JPH0819908B2 - Vacuum pump for exhausting vacuum manufacturing equipment - Google Patents
Vacuum pump for exhausting vacuum manufacturing equipmentInfo
- Publication number
- JPH0819908B2 JPH0819908B2 JP4166800A JP16680092A JPH0819908B2 JP H0819908 B2 JPH0819908 B2 JP H0819908B2 JP 4166800 A JP4166800 A JP 4166800A JP 16680092 A JP16680092 A JP 16680092A JP H0819908 B2 JPH0819908 B2 JP H0819908B2
- Authority
- JP
- Japan
- Prior art keywords
- vacuum pump
- vacuum
- exhaust
- pump
- motor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000007789 gas Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 239000007795 chemical reaction product Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000003745 diagnosis Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- -1 and as a result Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D19/00—Axial-flow pumps
- F04D19/02—Multi-stage pumps
- F04D19/04—Multi-stage pumps specially adapted to the production of a high vacuum, e.g. molecular pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D27/00—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids
- F04D27/001—Testing thereof; Determination or simulation of flow characteristics; Stall or surge detection, e.g. condition monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、排気用真空ポンプに係
り、特に、ドライエッチング、CVD(化学蒸着)、イ
オン注入などの工程に代表される半導体や液晶など精密
電子部品の製造装置(以下真空製造装置という)の排気
用真空ポンプに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exhaust vacuum pump, and more particularly to an apparatus for manufacturing precision electronic parts such as semiconductors and liquid crystals represented by processes such as dry etching, CVD (chemical vapor deposition) and ion implantation (Referred to as a vacuum manufacturing apparatus) for discharging a vacuum pump.
【0002】[0002]
【従来の技術】半導体製造プロセスの排気系には、エッ
チング、CVDなどのウエハープロセスに供給された未
反応ガス成分や、プロセスであらたに生成した数多くの
ガス成分が含まれている。これらの中にはきわめて反応
性に富んだガスが多く、その結果固形物状の反応生成物
が真空ポンプを含む排気系配管の内面に付着し、ついに
は閉塞させてしまう。2. Description of the Related Art An exhaust system of a semiconductor manufacturing process contains unreacted gas components supplied to a wafer process such as etching and CVD and many gas components newly generated in the process. Many of these are highly reactive gases, and as a result, solid reaction products adhere to the inner surface of the exhaust system pipe including the vacuum pump, and eventually block them.
【0003】従来はこれらの反応生成物の付着、さらに
は閉塞を検知する方法がなかった。閉塞物に起因して真
空ポンプが停止するなどの不具合が発生して初めて閉塞
を知るのが現状であった。このため、従来は経験から寿
命を想定して早めにポンプを交換してしまうか、予備の
ポンプを常に用意しておき、不具合が発生したときに急
いで交換するなどの手段をとっていた。Conventionally, there has been no method for detecting the adhesion of these reaction products and further the blockage. The current situation is to know the blockage only when a problem such as the vacuum pump stopping due to the blockage occurs. For this reason, conventionally, from experience, the pump has been replaced early, assuming the end of its life, or a spare pump has always been prepared so that when a problem occurs, it is replaced promptly.
【0004】[0004]
【発明が解決しようとする課題】真空製造装置ではLS
Iなどの精密な電子製品を加工しているので、何の前兆
もなく真空ポンプが突然停止すると、その工程にかかわ
るすべての製品が不良品になってしまう。また、ある期
間正規の排気が行われなかったことにより、ポンプ復旧
(交換)、排気ラインの付着固形物の除去などに長時間
を要し、生産停止に伴う経済的損失が大きい。本発明
は、上記真空製造装置の真空ポンプを含む排気系に対す
る反応生成物の付着・閉塞を予知する手段を有する排気
用真空ポンプを提供することを課題とする。In the vacuum manufacturing apparatus, the LS is used.
Since precision electronic products such as I are processed, if the vacuum pump suddenly stops without any warning, all products involved in the process become defective products. In addition, since regular exhaustion is not performed for a certain period of time, it takes a long time to restore (replace) the pump, remove solid matters adhering to the exhaust line, and the economic loss due to production stoppage is large. An object of the present invention is to provide an evacuation vacuum pump having means for predicting adhesion / blockage of a reaction product with respect to an evacuation system including a vacuum pump of the above vacuum manufacturing apparatus.
【0005】[0005]
【課題を解決するための手段】上記課題を解決するため
に本発明では、真空製造装置の排気用真空ポンプにおい
て、該真空ポンプにモータ運転電流を測定するための電
流計とポンプ排気管内の温度を測定するための温度計と
を設け、該電流計及び/又は温度計の出力値を用いて排
気系の閉塞を検知する診断装置を具備することとしたも
のである。In order to solve the above problems, according to the present invention, in an exhaust vacuum pump of a vacuum manufacturing apparatus, an ammeter for measuring a motor operating current in the vacuum pump and a temperature in a pump exhaust pipe are provided. And a diagnostic device for detecting the blockage of the exhaust system by using the output value of the ammeter and / or the thermometer.
【0006】正常な真空ポンプで閉塞が生じていないも
のであれば、プロセス流量や半導体製造装置等の操作条
件は厳密にコントロールされているので、真空ポンプモ
ータ電流値、ポンプ排気温度とも変動がすくなく、安定
している。例えば、標準的なドライエッチング工程の場
合、排気量1000リットル/min程度で、ポンプモ
ータ電流値約14アンペアであるが、真空ポンプの流路
に反応生成物が付着してくると、その付着具合によって
モータ運転電流値が増大し、最大19アンペアに達する
例もある。As long as the normal vacuum pump does not cause blockage, the process flow rate and the operating conditions of the semiconductor manufacturing equipment are strictly controlled, so that the vacuum pump motor current value and the pump exhaust temperature do not vary much. ,stable. For example, in the case of a standard dry etching process, the pump motor current value is about 14 amperes at an evacuation rate of about 1000 liters / min. There is also a case where the motor operating current value increases and reaches a maximum of 19 amperes.
【0007】また、真空ポンプに内蔵しているインター
クーラの性能が悪くなり、排気温度が上昇する。たとえ
ば、長期間使用して付着物が異常に多くなったポンプで
は、ポンプ本体出口で百数十℃程度に排気温度が上昇す
る。本発明では、上記のようなモータ運転の電流変化及
びポンプ排気管の温度変化を、電流計及び温度計により
常時測定しておき、その測定値を診断装置で正常値と比
較することにより、真空ポンプの排気系の閉塞を検知す
ることができる。Further, the performance of the intercooler built in the vacuum pump deteriorates, and the exhaust temperature rises. For example, in a pump in which the amount of deposits has increased abnormally after being used for a long period of time, the exhaust gas temperature rises to about a hundred and several tens of degrees Celsius at the pump body outlet. In the present invention, the current change of the motor operation and the temperature change of the pump exhaust pipe as described above are constantly measured by an ammeter and a thermometer, and the measured value is compared with a normal value by a diagnostic device to obtain a vacuum It is possible to detect blockage of the exhaust system of the pump.
【0008】[0008]
【実施例】以下、本発明を図面を用いて具体的に説明す
るが、本発明はこれに限定されるものではない。 実施例1 図1は、本発明の真空製造装置の排気用真空ポンプの主
要機器を模的的に示す概略図である。図1において、真
空ポンプ2は半導体製造装置1に接続され、該装置1に
導入されたプロセスガス8と共に排気ガスを吸引して排
気管7から排気9する。真空ポンプ2はモータ3によっ
て作動され、該モータ3にはモータ運転電流を測定する
ためのモータ電流計5が設けられ、また真空ポンプ2の
排気管7には排気管内の温度を測定するための温度計4
が設けられている。そして、電流計5及び温度計4の測
定値は閉塞診断装置6に送られる。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below with reference to the drawings, but the present invention is not limited thereto. Example 1 FIG. 1 is a schematic view schematically showing main equipment of an exhaust vacuum pump of a vacuum manufacturing apparatus of the present invention. In FIG. 1, a vacuum pump 2 is connected to a semiconductor manufacturing apparatus 1 and sucks exhaust gas together with a process gas 8 introduced into the apparatus 1 and exhausts the exhaust gas 7 from an exhaust pipe 7. The vacuum pump 2 is operated by a motor 3, the motor 3 is provided with a motor ammeter 5 for measuring the motor operating current, and the exhaust pipe 7 of the vacuum pump 2 is for measuring the temperature in the exhaust pipe. Thermometer 4
Is provided. Then, the measured values of the ammeter 5 and the thermometer 4 are sent to the occlusion diagnosis device 6.
【0009】閉塞診断装置6での閉塞診断は、上記のモ
ータ電流値と排気温度の絶対値及びそれらの変化率(単
位時間当りの変化量)を演算して行うことができる。具
体的には モータ電流値上限値(例えば18Å)、排気温度上
限値(例えば40℃)のいずれかで警報を出す。 モータ電流値の変化率、排気温度の変化率を演算し
て規定値を越えると警報を出す。 ことにより行うことができ、真空ポンプを含む排気系に
対する反応生成物の付着・閉塞を予知することができ
る。The blockage diagnosis by the blockage diagnosis device 6 can be performed by calculating the absolute values of the motor current value and the exhaust gas temperature and the rate of change thereof (change amount per unit time). Specifically, an alarm is issued at either the motor current upper limit value (for example, 18Å) or the exhaust temperature upper limit value (for example, 40 ° C). Calculates the rate of change of motor current value and the rate of change of exhaust temperature, and issues an alarm when the specified values are exceeded. It is possible to predict the adhesion and clogging of the reaction product with respect to the exhaust system including the vacuum pump.
【0010】[0010]
【発明の効果】本発明によれば、真空ポンプモータ運転
電流値及び/又はポンプ排気温度を測定演算することに
より、排気系への反応生成物付着さらには閉塞を予知す
ることができるので計画的に真空ポンプの交換を行うこ
とができる。According to the present invention, it is possible to predict the adhesion of reaction products to the exhaust system and further the blockage by measuring and operating the operating current value of the vacuum pump motor and / or the pump exhaust temperature. The vacuum pump can be replaced.
【図1】本発明の主要機器を模式的に示す概略図。FIG. 1 is a schematic view schematically showing main equipment of the present invention.
1:半導体製造装置、2:真空ポンプ本体、3:真空ポ
ンプモータ、4:真空ポンプ排気温度計、5:モータ電
流計、6:閉塞診断装置、7:排気管、8:プロセスガ
ス、9:排気ガス1: semiconductor manufacturing device, 2: vacuum pump body, 3: vacuum pump motor, 4: vacuum pump exhaust thermometer, 5: motor ammeter, 6: blockage diagnostic device, 7: exhaust pipe, 8: process gas, 9: Exhaust gas
Claims (1)
て、該真空ポンプにモータ運転電流を測定するための電
流計とポンプ排気管内の温度を測定するための温度計と
を設け、該電流計及び/又は温度計の出力値を用いて排
気系の閉塞を検知する診断装置を具備することを特徴と
する真空製造装置の排気用真空ポンプ。1. An exhaust vacuum pump of a vacuum manufacturing apparatus, wherein the vacuum pump is provided with an ammeter for measuring a motor operating current and a thermometer for measuring a temperature in a pump exhaust pipe. An exhaust vacuum pump for a vacuum manufacturing apparatus, comprising a diagnostic device for detecting blockage of an exhaust system using an output value of a thermometer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4166800A JPH0819908B2 (en) | 1992-06-03 | 1992-06-03 | Vacuum pump for exhausting vacuum manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4166800A JPH0819908B2 (en) | 1992-06-03 | 1992-06-03 | Vacuum pump for exhausting vacuum manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0626460A JPH0626460A (en) | 1994-02-01 |
| JPH0819908B2 true JPH0819908B2 (en) | 1996-03-04 |
Family
ID=15837919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4166800A Expired - Fee Related JPH0819908B2 (en) | 1992-06-03 | 1992-06-03 | Vacuum pump for exhausting vacuum manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0819908B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101111680B (en) * | 2005-04-08 | 2010-12-01 | 株式会社荏原制作所 | Vacuum pump self-diagnosis method, vacuum pump self-diagnosis system, and vacuum pump central monitoring system |
| JP5504107B2 (en) * | 2010-09-06 | 2014-05-28 | エドワーズ株式会社 | Backflow prevention system and vacuum pump equipped with the backflow prevention system |
| EP3456979B1 (en) * | 2017-09-18 | 2022-03-30 | Pfeiffer Vacuum Gmbh | Vacuum device and method for generating an item of information concerning the operation of a vacuum device |
| JP7577989B2 (en) * | 2020-12-08 | 2024-11-06 | 富士電機株式会社 | Pump clogging detection system |
-
1992
- 1992-06-03 JP JP4166800A patent/JPH0819908B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0626460A (en) | 1994-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100402826C (en) | Abnormal stop avoidance method and abnormal stop avoidance system of semiconductor production equipment | |
| US20180166306A1 (en) | Quartz crystal microbalance utilization for foreline solids formation quantification | |
| US20050284575A1 (en) | Processing system and operating method of processing system | |
| JP2020031194A (en) | Substrate transfer module and substrate transfer method | |
| WO2018043446A1 (en) | Method for cleaning semiconductor production chamber | |
| JPH11345778A (en) | Method of cleaning film forming apparatus and cleaning mechanism thereof | |
| JPH0339198B2 (en) | ||
| JPH0819908B2 (en) | Vacuum pump for exhausting vacuum manufacturing equipment | |
| US20030010091A1 (en) | System and method for detecting occlusions in a semiconductor manufacturing device | |
| JPH08255778A (en) | Method for cleaning material and / or device surface in semiconductor manufacturing | |
| JP2001144020A (en) | CVD apparatus and its purging method | |
| US4372806A (en) | Plasma etching technique | |
| JP4074079B2 (en) | Plasma processing apparatus and plasma processing method | |
| JP4127586B2 (en) | Semiconductor device manufacturing method and semiconductor manufacturing apparatus | |
| JP3137810B2 (en) | Microwave plasma discharge stop detection method, microwave plasma processing method, and microwave plasma processing apparatus | |
| JP2002237511A (en) | Substrate processing apparatus and substrate processing method | |
| JP2006005118A (en) | Semiconductor manufacturing equipment | |
| JPH07335557A (en) | Gas exhaust pipe for semiconductor manufacturing equipment | |
| JP2002151475A (en) | Thin film processing monitoring method and thin film processing equipment | |
| JP2978854B2 (en) | Dry etching equipment | |
| JPS6295828A (en) | plasma processing equipment | |
| JPH02205019A (en) | Plasma treatment equipment and diagnostic method thereof | |
| US20030013212A1 (en) | System and method for removing deposited material from within a semiconductor fabrication device | |
| JPH1161455A (en) | Monitoring method and maintenance method for vacuum processing equipment | |
| JP5013484B2 (en) | Semiconductor manufacturing apparatus cleaning method and semiconductor manufacturing apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100304 Year of fee payment: 14 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110304 Year of fee payment: 15 |
|
| LAPS | Cancellation because of no payment of annual fees |