JPH0821602B2 - Exterior packaging method for hybrid integrated circuit - Google Patents

Description

TECHNICAL FIELD The present invention relates to an exterior forming method for forming an exterior made of synthetic resin around a hybrid integrated circuit.

[Conventional example]

Hybrid integrated circuits (Hybrid ICs) have been widely used in recent years due to the demand for miniaturization and high functionality of electronic devices, but when actually used, synthetic resin is used to protect internal component elements from the external environment. It is made to cover with an exterior body made of. As the method of forming the outer package, a method of immersing the hybrid IC in a liquid or powder resin, a method of putting the hybrid IC in a box-shaped mold, injecting the resin into the mold, and hardening the mold How to retrieve from,
There are a method of applying the liquid resin with a roller and a brush, a method of spraying with a spray, and the like.

[Problems to be solved by the invention]

However, in the above, there are drawbacks such that holes are apt to be generated due to entrainment of air bubbles and a uniform film thickness and shape cannot be obtained. Further, the above requires a box-shaped mold, which is not preferable in terms of cost. Further, in the above, since only one side can be coated at a time, the work efficiency is poor and it is difficult to make the coating uniform.
On the other hand, in the above, it is difficult to form a film especially on the side surface of the substrate. What can be said in common with the above-mentioned conventional examples is that most of them use a liquid resin, and therefore it takes several hours until it is dried and cured, and the productivity is poor.

[Means for solving problems]

In order to solve the above-mentioned conventional drawbacks, in the present invention, the hybrid IC is housed in a bag made of thermosetting synthetic resin, the inside of the bag is decompressed to adhere the bag to the hybrid IC, and unnecessary portions are cut and removed. After that, by heating and curing the bag body, an exterior is formed around the hybrid IC.

〔Example〕

Hereinafter, the present invention will be described in detail with reference to the embodiments shown in the accompanying drawings.

First, as shown in FIG. 1, the hybrid IC 1 is housed in the bag body 2 made of thermosetting synthetic resin. At that time, the film thickness of the bag body 2 is selected in consideration of the film thickness of the outer package to be obtained. That is, according to the present invention, by changing the film thickness of the bag body 2, the outer thickness of the hybrid IC 1 can be easily changed. In this embodiment, the rectangular column-shaped bag body 2 is used, but a flat envelope-shaped bag body may be used depending on the case.

Next, the inside of the bag body 2 is decompressed by an appropriate decompression means, and the bag body 2 is brought into close contact with the hybrid IC 1 as shown in FIG. Then, an unnecessary portion, for example, a portion around the lead 1a of the hybrid IC 1 or a portion protruding in a burr shape is cut by a heat source such as a laser so as to prevent air from entering the bag body 2 and removed.

Thereafter, the bag body 2 is cured by heating it in a high temperature atmosphere or blowing hot air to form the exterior 3 made of synthetic resin on the hybrid IC 1 as shown in FIG.

〔effect〕

As described above, according to the present invention, the hybrid
It is possible to easily form an outer package of a predetermined thickness around the IC within a short time. In that case, since there is almost no air in the exterior, no perforation or the like occurs, and since the film thickness is uniform, the shape is stable, and the effects are remarkable.

[Brief description of drawings]

FIG. 1 is a perspective view showing a state in which the hybrid IC is housed in a bag made of thermosetting synthetic resin, and FIG. 2 is a sectional view for explaining a state in which the bag body is decompressed and brought into close contact with the hybrid IC. 3 is a sectional view showing the final finished state. In the figure, 1 is a hybrid IC (hybrid integrated circuit), and 2 is a bag.

Claims (2)

[Claims] 1. A method of forming a package by covering the periphery of a hybrid integrated circuit with an electrically insulating synthetic resin, wherein the hybrid integrated circuit is housed in a bag made of a thermosetting synthetic resin, and the inside thereof is A method for forming a package of a hybrid integrated circuit, which comprises depressurizing the bag to make it adhere to the hybrid integrated circuit, cutting and removing an unnecessary portion, and then heating the bag to cure the bag. 2. A method of forming a package of a hybrid integrated circuit according to claim 1, wherein the cutting and removing is performed by a laser.