JPH0827331B2 - Pin assembly method and test probe assembly method - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pin assembling method, and more particularly to a test probe pin assembling method suitable for inspecting a high-density multi-pin semiconductor device.

[Conventional technology]

The conventional device, as described in JP-A-61-80067,
To form a test probe, probe pins are individually inserted into through holes provided in the probe structure.

Further, the tip of the probe pin needs to be sharpened in order to improve the electrical contact characteristics, and after the probe pin is fixed to the probe structure, a flat surface is obtained by cutting and polishing and exposed by etching. There is.

[Problems to be Solved by the Invention]

The above-mentioned prior art does not consider the position accuracy in high density and high pin count of the probe head, and has a problem in improving the position accuracy of the pin tip.

The tip part of the probe pin, in particular when contacting the electrode pad (solder bump) of the semiconductor wafer, has a certain area (one chip worth) in order to secure the contact resistance characteristic between the pin and the pad which is springless and stands upright. ), It is necessary to align the height and lateral positions with high accuracy. In the prior art, the tip portion of the probe pin is formed by etching, but the necessity of improving the accuracy of the position of the tip portion is not taken into consideration.

An object of the present invention is to provide an assembling method that realizes a highly accurate pin stand for a pin tip position and a test probe assembling method suitable for inspecting a semiconductor element.

[Means for solving the problem]

In order to achieve the above object, in the pin assembling method, an elongated pin is inserted into each through hole of a substrate provided with a plurality of through holes, and the pin is magnetically attracted through a flat surface,
The tip of the pin is pressed against the flat surface, the tip of the pin is pressed against the flat surface, and then the pin and the substrate are bonded.

Further, in the test probe assembling method, an elongated test probe that transmits an electric signal by contacting an electrode pad of a component under test is inserted into each of the through holes of the substrate having a plurality of through holes, and a flat surface is formed. After magnetically attracting the test probe through the flat surface, the tip portion of the test probe is pressed against the flat surface, the tip portion of the test probe is pressed against the flat surface, and then the test probe and the substrate are To glue.

[Action]

By using a magnetic material for the probe pin, the above pins can be magnetically attracted independently.

Therefore, insert the above-mentioned pin into a housing having a through hole, magnetically attract the above-mentioned pin through a substrate having a flat surface, and independently press the pin tip portion onto the above-mentioned flat surface of the substrate. Thus, the variation in the height direction can be set to the same level as that of the flat surface. At this time, a fixed amount of suction force is required in order to fix the pin and the housing so that the variation in the height direction does not change. On the other hand, the lateral variation is ensured by reducing the variation in the height direction by using the jig for vertically standing the pin and the method described above.

〔Example〕

An embodiment of the present invention will be described below with reference to FIG. FIG. 1 shows an assembling method of pins used for a probe head. Positioning glass substrate 2, which has through holes 3 and 37 formed by photo processing in order to stand many permalloy pins 1 vertically
24 and a glass substrate 25 for a spacer are used. Further, the glass substrate 18 having the flat surface 19 against which the tip portion 20 of the permalloy pin 1 is pressed is arranged below the glass substrate 24. Further, on the upper side of the glass substrate 2, a glass substrate 26 for stopping the flow of the epoxy resin 4 used for fixing the permalloy pin 1 and the alignment glass substrate 2 is arranged. Through holes 36 provided around the glass substrates 2, 18, 24, 25, 26
Are formed so that their central axes are equal to each other, and a bolt 27 is inserted therein. Glass substrate 2,18,24,2 mentioned above
The 5,26 bolts 27 and nuts 28 are fixed after the Vermalloy pin 1 is inserted. When inserting the pin, the diameter of the through hole 36 is made larger than the diameter of the bolt 27 so that the glass substrates 2, 18, 24, 25, 26 described above can be moved laterally with the bolt 27 inserted. Under the glass substrate 18, permalloy pin 1
A magnet plate 21 and a soft magnetic body 22 for magnetically attracting are disposed.

The pin assembling method is first the glass substrate 18, 24, 25,
2, 26 through the two bolts 27-1, 27-2 in order through holes 36-1, 36-
Stack 2 by penetrating 2. At this time, in order to more accurately align the central axes of the through holes 3 and 37 provided in the glass substrates 2 and 24,
In addition to the bolt 27 and the through hole 36 described above, a positioning pin and a positioning through hole (not shown) may be provided.

Next, insert the Vermalloy pin 1 into the through holes 3 and 37, and
20 is in contact with the flat surface 19 of the glass substrate 18.

Next, a magnetic circuit composed of the magnet plate 21 and the soft magnetic material 22 is arranged below the glass substrate 18, and a magnetic field is applied to the permalloy pin 1. At this time, an electromagnet may be arranged instead of the magnet plate 21.

Fig. 2 shows the distribution of lines of magnetic force applied to the permalloy pin 1.
31 is shown. Since the magnetic lines of force are denser at the tip portion 20 of the permalloy pin 1 than at the other end portion 33, the longitudinal direction of the permalloy pin 1 is taken to be the Z axis 30 and the tip portion 20 and the end portion 33 are in the vicinity.
If the magnetic flux densities B at Z ₁ (32) and Z ₂ (34) are set as B ₁ and B ₂ , the magnetic attraction force f ₁ (23) acting on the permalloy pin 1
Acts in the negative direction of the Z axis 30. At this time, f ₁ is given by the following equation.

FIG. 3 shows the Z axis 30 when the permalloy pin 1 is arranged.
The magnetic flux density distribution B (x ₁ , y ₁ , Z) 35 with respect to the direction is shown. By increasing the length of the permalloy pin 1 (≈Z ₂ −Z ₁ ) and bringing the tip 20 closer to the magnet plate 21, the magnetic attraction force f ₁ (2
3) can be increased.

By the magnetic attraction force f ₁ (23) described above, the tip portions 20 of the plurality of permalloy pins 1 are independently formed on the flat surface of the glass substrate 18.
Can be pressed against 19.

Next, in a magnetically attracted state, the epoxy resin 4 is applied to the glass substrates 2 and 26 and the permalloy pin 1 to fix the glass substrate 2 and the permalloy pin 1. At this time, the adhesive force f acting on the permalloy pin 1 by the epoxy resin 4
_By applying a magnetic attraction force f ₁ (23) that is sufficiently larger than ₂ (29), the pin tip portion 20 is held on the flat surface 19. As a result, the height direction position accuracy of the bottle tip 20 is
Can be made to the same level as the flat surface 19 provided on the glass substrate 18 and 1μ
m can be easily realized. On the other hand, the lateral position accuracy is also
Since the position accuracy in the height direction can be reduced, the positioning glass substrates 2 and 24 can greatly improve the accuracy.

FIG. 4 shows the structure of the probe head 6 formed by the above-mentioned pin assembling method. Insert the permalloy pin 1 into the tapered through hole 3 provided in the glass substrate 2, and use the epoxy resin 4 to secure the positional accuracy of the pin tip 20 between the permalloy pin 1 and the glass substrate 2 described above. After fixing, remove the pin assembly jig, and then
The surface on the side opposite to 20 was polished including epoxy resin 4 to form a flat surface, and then Ni / Au was applied to the polished surface of permalloy pin 1.
The probe head 6 is formed by applying the plating 5. As the fixing resin, a polyimide resin may be used from the solder connection with the Ni / Au plating 5.

The probe head 6 described above can realize the minimum pitch of the permalloy pins 1 of about 100 μm and the number of pins of several thousand by using the glass substrates 2 and 24 for alignment by photo processing. At this time, in order to secure characteristics such as inter-pin crosstalk noise, delay time, and waveform rounding for high frequency signals, the pin length l and the pin diameter D are set with respect to the pitch P between the pins. Are satisfied.

Further, the surface of the permalloy pin 1 may be plated with Ni / Au or Ni / Rh. This is to reduce the self-inductance and loss of the permalloy pin 1 by positively utilizing the skin effect on the high frequency signal.

FIG. 5 shows a probe head 6 in which the above-mentioned multiple pins are formed on a solder ball (electrode pad) 10 arranged on one chip 9 area of a semiconductor wafer 8, a pitch-increasing multilayer thick film substrate 11, and a pitch-increasing pitch. 1 shows a cross-sectional structure of a semiconductor inspection device showing a state in which a probe card (6 + 11 + 12) composed of a multilayer printed circuit board 12 is electrically and mechanically contacted by a pin 1 provided on a probe head 6. The probe card (6 + 11 + 12) includes a coaxial connector 15 for exchanging signals with a tester unit (not shown), and an electrode pattern 17 provided on the surface of the pitch-increasing multilayer printed board 12.
A supporting substrate 14 on which a coaxial spring contact pin 13 for electrically and mechanically contacting is arranged, and a positioning substrate 16
Are electrically connected via. In this case, the probe card (6 + 11 + 12) is attached and detached by opening and closing the support substrate 14. Also, probe card (6 + 11 + 12)
When the pin 1 is worn or deformed, the probe head 6 is separated at the contact portion with the pitch-increasing multilayer thick film substrate 11 and replaced.

〔The invention's effect〕

According to the present invention, the pins can be independently pressed against the substrate having the flat surface by magnetic attraction, so that the variation in the height direction of the pin tip portion can be set to the same level as that of the flat surface, and highly accurate. It has the effect of realizing pinning.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a probe head assembling method according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a magnetic circuit that generates a magnetic attraction force when assembling the probe head, and FIG. 3 is a probe head. FIG. 4 is a characteristic view of a magnetic flux density distribution B (Z) that generates a magnetic attraction force during assembly, FIG. 4 is a cross-sectional view of a probe head having a magnetic pin according to another embodiment of the present invention, and FIG. It is a sectional view of a semiconductor inspection device using the invention. 1 ... Permalloy pin 2 ... Glass substrate 3 ... Through hole 4 ... Epoxy resin 6 ... Probe head 19 ... Flat surface 21 ... Magnet plate 23 ... Magnetic attraction force

Front page continuation (72) Inventor Kenji Tobita, 2326 Imai, Ome, Tokyo Metropolitan area, Hitachi Device Development Center (72) Inventor, Shoichiro Harada, 2326 Imai, Ome city, Tokyo Hitachi, Ltd. Device Development Center

Claims (3)

[Claims] 1. An elongated bottle is inserted into each of the through holes of a substrate provided with a plurality of through holes, the pin is magnetically attracted through a flat surface, and the end portion of the pin is attached to the flat surface. A method of assembling a pin, comprising pressing the tip of the pin against the flat surface and then adhering the pin to the substrate. 2. The pin assembling method according to claim 1, wherein the pin is made of permalloy. 3. An elongated test probe for transmitting an electric signal by contacting an electrode pad of a component to be inspected is inserted into each of the through holes of a substrate having a plurality of through holes, and the test is performed through a flat surface. After magnetically attracting the probe, pressing the tip of the test probe against the flat surface, pressing the tip of the test probe against the flat surface, and then adhering the test probe to the substrate. Characteristic test probe assembly method.