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JPH0822509B2 - Grinding wheel - Google Patents
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JPH0822509B2 - Grinding wheel - Google Patents

Grinding wheel

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Publication number
JPH0822509B2
JPH0822509B2 JP2028948A JP2894890A JPH0822509B2 JP H0822509 B2 JPH0822509 B2 JP H0822509B2 JP 2028948 A JP2028948 A JP 2028948A JP 2894890 A JP2894890 A JP 2894890A JP H0822509 B2 JPH0822509 B2 JP H0822509B2
Authority
JP
Japan
Prior art keywords
grinding wheel
grinding
base disk
base
abrasive grains
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2028948A
Other languages
Japanese (ja)
Other versions
JPH03234474A (en
Inventor
晃 永田
隆夫 余語
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Noritake Co Ltd
Original Assignee
Noritake Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Noritake Co Ltd filed Critical Noritake Co Ltd
Priority to JP2028948A priority Critical patent/JPH0822509B2/en
Publication of JPH03234474A publication Critical patent/JPH03234474A/en
Publication of JPH0822509B2 publication Critical patent/JPH0822509B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は,研削面に,ダイヤモンド,CBN(立方晶窒化
ホウ素)等の超砥粒層,或いは一般砥粒層を接合した高
周速回転研削用の研削砥石に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a high peripheral speed rotation in which a superabrasive grain layer of diamond, CBN (cubic boron nitride) or the like or a general abrasive grain layer is bonded to a ground surface. A grinding wheel for grinding.

〔従来技術〕[Prior art]

従来,回転研削用の研削砥石は種々のものが提案,実
用化されている。そして,上記研削砥石としては,金属
製等のベース円板に超砥粒層や一般砥粒層を接着したも
のがある。
Conventionally, various grinding wheels for rotary grinding have been proposed and put into practical use. As the above-mentioned grinding wheel, there is one in which a superabrasive grain layer or a general abrasive grain layer is adhered to a base disc made of metal or the like.

該超砥粒層としては,ダイヤモンドやCBNの砥粒をビ
トリファイドボンド結合したものが用いられている(例
えば特公昭58−34431号公報)。
As the super-abrasive grain layer, those in which abrasive grains of diamond or CBN are bonded by vitrified bond are used (for example, Japanese Patent Publication No. 58-34431).

上記ベース円板としては,従来,鋼,鋳鉄,アルミニ
ウム合金,フェノール樹脂などが用いられている(特開
昭61−152374号公報)。
Conventionally, steel, cast iron, aluminum alloys, phenolic resins, etc. have been used as the base disk (Japanese Patent Laid-Open No. 61-152374).

そして,上記超砥粒を用いた研削砥石は,砥粒自体が
一般の砥粒に比して非常に硬質であるため,砥石摩耗が
少ない。そのため,摩耗による寸法変化やバラツキも少
なく,高精度の研削加工が可能となる。それ故,主とし
て難削材の研削に使用されている。
Further, the grinding stone using the above-mentioned superabrasive grains has very little abrasion as the abrasive grains themselves are much harder than general abrasive grains. Therefore, there is little dimensional change or variation due to wear, and high-precision grinding is possible. Therefore, it is mainly used for grinding difficult-to-cut materials.

〔解決しようとする課題〕[Problems to be solved]

しかしながら,上記従来の回転研削用の研削砥石は,
回転時の遠心力を伴うベース円板の伸びが大きいため,
加工精度が低下するという問題があった。近年において
は,加工能率の向上や砥石寿命の向上がより強く望まれ
ているため,研削砥石の高周速化はますます要求され
る。それ故,回転時における研削砥石の伸びは,できる
だけ小さくする必要がある。
However, the above conventional grinding wheel for rotary grinding is
Due to the large elongation of the base disk due to the centrifugal force during rotation,
There was a problem that the processing accuracy was lowered. In recent years, the improvement of machining efficiency and the improvement of the life of the grindstone have been strongly demanded, so that the grinding wheel is required to have a higher peripheral speed. Therefore, it is necessary to minimize the elongation of the grinding wheel during rotation.

また,従来のベース円板は,超砥粒層よりも熱膨張係
数が大きい。そのため,研削時の熱或いは軸受装置の熱
によってベース円板が膨張し,ベース円板を含めた研削
砥石全体が熱膨張する。このことは,加工物の寸法精度
の低下をまねく原因となっている。
Moreover, the conventional base disk has a larger coefficient of thermal expansion than the superabrasive layer. Therefore, the base disk expands due to the heat of grinding or the heat of the bearing device, and the entire grinding wheel including the base disk expands thermally. This causes a decrease in the dimensional accuracy of the workpiece.

更に,従来のベース円板は,特に鋼,鋳鉄で作製され
たものは,その重量(比重)が大きい。そのため,研削
盤で研削砥石を回転する際に,モータへの負荷,砥石軸
への負荷が大きく,モータや軸受部分での発熱量が大き
い。それ故,これらの熱がベース円板へも伝熱し前記の
ごとくベース円板の熱膨張を更に大きくする原因ともな
っている。
Further, the conventional base disc, especially made of steel or cast iron, has a large weight (specific gravity). Therefore, when the grinding wheel is rotated by the grinder, the load on the motor and the load on the grindstone shaft are large, and the amount of heat generated by the motor and the bearing is large. Therefore, these heats are also transferred to the base disk, which causes the thermal expansion of the base disk to be further increased as described above.

また,上記の問題は,一般の砥粒を用いた研削砥石に
おいても生ずる。
The above problem also occurs in a grinding wheel using general abrasive grains.

本発明は上記従来問題点に鑑み,高周速下においても
高精度の研削加工ができる,回転研削用の研削砥石を提
供しようとするものである。
In view of the above-mentioned conventional problems, the present invention is to provide a grinding wheel for rotary grinding, which can perform highly accurate grinding even under a high peripheral speed.

〔課題の解決手段〕[Means for solving problems]

本発明は,砥粒層をベース円板に接着してなる回転研
削用の研削砥石において, 上記ベース円板は,エポキシ樹脂又はポリイミド樹脂
からなるプラスチックス中に,カーボン繊維,アラミド
繊維の一方又は双方よりなる繊維を分散させた複合材を
用いてなり,かつ上記ベース円板は熱膨張係数が15×10
-6/℃以下で,かつ密度(kg/cm3)/縦弾性率(kgf/c
m2)の比率(N)が3.5×10-9以下であることを特徴と
する研削砥石にある。
The present invention relates to a grinding wheel for rotary grinding, in which an abrasive grain layer is adhered to a base disk, wherein the base disk is a plastic made of epoxy resin or polyimide resin, and one of carbon fiber, aramid fiber or It is made of a composite material in which fibers composed of both are dispersed, and the base disk has a coefficient of thermal expansion of 15 × 10
-6 / ℃ or less, and density (kg / cm 3 ) / modulus of elasticity (kgf / c
The grinding wheel is characterized in that the ratio (N) of m 2 ) is 3.5 × 10 −9 or less.

本発明において,ベース円板を構成する複合材は,プ
ラスチック(母材)中に繊維を分散させたものである。
かかるプラスチックスとしては,エポキシ樹脂又はポリ
イミド樹脂を用いる。この2種の樹脂は,後述の特定の
繊維を分散させることにより,上記の比率(N)を小さ
くすることができ,ベース円板の伸びを極めて小さくす
る効果を発揮する(実施例の第1表参照)。
In the present invention, the composite material constituting the base disk is a plastic (base material) in which fibers are dispersed.
An epoxy resin or a polyimide resin is used as the plastics. These two kinds of resins can reduce the above-mentioned ratio (N) by dispersing the specific fiber described later, and exert an effect of extremely reducing the elongation of the base disk (the first embodiment). See table).

また,上記繊維としては,カーボン繊維,アラミド繊
維の一方又は双方を用いる。この中,エポキシ樹脂中に
カーボンを分散させたものが,最も好ましい。
Further, as the fibers, one or both of carbon fibers and aramid fibers are used. Among these, epoxy resin in which carbon is dispersed is most preferable.

次に,上記繊維は,ベース円板中に30〜70容積%含有
することが好ましい。30%未満では回転時の伸びが大き
く,一方70%を越えると製品としての安定性に欠けるた
め,好ましくない。また,繊維は,直径1〜300μmの
ものを用いることが好ましい。
Next, the above fibers are preferably contained in the base disk in an amount of 30 to 70% by volume. If it is less than 30%, the elongation during rotation is large, while if it exceeds 70%, the stability as a product is lacking, which is not preferable. Further, it is preferable to use fibers having a diameter of 1 to 300 μm.

また,本発明において,ベース円板は,その熱膨張係
数が15×10-6/℃以下で,かつ密度(kg/cm3)/縦弾性
率(kgf/cm2)の比率(N)が3.5×10-9以下であること
が必要である。この両者を満足する場合には,ベース円
板の熱膨張及び伸びが特に低くなり,一層優れた研削砥
石を得ることができる。
Further, in the present invention, the base disc has a coefficient of thermal expansion of 15 × 10 −6 / ° C. or less and a ratio (N) of density (kg / cm 3 ) / longitudinal elastic modulus (kgf / cm 2 ). It must be 3.5 × 10 -9 or less. If both of these are satisfied, the thermal expansion and elongation of the base disk will be particularly low, and a more excellent grinding wheel can be obtained.

また,ベース円板と砥粒層との接着に当たっては,エ
ポキシ樹脂などの接着剤を用いる。
In addition, an adhesive such as an epoxy resin is used to bond the base disk and the abrasive grain layer.

また,本発明において砥粒は,ダイヤモンドやCBN等
の超砥粒,アルミナ,炭化珪素などの一般砥粒がある。
Further, in the present invention, the abrasive grains include superabrasive grains such as diamond and CBN, and general abrasive grains such as alumina and silicon carbide.

また,砥粒層における砥粒の結合は,ビトリファイド
ボンド,レジノイドボンド又はメタルボンドなどにより
行う。
Further, the bonding of the abrasive grains in the abrasive grain layer is performed by vitrified bond, resinoid bond or metal bond.

本発明は,特に超砥粒を用いたビトリファイドボンド
の研削砥石に対して,その効果が大きい。
The present invention is particularly effective for a vitrified bond grinding wheel using superabrasive grains.

〔作用及び効果〕[Action and effect]

本発明の研削砥石においては,ベース円板の材料とし
て前記特定のプラスチックスの中に上記特定の繊維を分
散させた複合材を用いている。
In the grinding wheel of the present invention, a composite material in which the specific fiber is dispersed in the specific plastic is used as the material of the base disk.

また,該ベース円板は,アルミニウム合金等で作製し
た従来の金属ベース円板に比して,その熱膨張係数が15
×10-6/℃と低く,かつ前記比率(N)についても3.5×
10-9以下である。
In addition, the base disc has a thermal expansion coefficient of 15 compared with a conventional metal base disc made of an aluminum alloy or the like.
× 10 -6 / ℃ is low and the ratio (N) is 3.5 ×
It is 10 -9 or less.

そのため,本発明のベース円板は,熱膨張が低く,特
に回転時の伸びが従来品に比して約半分以下である(実
施例の第1表参照)。
Therefore, the base disc of the present invention has a low thermal expansion, and particularly the elongation during rotation is about half or less as compared with the conventional product (see Table 1 of Examples).

また,本発明のベース円板は,従来のベース円板に比
較して軽量であるため,研削砥石の回転に伴うモータへ
の負荷,砥石軸への負荷が小さく,これらにおける発熱
量が少ない。そのため,ベース円板への伝熱量が少な
く,研削砥石の熱膨張も一層少なく,高精度の研削を行
うことができる。
Further, since the base disc of the present invention is lighter in weight than the conventional base disc, the load on the motor and the grindstone shaft due to the rotation of the grinding wheel is small, and the amount of heat generated by these is small. Therefore, the amount of heat transferred to the base disk is small, the thermal expansion of the grinding wheel is even smaller, and highly accurate grinding can be performed.

それ故,本発明によれば,高周速下においても高精度
の研削加工ができる回転研削用の研削砥石を提供するこ
とができる。
Therefore, according to the present invention, it is possible to provide a grinding wheel for rotary grinding which can perform highly accurate grinding even at a high peripheral speed.

〔実施例〕〔Example〕

本発明にかかる超砥粒を用いた回転研削用の研削砥石
を作製し,その性能につきテストを行い,その結果を第
1表に示した。以下,これらを詳述する。
A grinding wheel for rotary grinding using the superabrasive grains according to the present invention was produced, its performance was tested, and the results are shown in Table 1. These will be described in detail below.

まず,上記研削砥石は第1図及び第2図に示すごと
く,超砥粒層からなるセグメントチップ1(第1図)を
作製し,これを第2図に示すごとくベース円板2に接着
した。接着剤としては,エポキシ樹脂系接着剤を用い
た。該ベース円板2は,中央部に回転軸用穴20を有す
る。
First, as the grinding wheel, as shown in FIGS. 1 and 2, a segment tip 1 (FIG. 1) made of a superabrasive grain layer was prepared and bonded to a base disk 2 as shown in FIG. . An epoxy resin adhesive was used as the adhesive. The base disk 2 has a rotary shaft hole 20 at the center.

そして,上記研削砥石は,ベース円板2の種類を変え
て,3種類作製(No.1〜3)にした。また,比較のため,
従来のベース円板を用いた研削砥石を4種類作製(No.C
1〜C4)した。
Then, the above grinding wheels were prepared in three types (No. 1 to 3) by changing the type of the base disk 2. Also, for comparison,
Four types of grinding wheels were manufactured using conventional base disks (No.C
1 to C4).

なお,セグメントチップ1は,いずれの研削砥石につ
いても同じである。
The segment tip 1 is the same for all the grinding wheels.

即ち,上記研削砥石は,その外径が305mm,回転軸用の
穴の径が76.2mm,厚みが15mmである。また,セグメント
チップの寸法は,長さ40mm,幅15mm,厚みは7mmである。
That is, the grinding wheel has an outer diameter of 305 mm, a diameter of the hole for the rotating shaft of 76.2 mm, and a thickness of 15 mm. The size of the segment chip is 40mm in length, 15mm in width, and 7mm in thickness.

また,出来上りの超砥粒層の構造は次のようである。 The structure of the finished superabrasive layer is as follows.

CBN砥粒(#325/400)・・・・50容量部, ビトリファイドボンド・・・・18容量部, 気 孔・・・・・・・・・32容量部, また,テストにおける研削条件は,下記のようであ
る。
CBN abrasive grains (# 325/400) ··· 50 parts by volume, vitrified bond ・ ・ ・ · 18 parts by volume, pores ・ ・ ・ ・ ・ ・ 32 parts by volume, and the grinding conditions in the test are: It is as follows.

研削砥石周速度・・2700m/min, テーブル送り速度・・・20m/min, 切 込 量・・・・・・5μm/pass, 被 削 材・・・・・・SKH51, 被削材寸法・・・・・・長さ300×幅10mm, また,それぞれのベース円板の材質としては,第1表
に示すものを用いた。この材質中,アルミニウムはJIS
−A6061を,硬鋼はJIS−S55Cを用いた。
Grinding wheel peripheral speed: 2700 m / min, table feed speed: 20 m / min, depth of cut: 5 μm / pass, work material: SKH51, work material dimensions:・ ・ ・ Length 300 × width 10 mm, and the materials used for each base disk are those shown in Table 1. Among these materials, aluminum is JIS
-A6061 and JIS-S55C for hard steel.

また,Cはカーボンを示す。また,繊維状Cは,直径5
〜20μmのものを用いた。アラミド繊維は,直径5〜20
μmのものを用いた。
C represents carbon. The fibrous C has a diameter of 5
The one having a thickness of -20 μm was used. Aramid fiber has a diameter of 5 to 20
The thing with a micrometer was used.

また,同表におけるC繊維等の添加量(%)は,ベー
ス円板中に占める容積割合である。
Further, the addition amount (%) of C fiber and the like in the table is the volume ratio in the base disk.

上記測定の結果を,第1表に示す。 The results of the above measurements are shown in Table 1.

同表において,比率Nは密度(kg/cm3)縦弾性係数
(kgf/cm2)で除した値である。
In the table, the ratio N is a value obtained by dividing the density (kg / cm 3 ) by the longitudinal elastic modulus (kgf / cm 2 ).

第1表より知られるごとく,実施例1〜3のベース円
板は,熱膨張係数が比較例C1,C2のそれに比してかなり
低い。
As is known from Table 1, the base disks of Examples 1 to 3 have considerably lower thermal expansion coefficients than those of Comparative Examples C1 and C2.

また,前記比率Nに関しては,実施例1〜3のベース
円板は比較例C1〜C4に比して約半分以下である。この比
率Nは,その値が低いほどベース円板の伸びが小さいこ
とを示している。そのため,伸びに関しては,実施例1
〜3のベース円板は比較例C1〜C4に比して約半分以下で
ある。
Regarding the ratio N, the base disks of Examples 1 to 3 are about half or less of those of Comparative Examples C1 to C4. This ratio N indicates that the lower the value, the smaller the elongation of the base disk. Therefore, regarding elongation, Example 1
The base disks of Nos. 3 to 3 are about half or less of those of Comparative Examples C1 to C4.

なお,前記熱膨張に関しては,スーパーインバーを用
いた比較例C3のベース円板は実施例2,3より低い。しか
し,比較例C3は,前記のごとく比率Nが大きいために,
伸びが大きく,比較例C1,C2,C4と同様に本発明の目的を
達成できない。
Regarding the thermal expansion, the base disk of Comparative Example C3 using Super Invar is lower than those of Examples 2 and 3. However, in Comparative Example C3, since the ratio N is large as described above,
Since the elongation is large, the object of the present invention cannot be achieved like Comparative Examples C1, C2, and C4.

上記のごとく,本発明によれば,高周速下において使
用しても,熱膨張が小さく,伸びの小さい超砥粒を用い
た,回転研削用の研削砥石を得ることができる。
As described above, according to the present invention, it is possible to obtain a grinding wheel for rotary grinding, which uses superabrasive grains having a small thermal expansion and a small elongation even when used at a high peripheral speed.

また,実施例1と比較例C1の研削砥石について,実際
の研削性能を比較してみると,被加工物の面粗さが,実
施例1では0.4μRa,比較例C1では1.4μmRaで,本発明の
研削砥石は優れた加工精度を有していることが分かる。
ここにRaは,JISB0601により定められた中心線平均あら
さをいう。
Further, when comparing the actual grinding performances of the grinding wheels of Example 1 and Comparative Example C1, the surface roughness of the work piece was 0.4 μRa in Example 1 and 1.4 μmRa in Comparative Example C1. It can be seen that the grinding wheel of the invention has excellent processing accuracy.
Here, Ra means the center line average roughness defined by JIS B0601.

また,実施例1の研削砥石は,比較例C1に比して軽量
であるため,回転時にモータにかかる負担が小さく,例
えば空回転の場合のモータ電力は前者が0.4kw,後者が1.
0kwである。また,比較例C3の研削砥石は1.3kwである。
Further, since the grinding wheel of Example 1 is lighter than Comparative Example C1, the load on the motor during rotation is small. For example, the motor power in the idle rotation is 0.4 kw for the former and 1.
It is 0kw. The grinding wheel of Comparative Example C3 has a power of 1.3 kW.

このように,モータ電力が小さいということは,研削
砥石の回転に対するモータ負荷,軸受負荷が小さいとい
うことである。そのため,本発明の研削砥石を用いる場
合には,モータの発熱,軸受の発熱が小さくなる。その
結果,ベース円板の温度上昇も抑えられ,熱によるベー
ス円板の伸びも抑えられ,より高精度の研削ができるこ
とになる。
Thus, the small motor power means that the motor load and the bearing load for the rotation of the grinding wheel are small. Therefore, when the grinding wheel of the present invention is used, heat generation of the motor and heat generation of the bearing are reduced. As a result, the temperature rise of the base disk is suppressed, the elongation of the base disk due to heat is also suppressed, and more precise grinding can be performed.

また,それ故に,回転研削用の研削砥石の高周速化を
一層促進することができる。
In addition, therefore, it is possible to further promote the higher peripheral speed of the grinding wheel for rotary grinding.

【図面の簡単な説明】[Brief description of drawings]

第1図及び第2図は実施例にかかる研削砥石を示し,第
1図はその超砥粒層の斜視図,第2図は研削砥石の平面
図である。 1……セグメントチップ, 2……ベース円板,
1 and 2 show a grinding wheel according to an embodiment, FIG. 1 is a perspective view of the superabrasive layer, and FIG. 2 is a plan view of the grinding wheel. 1 …… Segment chip, 2 …… Base disk,

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】砥粒層をベース円板に接着してなる回転研
削用の研削砥石において, 上記ベース円板は,エポキシ樹脂又はポリイミド樹脂か
らなるプラスチックス中に,カーボン繊維,アラミド繊
維の一方又は双方よりなる繊維を分散させた複合材を用
いてなり, かつ上記ベース円板は熱膨張係数が15×10-6/℃以下
で,かつ密度(kg/cm3)/縦弾性率(kgf/cm2)の比率
(N)が3.5×10-9以下であることを特徴とする研削砥
石。
1. A grinding wheel for rotary grinding, comprising an abrasive grain layer adhered to a base disk, wherein the base disk is made of epoxy resin or polyimide resin in which one of carbon fiber and aramid fiber is formed. Or, a composite material in which fibers composed of both are dispersed is used, and the base disk has a coefficient of thermal expansion of 15 × 10 -6 / ° C or less and a density (kg / cm 3 ) / longitudinal elastic modulus (kgf The grinding wheel is characterized in that the ratio (N) of / cm 2 ) is 3.5 × 10 -9 or less.
【請求項2】第1請求項において,砥粒はダイヤモン
ド,CBN等の超砥粒,又はアルミナ,炭化珪素等の一般砥
粒であることを特徴とする研削砥石。
2. A grinding wheel according to claim 1, wherein the abrasive grains are superabrasive grains such as diamond and CBN, or general abrasive grains such as alumina and silicon carbide.
【請求項3】第1請求項において,砥粒層における砥粒
の結合は,ビトリファイドボンド,レジノイドボンド又
はメタルボンドであることを特徴とする砥削砥石。
3. A grinding wheel according to claim 1, wherein the bonding of the abrasive grains in the abrasive grain layer is a vitrified bond, a resinoid bond or a metal bond.
JP2028948A 1990-02-08 1990-02-08 Grinding wheel Expired - Lifetime JPH0822509B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2028948A JPH0822509B2 (en) 1990-02-08 1990-02-08 Grinding wheel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2028948A JPH0822509B2 (en) 1990-02-08 1990-02-08 Grinding wheel

Publications (2)

Publication Number Publication Date
JPH03234474A JPH03234474A (en) 1991-10-18
JPH0822509B2 true JPH0822509B2 (en) 1996-03-06

Family

ID=12262633

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2028948A Expired - Lifetime JPH0822509B2 (en) 1990-02-08 1990-02-08 Grinding wheel

Country Status (1)

Country Link
JP (1) JPH0822509B2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2514541B2 (en) * 1992-09-08 1996-07-10 大阪ダイヤモンド工業株式会社 Super Abrasive Wheel
JP2514542B2 (en) * 1992-09-08 1996-07-10 大阪ダイヤモンド工業株式会社 Super Abrasive Wheel
US5582625A (en) * 1995-06-01 1996-12-10 Norton Company Curl-resistant coated abrasives
US5865571A (en) * 1997-06-17 1999-02-02 Norton Company Non-metallic body cutting tools
US6074278A (en) * 1998-01-30 2000-06-13 Norton Company High speed grinding wheel
JP2003231061A (en) 2002-02-12 2003-08-19 Noritake Co Ltd Segment type grinding wheel
CN111571459A (en) * 2020-05-11 2020-08-25 中国有色桂林矿产地质研究院有限公司 A kind of inlaid ceramic-resin composite diamond abrasive tool and preparation method thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61152374A (en) * 1984-12-25 1986-07-11 Toyoda Mach Works Ltd Grindstone wheel

Also Published As

Publication number Publication date
JPH03234474A (en) 1991-10-18

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