JPH0828413B2 - Semiconductor substrate carrier - Google Patents
Semiconductor substrate carrierInfo
- Publication number
- JPH0828413B2 JPH0828413B2 JP61179691A JP17969186A JPH0828413B2 JP H0828413 B2 JPH0828413 B2 JP H0828413B2 JP 61179691 A JP61179691 A JP 61179691A JP 17969186 A JP17969186 A JP 17969186A JP H0828413 B2 JPH0828413 B2 JP H0828413B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- power transmission
- same
- crankshafts
- transmission device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 17
- 239000000758 substrate Substances 0.000 title claims description 15
- 230000005540 biological transmission Effects 0.000 claims description 8
- 239000000428 dust Substances 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 238000011109 contamination Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Reciprocating Conveyors (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、半導体基板の製造工程および半導体装置の
製造工程において使用し、半導体基板または半導体基板
収納箱を半導体基板の処理装置に供給するための半導体
基板搬送装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention is used in a semiconductor substrate manufacturing process and a semiconductor device manufacturing process to supply a semiconductor substrate or a semiconductor substrate storage box to a semiconductor substrate processing apparatus. The present invention relates to a semiconductor substrate carrier.
従来、この種の搬送装置は、ベルトを半導体基板の搬
送方向に移送させるか（ベルト式）、または多数のロー
ラーを搬送方向に回転させる（ローラー式）構造となっ
ている。Conventionally, this type of transport device has a structure in which a belt is transported in the transport direction of a semiconductor substrate (belt type) or a large number of rollers are rotated in the transport direction (roller type).
このような従来の半導体基板搬送装置は、ベルト式の
場合はベルトを支持するための多数のローラーを必要と
し、またローラー式の場合は、多数配置したローラーの
各々に駆動機構を必要とするため、これらの多数の可動
部分からの発塵があって半導体基板を汚染するという欠
点があり、また駆動系が複雑であるという欠点もある。Such a conventional semiconductor substrate transfer apparatus requires a large number of rollers for supporting the belt in the case of the belt type, and requires a driving mechanism for each of the arranged rollers in the case of the roller type. However, there is a drawback that the semiconductor substrate is contaminated due to the generation of dust from these many movable parts, and there is also a drawback that the driving system is complicated.
本発明が解決しようとする問題点、換言すれば本発明
の目的は、上述のような従来の半導体基板搬送装置の欠
点を除去し、搬送機構の構成を簡素化してコストが安
く、かつ可動部分の発塵による被搬送物の汚染を低減し
て、製品である半導体装置の品質を高めることのできる
半導体基板搬送装置を提供することにある。The problem to be solved by the present invention, in other words, the object of the present invention is to eliminate the drawbacks of the conventional semiconductor substrate transfer apparatus as described above, simplify the structure of the transfer mechanism, reduce the cost, and move the movable part. It is an object of the present invention to provide a semiconductor substrate transfer apparatus capable of reducing the contamination of an object to be transferred due to dust generation and improving the quality of a semiconductor device as a product.
本発明の半導体基板搬送装置は、駆動源と、前記駆動
源によって駆動される動力伝達装置と、前記動力伝達装
置の両端に配設されて同一方向・同一速度で回転し同一
位相にある２個以上を１組として等間隔の位相を保つ３
組以上の同一形状のクランク部を有する２個のクランク
シャフトと、前記２個のクランクシャフトの対応する前
記クランク部に架設された支持棒とを備えて構成され
る。The semiconductor substrate transfer apparatus of the present invention includes a drive source, a power transmission device driven by the drive source, and two power transmission devices disposed at both ends of the power transmission device and rotating in the same direction and at the same speed and in the same phase. Keep the phases at equal intervals with the above as one set 3
It is configured to include two crankshafts having two or more sets of crank parts of the same shape, and a support rod installed on the corresponding crank parts of the two crankshafts.
次に、本発明の実施例について図面を参照して詳細に
説明する。Next, embodiments of the present invention will be described in detail with reference to the drawings.
第１図は本発明の一実施例を示す斜視図である。図に
おいて、駆動源２および動力伝達装置３によって、同一
形状でかつクランク部の方向が一致した２個のクランク
シャフト４および５（動力伝達装置３の両端に取付けら
れている）は同一の回転速度で矢印ＢおよびＢ′方向へ
回転する。FIG. 1 is a perspective view showing an embodiment of the present invention. In the figure, two crankshafts 4 and 5 (mounted on both ends of the power transmission device 3) having the same shape and having the same crank direction by the drive source 2 and the power transmission device 3 have the same rotation speed. To rotate in the directions of arrows B and B '.
クランクシャフト４および５は、それぞれ３組のクラ
ンク部4a・4b・4cおよび5a・5b・5cを有し、それらの位
相は互に120°ずつずれている。クランクシャフト４と
クランクシャフト５の対応するクランク部の位相は一致
している。The crankshafts 4 and 5 each have three sets of crank portions 4a, 4b, 4c and 5a, 5b, 5c, which are 120 ° out of phase with each other. The phases of the corresponding crank parts of the crankshaft 4 and the crankshaft 5 are the same.
クランクシャフト４とクランクシャフト５との対応す
るクランク部4a・4b・4cおよび5a・5b・5cの間には、ク
ランクシャフトの回転に追随するように連結した３組
（各組２本ずつ）の被搬送物支持棒６−ａ−１・６−ａ
−２および６−ｂ−１・６−ｂ−２および６−ｃ−１・
６−ｃ−２が装架されている。従ってこれらはクランク
シャフト４・５の回転によって互に120°ずつ位相の異
なる上下動作を伴う前後動作を行い、半導体基板または
半導体基板収納箱等の被搬送物１を最上位にある支持棒
６−ａ−１・６−ａ−２から次に最上位にくる支持棒６
−ｂ−１・６−ｂ−２へ、更に支持棒６−ｂ−１・６−
ｂ−２から支持棒６−ｃ−１・６−ｃ−２へと順次受け
渡しながら矢印Ａ方向へ搬送する。Between the corresponding crank parts 4a, 4b, 4c and 5a, 5b, 5c of the crankshaft 4 and the crankshaft 5, three sets (two for each set) are connected so as to follow the rotation of the crankshaft. Transported object support rod 6-a-1 ・ 6-a
-2 and 6-b-1, 6-b-2 and 6-c-1.
6-c-2 is mounted. Therefore, these carry out the forward and backward movements accompanied by the vertical movements in which the phases are different from each other by 120 ° by the rotations of the crankshafts 4 and 5, and the carrier 1 such as the semiconductor substrate or the semiconductor substrate storage box is placed at the uppermost support rod 6- Support bar 6 which comes to the next highest position from a-1 ・ 6-a-2
-B-1, 6-b-2, further support rod 6-b-1, 6-
It is conveyed in the direction of arrow A while sequentially transferring from b-2 to the support rods 6-c-1 and 6-c-2.
以上説明したように本発明は、複数組の支持棒が異な
る位相で円運動を行い最上位にある支持棒で被搬送物を
担持しながら前進させ、位相の異なる支持棒間で順次に
被搬送物を受け渡しながら所定の方向に送ることができ
るため、搬送装置の構造を簡単にできるという効果があ
り、また可動部が極めて少ないことから発塵による被搬
送物への汚染を低減できるという効果もある。As described above, according to the present invention, a plurality of sets of support rods make circular motions in different phases, and the support rods at the uppermost positions move forward while carrying the transported object. Since an object can be transferred in a predetermined direction while being transferred, it has an effect that the structure of the transfer device can be simplified, and since the number of movable parts is extremely small, contamination of an object to be transferred due to dust generation can be reduced. is there.
第１図は本発明の一実施例を示す斜視図である。 １……被搬送物、２……駆動源、３……動力伝達装置、
４・５……クランクシャフト、６−ａ−１・６−ａ−２
・６−ｂ−１・６−ｂ−２・６−ｃ−１・６−ｃ−２…
…被搬送物支持棒。FIG. 1 is a perspective view showing an embodiment of the present invention. 1 ... Transported object, 2 ... Drive source, 3 ... Power transmission device,
4.5 ... Crankshaft, 6-a-1, 6-a-2
・ 6-b-1, 6-b-2, 6-c-1, 6-c-2 ...
... Supporting bar for transported objects.
Claims (1)
動力伝達装置と、前記動力伝達装置の両端に配設されて
同一方向・同一速度で回転し同一位相にある２個以上を
１組として等間隔の位相を保つ３組以上の同一形状のク
ランク部を有する２個のクランクシャフトと、前記２個
のクランクシャフトの対応する前記クランク部に架設さ
れた支持棒とを備えることを特徴とする半導体基板搬送
装置。1. A drive source, a power transmission device driven by the drive source, and two or more sets arranged at both ends of the power transmission device and rotating in the same direction at the same speed and in the same phase. And two crankshafts having three or more sets of crank parts of the same shape that maintain the phases at equal intervals, and a support rod installed on the corresponding crank parts of the two crankshafts. Semiconductor substrate transfer device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61179691A JPH0828413B2 (en) | 1986-07-29 | 1986-07-29 | Semiconductor substrate carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61179691A JPH0828413B2 (en) | 1986-07-29 | 1986-07-29 | Semiconductor substrate carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6334944A JPS6334944A (en) | 1988-02-15 |
| JPH0828413B2 true JPH0828413B2 (en) | 1996-03-21 |
Family
ID=16070185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61179691A Expired - Lifetime JPH0828413B2 (en) | 1986-07-29 | 1986-07-29 | Semiconductor substrate carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0828413B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5551900B2 (en) * | 2009-07-28 | 2014-07-16 | 有限会社西岡設計事務所 | Transport device |
-
1986
- 1986-07-29 JP JP61179691A patent/JPH0828413B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6334944A (en) | 1988-02-15 |
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