JPH0828434B2 - Trays for integrated circuits or large scale integrated circuits - Google Patents
Trays for integrated circuits or large scale integrated circuitsInfo
- Publication number
- JPH0828434B2 JPH0828434B2 JP62193174A JP19317487A JPH0828434B2 JP H0828434 B2 JPH0828434 B2 JP H0828434B2 JP 62193174 A JP62193174 A JP 62193174A JP 19317487 A JP19317487 A JP 19317487A JP H0828434 B2 JPH0828434 B2 JP H0828434B2
- Authority
- JP
- Japan
- Prior art keywords
- parts
- weight
- tray
- integrated circuits
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000005011 phenolic resin Substances 0.000 claims description 13
- 239000005062 Polybutadiene Substances 0.000 claims description 8
- 229920002857 polybutadiene Polymers 0.000 claims description 8
- 239000011159 matrix material Substances 0.000 claims description 7
- 239000011256 inorganic filler Substances 0.000 claims description 5
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 8
- 229920001568 phenolic resin Polymers 0.000 description 7
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 6
- 229920000459 Nitrile rubber Polymers 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 238000012858 packaging process Methods 0.000 description 4
- 239000006229 carbon black Substances 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 244000043261 Hevea brasiliensis Species 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920003052 natural elastomer Polymers 0.000 description 2
- 229920001194 natural rubber Polymers 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 244000226021 Anacardium occidentale Species 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 235000020226 cashew nut Nutrition 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） この発明は、集積回路（IC）若しくは大規模集積回路
（LSI）の製造工程、及びその後の梱包工程において使
用するトレーに関する。Description: TECHNICAL FIELD The present invention relates to a tray used in a manufacturing process of an integrated circuit (IC) or a large scale integrated circuit (LSI) and a subsequent packing process.
（従来の技術） 集積回路若しくは大規模集積回路にあっては、その製
造時の最終段階における封止剤の加熱、硬化の際に製品
を保持するため、及びその工程に続く製品梱包の際に製
品を保持するために、製品収容凹部を形成した板状のト
レーが用いられている。(Prior Art) In the case of an integrated circuit or a large-scale integrated circuit, in order to hold the product at the time of heating and curing the encapsulant at the final stage of its manufacture, and at the time of product packaging following the process. A plate-shaped tray having a product accommodating recess is used for holding the product.
従来そのトレーには、ステンレスやアルミ製のもの
と、導電性ポリスチレンあるいはポリプロピレン製のも
のとの二種類あり、前者は封止剤の加熱、硬化工程で、
後者は製品梱包工程で用いられている。このように区別
して用いられる理由は、封止剤の加熱、硬化工程では高
い耐熱寸法安定性と良好な導電性が要求されるのに対し
て、製品梱包工程では良好な導電性と軽量性、更には安
価なことが要求されるからである。Conventionally, there are two types of trays, one made of stainless steel or aluminum and the other made of conductive polystyrene or polypropylene. The former is the heating and curing process of the sealant,
The latter is used in the product packaging process. The reason why they are used separately in this way is that high heat resistance dimensional stability and good conductivity are required in the heating and curing process of the encapsulant, while good conductivity and light weight in the product packaging process, Further, it is required to be inexpensive.
（発明が解決しようとする問題点） 従って集積回路若しくは大規模集積回路の製造工場に
おいては、製造段階と梱包段階との間でロボットにより
製品を一つのトレーから他のトレーに移し替えることが
行なわれている。(Problems to be solved by the invention) Therefore, in a manufacturing plant of an integrated circuit or a large-scale integrated circuit, a product is transferred from one tray to another tray by a robot between a manufacturing stage and a packing stage. Has been.
しかしながら、そのトレーの移し替えの際に操作ミス
を生じ易く、また移し替え作業によりコスト増になる問
題がある。However, there is a problem in that an operation error is likely to occur when the trays are transferred, and the transfer work increases costs.
そこで、製品移し替えの必要のないトレーをこの発明
により提供し、前記問題の解決を図ったのである。Therefore, the present invention provides a tray that does not require product transfer to solve the above problem.
（問題点を解決するための手段） この発明は、製品収容凹部を有する板状のトレーを、
フェノール樹脂90〜99重量部、ブタジエン系ゴム10〜１
重量部からなる有機マットリックス100重量部と、導電
性カーボンブラック10〜60重量部、無機充填剤10〜40重
量部、繊維状物質10〜50重量部、流動性付与剤0.5〜５
重量部から形成し、かつ体積固有抵抗値を105Ωcm以下
としたことを特徴とするものである。(Means for Solving Problems) The present invention provides a plate-shaped tray having a product accommodating recess,
Phenolic resin 90-99 parts by weight, butadiene rubber 10-1
100 parts by weight of organic matrix consisting of 10 parts by weight, conductive carbon black 10 to 60 parts by weight, inorganic filler 10 to 40 parts by weight, fibrous substance 10 to 50 parts by weight, fluidity imparting agent 0.5 to 5
It is characterized by being formed from parts by weight and having a volume resistivity of 10 5 Ωcm or less.
（作用） フェノール樹脂は、熱硬化性樹脂の一つであり、耐熱
性、寸法安定性、品質安定性に優れるものであるが、三
次元架橋樹脂のため本質的に耐衝撃性に劣るので、セル
ロースやガラス繊維の様な有機又は無機の物質を繊維状
又は布状で配合し、併せて必要ならば無機充填剤、木粉
等を配合して強度の維持を図る必要がある。(Function) Phenolic resin is one of the thermosetting resins and is excellent in heat resistance, dimensional stability, and quality stability, but it is essentially inferior in impact resistance because it is a three-dimensional crosslinked resin. It is necessary to mix an organic or inorganic substance such as cellulose or glass fiber in a fibrous or cloth form and, if necessary, an inorganic filler, wood powder or the like to maintain the strength.
しかしながら、フェノール樹脂に大量のカーボンブラ
ックを配合して、105Ωcm以下の体積固有抵抗値からな
る集積回路若しくは大規模集積回路用トレーを得ようと
すると、カーボンブラック自体がフェノール樹脂に対し
て補強性に乏しいため、加熱時の剛性が極端に低下す
る。従って薄肉複雑形状からなる本発明のようなトレー
にあっては、製品成形後の脱型時あるいはロボットによ
るトレーからの集積回路取出し時の衝撃により、トレー
に割れ、欠け等が多発し、通常の配合処方では使用不可
能となる。However, when a large amount of carbon black is mixed with phenol resin to obtain an integrated circuit or large-scale integrated circuit tray with a volume resistivity of 10 5 Ωcm or less, the carbon black itself is reinforced against the phenol resin. Since it is poor in properties, the rigidity during heating is extremely reduced. Therefore, in the case of the tray of the present invention having a thin and complicated shape, the tray is often cracked or chipped due to an impact when the molded product is released from the mold or when the integrated circuit is taken out from the tray by a robot. It cannot be used in combination recipes.
そこで本発明は、導電性と熱時剛性とのバランスを、
カーボンブラックと補強繊維のバランスとしてのみ促え
ていては本発明の目的であるトレーを得ることができな
いと考え、マトリックスであるフェノール樹脂自体に柔
軟性を付与する本発明をなしたのである。即ち、フェノ
ール樹脂90〜99重量部に対してブタジエン系ゴム10〜１
重量部を加えて100重量部の有機マトリックスとしたの
である。Therefore, the present invention balances the conductivity and the rigidity at the time of heat,
Therefore, it is considered that the tray which is the object of the present invention cannot be obtained only by promoting the balance of carbon black and the reinforcing fiber, and the present invention was made to impart flexibility to the phenol resin itself which is the matrix. That is, 90 to 99 parts by weight of phenolic resin and 10 to 1 of butadiene rubber
100 parts by weight of the organic matrix was added by adding the parts by weight.
その有機マトリックスを配合してなる本発明のトレー
は、軽量であるのに加えて集積回路等の製造時に高温に
あっても変形や欠け等を生じる事がなく、またトレー自
体の成形時においても割れ等を生ずる事なく容易に成形
しうるものである。しかも、体積固有抵抗値が105Ωcm
以下であるため、集積回路等の製造工程及びその後の梱
包工程において併用することができる。The tray of the present invention containing the organic matrix is lightweight and does not cause deformation or chipping even at high temperatures during manufacturing of integrated circuits, and also during molding of the tray itself. It can be easily molded without cracking. Moreover, the volume resistivity value is 10 5 Ωcm
Since it is as follows, it can be used together in the manufacturing process of the integrated circuit and the subsequent packaging process.
（実施例） 以下実施例に基づきこの発明を説明する。(Example) This invention is demonstrated based on an Example below.
第１図はこの発明一実施例に係るトレー10の部分斜視
図である。このトレー10には、集積回路等の形状あるい
は集積回路等の製造設備に応じた形状の製品収容凹部12
が所定数形成してある。FIG. 1 is a partial perspective view of a tray 10 according to an embodiment of the present invention. The tray 10 has a product accommodating recess 12 having a shape of an integrated circuit or the like or a shape corresponding to a manufacturing facility of the integrated circuit or the like.
Are formed in a predetermined number.
このようにしてなるトレー10は、ブタジエンゴム（B
R）、ニトリルゴム（NBR）、天然ゴム（NR）、スチレン
−ブタジエンゴム（SBR）等のブタジエン系ゴム10〜１
重量部とフェノール樹脂90〜99重量部からなる有機マト
リックス100重量部に対して、導電性カーボンブラック1
0〜60重量部、補強の為に用いるシリカ又はタルク等の
無機充填剤10〜40重量部、衝撃強度向上を目的とするガ
ラス繊維又はセルロース等の繊維状物質10〜50重量部、
成形性向上の為に用いるシリコンオイル、ワックス、脂
肪酸エステル金属塩等の流動性付与剤0.5〜５重量部を
配合、混練し、粉砕した素材を所定形状に加熱圧縮した
ものである。加熱圧縮時の成形温度は150〜190℃、圧力
は100〜300kg/cm2が好ましい。また上記成形品の柔軟性
の評価については、曲げ歪量による表示が最適である
が、一般のフェノール樹脂では通常0.5〜0.8％である。The tray 10 thus formed is made of butadiene rubber (B
R), nitrile rubber (NBR), natural rubber (NR), styrene-butadiene rubber (SBR) and other butadiene rubbers 10 to 1
To 100 parts by weight of an organic matrix consisting of 90 parts by weight and 90 to 99 parts by weight of phenolic resin, conductive carbon black 1
0 to 60 parts by weight, 10 to 40 parts by weight of an inorganic filler such as silica or talc used for reinforcement, 10 to 50 parts by weight of a fibrous substance such as glass fiber or cellulose for the purpose of improving impact strength,
A material obtained by mixing, kneading, and pulverizing 0.5 to 5 parts by weight of a fluidity-imparting agent such as silicone oil, wax, and fatty acid ester metal salt used for improving moldability is heated and compressed into a predetermined shape. The molding temperature during heat compression is preferably 150 to 190 ° C., and the pressure is preferably 100 to 300 kg / cm 2 . Regarding the evaluation of the flexibility of the above-mentioned molded product, the display by the amount of bending strain is most suitable, but it is usually 0.5 to 0.8% for general phenolic resins.
次にこの発明における２つの配合例及びその配合から
なるトレーの物性について示す。Next, the physical properties of two compounding examples and a tray composed of the compounding in the present invention will be shown.
配合例１ （重量部） ・レゾール系フェノール樹脂 95 （群栄化学（株）製） ・ポリブタジエン（BR） ５ ・アセチレンブラック 50 （電気化学工業（株）製） ・ガラス短繊維 30 ・脂肪酸エステル金属塩 ３ トレーの物性 体積固有抵抗値 ８×102Ωcm 熱変形温度 160℃ 曲げ歪量 1.55％ なおポリブタジエンを用いない100％フェノール樹脂
を用いる場合は曲げ歪量が1.0％であった。Formulation Example 1 (parts by weight) -Resole type phenolic resin 95 (manufactured by Gunei Chemical Co., Ltd.)-Polybutadiene (BR) 5-Acetylene black 50 (manufactured by Denki Kagaku Kogyo) -Short glass fiber 30-Fatty acid ester metal Salt 3 Physical properties of tray Volume resistivity 8 × 10 2 Ωcm Heat distortion temperature 160 ° C Bending strain amount 1.55% When 100% phenol resin without polybutadiene was used, the bending strain amount was 1.0%.
配合例２ （重量部） ・カシュー変形ノボラック型 フェノール樹脂（ヘキサミン含有） 90 （三井東圧化学（株）製） ・ニトリルゴム（NBR） 10 ・ケッチェンブラックEC 25 （アクゾ社製） ・タルク 20 ・パルプ 40 ・シリコンオイル １ トレーの物性 体積固有抵抗値 ５×103Ωcm 熱変形温度 190℃ 曲げ歪量 2.1％ またニトリルゴムを用いない100％フェノール樹脂を
用いる場合は曲げ歪量が1.3％であった。Compounding Example 2 (parts by weight) ・ Cashew modified novolac type phenolic resin (containing hexamine) 90 (manufactured by Mitsui Toatsu Chemicals, Inc.) ・ Nitrile rubber (NBR) 10 ・ Ketjen Black EC 25 (manufactured by Akzo) ・ Talc 20・ Pulp 40 ・ Silicon oil 1 Physical properties of a tray Volume specific resistance value 5 × 10 3 Ωcm Heat distortion temperature 190 ℃ Bending strain amount 2.1% When 100% phenolic resin without nitrile rubber is used, the bending strain amount is 1.3%. there were.
なお、前記２つの配合例においては、圧縮成形を170
℃×５分間行なった後、圧縮を解除した形態で160℃×3
0分の加熱を行なった。It should be noted that compression molding was performed at 170
℃ × 5 minutes, then uncompressed form 160 ℃ × 3
Heating was performed for 0 minutes.
また、この発明のトレーは良好な耐熱性、耐曲げ歪
性、導電性を持つために、表面へのメッキ加工も問題な
く行なえ、配合例１、２いずれのトレーもメッキ付着が
良好であった。Further, since the tray of the present invention has good heat resistance, bending strain resistance and conductivity, it is possible to perform plating on the surface without any problem, and both trays of Formulation Examples 1 and 2 have good plating adhesion. .
（発明の効果） この発明のトレーは、フェノール樹脂とブタジエン系
ゴムの有機マトリックスと導電性カーボンブラック、無
機充填剤等からなるため、耐熱性及び導電性に優れるの
みならず成形性に優れ、かつ軽量である。(Effects of the Invention) The tray of the present invention is composed of an organic matrix of a phenol resin and a butadiene rubber, conductive carbon black, an inorganic filler, etc., and therefore is excellent not only in heat resistance and conductivity but also in moldability, and It is lightweight.
従って集積回路等の製造工程及び製品梱包工程の間
で、トレーを替えることなくこの発明からなる一つのト
レーで製品を保持して連続作業を行なうことができ、工
程の単純化の実現、及び製品移し替え時の作業ミスの防
止が可能になった。Therefore, between the manufacturing process of the integrated circuit and the packaging process of the product, the product can be held by one tray according to the present invention without changing the tray, and the continuous operation can be performed. It has become possible to prevent work mistakes during transfer.
また、作業工程の単純化、作業ミスの防止による製品
価格の低減効果を得ることもできた。In addition, the product cost can be reduced by simplifying the work process and preventing work mistakes.
第１図はこの発明の一実施例に係るトレーの部分斜視図
であり、12は製品収容凹部である。FIG. 1 is a partial perspective view of a tray according to an embodiment of the present invention, and 12 is a product accommodating recess.
Claims (1)
て、フェノール樹脂90〜99重量部、ブタジエン系ゴム10
〜１重量部からなる有機マトリックス100重量部と、導
電性カーボンブラック10〜60重量部、無機充填剤10〜40
重量部、繊維状物質10〜50重量部、流動性付与剤0.5〜
５重量部からなり、かつ体積固有抵抗値が105Ωcm以下
であることを特徴とする、集積回路若しくは大規模集積
回路用トレー。1. A plate-shaped tray having a product accommodating recess, comprising 90 to 99 parts by weight of a phenol resin and 10 parts of a butadiene rubber.
To 100 parts by weight of organic matrix consisting of 1 to 10 parts by weight, conductive carbon black 10 to 60 parts by weight, inorganic filler 10 to 40
Parts by weight, fibrous substance 10 to 50 parts by weight, fluidity imparting agent 0.5 to
A tray for an integrated circuit or a large-scale integrated circuit, comprising 5 parts by weight and having a volume resistivity value of 10 5 Ωcm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62193174A JPH0828434B2 (en) | 1987-07-31 | 1987-07-31 | Trays for integrated circuits or large scale integrated circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62193174A JPH0828434B2 (en) | 1987-07-31 | 1987-07-31 | Trays for integrated circuits or large scale integrated circuits |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6437040A JPS6437040A (en) | 1989-02-07 |
| JPH0828434B2 true JPH0828434B2 (en) | 1996-03-21 |
Family
ID=16303532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62193174A Expired - Lifetime JPH0828434B2 (en) | 1987-07-31 | 1987-07-31 | Trays for integrated circuits or large scale integrated circuits |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0828434B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2500979Y2 (en) * | 1990-03-05 | 1996-06-12 | 住友ベークライト株式会社 | Bag for electronic parts |
-
1987
- 1987-07-31 JP JP62193174A patent/JPH0828434B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6437040A (en) | 1989-02-07 |
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