JPH0830146B2 - Conductive silicone composition - Google Patents
Conductive silicone compositionInfo
- Publication number
- JPH0830146B2 JPH0830146B2 JP11342590A JP11342590A JPH0830146B2 JP H0830146 B2 JPH0830146 B2 JP H0830146B2 JP 11342590 A JP11342590 A JP 11342590A JP 11342590 A JP11342590 A JP 11342590A JP H0830146 B2 JPH0830146 B2 JP H0830146B2
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- Prior art keywords
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- curing
- silicone composition
- Prior art date
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Description
【発明の詳細な説明】 [発明の目的] (産業上の利用分野) 本発明は、導電性を有するシリコーン組成物に係り、
さらに詳しくは、高導電性を得る目的でカーボンブラッ
クを高充填しても、可塑性を失わない加工性に優れたシ
リコーン組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a silicone composition having conductivity,
More specifically, the present invention relates to a silicone composition excellent in processability that does not lose plasticity even when carbon black is highly filled for the purpose of obtaining high conductivity.
(従来の技術) 従来から、硬化してリコーンゴムとなるシリコーン組
成物はよく知られており、その耐侯性、耐熱性、耐寒
性、電気絶縁性等の優れた性質を利用して、電気電子部
品のポッティング材、コーティング材、型取り用等の成
形材料等に幅広く使用されている。また、本来絶縁材料
であるシリコーン組成物に導電性を付与して使用するこ
とも行われている。(Prior Art) Silicone compositions that harden into silicone rubber have been well known in the past, and by utilizing their excellent properties such as weather resistance, heat resistance, cold resistance, and electrical insulation, electrical and electronic parts can be utilized. It is widely used as potting material, coating material, molding material for molding, etc. In addition, a silicone composition, which is originally an insulating material, is given conductivity and used.
上述したように、シリコーン組成物に導電性を付与す
る方法としては、一般的には導電性カーボンブラックを
配合する方法が知られている。例えば特開昭54−139659
号公報には、40〜100m2/gの比表面積を有するファーネ
スブラックとアセチレンブラックを併用した導電性オル
ガノポリシロキサンエラストマーが記載されており、ま
た同55−120656号公報には表面積が900m2/g以上で、中
空のシェル状粒子が存在するカーボンブラックを配合し
た液状オルガノポリシロキサン組成物が、同55−108455
号公報にはカーボンブラックと導電性繊維を併用した押
出成形型液状オルガノポリシロキサン組成物が、さらに
同56−120761号公報には比表面積80m2/g以上のカーボン
ブラックを用いたシリコーンゴム組成物が記載されてい
る。As described above, as a method of imparting conductivity to a silicone composition, a method of blending conductive carbon black is generally known. For example, JP-A-54-139659
The publication describes a conductive organopolysiloxane elastomer in which a furnace black and an acetylene black having a specific surface area of 40 to 100 m 2 / g are used in combination, and the publication 55-120656 discloses a surface area of 900 m 2 / g. A liquid organopolysiloxane composition containing carbon black in which hollow shell-shaped particles are present in an amount of g or more is
JP-A No. 6-120761 discloses an extrusion-molding type liquid organopolysiloxane composition in which carbon black and conductive fibers are used in combination, and JP-A No. 56-120761 discloses a silicone rubber composition using a carbon black having a specific surface area of 80 m 2 / g or more. Is listed.
上述したような導電性付与の目的で使用されるカーボ
ンブラックは、その製造方法によりサーマルブラック、
ファーネスブラック、アセチレンブラック等の種類に分
類される。これらの中でも、アセチレンブラックは高純
度であることから、乾電池をはじめとして、一般のゴム
への導電性付与のための充填剤等としても多用されてい
る。Carbon black used for the purpose of imparting conductivity as described above, thermal black by the manufacturing method,
It is classified into types such as furnace black and acetylene black. Among these, acetylene black has a high purity and is therefore widely used as a filler for imparting conductivity to general rubber, including dry batteries.
(発明が解決しようとする課題) しかしながら、上述したようなシリコーンゴム組成物
においては、高い導電性を得ようとする場合、カーボン
量の増量によりベースポリマーへの配合がしにくくなる
と共に、例えばミラブル型シリコーンゴムにおいては、
未加硫コンパウンドの可塑度が高くなり、成形時のコン
パウンドの流れ性が低下し、金型への流れ、押出し性、
ロール作業性が著しく悪化するという問題があった。(Problems to be Solved by the Invention) However, in the silicone rubber composition as described above, when it is desired to obtain high conductivity, it becomes difficult to mix it with the base polymer due to an increase in the amount of carbon, and for example, a mirable In type silicone rubber,
The plasticity of the unvulcanized compound increases, the flowability of the compound during molding decreases, the flow into the mold, extrudability,
There is a problem that the roll workability is significantly deteriorated.
本発明は、このような課題に対処するためになされた
もので、アセチレンブラックを配合することによって導
電性を付与したシリコーンゴム組成物において、適度の
可塑度または粘度を有し、成形時の操作性に優れた導電
性シリコーン組成物を提供することを目的とするもので
ある。The present invention has been made to address such a problem, and in a silicone rubber composition provided with conductivity by blending acetylene black, it has an appropriate degree of plasticity or viscosity, and has an operation during molding. The purpose of the present invention is to provide a conductive silicone composition having excellent properties.
[発明の構成] (課題を解決するための手段と作用) 本発明者は、前述の目的を達成すべく検討を重ねた結
果、カーボンブラックとして、アセチレンを原料とし、
発熱分解法で製造された、塩酸吸液量が12ml/5g以下
で、かつヨウ素吸着量が50mg/g以下のものを用いること
により、上述の目的が達成されることを見出し、ここに
本発明を成すに至った。[Structure of the Invention] (Means and Actions for Solving the Problems) As a result of repeated studies to achieve the above-mentioned object, the present inventor has used acetylene as a raw material as carbon black,
Produced by the exothermic decomposition method, hydrochloric acid absorption amount of 12ml / 5g or less, and by using iodine adsorption amount of 50mg / g or less, it was found that the above-mentioned object is achieved, the present invention It came to be done.
すなわち本発明は、カーボンブラックを含有する導電
性シリコーン組成物において、前記カーボンブラック
は、塩酸吸液量が12ml/5g以下で、かつヨウ素吸着量が5
0mg/g以下のアセチレンブラックであることを特徴とし
ている。That is, the present invention is a conductive silicone composition containing carbon black, wherein the carbon black has a hydrochloric acid absorption amount of 12 ml / 5 g or less, and an iodine adsorption amount of 5
It is characterized by being acetylene black of 0 mg / g or less.
本発明の導電性シリコーン組成物は、基本的には常温
または加熱等によって硬化させることによりゴム弾性体
となるポリオルガノシロキサン組成物に、上記条件を満
足するカーボンブラックおよび必要に応じて各種添加剤
等を配合し、均一に分散させたものである。The conductive silicone composition of the present invention is basically a polyorganosiloxane composition which becomes a rubber elastic body when cured at room temperature or by heating, etc., to a carbon black satisfying the above conditions and, if necessary, various additives. Etc. are mixed and uniformly dispersed.
本発明に用いられるアセチレンブラックは、優れた導
電性を付与するとともに、コンパウンド組成物の可塑度
または粘度を適度に抑制する。本発明における特徴的な
成分であり、塩酸吸液量が12ml/5g以下で、かつヨウ素
吸着量が50mg/g以下のものである。これら品質特性が意
味するものは、以下に示す通りである。The acetylene black used in the present invention imparts excellent conductivity and appropriately suppresses the plasticity or viscosity of the compound composition. It is a characteristic component in the present invention, and has a hydrochloric acid absorption amount of 12 ml / 5 g or less and an iodine adsorption amount of 50 mg / g or less. The meanings of these quality characteristics are as follows.
すなわち、JIS K 1469(アセチレンブラック)に規定
されている塩酸吸液量がストラクチャー「カーボン一次
粒子の連鎖構造」の発達の度合を表す指標となり、また
JIS K 1474「粉末活性炭試験方法」に規定されるヨウ素
吸着量がストラクチャーの強さを示す指標となることが
知られている。ここで、ゴム組成物に導電性を付与する
場合、ストラクチャーが発達していること、すなわち塩
酸吸液量が多く、またそのストラクチャーが強いこと、
すなわちヨウ素吸着量が大きい程、カーボンの二次接触
確率が高まり、かつ混合または混練による応力によって
ストラクチャーが破壊されにくいため、より望ましいカ
ーボンと考えられ、使用されていた。しかしながら、他
の有機ポリマーに比較して格段に柔らかいシリコーン系
ポリマーにおいては、その通念が当てはまらず、均一分
散を可能とするには適度のストラクチャーが必要である
ことを、本発明により明らかにしたものである。In other words, the hydrochloric acid absorption amount specified in JIS K 1469 (acetylene black) is an index showing the degree of development of the structure "chain structure of carbon primary particles", and
It is known that the iodine adsorption amount specified in JIS K 1474 "Powdered activated carbon test method" is an index showing the strength of the structure. Here, when imparting conductivity to the rubber composition, that the structure is developed, that is, the amount of hydrochloric acid absorbed is large, and that structure is strong,
That is, the larger the amount of iodine adsorbed, the higher the secondary contact probability of carbon, and the structure is less likely to be broken by the stress caused by mixing or kneading. However, according to the present invention, it has been clarified that a silicone-based polymer, which is much softer than other organic polymers, does not have the same general idea and requires an appropriate structure to enable uniform dispersion. It is.
すなわち、コンパウンドあるいは組成物に良好な作業
性を付与し、かつ良好な導電性を与えるためには、アセ
チレンブラックの塩酸吸液量が12mg/g以下で、かつヨウ
素吸着量が50mg/gであることが必要であり、いずれの値
が上記数値を超える場合においても、良好な作業性と良
好な導電性を付与することはできない。That is, in order to impart good workability to the compound or composition, and to give good conductivity, the hydrochloric acid absorption amount of acetylene black is 12 mg / g or less, and the iodine adsorption amount is 50 mg / g. It is necessary to provide good workability and good conductivity even when any of the values exceeds the above values.
一方、本発明のシリコーンゴム組成物の主成分となる
ポリオルガノシロキサン組成物は、(a)ポリオルガノ
シロキサンベースポリマーと、(b)硬化剤と、必要に
応じて各種添加剤等を配合し、均一に分散させたもので
ある。On the other hand, the polyorganosiloxane composition, which is the main component of the silicone rubber composition of the present invention, contains (a) a polyorganosiloxane base polymer, (b) a curing agent, and various additives as necessary, It is evenly dispersed.
このようなポリオルガノシロキサン組成物に用いられ
る各種成分のうち、(a)シリコーンベースポリマーと
(b)硬化剤とは、ゴム状弾性体を得るための反応機構
に応じて適宜選択されるものである。その反応機構とし
ては、有機過酸化物加硫剤による架橋方法、縮合反
応による方法、付加反応による方法等が知られてお
り、その反応機構によって、(a)成分と(b)成分す
なわち硬化用触媒もしくは架橋剤との好ましい組合せが
決まることは周知である。Among various components used in such a polyorganosiloxane composition, the (a) silicone base polymer and (b) curing agent are appropriately selected according to the reaction mechanism for obtaining the rubber-like elastic body. is there. As the reaction mechanism, a crosslinking method using an organic peroxide vulcanizing agent, a condensation reaction method, an addition reaction method, etc. are known. Depending on the reaction mechanism, the components (a) and (b), that is, for curing It is well known that the preferred combination with catalyst or crosslinker will be determined.
すなわち、上記の架橋方法を適用する場合において
は、通常、(a)成分のベースポリマーとしては、1分
子中のケイ素原子に結合した有機基のうち、少なくとも
2個がビニル基であるポリジオルガノシロキサンが用い
られる。また、(b)成分の硬化剤としては、ベンゾイ
ルペルオキシド、2,4−ジクロロベンゾイルペルオキシ
ド、ジクミルペルオキシド、クミル−t−ブチルペルオ
キシド、2,5−ジメチル−2,5−ジ−t−ブチルペルオキ
シヘキサン、ジ−t−ブチルペルオキシド等の各種の有
機過酸化物加硫剤が用いられ、特に低い圧縮永久歪みを
与えることから、ジクミルペルオキシド、クミル−t−
ブチルペルオキシド、2,5−ジメチル−2,5−ジ−t−ブ
チルペルオキシヘキサン、ジ−t−ブチルペルオキシド
が好ましい。なお、これらの有機過酸化物加硫剤は、1
種または2種以上の混合物として用いられる。That is, when the above crosslinking method is applied, the base polymer of the component (a) is usually a polydiorganosiloxane in which at least two of the organic groups bonded to silicon atoms in one molecule are vinyl groups. Is used. Further, the curing agent of the component (b) includes benzoyl peroxide, 2,4-dichlorobenzoyl peroxide, dicumyl peroxide, cumyl-t-butyl peroxide, 2,5-dimethyl-2,5-di-t-butylperoxy. Various organic peroxide vulcanizing agents such as hexane and di-t-butyl peroxide are used, and since they give particularly low compression set, dicumyl peroxide and cumyl-t-
Butyl peroxide, 2,5-dimethyl-2,5-di-t-butylperoxyhexane and di-t-butyl peroxide are preferred. In addition, these organic peroxide vulcanizing agents are 1
It is used as a kind or a mixture of two or more kinds.
(b)成分の硬化剤である有機過酸化物の配合量は、
(a)成分のシリコーンベースポリマー100重量部に対
し0.05〜15重量部の範囲が好ましい。有機過酸化物の配
合量が0.05重量部未満では加硫が十分に行われず、15重
量部を超えて配合してもそれ以上の格別な効果がないば
かりか、得られたシリコーンゴムの物性に悪影響を与え
ることがあるからである。The blending amount of the organic peroxide which is the curing agent of the component (b) is
The amount is preferably in the range of 0.05 to 15 parts by weight based on 100 parts by weight of the silicone base polymer as the component (a). If the content of the organic peroxide is less than 0.05 parts by weight, the vulcanization will not be sufficiently carried out, and if it is blended in excess of 15 parts by weight, there will be no further significant effect and the physical properties of the obtained silicone rubber This is because it may have an adverse effect.
また、上記の縮合反応を適用する場合においては、
(a)成分のベースポリマーとしては両末端に水酸基を
有するポリオルガノシロキサンが用いられる。(b)成
分の硬化剤としては、まず架橋剤として、エチルシリケ
ート、プロピルシリケート、メチルトリメトキシシラ
ン、ビニルトリメトキシシラン、メチルトリエトキシシ
ラン、ビニルトリエトキシシラン、メチルトリス(メト
キシエトキシ)シラン、ビニルトリス(メトキシエトキ
シ)シラン、メチルトリプロペノキシシラン等のアルコ
キシ型;メチルトリアセトキシシラン、ビニルトリアセ
トキシシラン等のアセトキシ型;メチルトリ(アセトン
オキシム)シラン、ビニルトリ(アセトンオキシム)シ
ラン、メチルトリ(メチルエチルケトシキム)シラン、
ビニルトリ(メチルエチルケトキシム)シラン等、およ
びその部分加水分解物が例示される。また、ヘキサメチ
ル−ビス(ジエチルアミノキシ)シクロテトラシロキサ
ン、テトラメチルジブチル−ビス(ジエチルアミノキ
シ)シクロテトラシロキサン、ヘプタメチル(ジエチル
アミノキシ)シクロテトラシロキサン、ペンタメチル−
トリス(ジエチルアミノキシ)シクロテトラシロキサ
ン、ヘキサメチル−ビス(メチルエチルアミノキシ)シ
クロテトラシロキサン、テトラメチル−ビス(ジエチル
アミノキシ)−モノ(メチルエチルアミノキシ)シクロ
テトラシロキサンのような環状シロキサン等も例示され
る。このように、架橋剤はシランやシロキサン構造のい
ずれでもよく、またそのシロキサン構造は直鎖状、分岐
状および環状のいずれでもよい。さらに、これらを使用
する際には、1種類に限定される必要はなく、2種以上
の併用も可能である。Further, in the case of applying the above condensation reaction,
As the base polymer of the component (a), polyorganosiloxane having hydroxyl groups at both ends is used. As the curing agent of the component (b), first, as a cross-linking agent, ethyl silicate, propyl silicate, methyltrimethoxysilane, vinyltrimethoxysilane, methyltriethoxysilane, vinyltriethoxysilane, methyltris (methoxyethoxy) silane, vinyltris ( Alkoxy type such as (methoxyethoxy) silane and methyltripropenoxysilane; acetoxy type such as methyltriacetoxysilane and vinyltriacetoxysilane; methyltri (acetoneoxime) silane, vinyltri (acetoneoxime) silane, methyltri (methylethylketoshikim) silane ,
Examples thereof include vinyltri (methylethylketoxime) silane and the like, and partial hydrolysates thereof. Also, hexamethyl-bis (diethylaminoxy) cyclotetrasiloxane, tetramethyldibutyl-bis (diethylaminoxy) cyclotetrasiloxane, heptamethyl (diethylaminoxy) cyclotetrasiloxane, pentamethyl-
Cyclic siloxanes such as tris (diethylaminoxy) cyclotetrasiloxane, hexamethyl-bis (methylethylaminoxy) cyclotetrasiloxane, and tetramethyl-bis (diethylaminoxy) -mono (methylethylaminoxy) cyclotetrasiloxane are also exemplified. It As described above, the cross-linking agent may have any of a silane and siloxane structure, and the siloxane structure may be any of linear, branched and cyclic structures. Furthermore, when using these, it is not necessary to be limited to one type, and two or more types can be used in combination.
また、(b)成分の硬化剤のうち、硬化用触媒として
は、鉄オクトエート、コバルトオクトエート、マンガン
オクトエート、スズナフテネート、スズカプリレート、
スズオレエートのようなカルボン酸金属塩;ジメチルス
ズジオレエート、ジメチルスズジラウレート、ジブチル
スズジアセテート、ジブチルスズジオクトエート、ジブ
チルスズジラウレート、ジブチルスズジオレエート、ジ
フェニルスズジアセテート、酸化ジブチルスズ、ジブチ
ルスズジメトキシド、ジブチルビス(トリエトキシシロ
キシ)スズ、ジオクチルスズジラウレートのような有機
スズ化合物が用いられる。Among the curing agents (b), curing catalysts include iron octoate, cobalt octoate, manganese octoate, tin naphthenate, tin caprylate,
Carboxylic acid metal salts such as tin oleate; dimethyltin dioleate, dimethyltin dilaurate, dibutyltin diacetate, dibutyltin dioctoate, dibutyltin dilaurate, dibutyltin dioleate, diphenyltin diacetate, dibutyltin oxide, dibutyltin dimethoxide, dibutylbis (tributylbis (tributyltin diacetate. Organotin compounds such as ethoxysiloxy) tin, dioctyltin dilaurate are used.
(b)成分の硬化剤のうち、上記架橋剤の配合量は
(a)成分のベースポリマー100重量部に対し0.1〜20重
量部が好ましい。架橋剤の使用量が0.1重量部未満で
は、硬化後のゴムに充分な強度が得られず、また20重量
部を超えると得られるゴムが脆くなり、いずれも実用に
耐え難たい。また、硬化用触媒の配合量は(a)成分の
ベースポリマー100重量部に対し0.01〜5重量部が好ま
しい。これより少ない量では硬化用触媒として不十分で
あって、硬化に長時間を要し、また空気との接触面から
遠い内部での硬化が不良となる。他方、これよりも多い
場合には、保存安定性が低下してしまう。より好ましい
配合量の範囲としては、0.1〜3重量部の範囲である。Of the curing agent (b), the amount of the crosslinking agent is preferably 0.1 to 20 parts by weight based on 100 parts by weight of the base polymer (a). If the amount of the cross-linking agent used is less than 0.1 parts by weight, the cured rubber will not have sufficient strength, and if it exceeds 20 parts by weight, the obtained rubber will be brittle, and any of them will be difficult to put into practical use. Further, the compounding amount of the curing catalyst is preferably 0.01 to 5 parts by weight with respect to 100 parts by weight of the base polymer as the component (a). If the amount is less than this, it is insufficient as a curing catalyst, and it takes a long time to cure, and the curing in the interior far from the contact surface with air becomes poor. On the other hand, if the amount is larger than this, the storage stability will decrease. A more preferable range of the compounding amount is 0.1 to 3 parts by weight.
上記の付加反応を適用する場合の(a)成分のベー
スポリマーとしては、上記におけるベースポリマーと
同様なものが用いられる。また、(b)成分の硬化剤と
しては、硬化用触媒として、塩化白金酸、白金オレフィ
ン錯体、白金ビニルシロキサン錯体、白金黒、白金トリ
フェニルホスフィン錯体等の白金系触媒が用いられ、架
橋剤として、ケイ素原子に結合した水素原子が1分子中
に少なくとも平均2個を超える数を有するポリジオルガ
ノシロキサンが用いられる。As the base polymer of the component (a) when the above-mentioned addition reaction is applied, the same base polymer as that described above is used. As the curing agent of the component (b), a platinum catalyst such as chloroplatinic acid, a platinum olefin complex, a platinum vinyl siloxane complex, platinum black, or a platinum triphenylphosphine complex is used as a curing catalyst. A polydiorganosiloxane having an average of at least two hydrogen atoms bonded to silicon atoms per molecule is used.
(b)成分の硬化剤のうち、硬化用触媒の配合量は、
(a)成分のベースポリマーに対し白金元素量で1〜10
00ppmの範囲となる量が好ましい。硬化用触媒の配合量
が白金元素量として1ppm未満では、充分に硬化が進行せ
ず、また1000ppmを超えても特に硬化速度の向上等が期
待できない。また、架橋剤の配合量は、(a)成分中の
アルケニル基1個に対し、架橋剤中のケイ素原子に結合
した水素原子が0.5〜4.0個となるような量が好ましく、
さらに好ましくは1.0〜3.0個となるような量である。水
素原子の量が0.5個未満である場合は、組成物の硬化が
充分に進行せずに、硬化後の組成物の硬さが低くなり、
また水素原子の量が4.0個を超えると硬化後の組成物の
物理的性質と耐熱性が低下する。In the curing agent of the component (b), the compounding amount of the curing catalyst is
(A) 1 to 10 elemental platinum elements based on the base polymer of component
Amounts in the range of 00 ppm are preferred. If the compounding amount of the curing catalyst is less than 1 ppm as the amount of platinum element, the curing does not proceed sufficiently, and if it exceeds 1000 ppm, no particular improvement in the curing rate can be expected. The amount of the crosslinking agent is preferably such that the number of hydrogen atoms bonded to silicon atoms in the crosslinking agent is 0.5 to 4.0 per alkenyl group in the component (a),
More preferably, the amount is 1.0 to 3.0. When the amount of hydrogen atoms is less than 0.5, the curing of the composition does not proceed sufficiently, and the hardness of the composition after curing becomes low,
On the other hand, if the number of hydrogen atoms exceeds 4.0, the physical properties and heat resistance of the composition after curing will deteriorate.
以上のような各種の反応機構において用いられる
(a)成分のベースポリマーとしてのポリオルガノシロ
キサンにおける有機基は、1価の置換または非置換の炭
化水素基であり、メチル基、エチル基、プロピル基、ブ
チル基、ヘキシル基、ドデシル基のようなアルキル基、
フェニル基のようなアリール基、β−フェニルエチル
基、β−フェニルプロピル基のようなアラルキル基等の
非置換の炭化水素基や、クロロメチル基、3,3,3−トリ
フルオロプロピル基等の置換炭化水素基が例示される。
なお、一般的にはメチル基が合成のしやすさ等から多用
される。The organic group in the polyorganosiloxane as the base polymer of the component (a) used in the various reaction mechanisms as described above is a monovalent substituted or unsubstituted hydrocarbon group, such as a methyl group, an ethyl group, or a propyl group. , Butyl group, hexyl group, alkyl groups such as dodecyl group,
Unsubstituted hydrocarbon groups such as aralkyl groups such as aryl groups such as phenyl groups, β-phenylethyl groups and β-phenylpropyl groups, and chloromethyl groups and 3,3,3-trifluoropropyl groups A substituted hydrocarbon group is exemplified.
In addition, a methyl group is generally used because of its ease of synthesis.
本発明の導電性シリコーン組成物においては、上記硬
化機構およびポリシロキサンベースポリマーは特に限定
されないが、導電特性の点からはの付加反応、または
の有機過酸化物加硫によるものが好ましく、またポリ
シロキサンベースポリマーの重合度は1000以上のもの、
いわゆるミラブル型と称するものが好ましい。これは、
混合時のせん断応力が適度であるために、配合によって
前述の効果がより発揮されるものと推察される。In the conductive silicone composition of the present invention, the above-mentioned curing mechanism and polysiloxane base polymer are not particularly limited, but from the viewpoint of conductive properties, addition reaction or organic peroxide vulcanization thereof is preferable. The degree of polymerization of the siloxane-based polymer is 1000 or more,
The so-called millable type is preferable. this is,
Since the shear stress at the time of mixing is moderate, it is presumed that the above-mentioned effects can be more exerted by mixing.
また、アセチレンブラックの配合量は、ポリシロキサ
ンベースポリマーの重合度と得られるシリコーンゴム組
成物の特性により任意に選ばれるものであり、特に限定
はされないが、一般にはポリシロキサンベースポリマー
100重量部に対し1〜500重量部、好ましくは5〜200重
量部の範囲で用いられる。The compounding amount of acetylene black is arbitrarily selected depending on the degree of polymerization of the polysiloxane base polymer and the characteristics of the resulting silicone rubber composition, and is not particularly limited, but generally the polysiloxane base polymer is used.
It is used in the range of 1 to 500 parts by weight, preferably 5 to 200 parts by weight, based on 100 parts by weight.
なお、本発明の導電性シリコーン組成物には、充填
剤、顔料、耐熱性向上剤、難燃剤等を随時付加的に配合
してもよく、本発明の効果を損なわない範囲で他のポリ
オルガノシロキサンを併用してもよい。このようなもの
としては、通常、煙霧質シリカ、沈澱法シリカ、けいそ
う土等の補強性充電剤、酸化チタン、酸化アルミニウ
ム、酸化亜鉛、酸化鉄、酸化セリウム、マイカ、クレ
イ、グラファイト、炭酸亜鉛、炭酸マンガン、水酸化セ
リウム、ガラスビーズ、ポリジメチルシロキサン、アル
ケニル基含有ポリシロキサン等が例示される。The conductive silicone composition of the present invention may be optionally added with a filler, a pigment, a heat resistance improver, a flame retardant, etc., within the range of not impairing the effects of the present invention. Siloxane may be used together. Examples of such substances are usually fumed silica, precipitated silica, reinforcing charging agents such as diatomaceous earth, titanium oxide, aluminum oxide, zinc oxide, iron oxide, cerium oxide, mica, clay, graphite, zinc carbonate. , Manganese carbonate, cerium hydroxide, glass beads, polydimethylsiloxane, alkenyl group-containing polysiloxane, and the like.
(実施例) 以下、本発明の実施例について説明する。なお、以下
の文中における「部」は、全て「重量部」を示すものと
する。(Example) Hereinafter, an example of the present invention will be described. In the following text, all “parts” indicate “parts by weight”.
実施例1 末端がトリメチルシリル基で閉塞され、メチルビニル
シロキサン単位を0.15モル%含有するポリジメチルシロ
キサン(重合度約6000)100部に、カーボンブラックと
して塩酸吸液量が10ml/5gで、ヨウ素吸着量が48mg/gの
アセチレンブラックAを、第1表に示すように60部の割
合でニーダーに仕込み、混練を行ってコンパンドがまと
まってから取出した。Example 1 100 parts of polydimethylsiloxane (polymerization degree of about 6000) whose ends were blocked with trimethylsilyl groups and contained 0.15 mol% of methylvinylsiloxane units had a hydrochloric acid absorption capacity of 10 ml / 5 g as carbon black and an iodine adsorption capacity. 48 mg / g of acetylene black A was charged into a kneader at a ratio of 60 parts as shown in Table 1, kneaded and taken out after the compound was collected.
次いで、これに架橋剤として、2,5−ジメチル−2,5−
ジ−t−ブチルパーオキシヘキサン2部を均一に混合し
てシリコーンゴム組成物を調整した。Then, as a crosslinking agent, 2,5-dimethyl-2,5-
A silicone rubber composition was prepared by uniformly mixing 2 parts of di-t-butylperoxyhexane.
また、本発明との比較として、塩酸吸液量が16ml/5g
で、ヨウ素吸着量が58mg/gのカーボンブラック(アセチ
レンブラックB)と、ヨウ素吸着量が254mg/gのカーボ
ンブラック(ファーネスブラックC)とをそれぞれ用い
て、第1表に示すように上記実施例のシリコーンゴム組
成物と同様にして、比較用の試料組成物(比較例1およ
び比較例2)をそれぞれ調整した。Also, as a comparison with the present invention, the hydrochloric acid absorption amount is 16 ml / 5 g
Then, using carbon black having an iodine adsorption amount of 58 mg / g (acetylene black B) and carbon black having an iodine adsorption amount of 254 mg / g (furnace black C), as shown in Table 1, Comparative sample compositions (Comparative Example 1 and Comparative Example 2) were prepared in the same manner as the silicone rubber composition of Example 1.
このようにして得た各シリコーンゴム組成物をそれぞ
れ用いて、可塑性と得られたゴムの導電特性を以下に示
す方法により評価した。Using each of the silicone rubber compositions thus obtained, the plasticity and the conductive properties of the obtained rubber were evaluated by the methods described below.
組成物の可塑性については、ウィリアムス可塑度をJI
S K 6300(未加硫ゴム物理試験方法)に従って測定して
評価した。For composition plasticity, Williams Plasticity JI
It was measured and evaluated according to SK 6300 (unvulcanized rubber physical test method).
また、これらのコンパウンドを2mm厚シートとして、1
70℃、10分間の条件でプレス加硫を行った後、二次加硫
として200℃、4時間の条件であと加硫を行い、常温に
戻しそれぞれシリコーンゴムシートを得た後、マルチメ
ータ(アドバンテスト(株)社製)を用いて体積抵抗率
を測定した。In addition, these compounds are made into 2mm thick sheet, and 1
After press vulcanization at 70 ° C for 10 minutes, vulcanization was performed as secondary vulcanization at 200 ° C for 4 hours, and after returning to room temperature to obtain silicone rubber sheets, a multimeter ( The volume resistivity was measured using Advantest Corporation.
それらの結果を併せて第1表に示す。 The results are shown in Table 1.
[発明の効果] 以上説明したように本発明によれば、アセチレンブラ
ック配合のシリコーン組成物において、高導電性と良好
な作業性の両条件を満たすことが可能となる。 [Effects of the Invention] As described above, according to the present invention, a silicone composition containing acetylene black can satisfy both conditions of high conductivity and good workability.
Claims (1)
ーン組成物において、 前記カーボンブラックは、塩酸吸液量が12ml/5g以下
で、かつヨウ素吸着量が50mg/g以下のアセチレンブラッ
クであることを特徴とする導電性シリコーン組成物。1. A conductive silicone composition containing carbon black, wherein the carbon black is acetylene black having a hydrochloric acid absorption amount of 12 ml / 5 g or less and an iodine adsorption amount of 50 mg / g or less. And a conductive silicone composition.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11342590A JPH0830146B2 (en) | 1990-04-27 | 1990-04-27 | Conductive silicone composition |
| KR1019910004379A KR950001857B1 (en) | 1990-04-27 | 1991-03-18 | Electroconductive silicone composition |
| US07/689,208 US5164443A (en) | 1990-04-27 | 1991-04-22 | Electroconductive silicone composition |
| KR1019950001043A KR950002530B1 (en) | 1990-04-27 | 1995-01-23 | Silicone ink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11342590A JPH0830146B2 (en) | 1990-04-27 | 1990-04-27 | Conductive silicone composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0411659A JPH0411659A (en) | 1992-01-16 |
| JPH0830146B2 true JPH0830146B2 (en) | 1996-03-27 |
Family
ID=14611911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11342590A Expired - Lifetime JPH0830146B2 (en) | 1990-04-27 | 1990-04-27 | Conductive silicone composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0830146B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9345069B2 (en) | 2010-12-03 | 2016-05-17 | Wood Stone Ideas, Llc | Heat generation and exchange devices incorporating a mixture of conductive and dielectric particles |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5336003A (en) * | 1992-02-20 | 1994-08-09 | Tokyo Electric Co., Ltd. | Label printer |
| JPH05250925A (en) * | 1992-03-02 | 1993-09-28 | Toshiba Silicone Co Ltd | Electrical wire |
-
1990
- 1990-04-27 JP JP11342590A patent/JPH0830146B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9345069B2 (en) | 2010-12-03 | 2016-05-17 | Wood Stone Ideas, Llc | Heat generation and exchange devices incorporating a mixture of conductive and dielectric particles |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0411659A (en) | 1992-01-16 |
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