JPH0829499B2 - Ultra-thin cutting blade and manufacturing method thereof - Google Patents

Description

TECHNICAL FIELD The present invention relates to an ultrathin cutting blade having excellent wear resistance, which is attached to a multiband saw or the like and used for precision cutting of semiconductor materials and the like, and a manufacturing method thereof. .

"Prior Art" As an ultra-thin cutting blade for precision machining of this type, conventionally, a blade as shown in FIG. 7 or 8 has been used.

The ultra-thin cutting blade shown in FIG. 7 has a super-abrasive grain 3 with a metal plating film 2 only on one side edge of a strip base metal 1 such as SK material.
The abrasive grain layer 4 is formed by electrodeposition of only one layer, and when used, it is attached to a multi-band saw to apply tension, and the grinding liquid (oil) is supplied to the grinding portion while cutting the work material W. Do.

On the other hand, the blade shown in FIG. 8 is used for the loose abrasive grain method, and the strip thin plate 5 made of SK material or the like is used as it is. When this blade is used, the work material W is cut by the free abrasive grains 6 that move as the blade reciprocates while supplying the grinding oil containing a large amount of abrasive grains 6 such as SiC to the grinding portion. To do.

"Problems to be Solved by the Invention" However, both of the above two types of ultrathin cutting blades have a drawback that they have a short life due to the following reasons.

First, in the blade shown in FIG. 7, as the work material W is cut, the abrasion of the superabrasive grains 3 increases and some of the superabrasive grains 3 fall off, so that the sharpness of the blade gradually decreases. Therefore, in order to prevent the cutting speed from being extremely reduced, the load applied to the blade must be increased, the base metal 1 is bent, and the abrasive grain layer 4 is separated from the base metal 1 and cannot be cut. .

On the other hand, in the blade shown in FIG. 8, not only the work material W but also the blade 5 itself is gradually scraped by friction with the loose abrasive grains 6. For this reason, the width dimension of the blade 5 was insufficient in a relatively short time, the blade 5 could not bear the tension, and the blade 5 broke, so that a sufficient life could not be obtained as in the above case. Further, since the blade 5 becomes thinner as it is cut, the cutting width at the final stage of cutting becomes smaller than the cutting width at the initial stage of cutting, and there is also a drawback that accurate cutting cannot be performed.

Therefore, the present inventors have sought a means of extending the life of the blade while taking advantage of the sharpness of the free abrasive grain method not decreasing, and have obtained the following novel knowledge through various experiments. It was

It is not only on the side edges of the strip metal, but also on both sides, using a blade with a hard layer formed by dispersing hard particles such as diamond or CBN in a metal-plating phase in multiple layers, in this hard layer. Hard particles fixed to the main cutting edge, the free abrasive grains in the grinding fluid as a secondary cutting edge fixed-free abrasive grain when performing grinding by the composite grinding method, the blade by the hard layer on the blade surface by free abrasive grains Abrasion can be prevented, the life is significantly extended, and free abrasive grains come into contact with the worn portion of fixed hard particles, which is the main cutting edge that occurs with the progress of grinding, and minute crushing of the worn portion occurs. Since it is generated continuously and with appropriate strength, good sharpness can be maintained without an increase in grinding resistance.

However, at the stage of manufacturing such an ultra-thin cutting blade, the following problems occurred.

That is, in order to form a hard layer, after electrical contacts are provided at both ends of the strip base metal, when the base metal is immersed in a plating bath (40 to 60 ° C) for plating, the base metal thermally expands. As a result, it is inevitable that the resulting blade will have an uncorrectable warp or that the thickness of the hard layer of the blade will be partially uneven, resulting in a satisfactory cutting accuracy. It was difficult to manufacture the resulting blade.

In the conventional fixed-abrasive grinding method, hard particles such as super-abrasive particles are easily worn away, which causes an increase in grinding resistance, making it impossible to continue grinding. The blade made was so worn that it was impossible to cut a large-diameter work material.

In view of such a situation, the present inventors newly fixed-
A free abrasive grain composite grinding method was devised, and a blade suitable for the grinding method and a manufacturing method thereof were invented.

"Means for Solving Problems" The present invention has been made to solve the above problems.

First, the ultrathin cutting blade of the present invention is used in a fixed-free abrasive grain composite grinding method in which hard particles fixed in the cutting blade are used as a main cutting edge and free abrasive grains in a grinding liquid are used as a sub-cutting edge. On both sides and side edges of the belt-shaped and ultra-thin base metal, a hard layer is formed by uniformly dispersing hard particles such as diamond or CBN in a metal plating phase in a multi-layered manner to form the entire thickness. It is characterized in that the thickness is 150 μm or more and 300 μm or less.

The average particle diameter of the hard particles is preferably 10 to 60 μm, and the content of the hard particles in the hard layer is preferably 10 to 50 vol%.

Further, the hard layer may be formed with a plurality of recesses spaced in the longitudinal direction of the base metal.

On the other hand, the manufacturing method of the ultra-thin cutting blade of the present invention, the hard particles fixed in the cutting blade as the main cutting edge, fixed abrasive particles in the grinding fluid as a secondary cutting edge-fixed abrasive particle composite grinding method A method of manufacturing an ultra-thin cutting blade used in, wherein each of the both surfaces of the base metal is brought into contact with each convex portion of a base metal fixing jig having a plurality of convex portions separated in the longitudinal direction. Is sandwiched in a flat state, and one side edge of this base metal is immersed in a plating solution with its upper side facing upward, and on one side edge and both sides of the base metal, hard particles are formed into a multilayer in a metal plating phase. Further, it is characterized in that a hard layer formed by being uniformly dispersed is formed.

When performing the plating, a jig holding the base metal may be tilted in the thickness direction of the base metal so that the hard particles are easily attached to both surfaces of the base metal.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(Example of Ultrathin Cutting Blade) FIG. 1 is an enlarged cross-sectional view of an ultrathin cutting blade according to an embodiment.
FIG. 2 is a plan view of the blade.

This blade is a strip-shaped and ultra-thin base metal 10 made of SK material, stainless steel, or the like, and has hard particles 12 ... The hard layer 13 is formed to have an overall thickness of 15
It is set to 0 μm or more and 300 μm or less. The thickness of the blade
If it is 150 μm or less, the strength is insufficient and the material is easily broken. On the other hand, if it exceeds 300 μm, the cutting margin becomes large and the yield at the time of cutting the semiconductor lowers.

Diamond, CBN, or the like is used as the hard particles 12, and the average particle size thereof is preferably 10 to 60 μm, and the content in the hard layer 13 is preferably 10 to 50 vol%. If the average particle diameter is less than 10 μm, the hard particles 12 have insufficient grinding ability as a main cutting edge, and the hard particles 12 easily fall off, resulting in insufficient blade wear suppressing action. On the contrary, 60μ
If it is larger than m, the entire blade becomes thicker and the cutting width becomes wider, which is not preferable. Further, the content rate of the hard particles 12 is 10 vol.
If it is less than%, the effect of suppressing blade wear cannot be sufficiently obtained, and the grinding ability as the main cutting edge is insufficient.
When it is larger than vol%, the ratio of the metal plating phase 11 is relatively decreased, and the hard particles 12 are more likely to fall off.

Further, concave grooves (recesses) 14 ... Are formed symmetrically on both sides of the blade of the hard layer 13 at regular intervals in the longitudinal direction of the base metal 10, and the base metal 10 is exposed at that portion. In addition, at both ends of the blade, mounting holes 15, 1 for mounting on the drive device are provided.
5 are formed.

When using the ultrathin cutting blade having the above structure, both ends of the blade are attached to a driving device such as a multiband saw to apply tension to perform fixed-free abrasive grain grinding. As the grinding liquid at that time, the hard particles of the blade 12
A grinding fluid mixed with loose abrasive grains 16 as a sub-cutting edge of softer SiC or the like is used. The particle diameter of the loose abrasive grains 16 is difficult to specify depending on the purpose of cutting, but generally the hard particles 12
It is desirable that the particle size is smaller than the above-mentioned particle size in view of creation of a self-generated blade action of the main cutting edge and wear resistance.

When the above-mentioned blade is applied to the work material W such as a semiconductor ingot and reciprocated while supplying such a grinding liquid, the loose abrasive grains 16 in the grinding liquid cause the blade and the work material to move as shown in FIG. It comes into contact with W and grinds the work material W following the movement of the blade.

At this time, since many hard particles 12 are projected from the hard layer 13 on the blade surface, the metal plating phase 11 and the loose abrasive grains 16
Contact with ... is significantly reduced. Moreover, since the hard particles 12, which are the main cutting edges, are harder than the loose abrasive grains 16, the wear of themselves is negligible. Therefore, in this blade, compared with the speed at which the work material W is ground, the hard layer 13
The wear rate is extremely low, and a much longer life can be obtained as compared with a conventional blade made of only metal. at the same time,
Since there is almost no reduction in the wall thickness of the blade, there is also an advantage that highly accurate cutting with the same cutting width can be performed.

Further, by the hard particles 12 protruding from the hard layer 13,
Since the action of causing the free abrasive grains 16 to follow the movement of the blade can be obtained, the efficiency of grinding the work W by these free abrasive grains 16 can be improved, and the cutting speed can be increased as compared with the conventional single metal blade. Is.

Further, since the metal plating phase 11 of the hard layer 13 is slightly worn due to friction with the loose abrasive grains 16, the metal plating phase 11
The amount of protrusion of the hard particles 12 from 11 is always kept proper, and the self-developing blade action is good. Moreover, since the surface of the hard particles 12 that are the main cutting edges are always finely broken by the loose abrasive grains 16, the cutting edge is kept sharp, and the grinding resistance is kept constant without increasing. Therefore, when the blade comes into contact with the work material W, the hard particles 12 can effectively perform the grinding, and also from this point, the grinding efficiency can be improved.

Further, in this example, grooves 14 are formed in the hard layers 13 on both sides of the blade.
.. are formed, these grooves 14 can enhance the chip discharge property during grinding.

The groove 14 is not always necessary, and a configuration without a groove or a configuration in which a recess having another shape is formed can be implemented.

(Example of Blade Manufacturing Method) Next, a method of manufacturing the above-described ultrathin cutting blade will be described in the order of steps.

First, as shown in FIG. 4, the base metal 10 is alternately sandwiched and fixed to a plurality of base metal fixing jigs 20. These jigs 20
Is a rigid plate-like member formed of a material such as synthetic resin having an insulating property, and ridges 20A protruding in the width direction are formed at regular intervals on both sides of each ridge 20A.
Are symmetrically butted to both sides of the base metal 10 to hold the base metal 10 in a flat state. These ridges 20A
Corresponds to the concave groove 14, and the respective dimensions are determined accordingly.

Next, the base metal 10 fixed to the jig 20 ... as described above.
Are degreased and cleaned with an organic solvent, etc.
Set in the plating equipment shown in the figure. This apparatus includes a plating tank 21, an agitator (not shown) and a jig tilting mechanism (not shown) arranged in the plating tank 21, and a predetermined amount of the plating tank 21 is provided in the plating tank 21. Hard particles of
The plating solution M such as Ni or Co is filled.

In order to perform plating, the jigs 20 ... Are mounted horizontally on the jig support mechanism so that one side edge of the base metal 10 faces upwards.
10 is connected to a cathode of a power source, and an elongated plate-shaped anode 22 is arranged in parallel above these base metals 10.

Then, while stirring the plating solution M with a stirrer, the base metal 10
... and the anode 22 are energized, and at the same time, the jig tilting mechanism is operated to tilt the jigs 20 back and forth by a predetermined angle as shown in FIG. This tilting method may be an intermittent motion or a slow continuous motion.

Then, while the metal plating phase 11 of Ni, Co, etc. is deposited on the upper edge and both surfaces of each base metal 10, the hard particles 12 are incorporated into the metal plating phase 11 in a multi-layered manner, and A hard layer 13 is formed which is thick on the edges and thin on both sides. And
When the hard layer 13 has a predetermined thickness, the energization is stopped, the base metal 10 ... Is removed from the jig 20, and the blade is obtained through cleaning and shaping.

According to such a method for manufacturing an ultra-thin cutting blade, plating is performed while holding the base metal 10 with the jig 20 ... in a flat state, so that the base metal 10 is immersed even in a high temperature plating bath.
It is possible to manufacture a blade having high flatness in which the metal plating phase 11 is prevented from being segregated due to the warp of the base metal 10 and the thickness of the hard layer 13 is uniform in each part without bending.
Moreover, since many blades can be obtained at the same time, the manufacturing efficiency is high.

Further, since the protrusions 20A of the jig 20 are brought into contact with both sides of the base metal 10 for plating, the protrusions 20A are provided on both sides of the base metal 10.
The trace of A, that is, the concave groove 14 is formed, and it is possible to enhance the chip discharge property during grinding.

Further, in this method, since the base metal 10 is tilted reciprocally during plating, it is possible to promote the adhesion of the hard particles 12 to both surface portions of the base metal 10, and by appropriately setting the tilt angle and speed, The advantage that the amount of the hard particles 12 dispersed can be adjusted arbitrarily is also obtained.

If the groove 14 is not required, the jig 20 may be temporarily removed during the plating process so that the contact position of the ridge 20A is shifted so that the groove 14 is not formed. It is also possible to use a base metal fixing jig in which a protrusion having an irregular shape is formed instead of the protrusion 20A, and form a concave portion having a shape corresponding to this protrusion in the blade.

"Experimental Example" Next, the effect of the present invention will be demonstrated with an experimental example.

The strip-shaped SK material to be the base metal was fixed by sandwiching it with a base metal fixing jig made of synthetic resin similar to that shown in FIG. 4, and then subjected to cleaning treatment such as degreasing. Then, using a sulfamate Ni plating solution in which diamond particles are dispersed, while precipitating a Ni plating phase on one side edge and both sides of the base metal, a hard layer is formed by dispersing diamond particles in the metal plating phase. Formed. When performing the plating, the fixing jig was tilted back and forth in the thickness direction of the base metal. Each condition is shown below.

Base metal type: SK-6 Base metal dimensions: length 409 mm x width 6 mm x thickness 0.1 mm Plating solution composition: Ni sulfamate = 450 g / l, Ni chloride = 15 g / l, boric acid = 30 g / l, pit prevention Agent, brightener = each small amount, average particle size of PH4 diamond particles: 50μm Plating condition: Plating bath temperature = 50 ° C, Cathode current density = 1.7A / dm ² Plating time = 40min. Jig tilting method: Vertical → 10 ° Left tilt → Vertical → 10 ° Right tilt → Vertical (1 operation every 2 minutes, 1 cycle in 8 minutes) Dimension of the finished blade: Thickness = 230-250 μm Edge particle thickness = 4 layers Double side particle thickness = 2 layers Next, 100 blades made by the above method and S
Prepare 100 conventional blades consisting of K-6 (409 mm long x 6 mm wide x 0.2 mm thick) itself, and each 100 blades are 1 mm from each other.
The cutting jigs of the experimental example and the comparative example were set parallel to each other on a multi-band saw at intervals. Then, using each of these cutting jigs, stroke length 300 mm, 80 reciprocations / mi
n, a silicon ingot having a diameter of 150 mm and a length of 300 mm was diametrically cut with a grinding fluid prepared by dispersing 5 kg of SiC having an average particle size of 10 μm in 15 l of grinding oil.

As a result, the blades of SK material all broke when they were ground to half of the silicon ingot, while the blades of the experimental example were able to cut an average of 10 pieces with a cutting time of 60 hours per ingot. It was That is, the life of the blade is extended to about 20 times that of the conventional blade.

"Effects of the Invention" As invented above, in the ultrathin cutting blade of the present invention, since many hard particles that are the main cutting edges are projected from the hard layer on the blade surface, the metal plating phase is caused by these hard particles. In addition to the effect of reducing the friction with loose abrasive grains, the wear of the hard particles themselves is negligible, so the wear rate of the hard layer is significantly smaller than the speed at which the work material is ground. It is possible to obtain a much longer life than a blade made of only metal.

Further, by the hard particles that are the main cutting edge protruding from the hard layer, the action of causing the free abrasive grains that are the sub cutting edges to follow the movement of the blade can be obtained, and thus the free abrasive grains compared to the conventional single metal blade. It is possible to improve the grinding efficiency of the work material due to, and it is possible to increase the cutting speed.

Further, since the metal plating phase of the hard layer is slightly worn due to the friction with the free abrasive grains, the amount of the hard particles protruding from the metal plating phase is always kept proper and the self-developing action is good. Moreover, since the surface of the hard particles is always finely broken by the loose abrasive grains, the cutting edge is kept sharp. Therefore, even when the blade comes into contact with the work material, it is possible to effectively perform the grinding with the hard particles that are the appropriately protruding main cutting edges, and also from this point, the grinding efficiency can be improved.

Accordingly, the ultrathin cutting blade of the present invention can be applied to the fixed-loose abrasive grain composite grinding method, and therefore, compared with the cutting blade used in the conventional simple fixed abrasive grain grinding method or loose abrasive grain grinding method. Therefore, the grinding ability can be remarkably improved.

Furthermore, since the hard layers are formed on both sides of the blade, there is almost no reduction in the thickness of the blade, and cutting with extremely high cutting width accuracy can be performed.

On the other hand, according to the manufacturing method of the ultrathin cutting blade of the present invention, plating is performed while holding the base metal in a flat state by sandwiching the base metal with a base metal fixing jig having a plurality of convex portions separated in the longitudinal direction, Even when immersed in a relatively high temperature plating bath, the flatness of the base metal is not impaired, the segregation of the metal plating phase due to the warp of the base metal is prevented, and the blade with a high flatness with a uniform hard layer thickness Can be easily manufactured.

[Brief description of drawings]

FIG. 1 is an enlarged sectional view of an ultrathin cutting blade of the present invention, FIG.
FIG. 3 is a plan view of the blade, and FIG. 3 is a cross-sectional view of a cutting edge portion when the blade is cut. Further, FIG. 4 is a perspective view of a base metal fixing jig for manufacturing the same blade, and FIGS. 5 and 6 are a side view and a sectional view taken along line VI-VI of the plating apparatus. On the other hand, FIG. 7 and FIG. 8 are cross-sectional views of the cutting edge portion when cutting different conventional cutting blades. 10 …… Band base metal, 11 …… Metal plating phase, 12 …… Hard particles, 13 …… Hard layer, 14 …… Concave groove (concave), 15 …… Mounting hole, 16 …… Free abrasive grains, W… … Work material, 20 …… Base metal fixing jig, 20A …… Projection (protrusion), 21 …… Plating bath, 22 …… Anode plate.

Claims (5)

[Claims] 1. An ultra-thin cutting blade used in a fixed-free abrasive composite grinding method in which hard particles fixed in a cutting blade are used as a main cutting edge and free abrasive grains in a grinding fluid are used as a secondary cutting edge. Then, on both sides and side edges of the band-shaped and ultra-thin base metal, hard layers consisting of hard particles such as diamond or CBN dispersed in a metal plating phase in a multi-layered and uniform manner are formed, and the total thickness To
An ultra-thin cutting blade characterized by having a thickness of 150 μm to 300 μm. 2. The average particle size of the hard particles is 10 to 60 μm, and the content ratio of the hard particles in the hard layer is 10.
Claim 1 characterized in that it is -50 vol%
The ultra-thin cutting blade described in the item. 3. The ultrathin cutting blade according to claim 1, wherein the hard layer is formed with a plurality of recesses spaced apart in the longitudinal direction of the base metal. 4. A band-shaped and ultra-thin film which is used in a fixed-free abrasive composite grinding method in which hard particles fixed in a cutting blade are used as main cutting edges and free abrasive particles in a grinding fluid are used as sub-cutting edges. On both sides and side edges of the base metal, a hard layer is formed in which hard particles such as diamond or CBN are uniformly dispersed in a multi-layer in a metal plating phase, and the total thickness is 150 μm to 300 μm, And, a method of manufacturing an ultrathin cutting blade in which a plurality of recesses spaced in the longitudinal direction of the base metal are formed in the hard layer, and on each side of the base metal, a plurality of protrusions spaced in the longitudinal direction Both sides of the base metal are fixed by abutting the convex parts of the base metal fixing jig with the base plate and sandwiching the base metal in a flat state, and dipping one side edge of the base metal upward in the plating solution. And on one side edge,
A method for producing an ultra-thin cutting blade, which comprises forming a hard layer in which hard particles are uniformly dispersed in a multi-layer in a metal plating phase. 5. The method for manufacturing an ultrathin cutting blade according to claim 4, wherein a jig holding a base metal is tilted in a thickness direction of the base metal when the plating is performed.