, 13,23,
33 …… Back metal cover, 24,34 …… Module substrate, 25,35
...... Semiconductor chip, 26,36 ...... Resistance, 27,37 ...... Spring-1, 28 ...... Spring-2, 39 ...... Through-hole electrode.
Claims (1)
ル基板と、外部装置と接続する為のコネクターとを有
し、表裏を金属カバーにより外装された情報カードにお
いて、該表裏の金属カバー間を電気的に接続する第１の
スプリング及びモジュール基板上のアースと前記金属カ
バーとを抵抗を介して電気的に接続する第２のスプリン
グをさらに備えることを特徴とする情報カード。1. An information card having a module substrate having a semiconductor chip mounted therein, a connector for connecting to an external device, and a front and back covered with a metal cover. An information card, further comprising: a first spring that electrically connects with each other and a second spring that electrically connects the ground on the module substrate and the metal cover via a resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63023167A JPH0818474B2 (en) | 1988-02-02 | 1988-02-02 | Information card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63023167A JPH0818474B2 (en) | 1988-02-02 | 1988-02-02 | Information card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01198394A JPH01198394A (en) | 1989-08-09 |
| JPH0818474B2 true JPH0818474B2 (en) | 1996-02-28 |
Family
ID=12103066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63023167A Expired - Lifetime JPH0818474B2 (en) | 1988-02-02 | 1988-02-02 | Information card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0818474B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5397857A (en) * | 1993-07-15 | 1995-03-14 | Dual Systems | PCMCIA standard memory card frame |
| JP2667369B2 (en) * | 1994-08-05 | 1997-10-27 | インターナショナル・ビジネス・マシーンズ・コーポレイション | IC card manufacturing method and IC card |
| US5920460A (en) * | 1997-01-11 | 1999-07-06 | Methode Electronics, Inc. | PC card receptacle with integral ground clips |
| JP3778795B2 (en) * | 2000-11-14 | 2006-05-24 | シャープ株式会社 | Electrical equipment with light receiving unit |
| JP2012253398A (en) * | 2009-09-29 | 2012-12-20 | Univ Of Electro-Communications | Device, system, and method for transmitting power and information |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59127284A (en) * | 1983-01-10 | 1984-07-23 | Canon Inc | memory card |
| JPS6132456U (en) * | 1984-07-31 | 1986-02-27 | 勝次 松永 | Waterproof roof with frame for construction site |
| JPS61258797A (en) * | 1985-05-13 | 1986-11-17 | 菱電化成株式会社 | Integrated circuit card |
-
1988
- 1988-02-02 JP JP63023167A patent/JPH0818474B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01198394A (en) | 1989-08-09 |
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