JPH083156B2 - Alloy plating equipment - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an alloy plating apparatus for alloy-plating a plurality of metals on a steel wire used for rubber reinforcement of an automobile tire, for example.

[Conventional technology]

The conventional alloy plating method using the alloy plating equipment is
For example, in the case of plating two different metals, pretreatment such as degreasing, washing with water, pickling, etc. is performed on the material to be plated that has been drawn out from the reel, etc., and then the first plating bath,
The first layer and the second layer are sequentially plated with a second plating bath, washed with water, dried, and then subjected to a thermal diffusion treatment by a thermal diffusion heating device to obtain an alloy plating.

[Problems to be Solved by the Invention]

Generally, the composition ratio (elemental composition) of the alloy plating, the film thickness and the composition ratio of the alloy phase (crystal structure composition), etc., required for the steel wire used for gum reinforcement of automatic tires, etc. Subtly different materials are required depending on the adhesiveness, the type of rubber material, and the wire drawing workability in the subsequent process.

FIG. 2 is a phase diagram (I-nteratio) of an alloy of Cu and Zn.
nal Critical Tables Vol.2 p.435 M-cGRAW-HILL B
OOK COMPANY, INC. 1927), in which the horizontal axis represents the proportion of Zn contained in the alloy and the vertical axis represents the temperature applied to the alloy. As is clear from this figure, for example, even when the temperature is kept constant at 700 ° C, the Zn ratio becomes α phase at 30%, β phase at 50%, and conversely the ratio of Cu to Zn in the alloy. The same thing occurs when the temperature is changed while keeping the value constant.

Therefore, in order to arbitrarily control the composition ratio of the alloy plating, the film thickness, the composition ratio of the alloy phase, and the like, it is necessary to control the plating device and the thermal diffusion heating device with high accuracy.

However, in the above-described conventional alloy plating method, the plating current to each plating bath and the thermal diffusion amount of the thermal diffusion heating device are set to predetermined values in advance, and the surface condition of the material to be plated or the operating state It is not possible to accurately deal with such factors as the minute vibration of the material to be plated, the fluctuation of the plating current or the amount of heat diffusion due to long-term operation. Therefore, it has been very difficult to uniformly obtain the required composition ratio of alloy plating, film thickness, composition ratio of alloy phase, and the like.

In order to solve the above-mentioned drawbacks, the energy dispersive fluorescent X-ray analyzer is used to detect the characteristic X-rays of various metals alloy-plated on the material to be plated before the heat diffusion treatment by the heat diffusion heating device, A method of controlling the plating current by this signal (see JP-A-60-96753) and the fluorescent X before or after the thermal diffusion treatment by the thermal diffusion heating device.
A method for detecting characteristic X-rays of various metals alloy-plated on a material to be plated by a line analyzer and controlling the amount of thermal diffusion of the thermal diffusion heating device by this signal (see Japanese Patent Laid-Open No. 61-60877). There is.

However, in the method of controlling the plating current by the detected characteristic X-ray signal, the composition ratio and the plating thickness of the alloy can be controlled, but since the thermal diffusion treatment is not performed by the thermal diffusion heating device, the composition of the alloy phase is The ratio cannot be controlled. Further, in the method of controlling the thermal diffusion amount of the thermal diffusion heating device by the signal of the characteristic X-ray, the detected characteristic X-ray is
Since the composition ratio of the alloy phase is unknown, it is considered impossible to actually control the amount of thermal diffusion.

The present invention has been made in consideration of the above matters, and an object thereof is to obtain a composition ratio of alloy plating, a film thickness, a composition ratio of alloy phases, etc. arbitrarily and uniformly. To provide a gold plating device.

[Means for solving the problem]

In order to achieve the above-mentioned object, the present invention is to perform multi-layer plating of a plurality of different metals on a material to be plated by a plurality of plating devices, then wash with water and dry, and then perform heat diffusion heating on the metal plating layer. In an alloy plating apparatus for thermally diffusing an apparatus to obtain an alloy plating, an energy dispersive X-ray analysis apparatus is provided after the thermal diffusion heating apparatus, and the alloy plating layer is irradiated with X-rays for alloy plating. After detecting the fluorescent X-rays and the diffracted X-rays from the layer and converting the respective signals into control signals, the plating apparatus is controlled by the control signals by the fluorescent X-rays, and the heat by the control signals by the diffracted X-rays. The feature is that the diffusion heating device is controlled.

[Action]

In the alloy plating apparatus having the above structure, the composition ratio and film thickness of the alloy plating can be known based on the fluorescent X-rays from the alloy plating layer, and the alloy plating layer of the alloy plating layer can be detected based on the diffracted X-rays from the alloy plating layer. The composition ratio can be known. Then, data relating to the composition ratio and film thickness of the predetermined alloy plating, the composition ratio of the alloy phase, etc. is input to the microcomputer. The information (measured value) obtained by the fluorescent X-rays and the diffracted X-rays is compared with the above-mentioned data, and a control signal by the fluorescent X-rays is sent to the plating device to control it, while a control by the diffracted X-rays is performed. A signal is sent to the thermal diffusion heater to control it.

By doing so, it is possible to always apply a constant alloy plating to the material to be plated, the composition ratio of the alloy plating,
The film thickness and the composition ratio of the alloy phase can be controlled with high accuracy.

〔Example〕

 Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows an example of the configuration of an alloy plating apparatus according to the present invention. In FIG. 1, 1 is a material to be plated, 2 is a pretreatment device for pretreating the material to be plated 1, and 6 is a plating power source 3. The plating apparatus includes a plating bath 4 and a plating bath 5 that are driven and controlled. Further, 7 is a water washing device, 8 is a drying device, 9 is a thermal diffusion heating device, and an energy dispersive X-ray analysis device 10 is provided behind it. 11
Is a microcomputer for converting a signal from the energy dispersive X-ray analyzer 10 into a control signal and transmitting the control signal to the plating device 6 and the thermal diffusion heating device 9.

For example, when plating two types of different metals (Cu and Zn), the pretreatment device 2 performs pretreatment such as degreasing, washing with water, and pickling on the material to be plated 1 drawn out from the feeding reel (not shown), and then Cu and Zn are sequentially plated by the plating bath 4 and the plating bath 5, and after passing through a washing device 7 and a drying device 8, a thermal diffusion treatment is performed by a thermal diffusion heating device 9.

In the alloy plating step, an X-ray tube provided in the energy dispersive X-ray analyzer 10 after thermal diffusion treatment.
The alloy plating layer is irradiated with the primary X-rays from 12, and the fluorescent X-rays and diffracted X-rays from the alloy plating layer are detected by, for example, a semiconductor detector, and then the respective signals are detected by the microcomputer 11. Convert to control signal.

Here, the composition ratio and film thickness of the alloy plating can be obtained by fluorescent X-rays and the composition ratio of the alloy plating phase can be obtained by diffraction X-rays, respectively. When the data such as the composition ratio is input to the microcomputer 11 and the measured value is different from the measured data, the control signal a by the fluorescent X-ray is fed back from the microcomputer 11 to the plating power source 3, For example, the plating current is adjusted. Further, the control signal b by the diffracted X-ray is also fed back from the microcomputer 11 to the thermal diffusion heating device 9 to adjust the thermal diffusion amount.

In the embodiments of the present invention, the case of plating two kinds of different metals has been described above, but it goes without saying that the present invention is applied to the case of plating three or more kinds of metals.

〔The invention's effect〕

As described above, in the alloy plating apparatus of the present invention, an energy dispersive X-ray analysis device is provided at the subsequent stage of the thermal diffusion heating device, and X-rays are collated with the alloy plating layer.
After detecting fluorescent X-rays and diffracted X-rays from the alloy plating layer and converting each signal into a control signal, the plating device is controlled by the control signal by the fluorescent X-ray, and the heat is generated by the control signal by the diffracted X-ray. Since the diffusion heating device is controlled, the plating device and the thermal diffusion heating device can be independently adjusted.

Therefore, it is of course possible to apply a constant alloy plating to the material to be plated, and also to control the composition ratio of the alloy plating, the film thickness, and the composition ratio of the alloy phase with high accuracy. A desired alloy plating can be applied.

[Brief description of drawings]

FIG. 1 is a main configuration diagram of an alloy plating apparatus showing an embodiment of the present invention. FIG. 2 is a phase diagram of a Cu—Zn alloy. 1 ... Material to be plated, 6 ... Plating device, 7 ... Water washing device, 8 ... Drying device, 9 ... Thermal diffusion heating device, 10 ...
Energy dispersive X-ray analyzer.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display location C25D 17/00 L 21/12 A

Claims (1)

[Claims] 1. A plurality of different metals are plated on a material to be plated in a plurality of layers by a plurality of plating devices, followed by washing with water and drying, and then heat diffusion to the metal plating layer by a heat diffusion heating device, In an alloy plating apparatus for obtaining alloy plating, an energy dispersive X-ray analysis device is provided after the thermal diffusion heating device, and the alloy plating layer is irradiated with X-rays, and fluorescent X-rays from the alloy plating layer are obtained. And diffraction X
After detecting the lines and converting each signal into a control signal,
An alloy plating apparatus, wherein the plating apparatus is controlled by a control signal by fluorescent X-rays, and the thermal diffusion heating apparatus is controlled by a control signal by diffracted X-rays.