JPH0821787B2 - Information processing device mounting structure - Google Patents
Information processing device mounting structureInfo
- Publication number
- JPH0821787B2 JPH0821787B2 JP62123774A JP12377487A JPH0821787B2 JP H0821787 B2 JPH0821787 B2 JP H0821787B2 JP 62123774 A JP62123774 A JP 62123774A JP 12377487 A JP12377487 A JP 12377487A JP H0821787 B2 JPH0821787 B2 JP H0821787B2
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- cooling
- mounting board
- generating electronic
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、情報処理装置の実装構造に関し、詳しく
は、水冷を要する高発熱電子部品と空冷で足りる低発熱
電子部品を混載して実装する場合に、その水冷および空
冷の冷却機構を単純化し、かつ高密度実装を可能とする
情報処理装置の実装構造に関するものである。Description: TECHNICAL FIELD The present invention relates to a mounting structure of an information processing apparatus, and more specifically, a high heat generating electronic component that requires water cooling and a low heat generating electronic component that requires air cooling are mounted together. In this case, the present invention relates to a mounting structure of an information processing device that simplifies the cooling mechanism of water cooling and air cooling and enables high-density mounting.
従来、情報処理装置における電子部品の高密度実装構
造としては、例えば、日経エレクトロニクス,No396（19
86.6.2）の197〜209ページ「CPUを１ボードに実装した
大型コンピュータ」の記載のように、高発熱電子部品と
他の低発熱電子部品を同一ボード面に混載して、両面実
装構造としているものがある。Conventionally, as a high-density mounting structure of electronic parts in an information processing device, for example, Nikkei Electronics, No396 (19
86.6.2), pages 197 to 209, "Large-sized computer with a CPU mounted on one board," combine high-heat-generating electronic components and other low-heat-generating electronic components on the same board to create a double-sided mounting structure. There is something.
また、特開昭63−2848969号公報に記載のように、基
板の一方の面に高発熱電子部分を平面実装し、他方の面
に低発熱電子部品を平面実装しているものがある。Further, as described in JP-A-63-2848969, there is one in which a high heat generating electronic part is planarly mounted on one surface of a substrate and a low heat generating electronic component is planarly mounted on the other surface.
上記従来技術において前者の実装構造は、高発熱電子
部品と他の低発熱電子部品が同一ボード面に混載される
構造となっており、その実装ボードの冷却は空冷により
行うようになっている。このため、同一ボード面に混載
実装した高発熱電子部品と他の部品との冷却能力を調整
するため、高発熱電子部品には放熱フィンを設ける構造
としており、冷却のための構成が複雑化している。ま
た、冷却機構は、高発熱電子部品の方に合せて冷却能力
を設定する必要があるため、過大な冷却能力が必要とな
る。さらに、高発熱電子部品がより高発熱化して水冷を
要する場合には、同一ボード面に対して空冷および水冷
を行うような実装構造にする必要があるため、その構造
は一層複雑化するという問題点があった。The former mounting structure in the above-mentioned conventional technology has a structure in which high heat generating electronic components and other low heat generating electronic components are mixedly mounted on the same board surface, and the mounting board is cooled by air cooling. For this reason, in order to adjust the cooling capacity of the high heat generating electronic components and other components mounted together on the same board surface, the heat generating fins are provided in the high heat generating electronic components, which complicates the configuration for cooling. There is. Further, the cooling mechanism needs to have an excessive cooling capacity because it is necessary to set the cooling capacity according to the high heat generating electronic component. Furthermore, when the high-heat-generating electronic components generate more heat and require water cooling, the mounting structure needs to be air-cooled and water-cooled on the same board surface, which makes the structure more complicated. There was a point.
また、後者の実装構造では、基板の一方の面に高発熱
電子部品を平面実装し、他方の面に低発熱電子部品を平
面実装している為、高発熱電子部品の発する熱が基板を
通して低発熱電子部品に直接伝わってしまう。その為、
低発熱電子部品の温度がその部品自体が発生する温度よ
りも高くなり、低発熱電子部品を冷却する為に過大な冷
却能力が必要となる。更に、高発熱電子部品から低発熱
電子部品に伝わる熱の温度が非常に高い場合には、低発
熱電子部品に障害に引き起こしかねないという問題があ
った。Further, in the latter mounting structure, high heat generating electronic components are planarly mounted on one surface of the substrate and low heat generating electronic components are planarly mounted on the other surface, so that the heat generated by the high heat generating electronic components is low through the substrate. The heat is directly transmitted to the electronic components. For that reason,
The temperature of the low heat generating electronic component becomes higher than the temperature generated by the component itself, and an excessive cooling capacity is required to cool the low heat generating electronic component. Further, when the temperature of heat transmitted from the high heat generating electronic component to the low heat generating electronic component is extremely high, there is a problem that the low heat generating electronic component may cause a failure.
本発明は、前記問題点を解決するためになされたもの
である。The present invention has been made to solve the above problems.
本発明の目的は、水冷を要する高発熱電子部品と空冷
で足りる低発熱電子部品を混載して実装する場合に、高
発熱電子部品の発生する熱を低発熱電子部品に伝えない
ようにすると共に、その水冷および空冷の冷却機構を単
純化し、かつ高密度実装を可能とする実装構造を提供す
ることにある。An object of the present invention is to prevent the heat generated by the high heat generating electronic components from being transmitted to the low heat generating electronic components when the high heat generating electronic components requiring water cooling and the low heat generating electronic components sufficient for air cooling are mounted together. , And to provide a mounting structure that simplifies the cooling mechanism of water cooling and air cooling and enables high-density mounting.
本発明の前記ならびにその他の目的と新規な特徴は、
本明細書の記述及び添付図面によって明らかになるであ
ろう。The above and other objects and novel features of the present invention are as follows.
It will be apparent from the description of this specification and the accompanying drawings.
前記の目的を達成するためになされた本発明のうち、
代表的なものの概要を簡単に説明すれば、下記のとおり
である。Among the present invention made to achieve the above object,
The outline of typical ones is briefly described as follows.
本発明においては、情報処理装置の実装構造におい
て、第１の実装ボードの一方の面に、水冷を要する高発
熱電子部品を平面状に実装し、第１の実装ボードの他方
の面に、空冷で足りる低発熱電子部品を実装した第２の
実装ボードを、通風路を形成するように垂直に複数枚実
装する構造としたことを主な特徴とする。According to the present invention, in the mounting structure of the information processing apparatus, the high heat generating electronic component requiring water cooling is mounted on one surface of the first mounting board in a plane shape, and the other surface of the first mounting board is air-cooled. The main feature of the second mounting board is that a plurality of second mounting boards on which low-heat-generating electronic components that are sufficient for the above are mounted vertically are formed so as to form a ventilation path.
前記手段によれば、水冷を要する高発熱電子部品（以
下、水冷部品と略称する）を、第１の実装ボードの一方
の面に平面状に実装し、第１の実装ボードの他方の面に
は、空冷で足りる低発熱電子部品（以下、空冷部品と略
称する）を実装した第２の実装ボードを、垂直に複数枚
実装した実装構造とする。このような実装構造をとる
為、空冷部品は水冷部品に対して第１の実装ボード及び
第２の実装ボードを介して接続されることになり、水冷
部品の発生する熱が空冷部品に直接伝わることがなくな
り、水冷部品が空冷部品に及ぼす熱影響が非常に小さく
なる。また、発熱電子部品に対する冷却機構は、第１の
実装ボードの一方の面側および他方の面側で、水冷部品
に対する冷却機構と空冷部品に対する冷却機構とに分離
して設ける構成とすることができ、冷却機構の構成を簡
単なものとすることができる。According to the above means, a high heat generating electronic component that requires water cooling (hereinafter, abbreviated as water cooling component) is mounted on one surface of the first mounting board in a plane shape and is mounted on the other surface of the first mounting board. Is a mounting structure in which a plurality of second mounting boards on which low-heat-generating electronic components that are sufficient for air cooling (hereinafter abbreviated as air cooling components) are mounted are vertically mounted. Because of such a mounting structure, the air-cooled component is connected to the water-cooled component via the first mounting board and the second mounting board, and the heat generated by the water-cooled component is directly transmitted to the air-cooled component. The heat effect of the water-cooled parts on the air-cooled parts becomes very small. In addition, the cooling mechanism for the heat-generating electronic component may be separately provided on one surface side and the other surface side of the first mounting board, that is, a cooling mechanism for the water-cooled component and a cooling mechanism for the air-cooled component. The structure of the cooling mechanism can be simplified.
すなわち、水冷部品が第１の実装ボードの一方の面
に、空冷部品が第１の実装ボードの他方の面に分離して
搭載され、水冷部品が平面状に搭載された実装構造とし
ているので、水冷部品を冷却する冷却機構は第１の実装
ボードの一方の面を専有して構成することができ、また
水冷部品が平面状に搭載された構造であるため、水冷部
品の冷却のための冷却機構の水冷配管等の構造が単純化
できる。また、第１の実装ボードの他方の面は空冷部品
のみが実装される構造であり、空冷部品の冷却のための
冷却機構の構造が単純化できる。That is, since the water-cooled component is separately mounted on one surface of the first mounting board and the air-cooled component is separately mounted on the other surface of the first mounting board, the water-cooled component is mounted in a planar shape. The cooling mechanism for cooling the water-cooled component can be configured by exclusively using one surface of the first mounting board, and since the water-cooled component is mounted on the plane, cooling for cooling the water-cooled component is possible. The structure of the mechanism such as water cooling pipes can be simplified. Further, since the other surface of the first mounting board has a structure in which only the air-cooled components are mounted, the structure of the cooling mechanism for cooling the air-cooled components can be simplified.
以下、図面を用いて本発明の一実施例を具体的に説明
する。Hereinafter, an embodiment of the present invention will be specifically described with reference to the drawings.
第１図は、本発明の一実施例の情報処理装置の実装構
造を示す斜視図である。第１図において、この実装構造
の要となる第１の実装ボード１は、一方の面には、水冷
を要する高発熱電子部品（水冷部品）２が平面状に搭載
され、他方の面には、第２の実装ボード３を垂直に複数
枚実装するためのコネクタ４が搭載される。第２の実装
ボード３には、空冷で足りる低発熱電子部品（空冷部
品）が搭載され、この第２の実装ボード３がコネクタ４
により、第１の実装ボード１に対して垂直に複数枚実装
される構造となっている。このような実装構造に対する
冷却機構としては、水冷冷却機構100と空冷冷却機構200
とが併用されて装備される構造となっている。FIG. 1 is a perspective view showing a mounting structure of an information processing apparatus according to an embodiment of the present invention. In FIG. 1, the first mounting board 1 which is the key to this mounting structure has a high heat generation electronic component (water cooling component) 2 which requires water cooling mounted on one surface in a planar shape, and the other surface on the other surface. A connector 4 for vertically mounting a plurality of second mounting boards 3 is mounted. Low heat-generating electronic components (air cooling components) sufficient for air cooling are mounted on the second mounting board 3, and the second mounting board 3 is mounted on the connector 4
As a result, a plurality of sheets are mounted vertically on the first mounting board 1. As a cooling mechanism for such a mounting structure, there are a water cooling mechanism 100 and an air cooling mechanism 200.
It is structured so that and are used together.
水冷冷却機構100は、一枚の平面基板に熱伝導板（冷
却モジュール）101が複数個実装されて、各熱伝導板101
が給水パイプ102で結ばれて構成されているものであ
り、第１の実装ボード１の高発熱電子部品（水冷部品）
２を搭載する面側に配置されている。また空冷冷却機構
200は、送風ファン201が複数個搭載されて構成されてい
るものであり、第１の実装ボード１の他方の面側の下部
に配置されている。In the water cooling / cooling mechanism 100, a plurality of heat conduction plates (cooling modules) 101 are mounted on one flat substrate, and each heat conduction plate 101 is mounted.
Is connected by a water supply pipe 102, and has a high heat generating electronic component (water cooling component) of the first mounting board 1.
It is arranged on the side on which 2 is mounted. Also air cooling mechanism
Reference numeral 200 denotes a configuration in which a plurality of blower fans 201 are mounted, and is arranged at a lower portion on the other surface side of the first mounting board 1.
このような冷却機構により、第１の実装ボード１の一
方の面に平面状に実装された高発熱電子部品２は、その
部品表面部に冷却モジュール101が密着されて、冷却モ
ジュール101に給水パイプ102を介して冷却水を循環させ
て、間接熱伝導冷却される。また、第１の実装ボード１
の他方の面側のコネクタ４により垂直に複数枚実装され
た第２の実装ボード３における空冷部品（図示せず）
は、送風ファン201を搭載した空冷冷却機構200により、
強制空気冷却される。With such a cooling mechanism, in the high heat generating electronic component 2 mounted on one surface of the first mounting board 1 in a planar manner, the cooling module 101 is brought into close contact with the component surface portion, and the cooling module 101 is provided with a water supply pipe. Indirect heat conduction cooling is performed by circulating cooling water through 102. Also, the first mounting board 1
Air-cooled components (not shown) on the second mounting board 3 vertically mounted by the connector 4 on the other surface side of the
Is an air-cooling cooling mechanism 200 equipped with a blower fan 201,
Forced air cooling.
第２図は、本発明の他の実施例の情報処理装置の実装
構造を示す斜視図である。第２図の実装構造において
は、第１の実装ボード１の空冷部品を搭載する側の実装
構造として、更に第３の実装ボード５が、第２の実装ボ
ード３（３−1,3−2,3−３）上に設けられる構造となっ
ている。このため、第２の実装ボード３上にはコネクタ
６が設けられ、このコネクタ６に第３の実装ボード５が
接続される構造となっている。この第３の実装ボード５
には、空冷部品が搭載される。FIG. 2 is a perspective view showing a mounting structure of an information processing apparatus according to another embodiment of the present invention. In the mounting structure shown in FIG. 2, the third mounting board 5 is the second mounting board 3 (3-1, 3-2) as the mounting structure on the side where the air-cooled components of the first mounting board 1 are mounted. , 3-3). Therefore, the connector 6 is provided on the second mounting board 3, and the third mounting board 5 is connected to the connector 6. This third mounting board 5
Air-cooled parts are mounted on the.
この実装構造は、第２の実装ボード３上で、第３の実
装ボード５を実装する構造の３次元実装となっており、
第３の実装ボード５上において空冷部品が搭載されて、
空冷部品が高密度実装される構造となっている。This mounting structure is a three-dimensional mounting of the structure in which the third mounting board 5 is mounted on the second mounting board 3.
Air-cooled components are mounted on the third mounting board 5,
The structure is such that air-cooled parts are mounted at high density.
以下に、このような実施例による実装構造の特徴点を
まとめて説明する。The characteristic points of the mounting structure according to such an embodiment will be collectively described below.
（１）第２図に示したような実装構造においては、空冷
部品を搭載した第３の実装ボード５が、第２の実装ボー
ド３上にコネクタ接続されて実装される構造となってい
る。このような実装構造では、第１の実装ボード１にお
ける第２の実装ボード３の装着枚数を減らすことがで
き、第２の実装ボード３が第１の実装ボード１上の水冷
部品２（２−1,2−2,2−３）の搭載エリア間の空エリア
部位にのみの搭載で足りるようにできる。これにより、
第１の実装ボード１上の表面（一方の面）および裏面
（他方の面）に、水冷部品２と第２の実装ボード３とを
搭載するについて、水冷部品２が搭載されている位置の
すぐ裏側は空エリアとすることができ、また、第２の実
装ボード３が搭載されている位置のすぐ裏側も空エリア
とすることができる。このため、両面実装の構造が簡易
なものとなる。このような構造であると、水冷部品２は
ピン挿入形にすることもできる。さらに、第１の実装ボ
ード１においては、空冷部品搭載側の面の空エリアを使
って、大電流を要する水冷部品へ直接給電する配線構造
とすることができ、この場合、第１の実装ボード１は電
源層数を減らすことができ、その構造は簡易なものとな
る。また、第１の実装ボード１上で実装部品面の反対面
の空エリアを利用して、波形観測を行なうためのチェッ
ク端子等を配設することが可能となる。(1) In the mounting structure as shown in FIG. 2, the third mounting board 5 on which the air-cooled components are mounted is mounted on the second mounting board 3 by connector connection. With such a mounting structure, the number of second mounting boards 3 mounted on the first mounting board 1 can be reduced, and the second mounting board 3 can reduce the number of water-cooled components 2 (2- 1,2-2,2-3) can be mounted only in the empty area between mounting areas. This allows
Regarding the mounting of the water cooling component 2 and the second mounting board 3 on the front surface (one surface) and the back surface (the other surface) of the first mounting board 1, immediately after the position where the water cooling component 2 is mounted. The back side can be an empty area, and the back side immediately after the position where the second mounting board 3 is mounted can also be an empty area. Therefore, the structure of double-sided mounting becomes simple. With such a structure, the water cooling component 2 can also be a pin insertion type. Furthermore, in the first mounting board 1, a wiring structure for directly supplying power to a water cooling component that requires a large current can be used by using an empty area on the surface on which the air cooling component is mounted. In this case, the first mounting board 1 1 can reduce the number of power supply layers, and the structure is simple. Further, it is possible to arrange check terminals and the like for performing waveform observation by utilizing the empty area on the surface opposite to the surface of the mounted component on the first mounting board 1.
（２）この実装構造では、水冷部品と空冷部品が第１の
実装ボードの両面に配置される両面実装構造となってお
り、水冷部品と空冷部品を第１の実装ボード上の同一面
に混載した場合に比べて、水冷部品と空冷部品の間の実
装距離を短くできる。これは、高発熱電子部品の論理LS
Iであるメモリ制御用LSIと低発熱電子部品のDRAMのメモ
リ素子によりメモリ装置を構成する場合に、適用して好
適な実装構造となっている。すなわち、この実装構造に
おいては、水冷部品のメモリ制御用LSIと空冷部品のメ
モリ素子との間の実装距離は短くなっており、メモリ制
御用LSIとメモリ素子間の配線遅延時間を少なくでき、
メモリの性能をフルに引き出せる等、性能向上にも寄与
することができる。なお、この場合の回路構成の論理分
割は、水冷部品（メモリ制御用LSI）２−１の３個で第
２の実装ボード３−１の空冷部品（DRAMメモリ素子）を
制御するようにし、水冷部品２−２の３個で第２の実装
ボード３−２の空冷部品を制御するようにし、水冷部品
２−３の３個で第２の実装ボード３−３の空冷部品を制
御するようにして、装置を構成する。(2) In this mounting structure, the water-cooled component and the air-cooled component are arranged on both sides of the first mounting board, and the water-cooled component and the air-cooled component are mixedly mounted on the same surface of the first mounting board. The mounting distance between the water-cooled component and the air-cooled component can be shortened as compared with the case. This is a logic LS for high heat generation electronic components.
This is a suitable mounting structure to be applied when a memory device is constituted by a memory control LSI that is I and a memory element of a DRAM that is a low heat-generating electronic component. That is, in this mounting structure, the mounting distance between the memory control LSI for the water-cooled component and the memory element for the air-cooled component is short, and the wiring delay time between the memory control LSI and the memory element can be reduced.
It is also possible to contribute to performance improvement such as taking out the full performance of the memory. In this case, the circuit configuration is logically divided by controlling the air-cooled components (DRAM memory elements) of the second mounting board 3-1 with three water-cooled components (memory control LSI) 2-1. Three parts 2-2 control the air-cooled parts of the second mounting board 3-2, and three water cooling parts 2-3 control the air-cooled parts of the second mounting board 3-3. And configure the device.
（３）この実装構造において用いる冷却機構は、その構
造において、さらに水冷部の冷却配管を空冷部の下部へ
まで配置する構成とすることにより、空冷部の導入空気
を冷却して空冷効果を補強できる構造とすることができ
る。(3) In the cooling mechanism used in this mounting structure, in the structure, the cooling pipe of the water cooling part is further arranged to the lower part of the air cooling part, thereby cooling the air introduced into the air cooling part and reinforcing the air cooling effect. The structure can be made.
以上、本発明を実施例にもとづき具体的に説明した
が、本発明は前記実施例に限定されるものではなく、そ
の要旨を逸脱しない範囲において種々変更可能であるこ
とはいうまでもない。Although the present invention has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and it goes without saying that various modifications can be made without departing from the scope of the invention.
以上、説明したように、本発明によれば、水冷を要す
る高発熱電子部品と空冷で足りる低発熱電子部品を混載
して実装する場合に、高発熱電子部品の発生する熱を低
発熱電子部品に伝えないようにすることができると共
に、その水冷及び空冷の冷却機構を単純化でき、かつ高
密度実装を行うことができる。さらに、高密度実装化の
ための両面実装は、比較的に簡単な実装技術で実施でき
るので、装置の高密度化を経済的に実現できる効果があ
る。また、このような実装構造を用いれば、回路構成
上、水冷部品と空冷部品を配置する実装上の距離がクリ
ティカルであるような場合に、同一ボード面に水冷部品
と空冷部品を配置した実装構造に比べ、実装上の配置距
離を短くできるので性能向上できる効果がある。As described above, according to the present invention, when high-heat-generating electronic components that require water cooling and low-heat-generating electronic components that can be air-cooled are mixed and mounted, the heat generated by the high-heat-generating electronic components can be reduced. The cooling mechanism for water cooling and air cooling can be simplified, and high-density mounting can be performed. Furthermore, double-sided mounting for high-density mounting can be carried out by a relatively simple mounting technique, so that there is an effect that the high-density mounting of the device can be economically realized. In addition, if such a mounting structure is used, the mounting structure in which the water cooling component and the air cooling component are arranged on the same board surface when the distance for mounting the water cooling component and the air cooling component is critical due to the circuit configuration Compared with, the arrangement distance on mounting can be shortened, so that the performance can be improved.
第１図は本発明の一実施例の情報処理装置の実装構造を
示す斜視図、 第２図は本発明の他の実施例の情報処理装置の実装構造
を示す斜視図である。 図中、１……第１の実装ボード、２……高発熱電子部
品、３……第２の実装ボード、４……コネクタ、５……
第３の実装ボード、６……コネクタ、100……水冷冷却
機構、200……空冷冷却機構である。FIG. 1 is a perspective view showing a mounting structure of an information processing apparatus according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a mounting structure of an information processing apparatus according to another embodiment of the present invention. In the figure, 1 ... First mounting board, 2 ... High heat generation electronic component, 3 ... Second mounting board, 4 ... Connector, 5 ...
Third mounting board, 6 ... Connector, 100 ... Water cooling mechanism, 200 ... Air cooling mechanism.
Claims (2)
する高発熱電子部品を平面状に実装し、第１の実装ボー
ドの他方の面に、空冷で足りる低発熱電子部品を実装し
た第２の実装ボードを、通風路を形成するように垂直に
複数枚実装する構造とした情報処理装置の実装構造。1. A high heat-generating electronic component requiring water cooling is mounted on one surface of a first mounting board in a plane shape, and a low heat-generating electronic component sufficient for air cooling is mounted on the other surface of the first mounting board. The mounting structure of the information processing device, in which a plurality of the second mounting boards are mounted vertically so as to form a ventilation path.
する高発熱電子部品を平面状に実装し、第１の実装ボー
ドの他方の面に第２の実装ボードを、垂直に複数枚実装
し、前記複数枚の第２の実装ボードの各々の一方の面
に、空冷で足りる低発熱電子部品を実装した第３の実装
ボードを、通風路を形成するように垂直に複数枚実装す
る構造とした情報処理装置の実装構造。2. A high-heat-generating electronic component requiring water cooling is mounted on one surface of a first mounting board in a plane shape, and a plurality of second mounting boards are vertically mounted on the other surface of the first mounting board. A plurality of second mounting boards, and a plurality of third mounting boards, each having one surface of each of the plurality of second mounting boards on which low-heat-generating electronic components sufficient for air cooling are mounted, are vertically mounted to form a ventilation path. The mounting structure of the information processing device having the structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62123774A JPH0821787B2 (en) | 1987-05-22 | 1987-05-22 | Information processing device mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62123774A JPH0821787B2 (en) | 1987-05-22 | 1987-05-22 | Information processing device mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63289999A JPS63289999A (en) | 1988-11-28 |
| JPH0821787B2 true JPH0821787B2 (en) | 1996-03-04 |
Family
ID=14868950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62123774A Expired - Fee Related JPH0821787B2 (en) | 1987-05-22 | 1987-05-22 | Information processing device mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0821787B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011185455A (en) * | 2010-03-04 | 2011-09-22 | T Rad Co Ltd | Module type heat exchanger |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01191917A (en) * | 1988-01-27 | 1989-08-02 | Nec Corp | Cooling structure for electronic equipment |
| JP2526654B2 (en) * | 1989-01-26 | 1996-08-21 | 日本電気株式会社 | Electronic circuit package cage structure |
| WO1993023825A1 (en) | 1992-05-20 | 1993-11-25 | Seiko Epson Corporation | Cartridge for electronic apparatus |
| JP2833999B2 (en) * | 1994-07-13 | 1998-12-09 | 日本電気株式会社 | LSI cooling module |
| JP6369004B2 (en) * | 2013-10-22 | 2018-08-08 | 富士通株式会社 | Electronics |
| JP7746804B2 (en) * | 2021-10-26 | 2025-10-01 | マツダ株式会社 | Cooling structure of the computing unit |
-
1987
- 1987-05-22 JP JP62123774A patent/JPH0821787B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011185455A (en) * | 2010-03-04 | 2011-09-22 | T Rad Co Ltd | Module type heat exchanger |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63289999A (en) | 1988-11-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS63179599A (en) | Electronic equipment cooling system | |
| US8363412B2 (en) | Mother and daughter board configuration to improve current and voltage capabilities of a power instrument | |
| US6970358B2 (en) | Stack up assembly | |
| US5986882A (en) | Electronic apparatus having removable processor/heat pipe cooling device modules therein | |
| EP0031419B1 (en) | Air-cooled hybrid electronic package | |
| CN101165629A (en) | Computer system cooling system | |
| US20050083660A1 (en) | Power supply without cooling fan | |
| KR20010070141A (en) | Electronic module | |
| JPH0821787B2 (en) | Information processing device mounting structure | |
| US11516941B2 (en) | Heat sink and printed circuit board arrangements for data storage systems | |
| CN100512613C (en) | Power component cooling device | |
| CN216650314U (en) | Electronic system | |
| JP3570995B2 (en) | Cooling structure of electronic circuit package | |
| US6775134B2 (en) | Heat dissipation system | |
| JPH0767021B2 (en) | Semiconductor element cooling structure | |
| JPS6011840B2 (en) | Cooling structure of electronic circuit package | |
| CN222424553U (en) | Power Module | |
| JP2594274B2 (en) | Uninterruptible power system | |
| JPH09305267A (en) | Semiconductor device and computer | |
| JP2000149541A (en) | Magnetic disk device and electronic device | |
| JP2000223872A (en) | Electronic apparatus, its cooling structure and arrangement method | |
| JP3026383B2 (en) | Semiconductor device | |
| JPS59155158A (en) | Cooling structure of semiconductor device | |
| JPH06334374A (en) | Electronic device cooling mechanism | |
| CN118317576A (en) | Power Module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |