JPH0831500B2 - Film carrier tape - Google Patents

Description

TECHNICAL FIELD The present invention relates to a film carrier tape suitable for a multi-lead semiconductor device.

[Prior Art] FIG. 7 is a plan view showing a conventional film carrier tape.

The insulating film 6c made of polyimide or the like is formed in a strip shape, and the sprocket holes 1c for transporting and positioning are regularly arranged along the longitudinal direction of the insulating film 6c at the widthwise edge of the insulating film 6c. Has been done. Further, a device hole 3c opened slightly larger than the semiconductor chip 2c to be connected is provided in the center of the insulating film 6c in the width direction. The device holes 3c are also provided at predetermined intervals along the longitudinal direction of the insulating film 6c. Around the device hole 3c, one outer lead bonding hole (hereinafter referred to as an OLB hole) 13 corresponding to one side of the device hole 3c.
c is formed in a trapezoidal shape.

On the insulating film 6c, a lead made of metal foil such as copper
4c is formed in a predetermined pattern. One end of this lead 4c is led out to the inside of the device hole 3c, and this lead 4c crosses over the OLB hole 13c and is connected to an electric selection pad 5c formed outside the OLB hole 13c. There is.

This film carrier tape is manufactured as follows.

First, the device hole 3c, the OLB hole 13c, and the sprocket hole 1c are formed in the insulating film 6c such as polyimide. Next, a metal foil such as copper is deposited on the insulating film 6c. Next, the lead 4c and the electric selection pad 5c are formed by forming the metal foil into a predetermined shape by etching or the like. As a result, the film carrier tape is completed.

8 and 9 are sectional views showing a method of connecting the above-described conventional film carrier tape and a semiconductor chip.

The semiconductor chip 2c is provided in advance with bumps 7c, which are metal protrusions, on the electrode terminals on the upper surface thereof. This semiconductor chip 2c is connected to the device hole 3c of the film carrier tape.
And the leads 4c and the bumps 7c are bonded (inner lead bonding) by a thermocompression bonding method or a eutectic method.

In this case, in order to prevent the deformation of the tips of the leads 4c, a suspender 8c, which is a frame of the insulating film 6c, may be provided in the vicinity of the tips of the leads as shown in FIG. Further, in order to improve reliability and mechanical protection of the semiconductor device, as shown in FIG. 9, resin 9a may be potted on the semiconductor chip 2c to seal the electrode terminal forming surface of the semiconductor chip 2c with resin. is there.

After that, a contact of a testing device is brought into contact with the electric selection pad 5c to perform electric selection and a bias test.

The film carrier tape type semiconductor device manufactured in this way is mounted on a printed circuit board as follows.

FIG. 10 is a cross-sectional view showing a method of mounting the film carrier tape type semiconductor device. First, lead 4c to OLB hole 1
3c is cut along the edge of the side far from the semiconductor chip 2c. Then, the semiconductor chip 2c is bonded to a predetermined position on the printed circuit board 11c with the adhesive 10c with its electrode terminal forming surface facing upward.

Next, the lead 4c is joined to the bonding pad 12c formed on the printed board 11c (outer lead bonding). This completes the mounting of the semiconductor device.

The use of the film carrier tape has an advantage that the bonding speed is fast because the inner lead bonding can be processed at one time regardless of the number of the leads 4c. Further, since the sprocket hole 1c can carry and position the sprocket hole 1c, there is an advantage that the work can be easily automated.

[Problems to be Solved by the Invention] However, in the conventional film carrier tape, since the leads 4c are thin and thin, the leads are easily deformed, and the mounting work is complicated or complicated.
In particular, when the number of leads 4c is large, the arrangement pitch of the leads 4c is small and the interval between the leads 4c is narrow, so if the leads 4c are connected to the bonding pads 12c by soldering, for example, a solder bridge is formed between the leads 4c. Are likely to be formed, and inconvenience such as short circuit may occur.

In general, the mounting of a semiconductor device by soldering is considered to be a limit for stable mounting when the lead tip pitch of the semiconductor device is 0.5 mm. However, when manufacturing a multi-lead semiconductor device having leads of 200 to 300 pins or more using a conventional film carrier tape, it is necessary to increase the area of the semiconductor device if the lead tips are arranged at a pitch of 0.5 mm. is there.

In recent years, the number of leads of a semiconductor device has been remarkably increased with the improvement of its capability. In the case of a film carrier tape type semiconductor device, the inner lead side can easily cope with the increase of the number of leads. On the lead side, the increase in the number of leads is restricted. That is, the semiconductor device using the conventional film carrier tape has the same mounting density as other packages, and has a problem that it is difficult to mount because the leads are thin.

The present invention has been made in view of the above problems, and provides a film carrier tape capable of high-density mounting while suppressing an increase in the area of the semiconductor device even in a semiconductor device having multiple leads. With the goal.

[Means for Solving the Problems] A film carrier tape according to the first invention of the present application is an insulating film, a rectangular device hole provided in the insulating film, and one side of the device hole around the device hole. And two or more first outer lead bonding holes formed on the insulating film, and a second outer lead bonding hole formed in a region outside the first outer lead bonding holes. A plurality of ones of which one end is led out to the inside of the device hole and the other end of which selectively crosses over either one of the first outer lead bonding hole and the second outer lead bonding hole. And a lead.

The film carrier tape according to the second invention of the present application is provided with an insulating film, a rectangular device hole provided in the insulating film, and two or more around the device hole with respect to one side of the device hole. The outer lead bonding hole, one end of which is formed on the insulating film and is led out to the inside of the device hole, and the other end of the outer lead bonding hole is closer to the device hole, and the side opposite to the side. A plurality of leads led out inside the outer lead bonding hole, and the other end of the lead is arranged in a zigzag manner in the outer lead bonding hole.

[Operation] In the first invention of the present application, two or more first OLB holes are provided around the device hole for one side of the device hole. A second OLB hole is provided outside the first OLB hole. Then, the lead selectively crosses over either the first OLB hole or the second OLB hole. That is, the lead crossing the first OLB hole is the same as the conventional one.
It extends to the edge of the device hole side of the B hole and crosses over the first OLB hole. Then, the lead that crosses the second OLB hole is, for example, wired between the two first OLB holes, and the leads that cross the first OLB hole do not cross the second OLB hole.
It extends to the edge of the second OLB hole and crosses over the second OLB hole.

The film carrier tape of the present invention has such a structure, and the semiconductor chip and the lead are inner lead bonded in the same manner as in the conventional case. Then, when mounted on a substrate, the outer lead side of the lead is cut at edges of the first and second OLB holes on the side far from the device hole, and is molded and mounted in a predetermined shape. That is, at the time of outer lead bonding, the leads of the first OLB hole and the leads of the second OLB hole are arranged in two rows and arranged on the substrate. As a result, the distance between the tips of the leads becomes larger than in the conventional case, and it is possible to suppress the occurrence of solder bridges or the like during mounting. In addition, the size of the semiconductor device is prevented from being limited by the mounting conditions, and high-density mounting of the semiconductor device is achieved.

In the second invention of the present application, the lead tips on the OLB hole side are arranged in a zigzag pattern and are led out from the two opposite sides of the OLB hole to the inside of the OLB hole. That is, in the OLB hole, the lead tips are arranged so that the leads drawn from the other side of the OLB hole are aligned with the central position between the leads drawn from the one side of the OLB hole.

In this case, one lead is led out to the OLB hole from the device hole side as in the conventional case. For example, the other lead is wired between two OLB holes and is located far from the device hole. It extends to the edge of and is led into the OLB hall from this edge. As a result, similarly to the first invention of the present application, the lead interval can be increased as compared with the conventional case, inconveniences such as solder bridges can be avoided, and high integration of the semiconductor device can be achieved.

[Embodiment] Next, an embodiment of the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a plan view showing a film carrier tape according to an embodiment of the first invention of the present application.

In the insulating film 6a, as in the conventional case, sprocket holes 1a for transporting and positioning are regularly arranged and drilled at the edge portion in the width direction, and the semiconductor chip 2a is arranged at the center in the width direction. A device hole 3a is provided.

Two first OLB holes 13a are formed around the device hole 3a with respect to one side of the device hole 3a.
The first OLB hole 13a is a trapezoid having one oblique side, and has a shape obtained by dividing the OLB hole of the conventional film carrier tape into two in a direction orthogonal to the side of the device hole 3a.

Two second OLB holes 14a are formed outside the first OLB hole 13a with respect to one side of the device hole 3a. The shape of the second OLB hole 14a is rectangular.

One end of the lead 4a is led out inside the device hole 3a. The leads 4a arranged at the center of each side of the device hole 3a are the two first OLB holes 13a.
Between the second OLB hole 14a and the electric selection pad 5a formed outside the second OLB hole 14a. In addition, the lead 4a arranged on the corner side of the device hole 3b traverses over the first OLB hole 13a and is connected to an electric selection pad 5a formed outside the first OLB hole 13a. .

FIG. 2 is a sectional view showing a state in which a semiconductor chip is connected to the film carrier tape according to this embodiment.

The semiconductor chip 2a is arranged in the center of the device hole 3a. Bumps 7a are provided on the electrode terminals formed on the upper surface of the semiconductor chip 2a, and the bumps 7a are inner lead bonded to the leads 4a. Then, the upper surface of the semiconductor chip 2a is sealed with, for example, the resin 9a.

FIG. 3 is a sectional view showing a method for mounting a semiconductor device using the film carrier tape according to this embodiment.

First, the lead 4a and the insulating film 6a are cut along the edge of the second OLB hole 14a on the side far from the device hole 3a. Next, the lead 4b is molded into a culving shape. That is, the lead 4a is bent substantially vertically at the edges of the first and second OLB holes 13a, 14a on the side close to the device hole, and
The tip of the lead 4a is bent so as to be parallel to the insulating film 6a. Then, if necessary, the upper surface of the semiconductor chip 2a is sealed with a resin 9a as shown in FIG.

Next, the semiconductor chip 2a is bonded to a predetermined position on the printed board 11a having the bonding pad 12a by the adhesive 10a. Then, the leads 4a are collectively outer lead bonded.

In this embodiment, the plurality of leads 4a is the first OLB.
Since the holes 13a and the second OLB holes 14a are arranged so as to be dispersed, the distance between the tips of the leads 4a on the outer lead side can be increased as compared with the conventional case. Therefore, it is possible to avoid the occurrence of inconvenience such as a solder bridge when mounting the semiconductor device. Therefore, the restriction on the size of the semiconductor device is eliminated, so that the semiconductor device can be downsized.

FIG. 4 is a plan view showing a film carrier tape according to an embodiment of the second invention of the present application.

Also in the insulating film 6b of the present embodiment, as in the conventional case, the sprocket holes 1b are regularly arranged at the edges in the longitudinal direction, and the rectangular device holes 3b provided in the center portion in the width direction are provided. Has been.

Two OLB holes 13b are provided around this device hole 3b for each side of the device hole 3b.
The shape of this OLB hole 13b is a trapezoid with one hypotenuse,
It is a shape obtained by dividing the OLB hole of a conventional film carrier tape in two. Lead 4b formed on insulating film 6b
One of the ends is led out to the inside of the device hole 3b. Then, the leads 4b arranged on the corner side of the device hole 3b are connected to the electric selection pad 5b provided on the edge of the OLB hole 13b on the side closer to the device hole 3b. It leads out into the hole 13b. Further, the remaining leads 4b are wired between the OLB holes 13b and are connected to the electric selection pad 5b provided on the edge of the OLB hole 13b far from the device hole 3b. It has been led into the OLB hall 13b from. These leads 4b are arranged in a staggered manner in the OLB hole 13b. Therefore, the tips of the leads 4b are relatively distant from each other.

FIG. 5 is a sectional view showing a state in which a semiconductor chip is connected to the film carrier tape according to this embodiment.

In this embodiment, the semiconductor chip 2b is arranged in the center of the device hole 3b, and the bump 7b and the lead 4b of the semiconductor chip 2b are inner lead bonded. afterwards,
The upper surface of the semiconductor chip 2b is sealed with resin 9b.

FIG. 6 is a sectional view showing a method for mounting a semiconductor device using the film carrier tape according to this embodiment.

First, the film carrier tape is cut outside the OLB hole 13b without cutting the lead 4. Then, the lead 4b is formed into a predetermined culving shape.

Next, the semiconductor chip 2b is adhered to the printed board 11b on which the bonding pad 12b is formed by the adhesive material 10b. Then, the leads 4b are collectively OLBed. This completes the mounting of the semiconductor device.

Also in this embodiment, the same effect as that of the first embodiment can be obtained.

[Effects of the Invention] As described above, according to the first invention of the present application, the first and second OLB holes are provided around the device hole, and the plurality of leads have the first and second OLB holes. Since they are distributed in the OLB holes, the distance between the lead tips on the outer lead side is larger than before. For this reason, short-circuit defects during outer lead bonding are suppressed. In addition, since the size of the semiconductor chip is prevented from being restricted by the restrictions at the time of mounting, the semiconductor device can be downsized, and high-density mounting of the semiconductor device can be achieved.

According to the second invention of the present application, the outer lead bonding side tips of the leads are led out to the two opposite sides of the OLB hole or to the inside of the OLB hole, and these lead tips are arranged in a staggered pattern. Therefore, the distance between the tip ends of the leads is larger than the conventional one. Therefore, similar to the first invention of the present application, short-circuit defects during outer lead bonding can be suppressed and high-density mounting of semiconductor devices can be achieved.

[Brief description of drawings]

FIG. 1 is a plan view showing a film carrier tape according to an embodiment of the first invention of the present application, FIG. 2 is a sectional view showing a state in which a semiconductor chip is connected to the film carrier tape, and FIG. FIG. 4 is a sectional view showing a method of mounting a semiconductor device using a tape, FIG. 4 is a plan view showing a film carrier tape according to an embodiment of the second invention of the present application, and FIG. 5 is a semiconductor chip connected to the film carrier tape. FIG. 6 is a sectional view showing a state, FIG. 6 is a sectional view showing a mounting method of a semiconductor device using the film carrier tape, FIG. 7 is a plan view showing a conventional film carrier tape, and FIGS. Similarly, a cross-sectional view showing the method of connecting the film carrier tape and the semiconductor chip, FIG. 10 is a conventional film carrier tape type semiconductor device mounting Law is a cross-sectional view showing a. 1a, 1b, 1c; sprocket hole, 2a, 2b, 2c; semiconductor chip, 3a, 3b, 3c; device hole, 4a, 4b, 4c; lead, 5a, 5
b, 5c; electric sorting pad, 6a, 6b, 6c; insulating film, 7a, 7b,
7c; bump, 8c; suspender, 9a, 9b, 9c; resin, 10a, 10b, 1
0c; adhesive, 11a, 11b, 11c; printed circuit board, 12a, 12b, 12c;
Bonding pad, 13a, 13b, 13c, 14a; Outer lead bonding hole

Claims (2)

[Claims] 1. An insulating film, a rectangular device hole provided in the insulating film, and a first outer lead bonding hole provided around the device hole in two or more per side of the device hole. And a second outer lead bonding hole formed in a region outside the first outer lead bonding hole, and one end of the second outer lead bonding hole formed on the insulating film and led out to the inside of the device hole and the other end. A plurality of leads selectively traversing over either one of the first outer lead bonding hole and the second outer lead bonding hole. 2. An insulating film, a rectangular device hole provided in the insulating film, two or more outer lead bonding holes provided around the device hole for one side of the device hole, Formed on an insulating film, one end of which is led out to the inside of the device hole, and the other end of which is from the side of the outer lead bonding hole close to the device hole and the side opposite to this side to the inside of the outer lead bonding hole. A film carrier tape having a plurality of leads led out, the other ends of the leads being arranged in a zigzag manner in the outer lead bonding holes.