JPH08288181A - Surface mount electronic component and mounting method thereof - Google Patents

Abstract

PURPOSE: To prevent one terminal of horizontal type surface mount type electronic parts from being lifted after mounting by a simple structure modification. CONSTITUTION: A lead terminal housing groove 12B for housing one portion of a lead terminal 11A led from an electrolytic capacitor body 11 is formed in a resin case 12 for insulating heat in a surface mount type electronic part, for example an electrolytic capacitor and one portion of the lead terminal 11A, namely an arrow part, is soldered to a conductor on a printed circuit board while one portion of a case, namely a gear-lock piece 12D is held.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type electronic component having a structure suitable for reflow soldering and a mounting method thereof.

[0002]

2. Description of the Related Art Surface mount type electronic parts, for example, surface mount type electrolytic capacitors are roughly classified into vertical type and horizontal type.

FIG. 4 is an explanatory view of a main part of a vertical type surface mount type electrolytic capacitor. FIG.
(B) shows a main part inclined surface showing a state in which the main body and the heat insulating resin spacer are coupled, and (C) shows a main part cut side surface showing a state mounted on a printed circuit board.

In the figure, 1 is an electrolytic capacitor body, and 1 is
A is a lead terminal, 2 is a heat insulating resin spacer, 2A is a lead terminal insertion hole formed in the heat insulating resin spacer, 3 is a printed circuit board, 4 is a conductor, and 5 is solder.

In the illustrated example, the lead terminal 1A of the electrolytic capacitor body 1 is inserted into the lead terminal insertion hole 2A of the heat insulating resin spacer 2, and the outwardly protruding portion is changed from the bottom surface to the side surface of the heat insulating resin spacer 2. It is bent along and is soldered to the conductor 4 on the printed circuit board 3 with the electrolytic capacitor body 1 standing up.

FIG. 5 is an explanatory view of a main part of a horizontal type surface mount type electrolytic capacitor. FIG. 5A is a main part slope showing a state in which a main body and a heat insulating resin case are combined, and FIG. 5B is a printed circuit board. The cut side surfaces of the essential parts showing the mounted state are shown. The same symbols as those used in FIG. 4 represent the same parts or have the same meanings.

In the figure, 6 is a heat insulating resin case, 6A
Shows respective body holding holes formed in the heat insulating resin case.

In the illustrated example, the lead terminal 1A of the electrolytic capacitor body 1 is bent from the bottom surface of the heat insulating resin case along the side surface, and the conductor 4 on the printed circuit board 3 with the electrolytic capacitor body 1 lying down. It is soldered to.

In any of the conventional examples shown in FIGS. 4 and 5, the electrolytic capacitor body 1 is manufactured by applying the same technique as the conventional technique. In addition, the heat insulating resin spacer 2,
Alternatively, the heat insulating resin case 6 is used in order to make it difficult for the heat during reflow soldering to be transferred to the inside of the electrolytic capacitor body 1.

[0010]

The vertical surface mount type electrolytic capacitor shown in FIG. 4 has a small mounting area but cannot be reduced in height. On the contrary, the horizontal surface mount electrolytic capacitor shown in FIG. 5 can be reduced in height, but the mounting area becomes large.

In recent years, electronic devices have been basically downsized and the parts have been downsized accordingly, and surface mounted electrolytic capacitors are no exception. There is a demand such that the length is [mm] or less.

In that sense, the horizontal type surface mount type electrolytic capacitor shown in FIG. 5 meets the above requirements.
When a shock is applied after mounting, the lead terminals 1A are bent back, and the heat insulating resin case 6 and the electrolytic capacitor body 1 are lifted to open from the surface of the printed circuit board 3. There is.

The above-mentioned drawbacks are remarkable especially in a large electrolytic capacitor, and in order to solve this problem, a means for fixing the heat insulating resin case 6 to the printed circuit board 3 with an adhesive after reflow soldering is adopted. You can also see products that have

However, if a process using an adhesive is introduced during the process of assembling the printed circuit board, the work efficiency will be greatly lowered and the reliability of the bonding will be low due to the influence of the flux for soldering. There's a problem.

According to the present invention, a simple structural modification is used.
Make sure that horizontal surface-mount electronic components do not rise after mounting.

[0016]

According to the present invention, a lead terminal led out from an electronic component is formed, that is, bent, and then its tip is locked in a groove or hole provided in a heat insulating resin case. It is basically to suppress the floating after mounting.

That is, in the surface mount type electronic component and the mounting method thereof according to the present invention, (1) Lead is applied to the case (eg, the heat insulating resin case 12) of the surface mount type electronic component (eg, electrolytic capacitor). Grooves for accommodating a part of terminals (for example, lead terminals 11A) (for example, lead terminal accommodating groove 12B, lead terminal locking groove 1)
2C) or recess (for example, notch-shaped recess 12E)
Is formed, or

(2) A case (for example, a heat insulating resin case 1) in a surface mount type electronic component (for example, an electrolytic capacitor)
2) groove (for example, lead terminal accommodating groove 12B,
A step of accommodating a part of the lead terminal (for example, the lead terminal 11A) in the lead terminal locking groove 12C or the like or a recess (for example, a cutout-shaped recess 12E), and then the lead terminal and the printed circuit board (for example, a print). Substrate 3: Refer to FIG. 5) and a part of the case (for example, locking piece 12D)
Part of the lead terminal (for example, an arrow portion) is soldered to a conductor (for example, conductor 4: see FIG. 5) on the printed circuit board (for example, solder 5: see FIG. 5) while sandwiching
And a step of performing.

[0019]

By adopting the above-mentioned means, the lateral surface mount type electronic component can be firmly soldered to the printed circuit board over substantially the entire length in the lateral direction or at both ends thereof. Unlike the cantilever method that depends on the technology, even if a shock is applied after mounting, there is no possibility that the electronic parts will float up to open from the printed circuit board, and it will extend in the lateral direction and be mounted. It is possible to firmly and horizontally mount a low-profile horizontal surface mount electronic component on a printed circuit board.

FIG. 1 is a main part explanatory view showing an electrolytic capacitor for explaining a first embodiment of the present invention.
(A) shows a side surface of a main part, and (B) shows a front surface of the main part.

In the figure, 11 is an electrolytic capacitor body,
11A is a lead terminal, 11B is a tip of the lead terminal, 12
Is a heat insulating resin case, 12A is a main body holding hole formed in the heat insulating resin case, 12B is a lead terminal accommodating groove, and 12C.
Indicates a lead terminal locking groove, and 12D indicates a locking piece.

In this embodiment, the heat insulating resin case 1 is used.
On the side surface of 2, the groove 12B capable of accommodating most of the bent lead terminal 11A and the groove 12B, and the locking piece 1
A lead terminal locking groove 12C having 2D is formed.

Main body holding hole 12A of the heat insulating resin case 12
The electrolytic capacitor body 11 is inserted in the lead terminal 11A led out from the electrolytic capacitor body 11, and the lead terminal housing groove 12B formed in the heat insulating resin case 12 is formed in the lead terminal housing groove 12B.
Is bent in the opposite direction to the lead-out direction, and its tip 11B is further bent in an L shape so as to be engageable with the locking piece 12D and is housed in the lead terminal locking groove 12C.

When mounting the electrolytic capacitor having the above structure on a printed circuit board, the portions of the two lead terminals 11A indicated by arrows in the figure are fixed by soldering to the conductors of the printed circuit board. It does not happen that the lead terminals 11A are spaced apart from each other and the tip 11B and the locking piece 12D are disengaged.

After mounting, even if a shock is applied to the electrolytic capacitor, since the tips 11B of the lead terminals 11A are engaged with the locking pieces 12D in the heat insulating resin case 12, the heat insulating resin case 12, and thus, There is no fear that the electrolytic capacitor body 11 will float up and open from the printed circuit board.

FIG. 2 is an essential part explanatory view showing an electrolytic capacitor for explaining a second embodiment of the present invention.
(A) shows the side surface of the main part, (B) shows the front surface of the main part,
The same symbols as those used in FIG. 1 represent the same parts or have the same meanings.

In the figure, 12E is a heat insulating resin case 1.
2 shows a notch-shaped recess formed at the tip of No. 2.

In the present embodiment, the lead terminal 11A led out from the electrolytic capacitor body 11 is bent in the direction opposite to the lead-out direction, and the tip end 11B thereof can be engaged with the notch-shaped recess 12E. Therefore, it is bent in a U-shape in a direction orthogonal to the extending direction, and the tip end is fitted with the recess 12E.

When mounting the electrolytic capacitor having the above structure on a printed circuit board, the portion indicated by the arrow in the drawing may be soldered to the conductor of the printed circuit board, as in the first embodiment.

After mounting, when a shock is applied to the electrolytic capacitor of the second embodiment, it exhibits the same resistance as that of the first embodiment, and there is no possibility that the electrolytic capacitor will float up from the printed board.

In each of the embodiments of the present invention, the molding die required to manufacture the heat insulating resin case 12 may have a simple structure, but the molding die used in the second embodiment is Since it is easier than the first embodiment, it is not necessary to pay much attention to the degree of rotation of the resin when molding.

Therefore, the first embodiment and the second embodiment may be properly used so as to select the one having higher production efficiency depending on the size and shape of the electrolytic capacitor.

FIG. 3 is an explanatory view of a main part of an electrolytic capacitor for explaining a third embodiment of the present invention.
(A) shows the side surface of the main part, (B) shows the front surface of the main part,
The same symbols as those used in FIGS. 1 and 2 represent the same parts or have the same meanings.

In the figure, 12F is a heat insulating resin case 1.
2 is a lead terminal accommodating groove formed on the side surface of the heat insulating resin case 12.
2G is being generated.

In this embodiment, the lead terminal 11A led out from the electrolytic capacitor body 11 is bent in the direction opposite to the lead-out direction, and further bent in a U-shape in its extending direction. Except for the rising and falling portions, most of the extending direction is engaged with the long locking piece 12G,
Only the vicinity of the rising portion 11C and the vicinity of the falling portion (tip 11B) face the printed circuit board.

When the electrolytic capacitor having the above structure is mounted on a printed board, one lead terminal 11A is soldered to a conductor of the printed board at two portions indicated by arrows in the figure.

After mounting, when an impact is applied to the electrolytic capacitor of the third embodiment, it exhibits almost the same resistance as in the first and second embodiments, and there is no possibility that the electrolytic capacitor will float up from the printed board.

The electrolytic capacitor of the third embodiment is particularly effective for manufacturing a large size one, and it is possible to dispose another conductor in the printed board below the locking piece 12G. is there.

The surface mount type electronic component according to the present invention is not limited to the above-mentioned embodiments, and many other modifications can be realized.

For example, in each of the above-mentioned embodiments, the combination of the cylindrical electrolytic capacitor body and the rectangular heat insulating resin case is mentioned. However, this shape depends on the shape of the electronic component.
It can be selected as needed.

Further, the shape of the lead terminal accommodating groove, the lead terminal locking groove, the notch-shaped recess, etc. may be arbitrarily selected according to need. The point is to accommodate a part of the lead terminal, or It suffices if it can be locked, for example, a notch-shaped recess
The recess may be a simple hole that is not a notch, and may be a recess into which the tip of the lead terminal can be inserted and locked.

In each of the above embodiments, aluminum
Although the electrolytic capacitor main body incorporated in the case was fitted in a heat insulating resin case, if the electronic component is, for example, an electrolytic capacitor, the main body is hermetically sealed in a sealable case that doubles as a heat insulating resin case. Even if it has a stopped structure, it can be applied in exactly the same manner. By doing so, the number of mounting steps can be reduced, the productivity is improved, and the manufacturing cost is reduced.

[0043]

In the surface mount type electronic component and the mounting method thereof according to the present invention, the case of the surface mount type electronic component is formed with the groove or the recess for accommodating a part of the lead terminal, and the lead is formed. A part of the lead terminal is soldered to a conductor on the printed circuit board while a part of the case is sandwiched between the terminal and the printed circuit board.

By adopting the above configuration, the lateral surface mount type electronic component can be firmly soldered to the printed circuit board over substantially the entire lateral length or at both ends thereof. Unlike the cantilever method that depends on the technology, even if a shock is applied after mounting, there is no possibility that the electronic parts will lift up to open from the printed circuit board and the mounting height will be lowered. It is possible to securely and reliably mount horizontal surface mount electronic components that are effective for high reliability on a printed circuit board, and the case required for that purpose has a simple structure and is compatible with current molding technology. Therefore, it can be easily obtained.

[Brief description of drawings]

FIG. 1 is a principal part explanatory view showing an electrolytic capacitor for explaining a first embodiment in the present invention.

FIG. 2 is a main part explanatory view showing an electrolytic capacitor for explaining a second embodiment of the present invention.

FIG. 3 is a main part explanatory view showing an electrolytic capacitor for explaining a third embodiment of the present invention.

FIG. 4 is a main part explanatory view showing a vertical type surface mount electrolytic capacitor.

FIG. 5 is an explanatory view of a main part of a horizontal surface mount electrolytic capacitor.

[Explanation of symbols]

11 Electrolytic Capacitor Main Body 11A Lead Terminal 11B Lead Terminal Tip 12 Heat Insulation Resin Case 12A Main Body Holding Hole Formed in Heat Insulation Resin Case 12B Lead Terminal Housing Groove 12C Lead Terminal Locking Groove 12D Locking Piece 12E Heat Insulation Resin Case 12 Notch-shaped recess 12F formed at the tip of the lead terminal accommodating groove 12G formed on the side surface of the resin case 12 for heat insulation

Claims (2)

[Claims] 1. A surface mount type electronic component, wherein a groove or a recess for accommodating a part of a lead terminal is formed in a case of the surface mount type electronic component. 2. A step of accommodating a part of a lead terminal in a groove or a recess formed in a case of a surface mount type electronic component, and then a step of inserting the case between the lead terminal and a printed circuit board. And a step of soldering a part of the lead terminal to a conductor on the printed circuit board with the portion sandwiched therebetween.