JPH0824149B2 - Hybrid integrated circuit - Google Patents
Hybrid integrated circuitInfo
- Publication number
- JPH0824149B2 JPH0824149B2 JP62049108A JP4910887A JPH0824149B2 JP H0824149 B2 JPH0824149 B2 JP H0824149B2 JP 62049108 A JP62049108 A JP 62049108A JP 4910887 A JP4910887 A JP 4910887A JP H0824149 B2 JPH0824149 B2 JP H0824149B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- box
- resin case
- shaped resin
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 43
- 229920005989 resin Polymers 0.000 claims description 43
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 210000000078 claw Anatomy 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は混成集積回路に関し、特に箱型樹脂ケースに
集積回路基板を装着してなる混成集積回路に関する。The present invention relates to a hybrid integrated circuit, and more particularly to a hybrid integrated circuit in which an integrated circuit board is mounted in a box type resin case.
従来SIPタイプの混成集積回路にはハーメチックタイ
プと樹脂タイプとがあった。ハーメチックタイプは特に
超高周波特性を必要とし信頼度を要する集積回路以外に
は高価なために用いられていない。樹脂タイプはコスト
的に安価であり一般的に用いられている。しかし、特に
超高周波特性を要する集積回路では高周波特性の劣化防
止のために箱型樹脂ケースを設け、中空にしたタイプが
用いられる場合がある。Conventionally, SIP type hybrid integrated circuits were classified into hermetic type and resin type. The hermetic type is not used because it is expensive except for an integrated circuit which requires super high frequency characteristics and requires reliability. The resin type is inexpensive and is generally used. However, particularly in an integrated circuit requiring ultra-high frequency characteristics, a box type resin case may be provided and a hollow type may be used to prevent deterioration of high frequency characteristics.
従来、ケース内部を中空にしたものとして第３図
（ａ）〜（ｃ）のように樹脂ケース内部に回路基板をは
さみ込んだものがあった。これは箱型樹脂ケース２の内
部につめ３−1,3−２、支持台４−１…を設け、集積回
路基板１をつめ３−1,3−２と支持台４−１…との間に
はさみ込むものであるが、つめ部の間隔と集積回路基板
１の長さは集積回路基板１の長さの方を少し大き目にし
なければつめ部にはさみ込まれなくなり意味のないもの
になる。またつめと支持台の間隔が狭い場合にはつめが
欠けたり、集積回路基板１が割れたり、時としてマイク
ロクラックが入ることがある。さらに箱型樹脂ケース２
の設計はつめ３−1,3−２の寸法を考慮しなければなら
ず、集積回路基板１の寸法等に合わせてつめ部の間隔を
設計しているが、しばしば箱型樹脂ケース２の金型の修
正または金型の造り直し等が必要になると言った欠点
と、金型の造り直しから発生する箱型樹脂ケース２の手
遅れが発生すると言った欠点も合せてあった。Conventionally, there has been a case in which a circuit board is sandwiched inside a resin case as shown in FIGS. 3 (a) to 3 (c) as a hollow case. This is provided with pawls 3-1 and 3-2, a support base 4-1 ... Inside the box type resin case 2, and the integrated circuit board 1 is provided with pawls 3-1 and 3-2 and the support base 4-1. Although it is sandwiched between them, the interval between the claws and the length of the integrated circuit board 1 are meaningless because they are not sandwiched by the claws unless the length of the integrated circuit board 1 is made a little larger. Further, when the distance between the pawl and the support is narrow, the pawl may be chipped, the integrated circuit board 1 may be broken, or sometimes microcracks may occur. Box-shaped resin case 2
In designing, the dimensions of the pawls 3-1 and 3-2 must be taken into consideration, and the spacing between the pawls is designed according to the dimensions of the integrated circuit board 1. There were also drawbacks such as the need to correct the mold or the rebuilding of the mold, and the drawback that the box-shaped resin case 2 was delayed due to the rebuilding of the mold.
本発明の混成集積回路は、少なくともその一主面に電
子回路素子が搭載され、周辺部に外部導出リードを取付
けた集積回路基板を箱型樹脂ケースに装着してなる混成
集積回路において、前記集積回路基板は、前記箱型樹脂
ケースの底面に選択的に設けられた支持台と前記箱型樹
脂ケースの側壁に設けられた凹み又は穴に嵌込まれた樹
脂製止め板で直接挟まれることによる機械的圧力で固定
されているというものである。The hybrid integrated circuit of the present invention is a hybrid integrated circuit in which an electronic circuit element is mounted on at least one main surface thereof, and an integrated circuit board having external lead-outs attached to its peripheral portion is mounted in a box-shaped resin case. The circuit board is directly sandwiched between a support table selectively provided on the bottom surface of the box-shaped resin case and a resin stopper plate fitted in a recess or hole provided in the side wall of the box-shaped resin case. It is fixed by mechanical pressure.
次に、本発明の実施例について図面を参照して説明す
る。Next, embodiments of the present invention will be described with reference to the drawings.
第１図（ａ）は本発明の第１の実施例に使用する箱型
樹脂ケースの斜視図、第１図（ｂ）は本発明の第１の実
施例の斜視図である。1 (a) is a perspective view of a box-shaped resin case used in the first embodiment of the present invention, and FIG. 1 (b) is a perspective view of the first embodiment of the present invention.
この実施例はその一主面に電子回路素子（図示しな
い）が搭載され、周辺部に外部導出リード７を取付けた
集積回路基板１を箱型樹脂ケース２に装着してなる混成
集積回路において、集積回路基板１は、箱型樹脂ケース
２の底面に選択的に設けられた支持台４−１…及び箱型
樹脂ケース２の側壁に設けられた穴５−1,5−２に嵌込
まれた樹脂製止め板６で挟まれたことによる機械的圧力
で固定されているというものである。This embodiment is a hybrid integrated circuit in which an electronic circuit element (not shown) is mounted on one main surface thereof, and an integrated circuit board 1 having external lead-outs 7 mounted on the periphery thereof is mounted in a box-shaped resin case 2. The integrated circuit board 1 is fitted into a supporting base 4-1 which is selectively provided on the bottom surface of the box-shaped resin case 2 and holes 5-1 and 5-2 provided in the side wall of the box-shaped resin case 2. It is fixed by mechanical pressure due to being sandwiched between the resin stopper plates 6.
次にこの実施例の製造方法について説明する。 Next, the manufacturing method of this embodiment will be described.
箱型樹脂ケース２の任意の部分に穴５−1,5−２を設
けると同時に支持台４−１…を３ケ所以上設ける。この
支持台は場合によって箱型樹脂ケース２の内部の周囲全
体に設けてもよい。次に箱型樹脂ケース２の内部の支持
台４−１…上に集積回路基板１を置く。この場合従来技
術で説明したつめ３−1,3−２がないので集積回路基板
1,箱型ケース２に何のストレスも加えなくて支持台４−
１…上に置くことができる。次に樹脂製止め板６を箱型
樹脂ケース２の穴５−1,5−２にはめ込む。この場合箱
型樹脂ケース２の長さと樹脂製止め板６の長さを同じに
することによって容易に集積回路基板１を箱型ケース２
に固定することができる。Holes 5-1 and 5-2 are provided in arbitrary portions of the box-shaped resin case 2, and at the same time, three or more support stands 4-1 are provided. This support base may be provided around the entire inside of the box-shaped resin case 2 in some cases. Next, the integrated circuit board 1 is placed on the support bases 4-1 ... Inside the box-shaped resin case 2. In this case, the integrated circuit board does not have the pawls 3-1 and 3-2 described in the prior art.
1, support box 4 without applying any stress to the box-shaped case 2
1 ... Can be placed on top. Next, the resin stopper plate 6 is fitted into the holes 5-1 and 5-2 of the box-shaped resin case 2. In this case, by making the length of the box-shaped resin case 2 and the length of the resin stopper plate 6 the same, the integrated circuit board 1 can be easily attached to the box-shaped case 2.
Can be fixed to.
樹脂製止め板６の穴５−1,5−２に嵌込まれる部分の
幅は穴に合わせた形状とするが、嵌合寸法とする必要は
ない。嵌込み部を樹脂性等の接着剤で固定すればよいか
らである。The width of the portion of the resin stopper plate 6 to be fitted into the holes 5-1 and 5-2 has a shape conforming to the hole, but it does not have to be a fitting dimension. This is because the fitting portion may be fixed with an adhesive agent such as resin.
第２図（ａ）は本発明の第２の実施例に使用する箱型
樹脂ケースの斜視図、第２図（ｂ）は本発明の第２の実
施例の斜視図である。2 (a) is a perspective view of a box-shaped resin case used in the second embodiment of the present invention, and FIG. 2 (b) is a perspective view of the second embodiment of the present invention.
第１の実施例では一体化された樹脂製止め板６を使用
したが、この実施例では２つの樹脂製止め板６−1,6−
２を使用している。In the first embodiment, the integrated resin stopper plate 6 is used, but in this embodiment, two resin stopper plates 6-1, 6- are used.
I am using 2.
従って樹脂製止め板の寸法に対する制約が緩和さてる
外、効果の点では第１の実施例と同じである。Therefore, in addition to the restriction on the size of the resin stopper plate being relaxed, the effect is the same as that of the first embodiment.
なお、以上の実施例において穴の代りに凹みを設けて
もよいことは改めて詳細に説明するまでもなく明らかな
ことである。Incidentally, it is obvious that a recess may be provided in place of the hole in the above-mentioned embodiment without needing to describe it in detail again.
以上説明したように本発明は箱型樹脂ケースに支持台
と樹脂製止め板がセットできる穴または凹みを設け、そ
の穴または凹みに樹脂製止め板をセットすることによ
り、集積回路基板を箱型樹脂ケースに容易に固定でき
る。また集積回路基板をセットする時に無理に押し込ん
だりする必要がないためつめが欠けたり集積回路基板の
割れ、マイクロクラック等がなく歩留り、信頼性の改善
された混成集積回路が得られる効果がある。As described above, according to the present invention, a box-shaped resin case is provided with a hole or a recess in which a support and a resin stopper plate can be set, and the resin stopper plate is set in the hole or the recess to form a box-shaped integrated circuit board. Can be easily fixed to the resin case. Further, since it is not necessary to force the integrated circuit board when it is set, there is an effect that a claw is not chipped, the integrated circuit board is free from cracks and microcracks, and the yield is improved, so that a hybrid integrated circuit with improved reliability can be obtained.
第１図（ａ）は本発明の第１の実施例に使用する箱型樹
脂ケースの斜視図、第１図（ｂ）は本発明の第２の実施
例の斜視図、第２図（ａ）は本発明の第２の実施例に使
用する箱型樹脂ケースの斜視図、第２図（ｂ）は本発明
の第２の実施例の斜視図、第３図（ａ）は従来例に使用
する箱型樹脂ケースの斜視図、第３図（ｂ）は従来例の
組立て工程中の状態を示す斜視図、第３図（ｃ）は従来
例の斜視図である。 １……集積回路基板、２……箱型樹脂ケース、３−1,3
−２……つめ、４−１〜４−５……支持台、５−1,5−
２……穴、6,6−1,6−２……樹脂製止め板、７……外部
導出リード。FIG. 1 (a) is a perspective view of a box-shaped resin case used in the first embodiment of the present invention, FIG. 1 (b) is a perspective view of the second embodiment of the present invention, and FIG. 2 (a). ) Is a perspective view of a box-shaped resin case used in the second embodiment of the present invention, FIG. 2 (b) is a perspective view of the second embodiment of the present invention, and FIG. 3 (a) is a conventional example. FIG. 3B is a perspective view of a box-shaped resin case used, FIG. 3B is a perspective view showing a state during an assembling process of a conventional example, and FIG. 3C is a perspective view of the conventional example. 1 ... Integrated circuit board, 2 ... Box-shaped resin case, 3-1 and 3
-2 ... Claw, 4-1 to 4-5 ... Supporting base, 5-1 and 5-
2 ... Hole, 6,6-1,6-2 ... Resin plate, 7 ... External lead.
Claims (1)
載され、周辺部に外部導出リードを取付けた集積回路基
板を箱型樹脂ケースに装着してなる混成集積回路におい
て、前記集積回路基板は、前記箱型樹脂ケースの底面に
選択的に設けられた支持台と前記箱型樹脂ケースの側壁
に設けられた凹み又は穴に嵌込まれた樹脂製止め板とで
直接挟まれることによる機械的圧力で固定されているこ
とを特徴とする混成集積回路。1. A hybrid integrated circuit in which an electronic circuit element is mounted on at least one main surface thereof, and an external lead is attached to a peripheral portion of the hybrid integrated circuit, which is mounted in a box-shaped resin case. Mechanically by being directly sandwiched between a support table selectively provided on the bottom surface of the box-shaped resin case and a resin stopper plate fitted in a recess or hole provided on the side wall of the box-shaped resin case A hybrid integrated circuit characterized by being fixed by pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62049108A JPH0824149B2 (en) | 1987-03-03 | 1987-03-03 | Hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62049108A JPH0824149B2 (en) | 1987-03-03 | 1987-03-03 | Hybrid integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63213947A JPS63213947A (en) | 1988-09-06 |
| JPH0824149B2 true JPH0824149B2 (en) | 1996-03-06 |
Family
ID=12821883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62049108A Expired - Lifetime JPH0824149B2 (en) | 1987-03-03 | 1987-03-03 | Hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0824149B2 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS492056A (en) * | 1972-04-25 | 1974-01-09 | ||
| JPS49124560A (en) * | 1973-04-02 | 1974-11-28 | ||
| JPS589388B2 (en) * | 1976-09-20 | 1983-02-21 | シャープ株式会社 | electronic watch |
| JPS5421840A (en) * | 1977-07-20 | 1979-02-19 | Nippon Telegr & Teleph Corp <Ntt> | Strip film lodging device for micro-film search apparatus |
-
1987
- 1987-03-03 JP JP62049108A patent/JPH0824149B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63213947A (en) | 1988-09-06 |
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