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JPH0825765B2 - Method for manufacturing laser resistant glass - Google Patents
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JPH0825765B2 - Method for manufacturing laser resistant glass - Google Patents

Method for manufacturing laser resistant glass

Info

Publication number
JPH0825765B2
JPH0825765B2 JP29248490A JP29248490A JPH0825765B2 JP H0825765 B2 JPH0825765 B2 JP H0825765B2 JP 29248490 A JP29248490 A JP 29248490A JP 29248490 A JP29248490 A JP 29248490A JP H0825765 B2 JPH0825765 B2 JP H0825765B2
Authority
JP
Japan
Prior art keywords
glass
laser
silica glass
remelting
resistant glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP29248490A
Other languages
Japanese (ja)
Other versions
JPH04164834A (en
Inventor
茂 山形
満葉 栗山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Quartz Products Co Ltd
Original Assignee
Shin Etsu Quartz Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Quartz Products Co Ltd filed Critical Shin Etsu Quartz Products Co Ltd
Priority to JP29248490A priority Critical patent/JPH0825765B2/en
Priority to US07/779,737 priority patent/US5410428A/en
Priority to AT91118411T priority patent/ATE135669T1/en
Priority to EP91118411A priority patent/EP0483752B1/en
Priority to DE69118101T priority patent/DE69118101T2/en
Publication of JPH04164834A publication Critical patent/JPH04164834A/en
Publication of JPH0825765B2 publication Critical patent/JPH0825765B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B19/00Other methods of shaping glass
    • C03B19/14Other methods of shaping glass by gas- or vapour- phase reaction processes
    • C03B19/1453Thermal after-treatment of the shaped article, e.g. dehydrating, consolidating, sintering
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B2201/00Type of glass produced
    • C03B2201/06Doped silica-based glasses
    • C03B2201/20Doped silica-based glasses doped with non-metals other than boron or fluorine
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B2201/00Type of glass produced
    • C03B2201/06Doped silica-based glasses
    • C03B2201/20Doped silica-based glasses doped with non-metals other than boron or fluorine
    • C03B2201/21Doped silica-based glasses doped with non-metals other than boron or fluorine doped with molecular hydrogen

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Glass Melting And Manufacturing (AREA)

Description

【発明の詳細な説明】 <産業上の利用分野> 本発明は、高出力レーザ光に使用される耐レーザガラ
スの製造方法に係り、より具体的にはYAG(1064nm),Ar
レーザ(350〜515nm),KrF(248nm)若しくはArF(193n
m)エキシマレーザ光その他の高出力レーザ光を利用し
た各種装置に組込まれるレーザ用光学部材に使用される
耐レーザガラスの製造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION <Industrial field of use> The present invention relates to a method for producing a laser resistant glass used for high-power laser light, more specifically, YAG (1064 nm), Ar.
Laser (350-515nm), KrF (248nm) or ArF (193n)
m) The present invention relates to a method for manufacturing a laser resistant glass used for an optical member for a laser incorporated in various devices using excimer laser light and other high power laser light.

<従来技術> 近年、エキシマレーザその他の高出力レーザは、LSI
製造のためのリソグラフィー技術、光化学反応を利用す
る技術、切断研削の為の加工技術、レーザ核融合技術に
利用されるものとして注目を集めている。
<Prior Art> Recently, excimer lasers and other high-power lasers are
It is attracting attention as a technology used in lithography technology for manufacturing, technology utilizing photochemical reaction, processing technology for cutting and grinding, and laser fusion technology.

そしてこの種の高出力レーザを透過、伝送、屈折、反
射、吸収、干渉させる為のレンズ、プリズム、フィルタ
ー等としてシリカガラス光学体の適用が試みられてい
る。しかしながら、前記各種オプテイクスを構成するシ
リカガラスに、略700〜600nmの可視波長域の光が作用し
た場合、又略360nmから略160nmの紫外波長域の光が作用
した場合は、特にガラスの構造上ダメージを受けやす
い。
Further, it has been attempted to apply a silica glass optical body as a lens, a prism, a filter or the like for transmitting, transmitting, refracting, reflecting, absorbing and interfering a high power laser of this kind. However, when the light in the visible wavelength range of about 700 to 600 nm acts on the silica glass that constitutes the various optics, or when the light in the ultraviolet wavelength range of about 360 nm to about 160 nm acts, especially on the structure of the glass. It is easily damaged.

なぜならば高出力レーザが長時間照射されるといわゆ
るNBOHC(ノンブリッジ、オキシジェン、ホール、セン
ター)と呼ばれる略630nmの吸収バンド、及びいわゆる
E′センターと呼ばれる略215nmの吸収バンドと、別の
略260nm吸収バンドが生成し、この結果略750〜500nm及
び略360nmから略160nmの紫外線の透過率を低下させ、光
学特性を劣化させてしまう。
This is because when a high-power laser is irradiated for a long time, an absorption band of about 630 nm called so-called NBOHC (non-bridge, oxygen, hole, center) and an absorption band of about 215 nm called so-called E'center and another about 260 nm. An absorption band is generated, and as a result, the transmittance of ultraviolet rays of about 750 to 500 nm and about 360 nm to about 160 nm is lowered, and the optical characteristics are deteriorated.

従って、シリカガラスを前記波長域における高出力レ
ーザに対して耐久性を向上させることは構造上極めて困
難である。
Therefore, it is structurally extremely difficult to improve the durability of silica glass against a high-power laser in the above wavelength range.

更に、特に略250nm以下の短紫外域におけるKrF若しく
はArFエキシマレーザは、他の紫外光に比較して最も強
いエネルギーを持っており、該エキシマレーザの照射に
より前記シリカガラスは一層強い光学的ダメージを受け
やすいことが確認されている。
Furthermore, KrF or ArF excimer laser in the short ultraviolet region of about 250 nm or less has the strongest energy as compared with other ultraviolet light, and the silica glass is irradiated with the excimer laser to cause stronger optical damage. It has been confirmed that it is easy to receive.

<発明が解決しようとする課題> そこで本発明者等は、シリカガラスに対する高出力レ
ーザ照射による光学特性劣化、特に透過率低下を抑制す
る為に全方向脈理フリー、屈折率変動幅Δnが2×10-6
以下である高純度高均質性の合成シリカガラス体(商品
名SUPRASIL−P10、信越石英株式会社製)を用いて耐レ
ーザ性光学部材を形成したが好ましい効果が得られなか
った。
<Problems to be Solved by the Invention> Therefore, the inventors of the present invention have omnidirectional striae-free and a refractive index fluctuation width Δn of 2 in order to suppress deterioration of optical properties of silica glass due to high-power laser irradiation, particularly, decrease of transmittance. × 10 -6
A laser-resistant optical member was formed using the following high-purity, high-homogeneity synthetic silica glass body (trade name: SUPRASIL-P10, manufactured by Shin-Etsu Quartz Co., Ltd.), but the desired effect was not obtained.

本発明者等は更に研究を重ね、前記合成シリカガラス
体を出発母材とし、該ガラス体中に水素ガスをドープす
る事により特に略250nm以下の短紫外域エキシマレーザ
の照射における光学的ダメージを大幅に低減した技術
(特願平1−145226)を開発したが前記ドープ方式では
水素ガスと接触する表面域には多くガスドープされる
が、例え加熱雰囲気下でもガラス固体内部に亙って均等
にガスドープをするのは中々困難であり、而もかかる欠
点はドープされるガラス体の厚みが大になればなるほど
増幅される。
The present inventors have further studied, using the synthetic silica glass body as a starting base material, and by doping hydrogen gas into the glass body, optical damage is particularly caused by irradiation with a short ultraviolet excimer laser of about 250 nm or less. A significantly reduced technology (Japanese Patent Application No. 1-145226) was developed, but in the above doping method, a large amount of gas is doped in the surface area in contact with hydrogen gas, but even in a heating atmosphere, it is evenly distributed inside the glass solid. Gas doping is quite difficult, and the disadvantage is exacerbated as the thickness of the glass body to be doped increases.

この為前記水素ドープ方式では適用可能な耐レーザガ
ラス部材の厚みに一定の制限を受ける。
For this reason, the thickness of the laser resistant glass member applicable to the hydrogen doping method is subject to certain restrictions.

又前記レーザガラス部材は高純度と高均質性を前提と
するものであるために、合成シリカガラス、特に塊状の
合成シリカガラス以外を用いる事ができないが、合成シ
リカガラスは短時間で而も酸水素炎を用いて高温合成を
行なうために、平衡化反応が十分行なわれず構造的には
充分安定とは言えない、而も天然石英に比較して構造的
に不安定な三員環及び四員環構造のガラス組織を多く含
み、この為該不安定に起因して必ずしも耐レーザ性を向
上し得ないものと推定される。この点についてレーザラ
マンで調べると49.5cm-1及び606cm-1散乱ピーク強度の
強いものは耐レーザ性に劣ることが確認された。この為
本発明者は前記したように水素ドープ等により前記ガラ
ス組織の補修を行なっていたが、これはあくまでも不安
定構造の存在を前提とする対処療法であり、必ずしも基
本的な解決につながらないのみならず、前記したように
ドープ可能な厚みに制限を受ける。
Further, since the laser glass member is premised on high purity and high homogeneity, it is not possible to use synthetic silica glass, especially lumpy synthetic silica glass. Since a high temperature synthesis is carried out using a hydrogen flame, the equilibration reaction is not performed sufficiently and it cannot be said that it is structurally sufficiently stable. Moreover, it is a structurally unstable three-membered ring and four-membered compared to natural quartz. It is presumed that a large amount of glass structure having a ring structure is included, and therefore the laser resistance cannot necessarily be improved due to the instability. When this point was examined by laser Raman, it was confirmed that those having strong 49.5 cm −1 and 606 cm −1 scattering peak intensities were inferior in laser resistance. For this reason, the present inventor has repaired the glass structure by hydrogen doping or the like as described above, but this is a coping therapy that is premised on the existence of an unstable structure, and does not always lead to a basic solution. However, the thickness that can be doped is limited as described above.

本発明はかかる従来技術の欠点に鑑み、前記三員環、
四員環の不安定なガラス構造割合の低減を図り、これに
より耐レーザ性の向上を可能ならしめた耐レーザガラス
の製造方法を提供する事を目的とする。
The present invention, in view of the drawbacks of the prior art, the three-membered ring,
It is an object of the present invention to provide a method for producing a laser resistant glass in which the ratio of an unstable glass structure of a four-membered ring is reduced and thereby the laser resistance can be improved.

又本発明の他の目的とする所は、従来の合成若しくは
天然シリカガラスに比較して数段の高密度化を図り、こ
れにより耐レーザ性の向上を可能ならしめて耐レーザガ
ラスの製造方法を提供する事にある。
Another object of the present invention is to provide a method for producing a laser resistant glass by improving the laser resistance by increasing the density in several steps as compared with conventional synthetic or natural silica glass. To provide.

又本発明の他の目的とする所は、前記ガラス組織中に
水素分子と希ガス元素を含有せしめ、これにより耐レー
ザ性の向上を可能ならしめて耐レーザガラスの製造方法
を提供する事にある。
Another object of the present invention is to provide a method for producing a laser resistant glass by containing hydrogen molecules and a rare gas element in the glass structure, thereby making it possible to improve laser resistance. .

又本発明の他の目的とする所は爆発の危険が伴う事な
く而もシリカガラスの厚みに制限される事なくほぼ均一
濃度で該ガラス内部全域に亙って極めて安全に水素分子
を含有し得る耐レーザガラスの製造方法を提供する事に
ある。
Another object of the present invention is to contain hydrogen molecules in a substantially uniform concentration throughout the entire glass without any danger of explosion and without being restricted by the thickness of silica glass. Another object of the present invention is to provide a method for manufacturing an obtained laser resistant glass.

<課題を解決するための手段> 本発明は、塊状の高純度透明、更に少なくとも一方向
から目視にて脈理が検知し得ない程度の高均質合成シリ
カガラスを出発母材に用いる事を前提とするものであ
る。
<Means for Solving the Problems> The present invention is premised on using, as a starting base material, a highly pure and transparent lump, and a highly homogeneous synthetic silica glass in which striae cannot be visually detected from at least one direction. It is what

けだし前記したように耐レーザ性を得るには高純度高
均質且つ透明である事が必要でありこの様な条件は合成
シリカガラス以外では得る事が出来ない。
As described above, in order to obtain laser resistance, it is necessary to have high purity, high homogeneity and transparency, and such a condition cannot be obtained except for synthetic silica glass.

又出発母材に塊体を用いた理由は、合成シリカガラス
でも粉状物や粒状物を用いると前記再溶融時に高圧下で
熱処理されるために含泡したり又粒状構造が残った状態
で溶融固化し、耐レーザ性能が大きく低下する事に起因
する。
Also, the reason for using the lump as the starting base material is that even in the case of synthetic silica glass, if a powdery substance or a granular substance is used, it is heat treated under high pressure at the time of the above-mentioned remelting so that it may contain bubbles or have a granular structure. This is caused by melting and solidification and a large decrease in laser resistance performance.

そして本発明の第1の特徴とする所は前記塊状の高純
度透明合成シリカガラスをドープ可能な稀ガス高圧雰囲
気下で加熱して再溶融し,該再溶融状態を所定時間維持
した点にある。
The first feature of the present invention is that the lump-shaped high-purity transparent synthetic silica glass is heated in a dopeable rare gas high-pressure atmosphere to be re-melted, and the re-melted state is maintained for a predetermined time. .

即ち前記再溶融状態を所定時間維持する事により前記
ガラス組織中で平衡反応が繰返し行なわれ、不安定結合
である三及び四員環構造が低減し、六員環構造等の安定
結合に移行させる事が出来る。
That is, by maintaining the remelted state for a predetermined time, the equilibrium reaction is repeatedly performed in the glass structure, the three- and four-membered ring structure which is an unstable bond is reduced, and a stable bond such as a six-membered ring structure is transferred. I can do things.

この場合前記再溶融は高圧雰囲気下,より具体的には
2000atm程度の高圧雰囲気下で行なうのが好ましいが、
再溶融圧力が500atm以上でも所定の耐レーザ性を得る事
が出来る。
In this case, the remelting is performed in a high pressure atmosphere, more specifically,
It is preferable to perform it in a high pressure atmosphere of about 2000 atm,
Even if the remelting pressure is 500 atm or more, a predetermined laser resistance can be obtained.

そしてこのような三及び四員環構造は、レーザラマン
散乱測定法による、珪素と酸素との間の基本振動による
散乱ピーク(800cm-1)との強度比(下記1及び2式参
照)より求める事が出来、例えば再溶融処理前の合成シ
リカガラスの場合、R1=0.485〜0.503、R2=0.155〜0.1
60であるからして前記再溶融処理により少なくともR1<
0.48,R2<0.15、より具体的にはR1=0.30〜0.45、R2=
0.05〜0.13に低減させる事が出来る。
Then, such a three- and four-membered ring structure is obtained from the intensity ratio (see formulas 1 and 2 below) to the scattering peak (800 cm -1 ) due to the fundamental vibration between silicon and oxygen by the laser Raman scattering measurement method. In the case of synthetic silica glass before remelting treatment, for example, R1 = 0.485-0.503, R2 = 0.155-0.1
Since it is 60, at least R1 <
0.48, R2 <0.15, more specifically R1 = 0.30 to 0.45, R2 =
It can be reduced to 0.05 to 0.13.

R1=I1(495cm-1)/I0(800cm-1) …(1) R2=I2(606cm-1)/I0(800cm-1) …(2) (定義) I1:495cm-1散乱ピーク強度 I2:606cm-1散乱ピーク強度 I0:800cm-1散乱ピーク強度 又前記再溶融は高圧雰囲気下で行なわれるために、ガ
ラス組織の密度も向上し、前記ガラス体の絶対屈折率nd
(ナトリウムのd線)が再溶融処理前後において1.4595
以上、より具体的には前記ガラス体の絶対屈折率ndを0.
001〜0.005の範囲に上昇させる事が出来る。
R1 = I 1 (495cm -1) / I 0 (800cm -1) ... (1) R2 = I 2 (606cm -1) / I 0 (800cm -1) ... (2) ( Definition) I 1: 495cm - 1 Scattering peak intensity I 2 : 606cm -1 Scattering peak intensity I 0 : 800cm -1 Scattering peak intensity Also, since the remelting is performed in a high pressure atmosphere, the density of the glass structure is also improved, and the absolute refraction of the glass body is increased. Rate n d
(Sodium d-line) is 1.4595 before and after remelting treatment
Above, more specifically, the absolute refractive index n d of the glass body is 0.
It can be raised in the range of 001 to 0.005.

従って前記高圧再溶融により、Si原子とO原子間の結
合力の弱い三及び四員環構造を低減しつつ前記両原子で
構成されるガラス網目構造の密度を高める事が出来、こ
れにより耐レーザ性を大幅に向上し得る。
Therefore, by the high-pressure remelting, the density of the glass network structure composed of both atoms can be increased while reducing the weak three- and four-membered ring structure between Si atom and O atom, thereby improving the laser resistance. Sex can be significantly improved.

第2の特徴とする所は前記再溶融をドープ可能な希ガ
ス雰囲気下で行なう点にある。
The second characteristic is that the remelting is performed in a rare gas atmosphere capable of doping.

これにより前記ガラス組織の員環構造の隙間等に希ガ
スが入り込み、ガラス網目構造を安定化させ、結果とし
て高出力レーザ照射による構造切断が起こりにくくなる
ものと推定される。
It is presumed that, as a result, the rare gas enters the gaps of the member ring structure of the glass structure and stabilizes the glass network structure, and as a result, structural cutting due to high-power laser irradiation is less likely to occur.

又前記希ガス雰囲気下による再溶融により耐レーザ性
を高める上で好ましい分子である水素分子(H2)が生成
される。
Further, hydrogen molecules (H 2 ) which is a preferable molecule for improving laser resistance are generated by remelting in the rare gas atmosphere.

尚、前記処理により水素分子が生成される理由につい
てはさだかでないが、合成シリカガラスの製造法である
酸水素炎加水分解法の直接火炎法やCVDスート再溶融合
成法においてはいずれも酸水素炎を用いて形成されるも
のである為に、前記製法により製造されたシリカガラス
体中にはプロトン(H+)等の水素元素のもとが含まれる
事となる。
It should be noted that the reason why hydrogen molecules are generated by the above-mentioned treatment is not clear, but in the direct flame method of the oxyhydrogen flame hydrolysis method and the CVD soot remelting synthesis method which are the production methods of synthetic silica glass, both oxyhydrogen flames are used. Therefore, the silica glass body produced by the above-mentioned method contains a source of hydrogen element such as proton (H + ) because it is formed by using

これらの水素元素を含むガラス体を高圧力下で再溶融
する事によりガラス組織に緩やかに結合しているプロト
ン(H+)やOH基若しくはH2Oが分離され、更にその溶融
体中にその雰囲気ガスである希ガスが拡散されることに
より該希ガスがガラス網目構造のすき間に入り込み、合
成時に生成した酸素ガスを外部へ脱ガスされつつ、前記
生成水素分子が前記ガラス組織中に含有/生成させる事
が可能となるものと推定される。
By remelting the glass body containing these hydrogen elements under high pressure, the protons (H + ) or OH groups or H 2 O that are loosely bound to the glass structure are separated, and the The rare gas that is an atmospheric gas diffuses into the gap of the glass network structure by diffusion, and oxygen gas generated during synthesis is degassed to the outside, while the generated hydrogen molecules are contained in the glass structure / It is estimated that it will be possible to generate.

尚、耐紫外線レーザ性を効果的に達成するには前記シ
リカガラス体中に5×1017(molecule/cm3・glass)以
上の水素分子を含有させるのがよく、それには前記合成
シリカガラスが酸水素炎若しくは水素元素を含む原料ガ
スを用いて製造されたシリカガラス体である必要があ
る。
In order to effectively achieve ultraviolet laser resistance, it is preferable that the silica glass body contains 5 × 10 17 (molecule / cm 3 · glass) or more hydrogen molecules. It must be a silica glass body manufactured using a source gas containing an oxyhydrogen flame or a hydrogen element.

そして第3の特徴とする所は、少なくとも歪点に至る
まで加圧雰囲気下、より具体的には500atm以上で徐冷さ
せた点にある。
The third characteristic is that the material is gradually cooled at least up to the strain point in a pressurized atmosphere, more specifically, at 500 atm or more.

これにより前記固化冷却後の歪量を5(nm/cm)以下
に維持する事が可能となり、例え再溶融しても尚高均質
のシリカガラスを得る事が出来、耐レーザ性が低下しな
い。
This makes it possible to maintain the amount of strain after solidification cooling to 5 (nm / cm) or less, and even if it is re-melted, a highly homogeneous silica glass can be obtained and the laser resistance does not deteriorate.

これにより好ましい耐レーザガラスの提供が可能とな
る。
This makes it possible to provide a preferable laser resistant glass.

<実施例> 原料四塩化ケイ素を蒸留処理して不純物を除去させた
高純度の四塩化ケイ素原料を用いて酸水素炎加水分解法
の直接火炎法(以下ダイレクト法という)にて、高純度
シリカガラスインゴットを各々複数個合成した。
<Example> Using a high-purity silicon tetrachloride raw material obtained by distilling the raw material silicon tetrachloride to remove impurities, a high-purity silica was obtained by a direct flame method of an oxyhydrogen flame hydrolysis method (hereinafter referred to as a direct method). A plurality of glass ingots were synthesized.

次にこれらのインゴットを一定の直径の棒状体に延伸
した後、横型浮遊帯域融解法(FZ法)により混練り均質
化し、三方向における脈理が認められず且つ光使用領域
(クリヤーアパーチャー)における屈折率変動幅(Δ
n)を2×10-6以下に抑えたシリカガラス体を切断、研
削加工して直径100φ×h100mmの試験片を数個作成し
た。
Next, these ingots were drawn into rods with a constant diameter, and then kneaded and homogenized by the horizontal floating zone melting method (FZ method), striae were not recognized in three directions, and in the light use area (clear aperture). Refractive index fluctuation range (Δ
A silica glass body whose n) was suppressed to 2 × 10 −6 or less was cut and ground to prepare several test pieces having a diameter of 100φ × h 100 mm.

次に前記試験片を内面に窒化ホウ素(BN)の粉末をコ
ーティングした高純度アルミナ(Al2O3)製坩堝に入
れ、熱間等方圧加圧法(HIP処理法)により、アルゴン
ガス100%の2000atmの高圧雰囲気で、1750℃の温度を3h
r維持して再溶融した後、第1図に基づく温度/圧力曲
線に基づいて徐冷速度をほぼ100℃/hrに維持して900℃
まで徐冷しつつ及び減圧速度を前記徐冷速度に対応させ
て50〜100atm/hrにて1300atmまで降圧する。そして1300
atmの圧力を維持した状態で前記熱処理温度が200℃に低
下するのをまち、該低下した後暫くして徐々に放圧す
る。又加熱温度においても、前記900℃まで徐冷した後
そのまま自然放冷を行なう。
Next, the test piece was placed in a crucible made of high-purity alumina (Al 2 O 3 ) whose inner surface was coated with boron nitride (BN) powder, and was subjected to hot isostatic pressing (HIP treatment) to obtain 100% argon gas. In a high pressure atmosphere of 2000 atm, the temperature of 1750 ℃ for 3 hours
After maintaining and remelting, maintain the slow cooling rate at approximately 100 ° C / hr based on the temperature / pressure curve shown in Fig. 1 and 900 ° C.
The pressure is reduced to 1300 atm at 50 to 100 atm / hr in accordance with the slow cooling rate while gradually cooling to 50 ° C. And 1300
While maintaining the pressure of atm, the heat treatment temperature is lowered to 200 ° C., and after the temperature is lowered, the pressure is gradually released. Also at the heating temperature, the material is gradually cooled to 900 ° C. and then naturally cooled.

(実施例No1) 次に前記ダイレクト法で製造したサンプルについて窒
素ガス100%の2000atmの高圧雰囲気で、前記と同様な条
件で再溶融処理を行なった。(実施例No2) 次に前記の方法で熱処理した試験片についてそのガラ
ス中心部で夫々耐エキシマレーザ性評価用に40×30×t1
0mm、両面鏡面仕上げサンプル4枚と、ラマン散乱測定
法による水素ガス濃度測定用に5×10×t20mm、3面鏡
面仕上げサンプル4枚を作成し、各種評価を行った。
(Example No. 1) Next, the sample produced by the direct method was subjected to remelting treatment under the same conditions as above in a high pressure atmosphere of 2000 atm containing 100% nitrogen gas. (Example No. 2) Next, with respect to the test piece heat-treated by the above-mentioned method, 40 × 30 × t 1 was used to evaluate the excimer laser resistance at the center of the glass.
Four 0 mm, double-sided mirror-finished samples and 5 × 10 × t 20 mm three-sided mirror-finished samples for measuring hydrogen gas concentration by Raman scattering were prepared and various evaluations were performed.

先ず耐KrFエキシマレーザ性の評価では、照射条件が
パルスエネルギー密度を約900(mj/cm2.pulse)と高出
力に設定し、周波数100(Hz)、照射パルス数1×10
6(pulses)としてレーザ照射前後でのシリカガラスの1
40nm〜900nm域での透過率の変化を調べた。
First, in the evaluation of KrF excimer laser resistance, the irradiation condition was set to a high output with a pulse energy density of about 900 (mj / cm 2 .pulse), a frequency of 100 (Hz), and an irradiation pulse number of 1 × 10.
6 (pulses) of silica glass before and after laser irradiation
The change in transmittance in the 40 nm to 900 nm region was investigated.

その結果、実施例No.1の試験片の中心部から切出した
いずれのサンプルにおいても、実質的に透過率低下が認
められなかった。特に、E′センター吸収バンドに対応
する5,8eV(約214nm)での透過率は、レーザ照射後も±
0.5(%)以内の見かけの透過率低下であり、測定器の
精度内のばらつきであった。
As a result, in any of the samples cut out from the center of the test piece of Example No. 1, substantially no decrease in transmittance was observed. Especially, the transmittance at 5,8 eV (about 214 nm) corresponding to the E'center absorption band is ±
There was an apparent decrease in transmittance within 0.5 (%), which was within the accuracy of the measuring instrument.

次に、耐ArFエキシマレーザ性の評価では、照射条件
がパルスエネルギー密度約200(mj/cm2・pulse)周波数
100(Hz)、照射パルス数1×106(pulses)としてレー
ザ照射前後でのシリカガラスの140nm〜900nm域での透過
率の変化を調べた。
Next, in the evaluation of ArF excimer laser resistance, the irradiation condition was a pulse energy density of about 200 (mj / cm 2 · pulse) frequency.
The change in the transmittance of silica glass in the 140 nm to 900 nm region before and after laser irradiation was examined under the conditions of 100 (Hz) and the irradiation pulse number of 1 × 10 6 (pulses).

その結果、実施例No.1のサンプルの5.8eVでの見かけ
の透過率90%がレーザ照射後にいずれのサンプルも低下
が認められなかった。しかし、実施例No.2のサンプルに
KrFとArFエキシマレーザを照射したところ、透過率低下
が大幅に起こりやすく、好ましい耐レーザ性は得られな
かった。この原因は、ガラス中に何らかのチッ素化合物
が生成したためと推定される。
As a result, the apparent transmittance at 90% of 5.8 eV of the sample of Example No. 1 did not decrease in any of the samples after laser irradiation. However, for the sample of Example No. 2
When irradiated with KrF and ArF excimer lasers, a decrease in transmittance was apt to occur, and preferable laser resistance was not obtained. The cause of this is presumed to be that some nitrogen compound was generated in the glass.

又、水素ガス濃度は前記いずれのサンプルも3〜4×
1018(molecules/cm3)と加熱処理前の水素濃度(5×1
016(molecules/cm3未満)に比較して大幅に向上してい
る事が確認され、又中心部のサンプルと表面近くのサン
プルでも顕著なる差がみられなかった。
In addition, the hydrogen gas concentration is 3 to 4 × in any of the above samples.
10 18 (molecules / cm 3 ) and hydrogen concentration before heat treatment (5 × 1
It was confirmed that it was significantly improved as compared with 0 16 (less than molecules / cm 3 ), and no significant difference was observed between the sample in the central part and the sample near the surface.

次に圧力条件の耐エキシマレーザ性に対する影響を調
べるため、前述のアルミナルツボ入りガラス体を温度条
件を実施例No.1と同一で固定しつつ、圧力条件を1000at
m,500atm,10atm,1atmの夫々の圧力下で再溶融し所定時
間維持した後、前記圧力条件を維持して徐冷速度をほぼ
100℃/hrに維持して900℃まで徐冷し、そして前記再溶
融圧力を維持した状態で前記熱処理温度が200℃に低下
するのをまち、該低下した後暫くして徐々に放圧しつつ
自然放冷を行なう処理実験を行った。(実施例No.3〜
6) そして前記各実施例No.3〜6についてその内部域のサ
ンプルを採取し、耐KrFエキシマレーザ性の評価を実施
例No.1と同一の手法を行った結果、照射前の5.8eVの見
かけの透過率が90〜91%であったサンプルがレーザ照射
後は、実施例No.3のサンプルでは89%前後に、No.4サン
プルでは87%前後に、No.5サンプルでは30%前後に、N
o.6サンプルでは25%前後に各々低下してしまった。
Next, in order to investigate the influence of the pressure condition on the excimer laser resistance, while fixing the above-mentioned alumina crucible-containing glass body in the same temperature condition as in Example No. 1, the pressure condition was set to 1000 at.
After remelting under each pressure of m, 500 atm, 10 atm, 1 atm and maintaining for a predetermined time, maintain the above pressure conditions and keep the slow cooling rate almost
Maintaining 100 ° C / hr, gradually cooling to 900 ° C, and while maintaining the remelting pressure, wait until the heat treatment temperature decreases to 200 ° C, and gradually release the pressure for a while after the decrease. A treatment experiment was carried out to perform natural cooling. (Example No. 3 ~
6) Then, for each of the above-mentioned Example Nos. 3 to 6, samples in the internal region were taken, and the KrF excimer laser resistance was evaluated by the same method as that of Example No. 1. As a result, the irradiation of 5.8 eV before irradiation was performed. After laser irradiation, the samples with apparent transmittance of 90 to 91% were around 89% for the sample of Example No. 3, around 87% for the No. 4 sample, around 30% for the No. 5 sample. , N
In the o.6 sample, it decreased to around 25%.

この結果、再溶融圧力及び前記徐冷時の歪点に至るま
での加圧雰囲気圧力が500atm以上であれば、かなり高い
耐エキシマレーザ性を示していると判断される。
As a result, it is judged that the excimer laser resistance is considerably high when the remelting pressure and the pressure of the pressurized atmosphere until reaching the strain point during the slow cooling are 500 atm or more.

さらに、温度条件の耐エキシマレーザ性に対する影響
を調べるために実施例No.1と同様な試験片をアルゴンガ
ス100%の2000atmの高圧雰囲気で、再溶融温度(1600℃
以上)より低い1300℃の温度を3hr維持して再溶融する
事なく加熱処理した後、以下前記実施例No1と同様に徐
冷速度をほぼ100℃/hrに維持して900℃まで徐冷しつつ
及び減圧速度を前記徐冷速度に対応させて50〜100atm/h
rにて1300atmまで降圧する。
Further, in order to investigate the influence of the temperature condition on the excimer laser resistance, a test piece similar to that of Example No. 1 was subjected to a remelting temperature (1600 ° C.) in a high pressure atmosphere of 2000 atm of 100% argon gas.
(Above) was maintained at a lower temperature of 1300 ° C. for 3 hours and heat-treated without remelting, and then slowly cooled to 900 ° C. while maintaining the slow cooling rate at about 100 ° C./hr as in the case of the above Example No. 1. Meanwhile, the depressurization rate corresponds to the slow cooling rate and 50 to 100 atm / h
Step down to 1300 atm at r.

そして1300atmの圧力を維持した状態で前記熱処理温
度が200℃に低下するのをまち、該低下した後暫くして
徐々に放圧する。又加熱温度においても、前記900℃ま
で徐冷した後そのまま自然放冷を行なって比較例1を作
成した。
Then, while maintaining the pressure of 1300 atm, the heat treatment temperature is lowered to 200 ° C., and after the temperature is lowered, the pressure is gradually released. Also at the heating temperature, Comparative Example 1 was prepared by gradually cooling to 900 ° C. and then naturally cooling.

そしてこの比較例1についてその中心部のサンプルを
採取し、耐KrFエキシマレーザ性の評価を実施例No.1と
同一の手法を行った結果、レーザ照射前の5.8eVの見か
けの透過率が91%であったサンプルがレーザ照射後は、
比較例1では75%に大幅に低下してしまった。
Then, a sample of the central portion of this Comparative Example 1 was sampled and the KrF excimer laser resistance was evaluated in the same manner as in Example No. 1. As a result, the apparent transmittance of 5.8 eV before laser irradiation was 91. After the laser irradiation, the sample that was
In Comparative Example 1, it was significantly reduced to 75%.

最後に、水素ドープ処理による耐KrFエキシマレーザ
性と比較するために、実施例No1と同様なアルミナルツ
ボ入り試験片をステンレルスチール製ジャケットのタン
グステンヒーター炉内に設置し、水素ガス100%雰囲気
にて、10atm,500℃の加熱処理を行い、耐KrFエキシマレ
ーザ性の評価を行って比較例2を作成した。
Finally, in order to compare with the KrF excimer laser resistance by hydrogen doping treatment, a test piece containing an alumina crucible similar to that of Example No. 1 was placed in a tungsten heater furnace of a stainless steel jacket, and the atmosphere was set to 100% hydrogen gas atmosphere. Comparative Example 2 was prepared by performing heat treatment at 10 atm and 500 ° C. and evaluating the KrF excimer laser resistance.

そしてこの比較例1についてその中心部からサンプル
を採取し、耐KrFエキシマレーザ性の評価を実施例No.1
と同一の手法を行った結果、レーザ照射前の5.8eVの見
かけの透過率91%がレーザ照射後は82%まで低下してし
まった。このデータからも本発明の大きな効果が認めら
れた。
A sample was taken from the center of Comparative Example 1 to evaluate the KrF excimer laser resistance.
As a result, the apparent transmittance of 91% at 5.8 eV before laser irradiation decreased to 82% after laser irradiation. From this data, the great effect of the present invention was recognized.

実施例No.1〜6及び比較例1、2までのサンプルにつ
いてナトリウムd線(約588nm)における絶対屈折率の
測定を行った。測定サンプルは、水素ガス濃度測定に使
用したものを再利用した。
The absolute refractive index at the sodium d-line (about 588 nm) was measured for the samples of Examples No. 1 to 6 and Comparative Examples 1 and 2. As the measurement sample, the one used for the hydrogen gas concentration measurement was reused.

その結果、実施例No.1では、nd=1.4615,No.2ではnd
=1.4620,実施例No.3では、nd=1.4608,No.4nd=1.459
5,5〜6ではnd=1.4585,比較例1ではnd=1.4598,比較
例2では、nd=1.4585であった。
As a result, in Example No. 1, n d = 1.4615, and in No. 2 n d
= 1.4620, in Example No. 3, n d = 1.4608, No.4n d = 1.459
In 5, 5 to 6, n d = 1.4585, in Comparative Example 1 n d = 1.4598, and in Comparative Example 2, n d = 1.4585.

HIP処理前の試験片の屈折率はnd=1.4585であること
から特に耐エキシマレーザ性の高い実施例No.1のサンプ
ルでは屈折率が0.003上昇していた。
Since the refractive index of the test piece before HIP treatment was n d = 1.4585, the refractive index of the sample of Example No. 1 having particularly high excimer laser resistance was increased by 0.003.

また、実施例No.1、比較例2の2つのサンプル及び処
理前のサンプルについてレーザラマン散乱測定法によ
る、珪素と酸素との間の基本振動による散乱ピーク(80
0cm-1)と495(cm-1)のD1ラインと606(cm-1)のD2
インのピークを測定し、上記1及び2式に基づいてその
強度比を求めた所、処理前のサンプルはR1=0.485〜0.5
03 R2=0.155〜0.160であるのに対し、比較例2のサン
プルはR1=0.490 R2=0.157、と処理前のサンプルに比
較して低減は見られなかったが実施例No.1のサンプルに
ついてはR1=0.405 R2=0.110と大幅に低減している事
が確認された。
In addition, the scattering peak due to the fundamental vibration between silicon and oxygen by the laser Raman scattering measurement method for the two samples of Example No. 1 and Comparative Example 2 and the sample before treatment (80
The peaks of the D 1 line of 0 cm −1 ) and 495 (cm −1 ) and the peak of D 2 line of 606 (cm −1 ) were measured, and the intensity ratio was calculated based on the above equations 1 and 2, before treatment. Sample is R1 = 0.485-0.5
03 R2 = 0.155 to 0.160, whereas the sample of Comparative Example 2 showed R1 = 0.490 R2 = 0.157, which was not seen as a reduction compared with the sample before treatment, but the sample of Example No. 1 It was confirmed that R1 = 0.405 R2 = 0.110, which was a significant reduction.

そして前記D1ラインとD2ラインのピークは夫々4員環
と3員環のピークに対応するものである為に、実施例N
o.1についてはこれらの員環構造が低減している事が確
認された。
Since the peaks of the D 1 line and the D 2 line correspond to the peaks of the 4-membered ring and the 3-membered ring, respectively, Example N
Regarding o.1, it was confirmed that these member ring structures were reduced.

次に実施例No.1、比較例2の2つのサンプルの歪量を
測定した所いずれも5nm/cm以下であった。尚、歪測定は
日本光学硝子工業会規格「JOGIS14」光学ガラスのひず
みの測定方法に基づいて行った。
Next, when the strain amounts of the two samples of Example No. 1 and Comparative Example 2 were measured, both were 5 nm / cm or less. The strain was measured based on the method for measuring the strain of the optical glass of Japan Optical Glass Industry Standard “JOGIS14”.

一方前述のアルミナルツボ入りガラス体を実施例1と
同様にアルゴンガス100%の2000atmの高圧雰囲気で、17
50℃の温度を3hr維持して再溶融した後、徐冷速度をほ
ぼ500℃/hrに維持して900℃まで徐冷しつつ900℃に低下
後自然放冷を行なう。一方降圧速度においては歪点(11
20℃)以上の温度域で常圧になるように降圧して熱処理
を行なったサンプルについて歪量を測定したについても
10(nm/cm)以上と、歪が拡大している事が確認され、
(比較例3)そしてこの比較例3についてその内部域の
サンプルを採取し、耐KrFエキシマレーザ性の評価を実
施例No.1と同一の手法を行った結果、レーザ照射前の5.
8eVの見かけの透過率91%がレーザ照射後は35%まで低
下してしまった。
On the other hand, the glass body containing the alumina crucible was subjected to the same procedure as in Example 1 in a high pressure atmosphere of 2000 atm containing 100% argon gas.
After remelting while maintaining the temperature of 50 ° C for 3 hours, the cooling rate is maintained at about 500 ° C / hr, gradually cooling down to 900 ° C, and then naturally cooling after cooling down to 900 ° C. On the other hand, the strain point (11
It is also possible to measure the amount of strain in a sample that has been heat-treated by reducing the pressure to normal pressure in the temperature range of 20 ° C or higher.
It has been confirmed that the strain has expanded to over 10 (nm / cm),
(Comparative Example 3) A sample in the inner region of Comparative Example 3 was taken, and the KrF excimer laser resistance was evaluated by the same method as in Example No. 1. As a result, 5.
The apparent transmittance of 91% at 8 eV decreased to 35% after laser irradiation.

「発明の効果」 従って前記実施例より理解される如く、本発明は合成
シリカガラスを再溶融処理をする事により、前記三員環
四員環の不安定なガラス組織割合の低減を図りつつ高密
度化、言換えれば絶対屈折率の向上を図り、更には水素
ガスを含まない雰囲気下でもガラス組織中に希ガスとと
もに水素分子の含有を可能にし、これにより耐レーザ性
の大幅向上を可能ならしめることが出来る。
[Effects of the Invention] Therefore, as understood from the above-mentioned examples, the present invention re-melts the synthetic silica glass to increase the ratio of the unstable glass structure of the three-membered ring to the four-membered ring while reducing the high ratio. If the density is improved, in other words, the absolute refractive index is improved, hydrogen molecules can be contained in the glass structure together with the rare gas even in an atmosphere containing no hydrogen gas. Can be tightened.

又前記再溶融処理は希ガス雰囲気下で行なわれる為に
爆発の危険が伴う事ない。
Further, since the remelting treatment is performed in a rare gas atmosphere, there is no danger of explosion.

又前記水素分子はガラス組織内の水素元素を基に生成
できるために、シリカガラスの厚みに制限される事なく
所望の耐レーザガラスを得る事が出来る。
Further, since the hydrogen molecules can be generated based on the hydrogen element in the glass structure, a desired laser resistant glass can be obtained without being limited by the thickness of silica glass.

等の種々の著効を有す。It has various remarkable effects.

【図面の簡単な説明】[Brief description of drawings]

図面は本発明の実施例1及び2における熱処理状態を示
す温度と圧力の時系列曲線図である。
The drawing is a time series curve diagram of temperature and pressure showing the heat treatment state in Examples 1 and 2 of the present invention.

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】塊状の高純度透明合成シリカガラスをドー
プ可能な稀ガス高圧雰囲気下で加熱して再溶融し,該再
溶融状態を所定時間維持した後、少なくとも歪点に至る
まで加圧雰囲気下で徐冷する事を特徴とする耐レーザガ
ラスの製造方法
1. A lump-shaped high-purity transparent synthetic silica glass is heated in a high-pressure atmosphere of a rare gas that can be doped to remelt it, and the remelted state is maintained for a predetermined time, and then a pressurized atmosphere is reached at least until the strain point is reached. Method for producing laser resistant glass characterized by slow cooling under
【請求項2】前記合成シリカガラスがケイ素化合物原料
の酸水素炎加水分解法により合成されたガラス体である
請求項1)記載の耐レーザガラスの製造方法
2. The method for producing a laser resistant glass according to claim 1, wherein the synthetic silica glass is a glass body synthesized by an oxyhydrogen flame hydrolysis method using a silicon compound raw material.
【請求項3】出発母材たる前記高純度透明合成シリカガ
ラスに、少なくとも一方向から目視にて脈理が検知し得
ない高均質シリカガラス体を用いた請求項1)記載の耐
レーザガラスの製造方法
3. The laser resistant glass according to claim 1, wherein a highly homogeneous silica glass body whose striae cannot be visually detected from at least one direction is used as the high-purity transparent synthetic silica glass as a starting base material. Production method
【請求項4】前記再溶融により、得られたガラス体のレ
ーザラマンによる495cm-1散乱ピーク強度(I1)及び606
cm-1散乱ピーク強度(I2)を低減させ、それらとケイ素
と酸素との間の基本振動による800cm-1散乱ピーク強度
(I0)との強度比を、夫々R1<0.48,R2<0.15に設定し
た事を特徴とする請求項1)記載の耐レーザガラスの製
造方法 R1=I1(495cm-1)/I0(800cm-1) R2=I2(606cm-1)/I0(800cm-1
4. The remelted glass body obtained by laser Raman has a 495 cm −1 scattering peak intensity (I 1 ) and 606.
The cm -1 scattering peak intensities (I 2 ) were reduced, and the intensity ratios between them and the 800 cm -1 scattering peak intensities (I 0 ) due to the fundamental vibration between silicon and oxygen were calculated as R1 <0.48 and R2 <0.15, respectively. and wherein the set to claim 1) resistant laser glass as claimed manufacturing method R1 = I 1 (495cm -1) / I 0 (800cm -1) R2 = I 2 (606cm -1) / I 0 ( 800cm -1 )
【請求項5】前記再溶融により、前記ガラス体の絶対屈
折率ndを少なくとも1.4595以上に設定した事を特徴とす
る請求項1)記載の耐レーザガラスの製造方法
5. The method for producing a laser resistant glass according to claim 1, wherein the absolute refractive index n d of the glass body is set to at least 1.4595 or more by the remelting.
【請求項6】再溶融時の雰囲気圧力及び前記徐冷時の歪
点に至るまでの雰囲気圧力が500atm以上である請求項
1)記載の耐レーザガラスの製造方法
6. The method for producing a laser resistant glass according to claim 1, wherein the atmospheric pressure during remelting and the atmospheric pressure up to the strain point during the slow cooling are 500 atm or more.
JP29248490A 1990-10-30 1990-10-30 Method for manufacturing laser resistant glass Expired - Fee Related JPH0825765B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP29248490A JPH0825765B2 (en) 1990-10-30 1990-10-30 Method for manufacturing laser resistant glass
US07/779,737 US5410428A (en) 1990-10-30 1991-10-23 Optical member made of high-purity and transparent synthetic silica glass and method for production thereof or blank thereof
AT91118411T ATE135669T1 (en) 1990-10-30 1991-10-29 OPTICAL COMPONENT MADE OF HIGHLY PURE AND TRANSPARENT SYNTHETIC QUARTZ GLASS AND METHOD FOR ITS PRODUCTION AND ITS BLANK
EP91118411A EP0483752B1 (en) 1990-10-30 1991-10-29 Optical member made of high-purity and transparent synthetic silica glass and method for production thereof and blank thereof
DE69118101T DE69118101T2 (en) 1990-10-30 1991-10-29 Optical component made of high-purity and transparent, synthetic quartz glass and process for its production and its blank

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29248490A JPH0825765B2 (en) 1990-10-30 1990-10-30 Method for manufacturing laser resistant glass

Publications (2)

Publication Number Publication Date
JPH04164834A JPH04164834A (en) 1992-06-10
JPH0825765B2 true JPH0825765B2 (en) 1996-03-13

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JPH0825765B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4305611B2 (en) * 2002-07-18 2009-07-29 株式会社ニコン Illumination optical apparatus, exposure apparatus, and exposure method
WO2015022966A1 (en) * 2013-08-15 2015-02-19 旭硝子株式会社 Low scattering silica glass, and method for thermally treating silica glass

Also Published As

Publication number Publication date
JPH04164834A (en) 1992-06-10

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