JPH0819554B2 - Compound plating equipment - Google Patents

Description

TECHNICAL FIELD The present invention relates to a composite plating apparatus used for composite plating in which a composite material such as inorganic or organic fine particles is codeposited in a plating film.

Conventional technology Conventionally, in composite plating in which a composite material such as inorganic or organic fine particles is co-deposited in a plating film, plating is performed for the purpose of uniformly dispersing the composite material in a plating solution and uniformly co-depositing in the plating film. In order to stir the solution, a propeller stirring type plating device that stirs by rotating a propeller immersed in the plating solution, or air or the plating solution is operated by a pump from the blowout hole of the blowout pipe installed at the bottom of the plating tank. A pump agitation type plating apparatus that agitates by blowing it into a liquid is generally used.

Problems to be Solved by the Invention However, these composite plating apparatuses are not suitable for SiC, Al ₂ O ₃ , and Zn.
When using a plating solution containing inorganic fine particles such as O ₂ and Y ₂ O ₃ and organic fine particles such as polytetrafluoroethylene, when performing composite plating in which these inorganic or organic fine particles are uniformly dispersed and co-deposited in the plating film, In particular, inorganic fine particles having a high specific gravity tend to be deposited in blind spots such as corners in a plating tank that cannot be stirred or are weakly stirred, and even if a large amount of fine particles are added to the plating solution, Not all of them are uniformly dispersed in the plating solution, and therefore, there are wasteful particles that are not used for composite, which is uneconomical and causes a problem that the amount of eutectoid does not increase as much as the amount of added particles. Furthermore, although the amount of fine particles co-deposited can be increased or decreased depending on the strength of stirring, the amount of fine particles added is not used effectively as described above, and the amount of fine particles deposited in the squares varies depending on the strength of stirring. The reproducibility of the amount of eutectoid due to the strength of is poor.

Further, in a plating apparatus using a propeller agitation method, the plating solution has a vortex shape, and the vortex causes flow direction in the solution, so that the plating solution is not uniformly stirred and the composite material is not uniformly dispersed in the plating solution. Therefore, in this type of plating equipment, the amount of composite material dispersed in the plating solution and the amount of composite material co-deposition in the plating film decrease, and the amount of composite material co-deposition varies depending on the location of the object to be plated itself. May occur,
Problems such as a pattern appearing in the plating appearance corresponding to the flow of the plating solution, and when a large number of objects to be plated are plated at the same time, the eutectoid amount of the composite material varies among the objects to be plated, occur.

The present invention has been made in view of the above circumstances, and it is possible to uniformly stir the plating solution by preventing the generation of vortices in the plating solution, and to prevent the composite material from forming a blind spot such as a corner in the plating tank. The composite material can be efficiently dispersed in the plating solution without depositing, thus increasing the eutectoid amount of the composite material in the plating film and providing a uniform and stable composite plating film without unevenness. An object of the present invention is to provide a composite plating apparatus capable of performing the above.

Means for Solving the Problems In order to achieve the above-mentioned object, the present invention provides a square box-shaped plating tank in which a composite plating solution in which a composite material is dispersed is accommodated in the bottom wall inner surface of a bottom wall center portion to four corner portions. The V-shaped troughs are formed so that the depth gradually increases from the center of the bottom wall toward the four corners, and a rotary propeller that stirs the plating solution is arranged near the deepest part of each trough. The discharge port of the discharge pipe connected to the pump for returning the plating solution taken out from the plating tank to the plating tank instead of the composite plating apparatus and the above-mentioned rotary propeller is located near the deepest part of the valley. Provided is a composite plating apparatus characterized by being arranged as described above.

Here, the depth of the deepest part of the valley is 15-100m from the center
It is preferable to make m deep, especially 20 to 60 mm.

The plating apparatus of the present invention can be applied to both composite electroplating and composite electroless plating, the type of plating solution contained therein is not particularly limited, and incidental equipment corresponding to the type of these plating solutions, for example, An anode, a machine, etc. can be attached. In this case, a rocking device that rocks the object to be plated back and forth, left and right, or up and down can be used together. Further, the kind of the composite material dispersed in the composite plating solution is not limited, and may be inorganic fine particles, organic fine particles, short fibers, or the like, but in the present invention, those having a relatively large specific gravity, for example, SiC. , Al ₂ O ₃ , ZnO ₂ , Y ₂ O _{3 and} other inorganic fine particles, polytetrafluoroethylene and other fluororesins, and fluorinated graphite and other fine particles.

Working The plating apparatus of the present invention has the above-mentioned configuration,
The plating solution flow generated by the rotation of the propeller or the plating solution flow from the discharge port of the pump flows from the deepest part to the highest part (center part of the bottom wall of the plating tank) through the valley formed on the bottom wall of the plating tank. With the plating solution flow from the other valleys formed as described above, a solution flow that flows upward in the center of the plating tank is formed. As a result, the plating solution in the plating tank is agitated uniformly and the composite material is uniformly dispersed without causing the disadvantage of generation of vortices. Further, in this case, the discharge port of the rotary propeller or the pump agitator is arranged near the deepest part of each valley, that is, near the lower end of the peripheral wall of the plating tank. In this case, the deepest part of the valley is a rectangular box-shaped plating. Since it is at each corner of the bath, composite materials such as high-density inorganic fine particles do not settle in the blind spots at the corners of the plating bath, and a large amount of composite material can be efficiently dispersed in the plating solution. .
Therefore, it is possible to increase the amount of the composite material eutectoid in the plating film and to provide a uniform and stable composite plating film without unevenness.

In addition, since the composite material can be uniformly and efficiently dispersed in the plating solution in this way, the rotation of the propeller is changed from low rotation to high rotation, or the pump flow rate is changed from low flow rate to high flow rate to agitate a wide range. A composite plating solution that is stable in force can be obtained. Therefore, the eutectoid amount of the composite material in the plating film can be easily increased or decreased by adjusting the rotation speed of the propeller or the discharge amount from the pump.

Embodiments of the present invention will be described below with reference to the drawings.

[First Embodiment] FIGS. 1 and 2 show a composite plating apparatus according to an embodiment of the present invention.

In the figure, 1 is a rectangular box-shaped plating tank containing a composite plating solution 2 in which a composite material is dispersed, and a rectangular link-shaped reinforcing body 3 is fixed to the outer peripheral portion of the upper peripheral wall of the plating tank 1. As shown in FIG. 3, the inner surface of the bottom wall 4 has four corners (even parts) 5,5,5, from the center and the center of each ridge (edge).
V-shaped troughs 6, 6, 6, 6 with progressively deeper depth toward 5
Are formed. Further, four stirrers 9,9,9,9 each having a propeller 8 attached to the tip of a rotary shaft 7 rotated by a motor (not shown) are connected to the above propellers 8,8,8,8 by the above-mentioned troughs. Are arranged so as to be located slightly above the deepest part of the. In the figure, 10 and 10 are legs.

Here, the rotation diameter of the propeller is 20 to 80 mmφ, especially 40
The diameter of the propeller is preferably -60 mmφ, and the position of the propeller is preferably 5-100 mm, particularly 10-30 mm above the deepest part of the valley.

When performing the composite plating using the above plating apparatus, the object to be plated is immersed in the composite plating solution 2 in the plating tank 1 and the four propellers 8,8,8,8 are rotated by the rotation of the motor.
The plating is performed while rotating the. As a result, the plating solution in the vicinity of each corner 5, 5, 5, 5 in the plating tank 1 flows downward by the rotation of the propeller 8, that is, toward the deepest part of the valley, and along the valley, the bottom wall center Ascending toward the section, at the center, the liquid flows from the four valleys together rise, thus forming a downward to upward flow. Next, this flow descends in the vicinity of each corner of the plating tank 1, and thereafter the same flow state is continuously repeated.

Therefore, in the above device, the valleys 6,6,6,6 are formed on the inner surface of the bottom wall 4 of the plating tank 1 so as to gradually deepen from the center toward the four corners 5,5,5,5. Rotating propellers 8,8,8,8 are respectively arranged at the deepest positions of the parts 6,6,6,6, that is, at the corners of the bottom wall, and the propellers 8,8,8,8 are rotated. By doing so, the above-mentioned liquid flow is formed, so that the composite material does not deposit on the corner portion 11 of the plating tank 1, there is no flat portion on the bottom wall 4, and the deepest portion has a corner portion. Since the composite material does not deposit on other portions, the composite material can be efficiently and uniformly dispersed in the plating solution. In addition, a stable upward liquid flow is formed by the troughs of the bottom wall 4, whereby the composite material can be uniformly dispersed without causing the inconvenience of generation of vortices. Therefore, according to the composite plating apparatus of this example, the amount of composite material eutectoid can be increased, and a plating film in which the composite material is uniformly and stably codeposited can be obtained. Further, since the composite material can be efficiently dispersed, the eutectoid amount of the composite material in the plating film can be easily increased or decreased by adjusting the stirring force, that is, the rotation speed of the rotary propeller.

In the above apparatus, the lower end is separated from the bottom wall 4 of the plating tank 1 by a predetermined distance as shown in FIG. 4 at the position shown by the chain double-dashed line in FIG. The partition plates 16, 16, 16, 16 having the slit window (16a) formed therein may be arranged to form the propeller chambers 17, 17, 17, 17. By providing such a propeller chamber, the plating solution flow can be circulated more smoothly in the form of a strip, the rotating flow of the solution can be more reliably prevented, and bubbles in the plating solution,
The entrainment of air can be prevented more reliably.

[Second Embodiment] FIG. 5 shows another embodiment of the present invention. In this embodiment, instead of the rotary propeller 8 of the first embodiment, the plating solution 2 is supplied from the upper portion 12 of the plating solution 2. Pump 14 for sucking the plating solution and discharging the plating solution from the four discharge pipes 13, and the discharge port 15 of the discharge pipe 13 is a valley portion 6, 6, 6, 6 formed in the bottom wall 4 of the plating tank 1. It is arranged so as to be located slightly above the deepest part of the. In this case, the pipe diameter of the discharge pipe is preferably 2 to 40 mmφ, particularly 5 to 25 mmφ, and the pump liquid amount is 1 to 100 / min, and particularly 15 to 70 / min.
It is preferable to set it as minutes. The rest of the configuration is similar to that of the first embodiment, so its explanation is omitted.

In this way, when the pump agitation method is adopted, by providing the discharge port 15 of the discharge pipe 13 in the vicinity of the deepest part of the valley part, the same effect as that of the first embodiment is produced.

In addition, in the second embodiment, the plating solution in the plating tank was sucked up by the pump and the sucked plating solution was discharged as described above. May be supplied to the auxiliary tank and discharged from the auxiliary tank to the deepest part of the valley as described above by a pump. In this case, the introduction of the plating solution into the auxiliary tank does not depend on the pump but is based on, for example, an overflow method. The method of can also be adopted.

Further, in the above-mentioned embodiment, the discharge pipe is arranged in the plating tank along the vertical direction, but as shown by the chain double-dashed line in FIG. 5, the discharge pipe is connected to the wall surface of the plating tank near the deepest part of the valley. However, the plating solution may be discharged in the horizontal direction, the vertical direction, or the diagonal direction.

In addition, the composite plating apparatus of the present invention includes the above first and second
The present invention is not limited to the examples, and the shape of the plating tank, the shape and number of valleys of the bottom wall, and other configurations may be variously changed without departing from the scope of the present invention.

 Next, the effects of the present invention will be specifically shown by Examples.

[Experimental example]

The same plating equipment as shown in FIGS. 1 and 2 was used to perform the composite plating of the following (1) and (2), and the eutectoid amount of the composite material in the plating film was measured. In this case, plating tank 1
The size used was 250 mm × 250 mm × 300 mm. Also,
The depth of the deepest part of the valley 6 is 30 mm deeper than the center, the propeller position is 45 mm above the valley bottom, and the propeller rotation diameter is 40 mmφ.
And

(1) Disperse 300 μg of 1 μm diameter ZrO ₂ fine particles in a watt-type nickel plating solution, and change the propeller speed in the range of 0 to 800 rpm by the above method under the conditions of pH 4.2 and temperature 55 ° C. Composite electro-nickel plating was performed at a density of 4 A / dm ² , and the amount of eutectoid ZrO _{2 in} the plating film was measured. The results are shown in Table 1.

(2) 400g / of 3μm diameter SiO ₂ fine particles are dispersed in a nickel sulfamate plating solution, and the composite electric nickel is used at a cathode current density of 2A / dm ² under the conditions of pH 4.2, temperature 40 ° C, and propeller speed 0-500rpm. Perform plating and
The amount of eutectoid SiO ₂ was measured. Table 2 shows the results.

EFFECTS OF THE INVENTION As described above, the composite plating apparatus of the present invention can prevent the generation of vortices in the plating solution and uniformly stir the plating solution. The composite material can be efficiently dispersed in the plating solution without causing the composite material to be deposited in the blind spots. Therefore, the amount of the composite material codeposited in the plating film can be increased, and the uniform and stable composite material can be obtained. A plating film can be provided.

[Brief description of drawings]

FIG. 1 is a front view showing an embodiment of the composite plating apparatus of the present invention, FIG. 2 is a plan view of the same example, FIG. 3 is a perspective view showing a bottom wall of the same example, and FIG. -Cross section view along line IV, No. 5
The figure is a front view showing another embodiment of the composite plating apparatus of the present invention. 1 ... Plating tank, 2 ... Plating solution, 4 ... Bottom wall, 6 ...
Tanibe, 8 …… Rotating propeller, 13 …… Discharge pipe, 14 ……
Pump, 15 ... Discharge port.

Claims (2)

[Claims] Claim: What is claimed is: 1. A bottom of a rectangular box-shaped plating bath containing a composite material containing a composite material, the bottom wall having a V-shaped cross section extending from the center of the bottom wall to the four corners of the bottom wall. The complex plating apparatus is characterized in that it is formed so that the depth gradually becomes deeper from each part toward the four corners, and a rotary propeller for stirring the plating solution is arranged at a position near the deepest part of each valley. 2. The composite plating apparatus according to claim 1,
In place of the rotary propeller arranged near the deepest part of each valley, the discharge port of the discharge pipe connected to the pump for returning the plating solution taken out from the plating tank to the plating tank is located near the deepest part of the valley. The composite plating apparatus is characterized in that it is arranged so as to be located at.