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JPH0831702B2 - Housing for mounting electronic components - Google Patents
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JPH0831702B2 - Housing for mounting electronic components - Google Patents

Housing for mounting electronic components

Info

Publication number
JPH0831702B2
JPH0831702B2 JP61146866A JP14686686A JPH0831702B2 JP H0831702 B2 JPH0831702 B2 JP H0831702B2 JP 61146866 A JP61146866 A JP 61146866A JP 14686686 A JP14686686 A JP 14686686A JP H0831702 B2 JPH0831702 B2 JP H0831702B2
Authority
JP
Japan
Prior art keywords
housing
mounting
component
fan
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP61146866A
Other languages
Japanese (ja)
Other versions
JPS634698A (en
Inventor
隆 田部井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP61146866A priority Critical patent/JPH0831702B2/en
Publication of JPS634698A publication Critical patent/JPS634698A/en
Publication of JPH0831702B2 publication Critical patent/JPH0831702B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は電子部品の実装用筐体に係り、特に低騒音で
冷却効果を良好ならしめるのに好適な電子部品の実装用
筐体に関する。
The present invention relates to a housing for mounting electronic components, and more particularly to a housing for mounting electronic components suitable for achieving low noise and good cooling effect.

〔従来の技術〕[Conventional technology]

従来、低騒音で冷却効果を向上させる電子部品の実装
用筐体の例として、「日経バイト」1981年1月号、P.15
6、図3(日本経済新聞社)に示されるものが公知であ
る。かかる実装用筐体は、第2図にその概略を示すよう
に、筐体1の外壁にファン3を取り付けたものであり、
その動作は筐体内の高温空気を外部へ吸い出すか(第2
図(a))、あるいは外部の低温空気を内部へ吹き出す
(第2図(b))方策をとっている。しかし、これらは
低騒音と筐体内部の均一冷却については配慮されていな
かった。
The Nikkei Byte, January 1981, p. 15 has been used as an example of a conventional housing for mounting electronic components that improves cooling effect with low noise.
6, those shown in FIG. 3 (Nikkei Inc.) are known. As shown in the outline of FIG. 2, the mounting case has a fan 3 attached to the outer wall of the case 1.
Does the operation suck out the hot air in the housing to the outside?
As shown in FIG. 2 (a), or outside low temperature air is blown into the inside (FIG. 2 (b)). However, they did not consider low noise and uniform cooling inside the housing.

〔発明が解決しようとする問題点〕[Problems to be solved by the invention]

上記従来技術は、前述のように低騒音と装置内部の均
一冷却の点について配慮がされておらず、フアンが筐体
外壁に取り付けられているためフアンの回転音及び風切
音が直接外部に出て騒音のレベルが高くなるという問題
点があった。さらに第2図(a)の方式では、筐体内の
空気は平均的に流れるが、風速が遅いために筐体内の一
部に特に大きな発熱部があると冷却が十分でなくなり、
また第2図(b)の方式では、フアンの直前では風速も
早く冷却効率もよいが、それ以外のところに風の流れな
い場所ができて熱が篭り、異常な高温となって電子機器
の信頼性を下げるという問題点を生じていた。
As described above, the above-mentioned conventional technology does not consider low noise and uniform cooling of the inside of the apparatus, and since the fan is attached to the outer wall of the housing, the rotation noise and wind noise of the fan are directly exposed to the outside. There was a problem that the level of noise increased when coming out. Further, in the method of FIG. 2 (a), the air in the housing flows on average, but the wind speed is slow, so if there is a particularly large heat generating part in a part of the housing, cooling will not be sufficient,
Further, in the method of FIG. 2 (b), the wind speed is fast and the cooling efficiency is good just before the fan, but there is a place where the wind does not flow in other places, heat is gathered, and the temperature becomes abnormally high. There was a problem of reducing reliability.

本発明の目的は、フアンによる騒音を低下させるとと
もに、筐体内部の冷却を効率化させる新規な電子部品の
実装用筐体を提供することにある。
An object of the present invention is to provide a novel housing for mounting electronic components that reduces noise due to a fan and that efficiently cools the inside of the housing.

〔問題点を解決するための手段〕[Means for solving problems]

上記目的は、電子部品を実装するための筐体を2つの
小室に区分する隔壁と、該隔壁に設置され、一方の小室
における電子部品の冷却が吸い出し冷却であり、他方の
小室における電子部品の冷却が吹き出し冷却となる冷却
用フアンを具備することにより達成される。
The above-mentioned object is to partition a housing for mounting electronic parts into two small chambers, and to install cooling liquid in one small chamber to suck out cooling, and to install the electronic parts in the other small chamber. This is accomplished by providing a cooling fan that provides blow-off cooling.

〔作 用〕[Work]

電子部品を実装するための筐体は、冷却用フアンが設
置された隔壁により2つの小室に区分され、前記冷却用
フアンにより、一方の小室は吸い出し冷却、他方の小室
は吹き出し冷却とされる。そして、前記一方の小室には
例えば非発熱性電子部品が、前記他方の小室には発熱性
電子部品がそれぞれ実装される。
A housing for mounting electronic components is divided into two small chambers by a partition wall provided with a cooling fan, and one small chamber is sucked and cooled and the other small chamber is blown and cooled by the cooling fan. Then, for example, a non-heat-generating electronic component is mounted in the one small chamber, and a heat-generating electronic component is mounted in the other small chamber.

〔実施例〕〔Example〕

以下、本発明の一実施例を第1図により説明する。第
1図において、1は実装用筐体であり、通常四角形状を
なしている。その内部領域は、2つの小室A,Bを構成す
るように筐体中程の位置で隔壁2により区切られてい
る。該隔壁2の中央部にはフアン3が取付けられ、その
回転は空気流がA室では吸出し冷却、B室では吹出し冷
却であるようにセットされる。
An embodiment of the present invention will be described below with reference to FIG. In FIG. 1, reference numeral 1 denotes a mounting housing, which is usually in the shape of a quadrangle. The inner region is partitioned by a partition wall 2 at a middle position of the housing so as to form two small chambers A and B. A fan 3 is attached to the center of the partition wall 2 and its rotation is set so that the air flow is suction cooling in the chamber A and blow cooling in the chamber B.

前記A室には、フロッピーディスク4、ハードディス
ク5やIC,LSI等を搭載したプリント基板5,6…など、全
く発熱しないか、発熱しても発熱量の比較的少ない電子
部品が実装され、B室にはフアン3の正面にパワートラ
ンジスタ7、該パワートランジスタの熱の放熱フィン8
を含む電源装置など、前記電子部品に比較すれば発熱量
の多い電子部品が実装される。
In the chamber A, electronic components such as a floppy disk 4, a hard disk 5, and printed circuit boards 5, 6 on which ICs, LSIs, etc. are mounted, which do not generate heat at all, or generate a relatively small amount of heat, are mounted. The chamber has a power transistor 7 in front of the fan 3 and a heat radiation fin 8 for heat of the power transistor.
An electronic component, such as a power supply device including the above, that generates a large amount of heat as compared with the electronic component is mounted.

A室側の前記フアン3と対面すめ実装用筐体1の側面
の可成りの面にわたって空気吸入口9を設け、またB室
側ではフアン3による空気流と直交する筐体1の側面に
空気吐出口10を設ける。
An air inlet 9 is provided over a considerable side surface of the housing 3 for mounting mounting facing the fan 3 on the chamber A side, and on the side of the chamber B, air is provided on the side surface of the housing 1 orthogonal to the air flow by the fan 3. A discharge port 10 is provided.

なお、必要に応じてB室の内側等に吸音材11を張り付
け、また前記空気吐出口10に平行に防音壁12を設ける。
If necessary, a sound absorbing material 11 is attached to the inside of the chamber B or the like, and a soundproof wall 12 is provided in parallel with the air outlet 10.

上記構成において、フアン3の回転により空気は吸入
口9から吸入され、A室を経てB室へ流れ、吐出口10、
10から吐出される。このとき、A室において空気は、筐
体側面の可成りの面にわたって設けられた吸入口9から
広く吸入される。このため均一に空気流が形成され、空
気の淀むところはなくなり、平均的にA室内の電子部品
を冷却することとなる。
In the above structure, the rotation of the fan 3 sucks air from the suction port 9, flows through the chamber A to the chamber B, and the discharge port 10,
It is discharged from 10. At this time, in the room A, the air is widely sucked through the suction port 9 provided over a considerable surface of the housing. For this reason, an air flow is uniformly formed, there is no place where air stagnates, and the electronic components in the A room are cooled on average.

またA室を通過する空気は、該室において殆ど加熱さ
れることなくB室へ吹出されるが、高発熱部品が収納さ
れるB室では、吹出しによる速い風速(2m/s以上)で冷
却されるため、吹出しによる遅い風側(一般に0.5m/s以
下)に比べ約2倍以上の冷却効果が得られる。しかもこ
のようなB室に吹出される空気流は、フアン3の正面に
設置されるパワートランジスタ7に当って互に相反する
2方向へ進んで外へ吐出される。このためB室内での空
気の淀みはなくなる。さらにフアン3が筐体の内奥にあ
る隔壁2に設置されていることと、吸音材11並びに防音
壁12とにより消音効果を高め、低騒音化を図ることがで
きる。
Further, the air passing through the room A is blown into the room B with almost no heating in the room, but in the room B where high heat-generating components are stored, the air is cooled at a high wind speed (2 m / s or more) due to the blowing. Therefore, the cooling effect is about twice or more compared to the slow wind side (generally 0.5 m / s or less) due to the blowing. Moreover, such an air flow blown into the chamber B hits the power transistor 7 installed in front of the fan 3, advances in two directions opposite to each other, and is discharged to the outside. Therefore, the stagnation of air in the B room is eliminated. Further, the fan 3 is installed in the partition wall 2 in the inner part of the housing, and the sound absorbing material 11 and the soundproof wall 12 enhance the sound deadening effect, and the noise can be reduced.

〔発明の効果〕〔The invention's effect〕

本発明によれば、吸出し冷却により均一に風が流れ空
気が淀む所が無いため平均的に全体を冷却でき、また吹
出し冷却により特に発熱の大きいものに対し早い速度の
風を吹き付けるために、筐体全体として高い冷却効果を
得ることができる。さらにフアンが筐体の外壁に取付け
られていないために、フアンの回転音および風切音が直
接外部に出ず、低騒音化することができる。
According to the present invention, the whole body can be cooled on average because the air flows uniformly by suction cooling and there is no place where the air stagnates. A high cooling effect can be obtained for the whole body. Further, since the fan is not attached to the outer wall of the housing, the fan's rotation noise and wind noise do not directly come out to the outside, and noise can be reduced.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明による実装用筐体の平面図、第2図
(a)、(b)は従来技術による筐体の説明図である。 1……実装用筐体、2……隔壁、 3……冷却用フアン、4……フロツピーディスク、 5……ハードディスク、6……プリント基板、 7……パワートランジスタ、8……放熱用フィン、 11……吸音材、12……防音壁。
FIG. 1 is a plan view of a mounting housing according to the present invention, and FIGS. 2 (a) and 2 (b) are explanatory views of a conventional housing. 1 ... Mounting case, 2 ... Partition wall, 3 ... Cooling fan, 4 ... Floppy disk, 5 ... Hard disk, 6 ... Printed circuit board, 7 ... Power transistor, 8 ... Heat dissipation fin , 11 …… Sound absorbing material, 12 …… Soundproof wall.

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】電子部品と、該電子部品に給電するための
電源部品を実装する電子部品の実装用筐体において、 前記電源部品を収納するエリアを前記電子部品を収納す
るエリアと分ける隔壁を設け、 該隔壁にファンを設置し、 前記電子部品を収納するエリアの前記筐体に吸入口を設
け、 前記電源部品を収納するエリアの前記筐体には吐出口の
みを設け、 前記ファンにより前記電子部品の冷却を吸い込み冷却に
より、前記電源部品の冷却を吹き出し冷却により行うこ
とを特徴とする電子部品の実装用筐体。
1. A housing for mounting an electronic component on which an electronic component and a power source component for supplying power to the electronic component are mounted, a partition wall separating an area for accommodating the power source component from an area for accommodating the electronic component. A fan is installed on the partition wall, an inlet is provided in the housing in an area for storing the electronic component, and only a discharge port is provided in the housing in an area for storing the power supply component. A housing for mounting electronic components, wherein cooling of electronic components is performed by suction and cooling of the power source components is performed by blowout cooling.
【請求項2】特許請求の範囲第1項記載の電子部品の実
装用筐体において、前記ファンの吹き出し口付近に電源
部品のうちでも高発熱部品であるパワートランジスタを
実装することを特徴とする電子部品の実装用筐体。
2. The electronic component mounting housing according to claim 1, wherein a power transistor, which is a high heat generating component among the power source components, is mounted near the outlet of the fan. Housing for mounting electronic components.
【請求項3】特許請求の範囲第1項記載の電子部品の実
装用筐体において、前記吐出口は、前記ファンによる風
向きに対し直行する方向の筐体側面に設けたことを特徴
とする電子部品の実装用筐体。
3. The electronic component mounting housing according to claim 1, wherein the discharge port is provided on a side surface of the housing perpendicular to a wind direction of the fan. Housing for mounting parts.
【請求項4】特許請求の範囲第1項記載の電子部品の実
装用筐体において、前記電源部品を収納するエリア内の
前記吐出口を除く部分に消音用設備を施していることを
特徴とする電子部品の実装用筐体。
4. A housing for mounting an electronic component according to claim 1, wherein a part for excluding the discharge port in an area for accommodating the power source component is provided with a sound deadening facility. A housing for mounting electronic components.
【請求項5】特許請求の範囲第4項記載の電子部品の実
装用筐体において、前記消音用設備は、前記電源部品を
収納するエリアの内壁の殆どの部分に設置された吸音材
であることを特徴とする電子部品の実装用筐体。
5. The housing for mounting electronic parts according to claim 4, wherein the sound deadening equipment is a sound absorbing material installed on most of an inner wall of an area for housing the power supply parts. A housing for mounting electronic parts, which is characterized in that
JP61146866A 1986-06-25 1986-06-25 Housing for mounting electronic components Expired - Fee Related JPH0831702B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61146866A JPH0831702B2 (en) 1986-06-25 1986-06-25 Housing for mounting electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61146866A JPH0831702B2 (en) 1986-06-25 1986-06-25 Housing for mounting electronic components

Publications (2)

Publication Number Publication Date
JPS634698A JPS634698A (en) 1988-01-09
JPH0831702B2 true JPH0831702B2 (en) 1996-03-27

Family

ID=15417337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61146866A Expired - Fee Related JPH0831702B2 (en) 1986-06-25 1986-06-25 Housing for mounting electronic components

Country Status (1)

Country Link
JP (1) JPH0831702B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0412697U (en) * 1990-05-21 1992-01-31

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS609294U (en) * 1983-06-28 1985-01-22 株式会社アドバンテスト Heat dissipation device for electronic equipment
JPS6163990A (en) * 1984-09-05 1986-04-02 Hitachi Ltd magnetic disk storage device

Also Published As

Publication number Publication date
JPS634698A (en) 1988-01-09

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