JPH0826166B2 - Bacterial resistant copper clad laminate - Google Patents
Bacterial resistant copper clad laminateInfo
- Publication number
- JPH0826166B2 JPH0826166B2 JP62203879A JP20387987A JPH0826166B2 JP H0826166 B2 JPH0826166 B2 JP H0826166B2 JP 62203879 A JP62203879 A JP 62203879A JP 20387987 A JP20387987 A JP 20387987A JP H0826166 B2 JPH0826166 B2 JP H0826166B2
- Authority
- JP
- Japan
- Prior art keywords
- clad laminate
- copper
- varnish
- thermosetting resin
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 16
- 229910052802 copper Inorganic materials 0.000 title claims description 11
- 239000010949 copper Substances 0.000 title claims description 11
- 230000001580 bacterial effect Effects 0.000 title 1
- 229920005989 resin Polymers 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 30
- 239000002966 varnish Substances 0.000 claims description 27
- 229910021536 Zeolite Inorganic materials 0.000 claims description 16
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 claims description 16
- 229920001187 thermosetting polymer Polymers 0.000 claims description 16
- 239000010457 zeolite Substances 0.000 claims description 16
- 241000233866 Fungi Species 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 229910021645 metal ion Inorganic materials 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 2
- 230000000844 anti-bacterial effect Effects 0.000 description 9
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 241000894006 Bacteria Species 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 239000000022 bacteriostatic agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Description
【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） 本発明は、電気絶縁材料として用いられる積層板に関
し、特に耐菌性、電気特性に優れた耐菌性を有する銅張
積層板に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application] The present invention relates to a laminate used as an electric insulating material, and particularly to a copper clad having excellent bactericidal resistance and electric characteristics. Regarding a laminated plate.
（従来の技術） 電気絶縁材料として用いられる、フェノール樹脂、エ
ポキシ樹脂、シリコーン樹脂、ポリイミド樹脂、トリア
ジン樹脂等の熱硬化性樹脂の積層板は、高湿度中にさら
されると菌（かび、バクテリア等）が発生しやすい。ま
た、銅箔等の金属を貼ったプリント配線用積層板に菌が
発生すると、極端に絶縁性が低下し、回路が浸食し、外
観が悪くなる等の欠点があった。(Prior Art) Laminates of thermosetting resins such as phenolic resin, epoxy resin, silicone resin, polyimide resin, triazine resin, etc., used as electrical insulating materials, are exposed to high humidity and fungi (mold, bacteria, etc.) ) Is easy to occur. In addition, when bacteria are generated in a printed wiring laminate having a metal such as a copper foil attached thereto, there is a drawback that the insulation property is extremely lowered, the circuit is corroded, and the appearance is deteriorated.
（発明が解決しようとする問題点） 従来、菌の発生を防止するためには、防菌剤を含むワ
ニスを、加工したのちの積層板やプリント配線板に塗布
することが行われてきた。しかしながら、積層板自体に
耐菌性を付与することがより好ましいことである。とこ
ろが積層板は、高温のプリプレグ乾燥工程や加熱成形工
程を経て製造されるため、耐菌性を付与することが難し
く、また、耐菌性を付与することができても、電気特性
やプリント配線板としての特性を保持することができな
いという欠点があった。(Problems to be Solved by the Invention) Conventionally, in order to prevent the generation of bacteria, a varnish containing a bacteriostatic agent has been applied to a laminated board or a printed wiring board after processing. However, it is more preferable to impart bactericidal resistance to the laminate itself. However, since the laminated board is manufactured through a high temperature prepreg drying step and a heat molding step, it is difficult to impart bactericidal resistance, and even if bactericidal resistance can be imparted, electrical characteristics and printed wiring There is a drawback that the characteristics as a plate cannot be maintained.
本発明は、これらの欠点を解消するためになされたも
ので、電気特性に優れ、回路の浸食がなく、外観のよ
い、プリント配線板としての特性を保持した、それ自体
が耐菌性を有する銅張積層板を提供しようとするもので
ある。The present invention has been made to solve these drawbacks, has excellent electrical characteristics, does not corrode a circuit, has a good appearance, retains the characteristics of a printed wiring board, and is itself resistant to bacteria. It is intended to provide a copper clad laminate.
［発明の構成］ （問題点を解決するための手段） 本発明者は、耐菌性を塗布することなく、銅張積層板
の積層板自体が耐菌性を有するように、熱硬化性樹脂ワ
ニスをゼオライトを配合しプリプレグをつくれば、上記
目的を達成することができることを見いだし、本発明を
完成したものである。すなわち、本発明は、 熱硬化性樹脂ワニスを基材に含浸乾燥してなるプリプ
レグの複数枚を積層し、少なくともその片面に銅箔を重
ね合わせて加熱加圧一体に成形してなる銅張積層板にお
いて、ゼオライトを配合して金属イオン以外の耐菌性成
分の保持機能を高めた熱硬化性樹脂ワニスを用いること
を特徴とする耐菌性を有する銅張積層板である。そし
て、熱硬化性樹脂ワニスが、ワニス樹脂固形分に対して
ゼオライトを0.02〜0.2重量％配合したものである耐菌
性を有する銅張積層板である。[Structure of the Invention] (Means for Solving Problems) The present inventor has developed a thermosetting resin so that the laminate itself of the copper-clad laminate has bactericidal resistance without applying bactericidal resistance. It has been found that the above object can be achieved by mixing varnish with zeolite to form a prepreg, and the present invention has been completed. That is, the present invention is a copper clad laminate obtained by laminating a plurality of prepregs obtained by impregnating and drying a base material with a thermosetting resin varnish, and superimposing a copper foil on at least one side of the prepregs and integrally molding them by heating and pressing. A copper-clad laminate having fungus resistance, characterized in that a thermosetting resin varnish having a function of retaining fungus-resistant components other than metal ions improved is used in the plate. The thermosetting resin varnish is a copper-clad laminate having fungus resistance in which 0.02 to 0.2% by weight of zeolite is mixed with the solid content of the varnish resin.
本発明に用いる熱硬化性樹脂ワニスは、基材に含浸し
150〜180℃の温度範囲で乾燥してプリプレグとし、加熱
加圧成形されるもので、例えばフェノール樹脂、エポキ
シ樹脂、シリコーン樹脂、ポリイミド樹脂、トリアジン
樹脂およびこれらの変性樹脂のワニスが挙げられる。こ
れらは熱硬化性樹脂を溶剤に溶解してワニスとしたもの
であり、ここに用いられる溶剤類としてはアルコール
類、ケトン類等通常用いられる溶剤が広く使用できる。The thermosetting resin varnish used in the present invention is obtained by impregnating the base material.
It is dried in the temperature range of 150 to 180 ° C. to obtain a prepreg, which is heat-pressed, and examples thereof include phenol resin, epoxy resin, silicone resin, polyimide resin, triazine resin and varnish of these modified resins. These are varnishes obtained by dissolving a thermosetting resin in a solvent, and as the solvents used here, commonly used solvents such as alcohols and ketones can be widely used.
本発明に用いる基材としては、ガラスクロス、ガラス
ペーパー等、又はリンター紙、クラフト紙等、又はこれ
らの混抄紙等、一般的に使用されている基材が広く使用
できる。As the base material used in the present invention, generally used base materials such as glass cloth, glass paper and the like, linter paper, kraft paper and the like, or mixed papers thereof can be widely used.
本発明に用いるゼオライトとしては、次の構造式で示
される化合物である。The zeolite used in the present invention is a compound represented by the following structural formula.
x M2/nＯ・Al2O3・y Si O2・z H2O （但し、式中Ｍは金属イオン、ｎは金属イオンの原子
価、ｘは金属酸化物の係数、ｙはシリカの係数、ｚは結
晶水の分子数を表す） ゼオライトの配合割合は、熱硬化性樹脂ワニスの樹脂
固形分に対して0.02〜0.2重量％配合することが好まし
く、より好ましくは、0.02〜0.1重量％である。配合量
が0.02重量％未満では十分な耐菌性が得られず、0.2重
量％を超えると半田耐熱性、耐薬品性、引きはがし強
さ、成形性等に影響があらわれ、実用上好ましくない。x M 2 / n O ・ Al 2 O 3・ y Si O 2・ z H 2 O (where M is a metal ion, n is a valence of the metal ion, x is a coefficient of the metal oxide, and y is silica). , Z represents the number of molecules of water of crystallization) The mixing ratio of zeolite is preferably 0.02 to 0.2% by weight, more preferably 0.02 to 0.1% by weight, based on the resin solid content of the thermosetting resin varnish. %. When the content is less than 0.02% by weight, sufficient bactericidal resistance cannot be obtained, and when it exceeds 0.2% by weight, solder heat resistance, chemical resistance, peeling strength, moldability, etc. are affected, which is not preferable in practice.
ゼオライトは、熱硬化性樹脂ワニス中に混合して、極
めて容易にゼオライト入り熱硬化性樹脂ワニスが得られ
る。こうして得られた熱硬化性樹脂ワニスを用いて常法
によってプリプレグを得、またプリプレグと銅箔を重ね
合わせ、一般的方法によって加熱加圧成形一体化して銅
張積層板を製造することができる。Zeolite can be mixed into a thermosetting resin varnish to very easily obtain a thermosetting resin varnish containing zeolite. Using the thermosetting resin varnish thus obtained, a prepreg can be obtained by a conventional method, and the prepreg and the copper foil can be superposed and integrated under heat and pressure by a general method to produce a copper clad laminate.
（作用） 熱硬化性樹脂ワニスにゼオライトを配合したことによ
り、熱硬化性樹脂ワニス中の金属イオン以外の耐菌性成
分をゼオライトが保持し、耐久性成分を保持したゼオラ
イトは銅張積層板基板の耐菌性性能を高めて菌の発生を
おさえ、かつ銅張積層板の電気特性の低下を防止するこ
とができる。(Function) By incorporating zeolite into the thermosetting resin varnish, the zeolite retains bacteria-resistant components other than metal ions in the thermosetting resin varnish and retains the durable component. It is possible to enhance the antibacterial performance of (1) to suppress the generation of microbes and to prevent the deterioration of the electrical characteristics of the copper clad laminate.
（実施例） 次に実施例を用いて本発明を説明するが、本発明はこ
れらの実施例によって限定されるものではない。以下の
実施例および比較例において「部」、「％」とあるのは
それぞれ「重量部」、「重量％」を意味する。(Examples) Next, the present invention will be described using examples, but the present invention is not limited to these examples. In the following Examples and Comparative Examples, "parts" and "%" mean "parts by weight" and "% by weight", respectively.
実施例 １ エピコート1001（シェル化学社製エポキシ樹脂、商品
名）80部と、エピコート828（シェル化学社製エポキシ
樹脂、商品名）20部とを、メチルエチルケトン40部に溶
解する。これにジシアンジアミドの10％ジメチルホルム
アミド溶液40部と２−エチル−４−メチルイミダゾール
0.1部とを加えて撹拌し、樹脂溶液とした。この樹脂溶
液100部（樹脂固形分）に水酸化アルミニウム20部を添
加し、良く撹拌して、充填剤入りエポキシ樹脂ワニスを
得た。このワニスにゼオライト0.12部（樹脂固形分に対
して0.1％）を加えて均一に混合してゼオライト入りワ
ニスとした。このワニスを用いてガラスクロスAS7628/4
50（旭シュエーベル社製、商品名）に含浸、165℃で６
分間乾燥し、半硬化状態のプリプレグを得た。このプリ
プレグの樹脂含有量は40.3％であった。こうして得られ
たプリプレグを８枚重ね、更にその上下に厚さ0.035mm
の電解処理銅箔を、その処理面をプリプレグ側にして、
１枚づつ重ねて、170℃に加熱した熱盤間にはさみ、45k
g/cm2の圧力で70分間加熱加圧成形して銅張積層板を製
造した。Example 1 80 parts of Epicoat 1001 (epoxy resin manufactured by Shell Chemical Co., trade name) and 20 parts of Epicoat 828 (epoxy resin manufactured by Shell Chemical Co., trade name) are dissolved in 40 parts of methyl ethyl ketone. Add 40 parts of a 10% dimethylformamide solution of dicyandiamide and 2-ethyl-4-methylimidazole.
0.1 part was added and stirred to obtain a resin solution. 20 parts of aluminum hydroxide was added to 100 parts of this resin solution (resin solid content) and stirred well to obtain a filled epoxy resin varnish. To this varnish, 0.12 parts of zeolite (0.1% based on the resin solid content) was added and uniformly mixed to obtain a varnish containing zeolite. Glass cloth AS7628 / 4 with this varnish
Impregnate 50 (Asahi Schebel, trade name), 6 at 165 ° C
After drying for a minute, a semi-cured prepreg was obtained. The resin content of this prepreg was 40.3%. Eight prepregs obtained in this way are stacked, and the thickness is 0.035mm above and below it.
The electrolytically treated copper foil of, with the treated surface on the prepreg side,
Stacked one by one, sandwiched between heating plates heated to 170 ℃, 45k
A copper clad laminate was manufactured by heat and pressure molding at a pressure of g / cm 2 for 70 minutes.
実施例 ２ エピコード1045（シェル化学社製臭素化エポキシ樹
脂、商品名）100部をメチルエチルケトン40部に溶解
し、ジシアンジアミドの10％ジメチルホルムアミド溶液
40部と、２−エチル−４−メチルイミダゾール0.1部と
を加え、撹拌して樹脂溶液とした。この樹脂溶液にゼオ
ライト0.21部（樹脂固形分に対して0.15％）を加えて均
一に混合してゼオライト入りワニスとした。このワニス
を用いて実施例１と同様にしてプリプレグを得、更に銅
張積層板を製造した。Example 2 100 parts of Epicord 1045 (a brominated epoxy resin manufactured by Shell Chemical Co., Ltd., trade name) was dissolved in 40 parts of methyl ethyl ketone, and a 10% dimethylformamide solution of dicyandiamide was dissolved.
40 parts and 0.1 part of 2-ethyl-4-methylimidazole were added and stirred to obtain a resin solution. 0.21 part of zeolite (0.15% based on the resin solid content) was added to this resin solution and uniformly mixed to obtain a varnish containing zeolite. Using this varnish, a prepreg was obtained in the same manner as in Example 1, and further a copper clad laminate was manufactured.
比較例 １ 実施例１において、ゼオライトを配合しないワニスを
用い実施例１と同様にしてプリプレグを得、加熱加圧一
体に成形して銅張積層板を製造した。Comparative Example 1 In Example 1, a prepreg was obtained in the same manner as in Example 1 except that the varnish containing no zeolite was used, and the prepreg was integrally molded by heating and pressing to produce a copper clad laminate.
比較例 ２ 実施例２においてゼオライトを配合しないワニスを用
いて実施例１と同様にしてプリプレグを得、加熱加圧一
体に成形して銅張積層板を製造した。Comparative Example 2 A prepreg was obtained in the same manner as in Example 1 except that the varnish containing no zeolite was used, and the prepreg was integrally molded under heat and pressure to produce a copper clad laminate.
実施例および比較例で製造した銅張積層板について諸
特性の試験を行ったのでその結果を第１表に示した。本
発明の銅張積層板は、かびの発生がなく、電気特性の低
下がみられず本発明の硬化が確認された。Various properties of the copper-clad laminates manufactured in Examples and Comparative Examples were tested, and the results are shown in Table 1. It was confirmed that the copper-clad laminate of the present invention did not cause mold and showed no deterioration in electrical characteristics, and that the curing of the present invention was performed.
［発明の効果］ 以上の説明および第１表から明らかなように、本発明
の銅張積層板の基板は耐菌性に優れているため、電気特
性の低下や、回路の浸食がなく、また外観のよいもの
で、信頼性の高いプリント配線板を製造することができ
る。 [Effects of the Invention] As is clear from the above description and Table 1, the substrate of the copper-clad laminate of the present invention is excellent in bactericidal resistance, so that there is no deterioration in electrical characteristics and no circuit erosion. A printed wiring board having a good appearance and high reliability can be manufactured.
Claims (2)
なるプリプレグの複数枚を積層し、少なくともその片面
に銅箔を重ね合わせて加熱加圧一体に成形してなる銅張
積層板において、ゼオライトを配合して金属イオン以外
の耐菌性成分の保持機能を高めた熱硬化性樹脂ワニスを
用いることを特徴とする耐菌性を有する銅張積層板。1. A copper clad laminate formed by laminating a plurality of prepregs obtained by impregnating a base material with a thermosetting resin varnish and drying, and superimposing a copper foil on at least one surface of the prepreg and integrally molding the same under heat and pressure. 2. A copper-clad laminate having fungus resistance, characterized in that a thermosetting resin varnish having a function of retaining fungus-resistant components other than metal ions is used by incorporating zeolite.
に対してゼオライトを0.02〜0.2重量％配合したもので
ある特許請求の範囲第１項記載の耐菌性を有する銅張積
層板。2. A copper-clad laminate having fungus resistance according to claim 1, wherein the thermosetting resin varnish contains 0.02 to 0.2% by weight of zeolite based on the solid content of the varnish resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62203879A JPH0826166B2 (en) | 1987-08-17 | 1987-08-17 | Bacterial resistant copper clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62203879A JPH0826166B2 (en) | 1987-08-17 | 1987-08-17 | Bacterial resistant copper clad laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6448838A JPS6448838A (en) | 1989-02-23 |
| JPH0826166B2 true JPH0826166B2 (en) | 1996-03-13 |
Family
ID=16481229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62203879A Expired - Lifetime JPH0826166B2 (en) | 1987-08-17 | 1987-08-17 | Bacterial resistant copper clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0826166B2 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5069173A (en) * | 1973-10-23 | 1975-06-09 | ||
| JPS51103146A (en) * | 1975-03-07 | 1976-09-11 | Showa Highpolymer | SEIKEIYOJUSHI SOSEIBUTSU |
| JPS61136530A (en) * | 1984-12-06 | 1986-06-24 | Kanebo Ltd | Treatment of polymer molding containing zeolite particle |
| JPS6281793A (en) * | 1985-10-05 | 1987-04-15 | 日立化成工業株式会社 | Manufacturing laminated board for printed circuit board |
-
1987
- 1987-08-17 JP JP62203879A patent/JPH0826166B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6448838A (en) | 1989-02-23 |
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