JPH0824240B2 - Electronic component recognition device - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an electronic component recognition device, and more particularly to a chip component installed on a printed circuit board, a semiconductor chip component, an IC, an LSI package, a resistor, The present invention relates to an electronic component recognition device capable of efficiently recognizing components such as capacitors.

[Prior Art] As a system for recognizing electronic parts, a part of the whole part is irradiated with predetermined light, an entire image of the part is sampled by an image sensor or the like, and the image is analyzed and recognized. There are also those that are recognized using ultrasonic waves or the like.

[Problems to be Solved] In a conventional one that collects an entire image of a part with an image sensor or the like and analyzes the image, a large amount of data is processed, and if the number of parts is large, a huge amount of data is generated. There is a drawback in that the processing is required, the processing becomes slow, and sufficient recognition cannot be performed.

Further, even in the case of sensing by ultrasonic waves or the like, depending on the type of component, the resolution is lowered and sufficient recognition cannot be performed, the erroneous recognition rate increases, and special processing is required.

[Object of the Invention] The present invention has been made in view of the problems and the like of the prior art. The problems and the like are solved, and the data processing amount thereof is small, and the parts can be efficiently used. An object of the present invention is to provide an electronic component recognition device capable of recognizing the presence or absence or the type thereof.

[Means for solving problems]

The feature of the electronic component recognition device of the present invention for achieving such an object is that a substrate on which an electronic component is mounted and a first characteristic portion of the outer shape of the electronic component are shaded on the substrate side. A first light source for irradiating a light beam through an optical fiber from a forming direction; a second light source for irradiating a light beam through an optical fiber from a direction for forming a shadow on the second characteristic portion of the outer shape on the substrate side; An image pickup unit that collects images of the first and second characteristic portions and generates a video signal corresponding to the images, and a processor and a characteristic outline that serves as a reference for the first and second characteristic portions. A memory for storing data, receives the video signal from the imaging unit, generates data of characteristic outlines of the first and second characteristic portions in accordance with the processing of the processor, and generates the generated data. In which and a determining data processing unit at least one of the electronic components of the type or position or orientation by comparing each data feature outline serving as the reference.

[Action]

With such a configuration, the electronic parts can be recognized by the plurality of outline data that characterize the parts, the data processing amount can be reduced, and the feature point data processing can be performed even with a small amount of data. Even if the number of types of electronic components increases, the recognition can be surely performed.

In addition, depending on the type of part, the shape of the part is a specific shape. It is also possible to calculate and to accurately measure its position.

Therefore, various types of parts can be recognized in a single time, and accurate and efficient recognition processing can be performed.

[Embodiment] An embodiment of the present invention will be described in detail below with reference to the drawings.

FIG. 1 (a) is a detailed view of a component detecting optical system for a chip component of an embodiment in which the electronic component recognizing device of the present invention is applied to a chip component recognizing device, FIG. 1 (b).
Is a plan view seen from the lower side of the structure of the tip of the objective optical system, FIG. 2 is a schematic view of a chip component recognizing device, and FIGS. 3 (a) and 3 (b) are respectively FIG. FIG. 4 is a functional block diagram of the image recognition device, and FIG. 4 is a cross-sectional view of a portion I-I in FIG.
FIGS. 5 (a) to (c) to 8 (a) to (c) are explanatory views for explaining the relationship between the recognition of the boundary line and the light irradiation, and FIGS. 9 (a) to 9 (e). 6A and 6B are explanatory diagrams for explaining the relationship between the recognition of the characteristic outline and the irradiation of light rays.

In FIG. 2, 20 is a component detection optical system, and 21
Is a solid-state image pickup camera, 22 is an objective optical system arranged below the solid-state image pickup camera, and an XY table 23 is further below.
And the printed circuit board 25 is located on the XY table 23.
It is installed on top.

Then, in order to recognize the chip components mounted therein, the image data obtained from the solid-state imaging camera 21 is used as the image processing device 24.
The position measurement is performed by processing the image data in the image processing device 24 in the same manner.
This is performed based on the position data obtained from the XY table 23.

As shown in FIG. 1 (a), the objective optical system 22 has a cylindrical housing 1 to which a solid-state image pickup camera 21 is fixed, and inside thereof, a lens barrel 2 is arranged from above, The lens 3 and the optical filter 4 are sequentially fixed under the lens.

The centers of the housing 1, the lens barrel 2, the lens 3, and the optical filter 4 are set so as to coincide with the optical axis of the solid-state imaging camera 21. A fiber fixing ring 12 is inserted and attached to the tip of the housing 1, and the fiber fixing ring 12 has an opening space 12b that allows reflected light from the components to pass therethrough. The objective optical system 22 itself has its housing 1 so that the tip of the fiber fixing ring 12 is positioned approximately 10 mm from the surface of the printed circuit board 25 placed on the XY table 23.
Is held by an arm (not shown) that supports the.

Now, as shown in FIG. 1 (b), the XY table 23
On the front end side of the housing 1 facing the front, six optical fibers are provided as a light projector that irradiates a light beam in a specific direction. That is, the first optical fiber cable 5 and the second optical fiber cable 6 are arranged at diagonal positions,
The third and fourth optical fiber cables 7 and 8 are respectively X-
The Y-table 23 is provided on the left and right sides, and the fifth and sixth optical fiber cables 9 and 10 are provided on the front and rear sides of the XY table 23, respectively.

Here, the third, fourth, fifth, and sixth optical fiber cables 7,
8, 9 and 10 are arranged such that their tip sides are arranged at 90 ° intervals when viewed from the plane, and the tip sides of the first and second optical fiber cables 5 and 6 are the 3rd, 4th, 5th and 5th, respectively. Like the optical fiber cables 7, 8, 9 and 10 of 6, the optical fiber cables are arranged at an angle of 45 ° when viewed from the plane.

As shown in FIGS. 3 (a) and 3 (b), the tip end side of these optical fiber cables 5 and 6 has a through hole 1 in the housing 1.
It is fixed to a, 1a via fixing plates 1b, 1b, and its optical fiber 5
a and 6a are through holes 12a and 12a of the fiber fixing ring 12, respectively.
Is held at a specific inclination angle (for example, in the range of 50 ° to 60 °).

In addition, the optical fibers 5a and 6a protruding on the tip side of the first and second optical fiber cables 5 and 6 have other optical fiber cables (the mounting inclination angle thereof is 20 ° to 25 ° as described later) at the tip portions thereof. The optical fiber cable is attached at a larger inclination angle (50 ° to 60 °) than that of other optical fiber cables, and its tip portion projects a little longer than other optical fiber cables, as shown in FIGS. 3 (a) and 3 (b). There is. As a result, light rays are sufficiently irradiated to the diagonal corners of the component to be recognized on the printed circuit board 25.

On the other hand, the other third, fourth, fifth, and sixth optical fiber cables 7,8,9,10 are in a state of being slightly inclined (for example, 20 ° ~ 20 °) as shown in FIG. 1 (a). At about 25 °), the tip of the optical fiber cable is also the through hole 1a, 1a, ...
..Fixed by fixing plates 1b, 1b to the optical fiber
7a, 8a, 9a, and 10a are through holes of the fiber fixing ring 12, respectively.
It is held at a specific angle (the range of 20 ° to 25 °) by 12a and 12a.

These first to sixth optical fiber cables 5,6,7,8,9,10
As typified by the fourth optical fiber cable 8 in FIG. 1 (a), the middle portion is fixed to the fiber fixing metal fittings 11 provided on the side surface of the housing 1 via the rubber ring 11a. , The rear end side corresponds to these optical fiber cables 5,6,7,8,9,10 and strobe light source 13,13, ...
・ (Only one is shown, the others are omitted).

Here, the solid-state imaging camera 21 has a two-dimensional image sensor (XY image sensor) and an amplifier circuit built therein, generates an image obtained from the objective optical system 22 as an analog signal, and forms an image of this image. It is sent to the A / D converter 30 of the processing device 24.

On the other hand, the image processing device 24 has an A / D converter 30 that receives an image signal from the solid-state imaging camera 21, and an image data buffer 31 that temporarily stores the data from the A / D converter 30. Then, the data in the image data buffer 31 is transferred to the memory 34 via the bus 32 under the control of the microprocessor (MPU) 33. Then, a predetermined process is performed on these image data according to a predetermined program, which will be described later, stored in the memory 34.

Here, in the recognition program area 35 of the memory 34, there are stored respective programs for roughly recognizing the chip parts to be recognized and individually recognizing the chip parts in the following five states.

(1) A recognition program 35a for square chip parts that is entirely bright.

(2) Recognition program for rectangular chip parts that are entirely dark
35b.

(3) A recognition program 35c for rectangular chip parts where the electrode part is bright and the other parts are dark.

(4) Recognition program 35d for rectangular chip parts that have leads such as transistors.

(5) Cylindrical chip component recognition program 35e. Then start one of these programs and
The memory 34 stores an inspection processing program 34a that defines the inspection order and includes the data of the parts and the position data thereof.

Here, the inspection processing program 34a and each of the five programs define the processing order of chip component recognition, and access various data areas 36 and various table areas 37 for the program to access the chip component form. , Position, orientation, and boundary line characteristic parameter data corresponding to the boundary line data are obtained, and a predetermined process described later is executed.

The image processing device 24 also has an XY stage drive circuit 41 for driving and controlling the keyboard 40 and the XY stage 23, a strobe drive circuit 42, a screen memory 43, and a CRT display 44. The flash drive circuit 42 and the XY stage 23 are connected to the MPU 33 via interface circuits 38 and 39 and the bus 32, respectively,
The PU 33 transfers predetermined data to the screen memory 43 and sends predetermined information to the CRT display 44 for display.

As shown in FIG. 4, the image processing device 24 having the above-mentioned configuration has a substrate positioning processing means 51, a strobe driving means 52, an image data reading means 53, and a window processing means 5.
4, functional units such as the boundary line position detection unit 55, the component type determination unit 56, the component position and direction calculation unit 57 are realized by the MPU 33 and various programs stored in the memory 34.

Here, the board positioning processing means 51 is realized by the inspection processing program 34a, and accesses the data storage area 36a (a part of various data areas 36) to obtain the printed board position and the form information of the parts. . Here, the morphological information is information including five morphological identification information corresponding to the five recognition states (corresponding to the five recognizing programs) and a mounting direction of the component.

Further, the window processing means 54 performs window processing, which will be described later, on the image data detected corresponding to the five recognition programs in order to individually recognize the chip components in the five states.

Further, the boundary line position detection means 55 includes a boundary line characteristic parameter table 37a (various pair table area 37) of the memory 34.
(Part of), the position of the boundary line in the window is calculated from the characteristic parameter. Then, the component type determination means 56 uses the component type table 37b (various table areas 3
(Part of 7), the type of the part is determined.

On the other hand, the position and direction calculation means 57 of the component is composed of the type data from the component type determination means 56 and the boundary position detection means.
The size table 37c (a part of various table areas 37) corresponding to the part type is obtained from the data of 55, the part size corresponding to the type is obtained, and the data of the mounting position and angle of the part with respect to the printed circuit board 25 is calculated. To do.

Incidentally, the window processing means 54 and the boundary line position detecting means 55,
The component classification unit 56 and the component position and direction calculation unit are realized by activating one of five programs for individually recognizing the chip components in the five states (1) to (5). It is something.

By the way, the image processing device 24 drives the strobe light source 13 determined by the above-mentioned five form identification information and the direction of the chip component when a certain chip component to be inspected comes directly under the objective optical system 22. Then, a light beam is emitted in a predetermined direction from the tip of the corresponding optical fiber, and image data is collected from the solid-state imaging camera 21. The image data is collected by the solid-state imaging camera 21 once or twice.
According to 24, the image data processing is performed once or twice.

Next, the image processing device 24, which has obtained the image data at the mounting position of a certain chip component, executes the above-mentioned 5 according to one of the recognition modes (1) to (5) for the chip component corresponding to the position. Based on the position data of the XY stage 23, a predetermined recognition program corresponding to the chip part selected from the three programs 35a to 35d is activated.
The presence and type of the chip component on the printed circuit board 25 is recognized, and the position and inclination of the chip component are measured according to various programs and data corresponding to the type, position, orientation, etc. of the chip component. .

When the recognition and inspection of the chip component thus completed are completed, the image processing device 24 causes the printed circuit board 25 of the memory 34 to
XY stage 23 so that the next chip component position is directly below the target optical system 22 by referring to the component data regarding
Drive one by one. Then, when the next chip part to be inspected again comes directly under the objective optical system 22, the strobe light source 13 is similarly driven as determined by the identification form and orientation of the chip part, and a predetermined distance from the tip of the corresponding optical fiber. A light beam will be emitted in the direction. Next, the same chip component recognition process and position measurement process as described above are performed.

Here, the image processing device 24 for executing the above processing
To specifically describe the operation of each means, first, the image processing device 24, in response to a command signal from the keyboard 40,
The MPU 33 is operated to start the inspection program 34a and the like. When the inspection processing program 34a is activated, the board positioning processing means 51 obtains the printed board component position and form information of the memory 34, and based on the printed board component position information, the X-Y stage drive circuit 41 drives the X- Y stage
By controlling 23, the first chip component on the printed circuit board 25 is positioned directly below the objective optical system 22, and the position data is stored in a predetermined area on the memory 34.

Upon completion of this positioning, the board positioning processing means 51
According to the morphological data of the chip component, the strobe drive means 52 is driven to cause the strobe light source 13 in a specific direction to emit light, and a light beam is emitted from a corresponding optical fiber in a predetermined sequence. The image data of the chip component is captured by the solid-state imaging camera 21, and the data is stored in the image data buffer 31. Next, the image data reading means 53 reads these image data and stores them in a specific area of the memory 34.

Then, the window processing means 54 is activated to read the image data from the memory 34, and the window processing is executed on the image data. The window processing means 54 corresponds to the form corresponding to one of the recognition types (1) to (5) of the chip parts obtained from the board positioning processing means 51, and will be described later with respect to the obtained image data. 5 (a) to (c) to 8 (a) to (c) and 9 (a) to (e) shown in FIG. To extract.

Next, these image data corresponding to each window are
Based on the boundary line parameter data by the boundary line position detection means 55, as position (edge position) data of the boundary line between the component and the board, that is, as a boundary line data string or a characteristic outline data string indicating a position where black and white are reversed. It is calculated and sent to the component type determination means 56.

The component type determining unit 56 refers to the boundary line position data for each window and the strobe light emission sequence data obtained from the substrate positioning processing unit 51, and refers to the component type table 37b of the memory 34 to identify a specific chip component. Determine that. The data of the chip component is output from the component type determining unit 56 to the CRT display 44 and displayed, or is output to the memory 34 or an external storage device and stored.

Further, the boundary line position data of the boundary line position detecting means 55 is sent to the part position and direction calculating means 57. The position and direction calculation means 57 of the component, this position data, information of the type of component determined by the component type determination means 56, information of the current position on the printed circuit board 25 sent from the board positioning processing means 51 and its A size table 37c corresponding to the type of component in the memory 34 based on the orientation information (from the form information)
With reference to, the actual mounting position on the printed circuit board 25 and its direction are calculated.

These data thus calculated are similarly output from the component position and direction calculation means 57 to the CRT display 44 for display, or output to the memory 34 or an external storage device for storage.

As described above, the type of the component is recognized, and the position and direction of the component are measured. When this is completed, the position and direction calculation means 57 of the component activates the substrate positioning processing means 51 in order to recognize and measure the next component on the printed circuit board 25. Then, the board positioning processing means 51 moves the XY table 23 so that the position of the next chip component is directly below the objective optical system 22, and positions the printed board 25.

In this way, the image processing device 24 and the XY table 23
And the parts perform recognition and inspection while synchronizing with each other.

When only recognizing the component, the component type determining means 56 activates the board positioning processing means 51. Also, when recognizing a specific chip component,
Without referring to the form information of the parts in the memory 34, the keyboard 40
From the recognition programs 35a to 35d, one of the recognition programs necessary for performing the target recognition processing is started by activating the strobe drive means 52, the window processing means 53, and the boundary line position detection means 55 by the designation from May be selected according to the command.

Further, when the chip component to be recognized is unspecified, these recognition programs can be sequentially activated to sequentially perform the target recognition of the chip component.

Next, a method of recognition processing of the image processing device 24 performed according to the five recognition programs will be described.

I: Chip parts that are bright in color as a whole (those that have sufficient reflection from the electrodes and part body).

As shown in FIGS. 5 (a) and 5 (b), for the chip components having a bright color as a whole, the first and second optical fibers 5,
The oblique strobe lights L ₁ and L ₂ are sequentially irradiated from the 6 at a predetermined timing, and the shadow part generated from the light reflected from the chip component surface and its electrode part and these rays generated in the peripheral part thereof. Is subjected to window processing by the window processing means 54, and the detection windows (detection areas) of W _{1 to} W _{6 in} the relationship shown in FIG. ) And obtain each boundary line data.

The data of each window thus detected is stored in a specific area of the memory 34 and read by the boundary line position detection means 55 to obtain the position of the boundary line. Based on the data, the presence or absence of each component chip, the type of component, the component itself is recognized,
Furthermore, the position and orientation of the component is determined by the component position and direction calculation means 57.

II: A chip that is entirely dark except for the electrodes (however, only the electrodes reflect and shine).

Similar to the above, for the dark-colored chip components except the electrode portion, as shown in FIGS. 6 (a) and 6 (b),
The oblique strobe lights L ₁ and L ₂ are sequentially emitted from the second optical fibers 5 and 6 at a predetermined timing, and are reflected from the electrode part of the chip component and from these light beams generated in the peripheral part thereof. The generated shadow portion is window-processed by the window processing means 54, and the relationship is as shown in FIG. 6 (c).
The detection windows (detection areas) of W _{1 to} W ₆ detect the image of the reflection portion including this shadow at 6 points (a plurality of points) to obtain the data of each boundary line, and the same processing as described above is performed. To be executed.

Here, the window position of W ₃ to _W-6 is to be determined from the calculation results of the electrode position by the window of W _1, W _2.

III: Chip parts that are entirely dark (when the board color of the printed circuit board is light).

As shown in FIGS. 7 (a) and 7 (b), the oblique strobe lights L ₁ and L ₂ from the first and second optical fibers 5 and 6 are given to the chip components whose colors are entirely dark. By sequentially irradiating at timing, the reflection processing (non-reflection state) from the electrode portion of the chip component and the reflection portion generated from these light rays generated in the peripheral portion are subjected to the window processing by the window processing means 54, the detection window of Figure 7 W in relation seen in (c) ₁ to _W-6 (detection area), by detecting the image including the reflected portion from the board side in six (multiple points) of the respective border After obtaining the data, the same processing as described above is executed.

IV: Those with lead wires such as transistors.

For chip parts having lead wires in the left-right or up-down direction such as transistors as shown in FIGS. 8 (a) and 8 (c), an optical fiber in a direction coinciding with the lead wire direction, for example, Strobe light L from the third and fourth optical fibers 7 and 8
₃ and L ₄ are sequentially irradiated at a predetermined timing, and the shadow processing part 54 performs a window process on the reflection part from the electrode part of the chip component and the shadow part generated from these rays generated in the peripheral part. See Fig. 8 (c).
The detection window of W ₇ to _W-9 (detection area) is detected in positions 3 corresponding the image including the reflected portion from the lead wire side lead wire (s point), to obtain data of each boundary line Then, the same processing as described above is executed.

V: For round chip parts.

In the case of a circular chip component as shown in FIGS. 9 (a) and 9 (b), right and left or up and down optical fibers, for example, third and fourth optical fibers 7, are arranged so as to coincide with the longitudinal direction. 8
The strobe lights L ₃ and L ₄ are successively emitted from the electrode part of the chip part and the shadow part generated from these rays generated in the peripheral part of the chip part, by the window processing means 54. Wind treatment by the 9th
The image waveform S is obtained in the relationship shown in FIG.
The windows W ₁₀ and W ₁₁ (detection area) as shown in Fig. 2 detect the image including the reflection part from the upper corner at two places (plural points) on both ends, and obtain each reflection data,
Thereafter, the same processing as described above is executed.

The inclination of such a component is shown in FIG. 9 (e).
The windows W ₁₀ and W are displaced relative to each other as shown in
The position of the center is calculated from ₁₁ (detection area) to obtain the inclination θ.

By the way, in this embodiment, the projection system of the optical fiber is provided in a unitized state at the tip of the objective optical system, and the objective optical system and the solid-state imaging camera are independent units. There is an advantage that it is easy to set the angle of the objective optical system, the distance, etc., and the symmetrical position setting of the optical fiber.

As described above, in the embodiment, FIG.
Except for (e), the window processing is performed centering on the boundary line of the part, but the target is not limited to the boundary line,
Of course, it can be applied to the outline of parts in general,
The parts are not limited to chip parts.

Further, in recognizing the presence / absence of a component and recognizing the type of a component, it is sufficient if one of the components can be recognized by activating five recognition programs including a window process for sequentially detecting each feature. Therefore, the form information related to the window processing is not required in advance.

In the embodiment, a plurality of optical fibers are arranged. However, it is needless to say that one optical fiber may be moved and installed in each direction.

Further, it goes without saying that the types of recognition modes or the types of recognition programs for detecting the features are not limited to the five types described in the embodiments.

[Effects of the Invention] As can be understood from the above description, in the present invention, a light beam that creates a shadow of a component in a predetermined direction is irradiated to form characteristic outlines of the shadow and the reflective portion of the component at a plurality of locations. The presence or absence of a component or the type of a component is determined based on the combination of the data of these plurality of outlines collected.
The presence or absence of an electronic component or its type can be recognized by a plurality of outline data that characterizes the component.

As a result, the amount of data processing can be reduced, and
The feature point data processing can be performed even with a small amount of data, and the recognition can be surely performed even if the number of target electronic components increases.

In addition, depending on the type of part, the shape of the part is a specific shape. It is also possible to calculate and to accurately measure its position.

Therefore, various types of parts can be recognized in a single time, and accurate and efficient recognition processing can be performed.

[Brief description of drawings]

FIG. 1 (a) is a detailed view of a component detecting optical system for a chip component of an embodiment in which the electronic component recognizing device of the present invention is applied to a chip component recognizing device, FIG. 1 (b). Is
A plan view of the tip of the objective optical system viewed from below, FIG. 2 is a schematic view of a chip component recognition device, and FIGS. 3 (a) and 3 (b) are respectively FIG. 1 (b). 4) is a sectional view of the I-I portion in FIG. 4A and a plan view corresponding thereto, FIG. 4 is a functional block diagram of the image recognition apparatus, and FIGS. 5A, 5B and 5C are bright chips, respectively. FIGS. 6A, 6B, and 6C are explanatory views for explaining the relationship between the recognition of the boundary line of the component and the irradiation of light, and FIG. 6A, FIG. 6B, and FIG. FIGS. 7 (a), (b) and (c) for explaining the relationship between the recognition and the light irradiation, and FIG. 7A, FIG. The explanatory views for explaining and FIGS. 8 (a), (b) and (c) respectively show the lead wire portion. 9A, 9B, and 9C are explanatory views for explaining the relationship between the boundary line of the chip component to be processed and the light irradiation, and FIG. 9A, FIG. 9B, and FIG. And FIG. 9 (d) and FIG. 9 (e) are explanatory views of the window processing, respectively. 1 ... Housing, 2 ... Lens barrel, 3 ... Lens, 4 ...
Optical filter, 5-10 ... Optical fiber, 13 ... Strobe light source, 12 ... Fiber fixing ring, 12b ... Aperture space, 20 ... Component detection optical system, 21 ... Solid-state imaging camera, 22
…… Objective optical system, 23 …… XY table, 24 …… Image processing device for image data, 25 …… Printed circuit board. 33 ... Microprocessor (MPU), 34 ... Memory, 51 ... Substrate positioning processing means, 52 ... Strobe driving means, 53 ... Image data reading means, 54 ... Window processing means, 55 ... Boundary line position Detecting means 56 ... Parts type judging means 57 ... Parts position and direction calculating means.

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Claims (6)

[Claims] 1. A substrate on which an electronic component is placed, and a first light source for irradiating a light beam through an optical fiber from a direction in which a first characteristic portion of the outer shape of the electronic component is shaded on the substrate side, A second feature of irradiating a light beam through an optical fiber from a direction that casts a shadow on the second characteristic portion of the outer shape on the substrate side.
A light source, and an imaging unit that collects images of the first and second characteristic portions and generates image signals corresponding to these images.
A processor and a memory that stores data of characteristic reference outlines corresponding to the first and second characteristic portions, and receives the video signal from the image pickup unit; At least one of the type, position, or orientation of the electronic component is generated by generating data of the characteristic outline of the second characteristic portion and comparing the generated data with the data of the reference characteristic outline. And a data processing unit that determines one of the two. 2. The characteristic outline data for the first and second characteristic portions is within a range of windows provided in advance for the first and second characteristic portions based on the video signal from the imaging section. The electronic component recognition device according to claim 1, wherein the electronic component recognition device is extracted and generated. 3. The electronic component is a chip component, and the irradiation direction of the light beam is a plurality of directions of 3 or more, and the first and second characteristic portions are provided in the chip component. A portion including a component component member such as an electrode, the data of the characteristic outline includes data of a boundary line of the component component member, and corresponds to a specific direction of the plurality of directions and the sampled direction. The presence or absence of a chip component or the type of component is determined by a combination of the data of the characteristic outlines that
The device for recognizing an electronic component according to claim 1, wherein the position of the chip component is calculated. 4. The electronic component is a plurality of types of chip components, and the irradiation direction of the light rays is a plurality of directions of three or more, and the first and second characteristic portions are the chip components. A portion including a component component such as an electrode provided,
The data of the characteristic contour line includes data of a boundary line of the component component member, and a specific direction of the plurality of directions is selected corresponding to the type of the chip component,
The presence or absence of a chip component or the type of component is determined by a plurality of combinations of the data of the characteristic outline corresponding to the selected irradiation direction, and the mounting deviation amount is calculated. The electronic device recognition device according to claim 1 or 2. 5. The electronic component according to claim 1, wherein the irradiation direction of the light beam is set by the installation position of the optical fiber. Recognition device. 6. The light source is a strobe, and the optical fibers are installed at a pair of front and rear, a pair of left and right, and a pair of intermediate positions of front and rear, left and right with respect to the apparatus, and the pair of front and rear 6. The electronic component recognizing device according to claim 5, wherein each of the optical fibers simultaneously emits a light beam, and each of the optical fibers installed at the intermediate positions independently emits a light beam.