JPH0828599B2 - Positioning method for semiconductor device - Google Patents
Positioning method for semiconductor deviceInfo
- Publication number
- JPH0828599B2 JPH0828599B2 JP2056843A JP5684390A JPH0828599B2 JP H0828599 B2 JPH0828599 B2 JP H0828599B2 JP 2056843 A JP2056843 A JP 2056843A JP 5684390 A JP5684390 A JP 5684390A JP H0828599 B2 JPH0828599 B2 JP H0828599B2
- Authority
- JP
- Japan
- Prior art keywords
- positioning
- positioning jig
- semiconductor device
- heat sink
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- Die Bonding (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、パワートランジスター等の半導体装置を
還元雰囲気の水素炉に投入して半田付接合する前に、各
部品を位置決め治具の開口部を介して、段積み状に積み
重ねる半導体装置の位置決め方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to the opening of a positioning jig for each component before a semiconductor device such as a power transistor is put into a hydrogen furnace in a reducing atmosphere and soldered. The present invention relates to a method of positioning semiconductor devices that are stacked in a stacked manner via a.
第３図〜第４図は従来の半導体装置の位置決め方法を
示したものであり、図において、１はパレットであり、
1aは部品（後述するアルミヒートシンク２）を位置決め
するための位置決めピン、1bは位置決め治具３をセット
するための位置決めピン、1cはパレット１の重量を軽減
するための開口部である。２はアルミ（Al）ヒートシン
クであり、2aは上記パレットの位置決めピン1aにセット
するための取付穴、2bは後述する部品が積み重ねられる
部品セット位置を示す。３は各部品を位置決めするため
の位置決め治具であり、3aは後述する部品がその中に積
み重ねられる開口部、3bは上記パレットの位置決めピン
1bに対峙する取付穴を示す。４は半田箔、５はメタライ
ズ基板、６は銅ヒートシンク、6aはこの銅ヒートシンク
６の凹部、７は半田箔、８はパワートランジスタチッ
プ、９は半田付接合を良好に行うためのオモリである。
第５図は半田付接合を行うための水素炉を示した斜視図
であり、11は還元炉である水素炉、11aはパレット１上
に仮置きされた部品２〜９を上記水素炉11無いに投入し
搬送するための金網ベルトである。3 to 4 show a conventional method of positioning a semiconductor device, in which 1 is a pallet,
1a is a positioning pin for positioning a component (aluminum heat sink 2 described later), 1b is a positioning pin for setting the positioning jig 3, and 1c is an opening for reducing the weight of the pallet 1. Reference numeral 2 is an aluminum (Al) heat sink, 2a is a mounting hole for setting the positioning pin 1a of the pallet, and 2b is a component setting position where components described later are stacked. Reference numeral 3 is a positioning jig for positioning each component, 3a is an opening for stacking components described later, and 3b is a positioning pin for the pallet.
The mounting hole facing 1b is shown. Reference numeral 4 is a solder foil, 5 is a metallized substrate, 6 is a copper heat sink, 6a is a concave portion of the copper heat sink 6, 7 is a solder foil, 8 is a power transistor chip, and 9 is a weight for good soldering and bonding.
FIG. 5 is a perspective view showing a hydrogen furnace for performing soldering and joining, 11 is a hydrogen furnace which is a reducing furnace, 11a is parts 2 to 9 which are temporarily placed on the pallet 1, and the hydrogen furnace 11 is not provided. It is a wire mesh belt for loading and transporting to.
次に、半導体装置等部品の仮置き順序について説明す
る。ここでは、部品を仮置きするための自動機は図示し
ないが、まず最初に、パレット１が搬送されて来て、所
定の位置で位置決めされ、次にアルミヒートシンク２が
その取付穴2aを介して上記パレットの位置決めピン1aに
セットされる。更に、位置決め治具３が取付穴3bを介し
て位置ピン1bにセットされる。その後、位置決め治具３
の開口部3aの箇所に半田箔４、メタライズ基板５、半田
箔４、銅ヒートシンク６、半田箔７、パワートランジス
タチップ８、オモリ９が順番に積み重ねられて仮置きが
完了する。Next, the order of temporary placement of components such as semiconductor devices will be described. Although an automatic machine for temporarily placing parts is not shown here, the pallet 1 is first conveyed and positioned at a predetermined position, and then the aluminum heat sink 2 is inserted through its mounting hole 2a. It is set on the positioning pin 1a of the pallet. Further, the positioning jig 3 is set on the position pin 1b through the mounting hole 3b. After that, the positioning jig 3
The solder foil 4, the metallized substrate 5, the solder foil 4, the copper heat sink 6, the solder foil 7, the power transistor chip 8, and the weight 9 are sequentially stacked at the opening 3a, and the temporary placement is completed.
そして、各開口部3aに仮置きが完了すれば、パレット
１を還元炉である水素炉11に投入し、そこで半田付接合
を行うのである。Then, when the temporary placement is completed in each opening 3a, the pallet 1 is put into the hydrogen furnace 11 which is a reducing furnace, and the soldering joining is performed therein.
従来の半導体装置の位置決め治具３による位置決め方
法は以上のようであり、開口部3aは、その開口寸法が比
較的幅広の半田箔4,メタライズ基板５を通すことができ
るように形成されている。そのため、自動機（図示せ
ず）で部品を積み重ねる場合に、微小な振動又は衝撃等
により、半田箔4,メタライズ基板５よりも小面積の銅ヒ
ートシンク６が、第６図に示すように、仮置きされる部
品2,4〜９のセンターよりδ量だけずれ、特に、パワー
トランジスター８が銅ヒートシンク６の凹部6aに正確に
仮置きできない等の問題点が生じていた。The conventional positioning method by the positioning jig 3 of the semiconductor device is as described above, and the opening 3a is formed so that the solder foil 4 and the metallized substrate 5 having a relatively wide opening size can be passed through. . Therefore, when components are stacked by an automatic machine (not shown), a copper heat sink 6 having a smaller area than the solder foil 4 and the metallized substrate 5 is temporarily moved by a slight vibration or impact as shown in FIG. There has been a problem that the components 2, 4 to 9 to be placed are deviated from the center by δ, and in particular, the power transistor 8 cannot be accurately temporarily placed in the recess 6a of the copper heat sink 6.
この発明は上記のような問題点を解消するためになさ
れたものであり、半導体装置等の部品の仮置き・積み重
ねの位置決めを正確におこない、ひいては部品の半田付
け接合が正確に行われることを目的とする。The present invention has been made to solve the above-mentioned problems, and it is possible to accurately perform temporary placement and stacking positioning of components such as semiconductor devices, and thus to perform soldering and joining of components accurately. To aim.
この発明に係る半導体装置の位置決め方法は、半導体
素子を放熱板，メタライズ基板及び半田箔等の部品と共
に積み重ね、還元雰囲気の水素炉に投入する場合、部品
の積み重ねを正確に行うために位置決め治具を使用する
が、この位置決め治具の使用に際して、位置決め治具の
開口部の寸法を、上記部品のうち最も基準となる部品の
外形サイズに合わせ、その基準となる部品を積み重ねる
直前に位置決め治具をセットし、その後基準部品等を積
み重ねていくものである。A semiconductor device positioning method according to the present invention is a positioning jig for accurately stacking semiconductor elements when the semiconductor elements are stacked together with components such as a heat dissipation plate, a metallized substrate, and a solder foil and put into a hydrogen furnace in a reducing atmosphere. When using this positioning jig, adjust the size of the opening of the positioning jig to the outer size of the most standard part among the above parts, and immediately before stacking the standard parts. Is set, and then standard parts are stacked.
この発明の半導体装置の位置決め方法によれば、位置
決め治具の開口部の寸法を基準となる部品の外形寸法に
合わせて狭小化するとともに、この位置決め治具の使用
順序を最適な順番とすることにより、部品の位置決めが
正確に行え、ひいては還元雰囲気の水素炉を通しての半
田付接合が正確に行われる。According to the semiconductor device positioning method of the present invention, the size of the opening of the positioning jig is narrowed in accordance with the external dimensions of the reference component, and the positioning jig is used in the optimum order. As a result, the positioning of the components can be performed accurately, and the soldering joining can be performed accurately through the hydrogen furnace in the reducing atmosphere.
以下、この発明の一実施例を図について説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第１図は本実施例に係る半導体装置等の部品の積み重ね
順序を示した斜視図、第２図は第１図において位置決め
治具がセットされた後の部品の積み重ね順序を示した詳
細斜視図である。FIG. 1 is a perspective view showing a stacking order of parts such as a semiconductor device according to this embodiment, and FIG. 2 is a detailed perspective view showing a stacking order of parts after a positioning jig is set in FIG. Is.
図において、30は位置決め治具であり、その開口部30
a、パワートランジスタ８が銅ヒートシンク６の凹部6a
に正確に位置決めされるように、銅ヒートシンク６の外
形寸法に適合した寸法に形成（狭小化）されている。な
お、その他の部品は第３図及び第４図に示した従来の構
成部品と同様である。In the figure, 30 is a positioning jig, and its opening 30
a, the power transistor 8 is the concave portion 6a of the copper heat sink 6.
The copper heat sink 6 is formed (narrowed) in size to fit the outer dimensions of the copper heat sink 6 so as to be accurately positioned. The other components are the same as the conventional components shown in FIGS. 3 and 4.
本実施例の部品及び位置決め治具の仮置き順序は概ね
従来と同様であるが、位置決め治具30をセットする順番
を従来より遅らせる。即ち、パレット１上に順々にアル
ミヒートシンク2,半田箔4,メタライズ基板5,半田箔４を
仮置きした後に、位置決め治具30をセットする。そして
その後、位置決め治具の開口部30a内に銅ヒートシンク
6,半田箔7,パワートランジスター8,オモリ９を順番に積
み重ねて、部品の仮り置きを完了する。そして最後に、
部品を仮り置きしたパレット１を、還元炉である水素炉
11に投入することにより半田付接合を行う。The temporary placement order of the components and the positioning jig of this embodiment is almost the same as the conventional one, but the order of setting the positioning jig 30 is delayed. That is, after the aluminum heat sink 2, the solder foil 4, the metallized substrate 5, and the solder foil 4 are temporarily placed on the pallet 1 in order, the positioning jig 30 is set. After that, the copper heat sink is placed in the opening 30a of the positioning jig.
6, the solder foil 7, the power transistor 8, and the weight 9 are sequentially stacked to complete the temporary placement of the parts. And finally,
The pallet 1 in which parts are temporarily placed is used as a hydrogen furnace that is a reduction furnace.
Solder and join by putting into 11.
上記実施例によれば、位置決め治具30をセットする順番
を遅らせると同時に、その開口部30aの寸法を銅ヒート
シンク６の外形に対応した寸法にしたので、各部品（特
にパワートランジスター８）の積み重ねが正確に行え、
従来のように部品の積み重ね後の手直しが皆無となり、
後工程の水素炉11に支障なく投入することが出来る。ま
た、水素炉11の中を搬送させるための金属製コンベア11
aの多少の振動に対しても強く部品がズレることもなく
なり、良好な半田付接合が行える。According to the above-mentioned embodiment, since the order of setting the positioning jig 30 is delayed and the size of the opening 30a is set to the size corresponding to the outer shape of the copper heat sink 6, the stacking of each component (particularly the power transistor 8) is performed. Can be done accurately,
There is no need to rework after stacking the parts as in the past,
It can be charged into the hydrogen furnace 11 in the subsequent process without any trouble. In addition, a metal conveyor 11 for transporting inside the hydrogen furnace 11
It is strong against the slight vibration of a and the parts do not shift, so good soldering can be performed.
以上のように、この発明によれば位置決め治具をセッ
トする順番を遅らせると同時に、位置決め治具の開口部
の寸法を基準となる部品の外形サイズに合わせたので、
各部品の積み重ねが正確に行え、多少の振動に対しても
部品がズレることもなくなり、良好な半田付接合が行え
る効果がある。As described above, according to the present invention, the order of setting the positioning jig is delayed, and at the same time, the dimension of the opening of the positioning jig is adjusted to the outer size of the reference component.
The components can be stacked accurately, the components will not be displaced even with some vibration, and good soldering can be performed.
第１図は本発明の一実施例の半導体装置の位置決め方法
による各部品の積み重ねの順序を示した斜視図、第２図
は第１図の位置決め治具をセットした後の部品の積み重
ね順序を示した詳細断面図、第３図は従来の半導体装置
の位置決め方法を示した斜視図、第４図は第３図の位置
決め治具をセットした後の部品の積み重ね順序を示した
詳細断面図、第５図は半田付接合を行うための水素炉を
示した斜視図、第６図は従来の方法により部品の積み重
ねを行った場合に銅ヒートシンクがズレた状態を示した
詳細断面図である。 図中、１はパレット、２はアルミヒートシンク、４は半
田箔、５はメタライズ基板、６は銅ヒートシンク、6aは
銅ヒートシンク６の凹部、７は半田箔、８はパワートラ
ンジスタチップ、９はオモリ、11は水素炉、11aは金
網、30は位置決め治具、30aは部品がその中に積み重ね
られる開口部である。なお、図中同一符号は同一又は相
当部分を示す。FIG. 1 is a perspective view showing a stacking order of each component by a semiconductor device positioning method according to an embodiment of the present invention, and FIG. 2 shows a stacking order of components after the positioning jig shown in FIG. 1 is set. The detailed sectional view shown in FIG. 3, FIG. 3 is a perspective view showing a conventional method for positioning a semiconductor device, and FIG. 4 is a detailed sectional view showing the stacking order of parts after setting the positioning jig shown in FIG. FIG. 5 is a perspective view showing a hydrogen furnace for soldering, and FIG. 6 is a detailed sectional view showing a state where copper heat sinks are displaced when components are stacked by a conventional method. In the figure, 1 is a pallet, 2 is an aluminum heat sink, 4 is a solder foil, 5 is a metallized substrate, 6 is a copper heat sink, 6a is a recess of the copper heat sink 6, 7 is a solder foil, 8 is a power transistor chip, 9 is a weight, Reference numeral 11 is a hydrogen furnace, 11a is a wire mesh, 30 is a positioning jig, and 30a is an opening through which components are stacked. The same reference numerals in the drawings indicate the same or corresponding parts.
Claims (1)
半田箔等の部品と共に、位置決め治具に設けた開口部を
利用して、パレット上に順番に積み重ねる半導体装置の
位置決め方法において、 上記位置決め治具の開口部を、上記部品のうち最も基準
となる部品の外形サイズに合わせ、その基準となる部品
を積み重ねる直前に位置決め治具をセットした後、上記
基準部品等を積み重ねていくことを特徴とする半導体装
置の位置決め方法。1. A positioning method for a semiconductor device, wherein semiconductor elements are stacked on a pallet in order by utilizing an opening provided in a positioning jig together with components such as a heat sink, a metallized substrate and a solder foil. It is characterized in that the opening of the tool is adjusted to the outer size of the most standard part of the above parts, the positioning jig is set immediately before the standard parts are stacked, and then the standard parts are stacked. Positioning method for semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2056843A JPH0828599B2 (en) | 1990-03-07 | 1990-03-07 | Positioning method for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2056843A JPH0828599B2 (en) | 1990-03-07 | 1990-03-07 | Positioning method for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03257899A JPH03257899A (en) | 1991-11-18 |
| JPH0828599B2 true JPH0828599B2 (en) | 1996-03-21 |
Family
ID=13038691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2056843A Expired - Lifetime JPH0828599B2 (en) | 1990-03-07 | 1990-03-07 | Positioning method for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0828599B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4770379B2 (en) * | 2005-10-13 | 2011-09-14 | 富士電機株式会社 | Metal member joining method and assembly jig thereof |
| JP5116615B2 (en) * | 2008-09-02 | 2013-01-09 | 新電元工業株式会社 | Positioning jig unit and soldering method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6242491A (en) * | 1985-08-19 | 1987-02-24 | 沖電気工業株式会社 | Positioning of flip chip |
| JPS6388835A (en) * | 1986-10-02 | 1988-04-19 | Fujitsu Ltd | Package for flip chip |
-
1990
- 1990-03-07 JP JP2056843A patent/JPH0828599B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03257899A (en) | 1991-11-18 |
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