JPH0825288B2 - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPH0825288B2 JPH0825288B2 JP63238488A JP23848888A JPH0825288B2 JP H0825288 B2 JPH0825288 B2 JP H0825288B2 JP 63238488 A JP63238488 A JP 63238488A JP 23848888 A JP23848888 A JP 23848888A JP H0825288 B2 JPH0825288 B2 JP H0825288B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- heating resistor
- thermal head
- power feeding
- folded electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000010438 heat treatment Methods 0.000 claims description 42
- 239000000463 material Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 14
- 239000010410 layer Substances 0.000 description 76
- 239000011241 protective layer Substances 0.000 description 11
- 239000010931 gold Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、サーマルプリンタに搭載するサーマルヘッ
ドに係り、特に薄膜型のサーマルヘッドに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal head mounted on a thermal printer, and more particularly to a thin film type thermal head.
〔従来の技術〕 サーマルプリンタに搭載するサーマルヘッドは、印字
ドットを構成する複数個の発熱抵抗体を同一基板上に直
線的に整列配列してなり、画像情報に従ってこれらの発
熱抵抗体を通電加熱させて、感熱記録紙に発色記録され
るか、あるいはインクリボンを溶融して普通紙に転写記
録するようになっている。[Prior Art] A thermal head mounted on a thermal printer is composed of a plurality of heating resistors forming print dots arranged linearly on the same substrate, and these heating resistors are electrically heated according to image information. Then, the color recording is performed on the heat-sensitive recording paper, or the ink ribbon is melted and transferred and recorded on the plain paper.
第３図および第４図は、それぞれこの種のサーマルヘ
ッドにおいて、特に、隣位の１対の発熱抵抗体層に折返
し電極を接続してほぼコ字形に折返すようにした従来の
ものの平面図を示すものである。FIG. 3 and FIG. 4 are plan views of a thermal head of this type, in particular, a conventional one in which folding electrodes are connected to a pair of adjacent heating resistor layers so as to be folded in a substantially U-shape. Is shown.
第３図において、セラミック基板等の絶縁性基板１上
には、蓄熱層として機能するガラスからなるグレーズ層
２が部分的に形成されている。このグレーズ層２の上に
は例えばTa−SiO2またはCr−SiOなどの比較的抵抗値の
大きな材料からなる複数個の発熱抵抗体をなす発熱抵抗
体層３が、蒸着、スパッタリングなどにより被着された
後、エッチングにより、直線状に列をなすように形成さ
れている。この発熱抵抗体層３の上には、この発熱抵抗
体層３に対して給電するための給電体をなす給電体層４
が形成されている。In FIG. 3, a glaze layer 2 made of glass that functions as a heat storage layer is partially formed on an insulating substrate 1 such as a ceramic substrate. On the glaze layer 2, a heating resistor layer 3 comprising a plurality of heating resistors made of a material having a relatively large resistance value such as Ta-SiO 2 or Cr-SiO is deposited by vapor deposition, sputtering or the like. After being formed, it is formed into a linear row by etching. On the heating resistor layer 3, a power feeding layer 4 serving as a power feeding body for feeding power to the heating resistor layer 3.
Are formed.
前記給電体層４は、例えばアルミニウム、銅、金など
の金属からなり、蒸着、スパタリングによって所望形状
のパターンに形成され、各発熱抵抗体層３の整列方向の
一側において共通給電体層4Aおよび信号給電体層4Bとし
てそれぞれ導出されている。また、隣位に１対の前記発
熱抵抗体層3,3の列方向の他側の端部間は折返し電極５
によって互いに連結されており、これにより、１対の発
熱抵抗体層3,3および折返し電極５により全体としてほ
ぼコ字形に形成されている。なお、前記折返し電極５は
前記給電体層４と同様に例えばアルミニウム、銅、金等
の材料によって形成されている。そして、１対の両給電
体層4Aおよび信号給電体層4B間において、１ドット相当
分の発熱領域を形成された各個独立した発熱抵抗体層３
は、１対の両給電体層4A,4B間に電圧を印加することに
よって発熱されるようになっている。The power supply layer 4 is made of a metal such as aluminum, copper, or gold, and is formed into a pattern of a desired shape by vapor deposition or sputtering, and the common power supply layer 4A and the common power supply layer 4A are formed on one side in the alignment direction of the heating resistor layers 3. Each is derived as the signal feed layer 4B. In addition, a folded electrode 5 is provided between adjacent ends of the pair of heating resistor layers 3, 3 on the other side in the column direction.
Are connected to each other by means of which the pair of heating resistor layers 3, 3 and the folded electrode 5 are formed into a generally U-shape. The folded electrode 5 is made of a material such as aluminum, copper, or gold, like the power supply layer 4. Then, between the pair of both power feeding body layers 4A and the signal power feeding body layer 4B, each individual heating resistor layer 3 in which a heating area corresponding to one dot is formed
Is heated by applying a voltage between the pair of power supply layers 4A and 4B.
前述した発熱抵抗体層３および給電体層４上には、こ
れらの発熱抵抗体層３および給電体層４を保護する保護
層６が形成されている。この保護層６は、発熱抵抗体層
３を酸化による劣化から保護するSiO2等からなる耐酸化
層と、この酸化層上に積層され、インクリボンなどとの
接触による摩耗から発熱抵抗体層３および給電体層４を
保護するTa2O5等からなる耐摩耗層とから形成されてお
り、この保護層６は端子部以外のヘッド面のすべてを覆
うようになっている。この保護層６の耐酸化層および耐
摩耗層は、スパッタリング等の手段によって順次積層さ
れ、その後、最終工程において絶縁性基板１を分割して
所望のサーマルヘッドチップを得るようになっている。A protective layer 6 for protecting the heating resistor layer 3 and the power feeding layer 4 is formed on the heating resistor layer 3 and the power feeding layer 4 described above. The protective layer 6 is laminated on the oxidation resistant layer made of SiO 2 or the like that protects the heating resistor layer 3 from deterioration due to oxidation, and is laminated on the oxidation layer to prevent abrasion due to contact with an ink ribbon or the like. And a wear resistant layer made of T a2 O 5 or the like for protecting the power feeding layer 4, and the protective layer 6 covers all of the head surface other than the terminal portion. The oxidation resistant layer and wear resistant layer of the protective layer 6 are sequentially laminated by means such as sputtering, and then the insulating substrate 1 is divided in a final step to obtain a desired thermal head chip.
第４図は第３図と異なる従来のサーマルヘッドを示す
ものであり、第３図に示すものと異なる点は、第３図に
示すサーマルヘッドにおいては、折返し電極５の材質が
給電体層４の材質と同様とされていたが、第４図に示す
サーマルヘッドにおいては、折返し電極５の材質が、例
えばTa−SiO2、Ta2Nなどの発熱抵抗体層３の材質と同様
とされている点である。FIG. 4 shows a conventional thermal head different from that shown in FIG. 3. The difference from the one shown in FIG. 3 is that in the thermal head shown in FIG. However, in the thermal head shown in FIG. 4, the material of the folding electrode 5 is the same as that of the heating resistor layer 3 such as Ta-SiO 2 or T a2 N. That is the point.
しかしながら、前述した第３図に示す従来のサーマル
ヘッド４においては、折返し電極５がアルミニウム等の
軟い材料で形成されているため、特に、折返し電極５の
隅部が変形し易く、このため、変形した折返し電極５上
に位置する保護層６が崩れて破損しやすい欠点を有して
いる。However, in the conventional thermal head 4 shown in FIG. 3 described above, since the folded electrode 5 is formed of a soft material such as aluminum, the corner portion of the folded electrode 5 is easily deformed, and therefore, It has a defect that the protective layer 6 located on the deformed folded electrode 5 is easily broken and damaged.
また、前述した第４図に示す従来のサーマルヘッドに
おいては、折返し電極５が発熱抵抗体層３と同様の材料
により形成されているため、特に折返し電極５の隅部に
発熱集中が生じ易く、折返し電極５の劣化が加速される
欠点を有している。Further, in the conventional thermal head shown in FIG. 4 described above, since the folded electrode 5 is made of the same material as the heating resistor layer 3, heat concentration is likely to occur particularly at the corners of the folded electrode 5, It has a drawback that deterioration of the folded electrode 5 is accelerated.
本発明は、前述した従来のものにおける問題点を解決
し、折返し電極の隅部において保護層が崩れて破損する
おそれがなく、また折返し電極の隅角部に発熱集中が生
じるおそれがなく、耐久性、熱分布特性を向上すること
ができるサーマルヘッドを提供することを目的とする。The present invention solves the above-mentioned problems in the conventional one, there is no risk that the protective layer will collapse and be damaged at the corners of the folded electrode, and there is no risk of heat generation being concentrated at the corners of the folded electrode. It is an object of the present invention to provide a thermal head capable of improving the thermal conductivity and heat distribution characteristics.
前述した目的を達成するため本発明は、印字ドットを
構成する複数個の発熱抵抗体を絶縁性基板上に整列状に
配設し、これらの発熱抵抗体に給電する共通給電体およ
び信号給電体を前記発熱抵抗体の整列方向の一側におい
てそれぞれ接続し、隣位の１対の前記発熱抵抗体の前記
整列方向の他側の端部間を折返し電極によって相互に連
結してなるサーマルヘッドにおいて、前記折返し電極
を、前記給電体の材料と比較して硬度が高くかつ、前記
発熱抵抗体より抵抗値の低い材料により形成したことを
特徴としている。In order to achieve the above-mentioned object, the present invention provides a common power supply body and a signal power supply body in which a plurality of heating resistors forming print dots are arranged in an array on an insulating substrate and power is supplied to these heating resistors. In a thermal head in which the heating resistors are connected to each other on one side in the alignment direction, and ends of the other pair of adjacent heating resistors on the other side in the alignment direction are interconnected by folded electrodes. The folded electrode is formed of a material having a hardness higher than that of the material of the power feeding body and a resistance value lower than that of the heating resistor.
前述した構成の本発明によれば、折返し電極が発熱抵
抗体材料に比較して抵抗値が低い材料により形成されて
いるため、特に折返し電極の隅部にも発熱集中が生じる
おそれがなく、また折返し電極が比較的硬度の高い材料
により形成されているため、折返し電極の隅部において
保護層が崩れた破損するおそれがなく、したがって、耐
久性および熱分布特性を向上することができる。According to the present invention having the above-described configuration, since the folded electrode is formed of a material having a resistance value lower than that of the heating resistor material, there is no danger of heat generation particularly at the corners of the folded electrode. Since the folded electrode is formed of a material having a relatively high hardness, there is no possibility that the protective layer collapses and is damaged at the corner of the folded electrode, and therefore durability and heat distribution characteristics can be improved.
以下、本発明を図面に示す実施例により説明する。 The present invention will be described below with reference to embodiments shown in the drawings.
第１図および第２図は本発明に係るサーマルヘッドの
実施例を示すものであり、これらの図において符号11は
絶縁性基板を示しており、この絶縁性基板11はアルミナ
などの絶縁性材料により形成されている。この絶縁性基
板11上には約50μｍ厚のグレーズ層12が焼成により形成
されている。印字ドットを構成する発熱抵抗体をなす発
熱抵抗体層13の形成領域たる前記絶縁性基板11の一端部
のグレーズ層12の上面は、絶縁性基板11の一端部側が低
位となるように傾斜した傾斜面14とされている。この傾
斜面14は、絶縁体基板11の上面に対して10゜〜15゜の傾
斜角をなすように形成されている。なお、前記傾斜面14
の傾斜角が15゜を越えて大きくなるに従って発熱抵抗体
層13の用紙Ｐへの圧接力が弱くなり、また、傾斜角が10
゜以下に小さくなるに従って、前記圧接力が分散され、
用紙Ｐが、表面粒子の粗いいわゆるラフペーパーの場
合、印字性が悪化してくる。1 and 2 show an embodiment of a thermal head according to the present invention. In these drawings, reference numeral 11 indicates an insulating substrate, and the insulating substrate 11 is an insulating material such as alumina. It is formed by. A glaze layer 12 having a thickness of about 50 μm is formed on the insulating substrate 11 by firing. The upper surface of the glaze layer 12 at one end of the insulating substrate 11, which is the formation region of the heating resistor layer 13 forming the heating resistor that forms the print dot, is inclined so that one end of the insulating substrate 11 is at a lower position. It is assumed to be the inclined surface 14. The inclined surface 14 is formed so as to form an inclination angle of 10 ° to 15 ° with respect to the upper surface of the insulating substrate 11. The inclined surface 14
As the angle of inclination of the heating resistor layer 13 becomes larger than 15 °, the pressure contact force of the heating resistor layer 13 against the paper P becomes weaker, and the angle of inclination becomes 10
As it becomes less than ℃, the pressure contact force is dispersed,
When the paper P is a so-called rough paper whose surface particles are coarse, the printability is deteriorated.
前記傾斜面14は、グレーズ層12の表面にエッチンググ
レードの高い層を形成してエッチングする写真製版技術
により形成される。一方、前記傾斜面14に連らなるグレ
ーズ層12の上面は、前記絶縁性基板11の上面に対してほ
ぼ平行とされた平行面15とされている。The inclined surface 14 is formed by a photoengraving technique in which a layer having a high etching grade is formed on the surface of the glaze layer 12 and etched. On the other hand, the upper surface of the glaze layer 12 that is continuous with the inclined surface 14 is a parallel surface 15 that is substantially parallel to the upper surface of the insulating substrate 11.
前記グレーズ層12の上面の前記発熱抵抗体層13の形成
予定領域たる傾斜面14から平行面15にかけては、Ta−Si
O2、Cr−SiOなどからなる発熱抵抗体をなす複数個の前
記発熱抵抗体層13が形成されている。各発熱抵抗体層13
は、同形の長方形をしたものがグレーズ層12に形成され
ている凸部21上から両傾斜面14,20にかけて整列状に形
成されており、一端から４個ずつの発熱抵抗体層13a,13
b,13c,13dがそれぞれ１組とされている。Ta-Si is formed on the upper surface of the glaze layer 12 from the inclined surface 14 to the parallel surface 15 which is the area where the heating resistor layer 13 is to be formed.
O 2, Cr-SiO plurality of said heat generating resistor layer 13 constituting the heat generating resistor made of are formed. Each heating resistor layer 13
Are formed in the same shape as the rectangular shape on the convex portion 21 formed on the glaze layer 12 to both inclined surfaces 14 and 20, and four heating resistor layers 13a and 13 are formed from one end.
Each of b, 13c, and 13d is a set.
このうち１組の発熱抵抗体層13における両端の発熱抵
抗体層13a,13dの前述した整列方向の一側には、それぞ
れ平行面15側に延在する信号給電体層16B,16Bが接続さ
れており、また、中央の発熱抵抗体層13b,13cの同じく
一側には、端部の幅を広くされた１本の共通給電体層16
Aが接続されている。さらに、これらの信号給電体層16
B,16Bおよび共通給電体層16Aにより給電体をなす給電体
層16が形成されており、この給電体層16は抵抗率の小さ
いアルミニウム（Al）、銅（Cu）、または金（Au）など
の金属材料により形成されている。Of these, one side of the heating resistor layers 13a and 13d at one end of the one pair of heating resistor layers 13 is connected to the one side of the above-mentioned alignment direction, and the signal feeder layers 16B and 16B respectively extending to the parallel surface 15 side are connected. Also, on the same side of the central heating resistor layers 13b and 13c, one common power feeding layer 16 having a wider end is provided.
A is connected. In addition, these signal feed layers 16
The B, 16B and the common power feeding layer 16A form a power feeding layer 16 that forms a power feeding body. The power feeding layer 16 has a low resistivity such as aluminum (Al), copper (Cu), or gold (Au). It is formed of a metal material.
また、隣位の１対の発熱低抗体層13aと13bおよび発熱
抵抗体層13cと13dは、前記給電体層10が接続された整列
方向の一側に対峙する他側の端部間においてそれぞれ折
返し電極23,23により連結されている。さらに、この折
返し電極23,23は、例えばアルミニウム（Al）、銅（C
u）、金（Au）などからなる前記給電体層16の材料と比
較して硬度が比較的高く、かつ、前記発熱抵抗体に比べ
て抵抗値が低い材料、例えばタンタル（Ta）、タングス
テン（Ｗ）、クロム（Cr）、ニッケル（Ni）などの材料
により形成されている。In addition, the pair of adjacent exothermic low antibody layers 13a and 13b and the exothermic resistor layers 13c and 13d are respectively provided between the ends on the other side facing the one side in the alignment direction to which the power feeding layer 10 is connected. They are connected by the folded electrodes 23, 23. Further, the folding electrodes 23, 23 are made of, for example, aluminum (Al), copper (C
u), gold (Au) or the like, which has a relatively high hardness as compared with the material of the power feeding layer 16 and has a lower resistance value than the heating resistor, such as tantalum (Ta) or tungsten ( It is made of a material such as W), chromium (Cr), or nickel (Ni).
前記発熱抵抗体層13および前記給電体層16の表面に
は、耐酸化および耐摩耗性を有する保護層17がほぼ全面
を覆うように積層されている。また、プリンタのプラテ
ン19の表面に対し傾斜面14がほぼ平行となるようにサー
マルヘッドはその向きを規制されており、インクリボン
Ｒおよび用紙Ｐを介して前記傾斜面14をプラテン19に押
圧できるようになっている。A protective layer 17 having oxidation resistance and abrasion resistance is laminated on the surfaces of the heating resistor layer 13 and the power feeding layer 16 so as to cover almost the entire surface. The direction of the thermal head is regulated so that the inclined surface 14 is substantially parallel to the surface of the platen 19 of the printer, and the inclined surface 14 can be pressed against the platen 19 via the ink ribbon R and the paper P. It is like this.
前述した構成によれば、一方の信号給電体層16Bを導
通状態にすると、共通給電体層16Aからの電流が発熱抵
抗体層13b（13c）から折返し電極23および発熱抵抗体層
13a（13d）を介して一方の信号給電体層16Bに流れ、発
熱抵抗体層13a,13bまたは発熱抵抗体層13c,13dが加熱さ
れる。したがって、両信号給電体層16Bを導通状態にす
ることにより４個のすべての発熱抵抗体層13a〜13dが加
熱される。According to the configuration described above, when one of the signal feeder layers 16B is made conductive, the current from the common feeder layer 16A flows from the heating resistor layer 13b (13c) to the return electrode 23 and the heating resistor layer.
It flows through one of the signal power supply body layers 16B via 13a (13d) and heats the heating resistor layers 13a, 13b or the heating resistor layers 13c, 13d. Therefore, all the four heat generating resistor layers 13a to 13d are heated by bringing both the signal feeding body layers 16B into the conductive state.
ところで、本実施例によれば、折返し電極23の材料と
して、発熱抵抗体13の材料と比較して抵抗値の低いもの
が用いられているため、特に折返し電極23の隅部におい
ても発熱集中が生じるおそれがない。また、折返し電極
23の材料が比較的硬度の高いものとされているため、特
に折返し電極23の隅部においても保護層17が崩れて破損
するおそれがなく、したがって、耐久性および熱分布特
性の向上をはかることができる。By the way, according to the present embodiment, as the material of the folding electrode 23, a material having a lower resistance value than that of the material of the heating resistor 13 is used, so that the heat generation is concentrated especially at the corners of the folding electrode 23. There is no danger of it occurring. Also, the folded electrode
Since the material of 23 is relatively hard, there is no possibility that the protective layer 17 will be broken and damaged even at the corners of the folded electrode 23, and therefore the durability and heat distribution characteristics should be improved. You can
なお、本発明は、前述した実施例に限定されるもので
はなく、必要に応じて種々の変更が可能である。It should be noted that the present invention is not limited to the above-described embodiments, and various modifications can be made if necessary.
以上説明したように本発明によれば、折返し電極の隅
部において保護層が崩れて破損するおそれがないし、ま
た、折返し電極の隅部において発熱集中が生じるおそれ
がなく、耐久性、熱分布特性を向上することができると
いう効果を奏する。As described above, according to the present invention, there is no risk that the protective layer collapses and breaks at the corners of the folded electrode, and there is no risk of heat generation being concentrated at the corners of the folded electrode, resulting in durability and heat distribution characteristics. The effect of being able to improve.
第１図および第２図は本発明に係るサーマルヘッドの実
施例を示すものであり、第１図は本実施例に適用される
給電体層の実施例を示す平面図、第２図は本実施例の縦
断面図、第３図および第４図は従来のサーマルヘッドに
適用される給電体層のそれぞれ異なる実施例を示す平面
図である。 11……絶縁性基板、12……グレーズ層、13……発熱抵抗
体層、16……給電体層、17……保護層、23……折返し電
極。1 and 2 show an embodiment of a thermal head according to the present invention, FIG. 1 is a plan view showing an embodiment of a power feeding layer applied to this embodiment, and FIG. FIGS. 3 and 4 are plan views showing different examples of the power feeding layer applied to the conventional thermal head. 11 ... Insulating substrate, 12 ... Glaze layer, 13 ... Heating resistor layer, 16 ... Power feeding layer, 17 ... Protective layer, 23 ... Folding electrode.
Claims (1)
を絶縁性基板上に整列状に配設し、これらの発熱抵抗体
に給電する共通給電体および信号給電体を前記発熱抵抗
体の整列方向の一側においてそれぞれ接続し、隣位の１
対の前記発熱抵抗体の前記整列方向の他側の端部間を折
返し電極によって相互に連結してなるサーマルヘッドに
おいて、前記折返し電極を、前記給電体の材料と比較し
て硬度が高くかつ、前記発熱抵抗体より抵抗値の低い材
料により形成したことを特徴とするサーマルヘッド。1. A plurality of heat generating resistors forming print dots are arranged in an array on an insulating substrate, and a common power supply and a signal power supply for supplying power to these heat generating resistors are provided in the heat generating resistors. Connected at one side in the direction of alignment, and the next one
In a thermal head in which ends of the pair of heat generating resistors on the other side in the alignment direction are mutually connected by a folded electrode, the folded electrode has a higher hardness than the material of the power feeding body, and A thermal head formed of a material having a resistance value lower than that of the heating resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63238488A JPH0825288B2 (en) | 1988-09-22 | 1988-09-22 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63238488A JPH0825288B2 (en) | 1988-09-22 | 1988-09-22 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0286464A JPH0286464A (en) | 1990-03-27 |
| JPH0825288B2 true JPH0825288B2 (en) | 1996-03-13 |
Family
ID=17030991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63238488A Expired - Lifetime JPH0825288B2 (en) | 1988-09-22 | 1988-09-22 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0825288B2 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS574781A (en) * | 1980-06-12 | 1982-01-11 | Matsushita Electric Ind Co Ltd | Thin film type thermal head |
| JPS58120047U (en) * | 1982-02-12 | 1983-08-16 | 沖電気工業株式会社 | thermal head |
| JPS62238767A (en) * | 1986-04-10 | 1987-10-19 | Ngk Insulators Ltd | Recorder |
-
1988
- 1988-09-22 JP JP63238488A patent/JPH0825288B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0286464A (en) | 1990-03-27 |
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