JPH0832108B2 - Ultrasonic probe manufacturing method - Google Patents
Ultrasonic probe manufacturing methodInfo
- Publication number
- JPH0832108B2 JPH0832108B2 JP61300455A JP30045586A JPH0832108B2 JP H0832108 B2 JPH0832108 B2 JP H0832108B2 JP 61300455 A JP61300455 A JP 61300455A JP 30045586 A JP30045586 A JP 30045586A JP H0832108 B2 JPH0832108 B2 JP H0832108B2
- Authority
- JP
- Japan
- Prior art keywords
- ultrasonic probe
- strip
- manufacturing
- matching layer
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Description
【発明の詳細な説明】 〔概要〕 本発明は、電子走査型超音波探触子の製造においてグ
レーティングロブを少なくし、送受信効率を増加させ、
かつ容易な製造方法とするため、単一の圧電素子を所定
の厚さに切断し、そのまま前面整合層と背面整合層ある
いは音波吸収体を形成する様にしたものである。DETAILED DESCRIPTION OF THE INVENTION [Outline] The present invention reduces the number of grating lobes and increases the transmission / reception efficiency in the production of an electronic scanning ultrasonic probe.
Further, in order to make the manufacturing method easy, a single piezoelectric element is cut into a predetermined thickness, and the front matching layer and the back matching layer or the sound wave absorber are formed as they are.
本発明は電子走査型超音波探触子の製造方法に関す
る。The present invention relates to a method for manufacturing an electronic scanning ultrasonic probe.
電子走査型超音波探触子は、複数個の短冊状圧電素子
を平面状にあるいは曲面上に配置した構造を有している
が、そのため単板圧電素子の場合には顕著には現れなか
ったグレーティングロブが発生し、音場が乱れ、結果と
して分解能が低下する傾向にある。又、素子面積が小さ
くなるので、送受信効率の低下が起きる。そのため、素
子間隔をできるだけ小さくし、単板の音場と近いものに
する製造方法が必要とされる。The electronic scanning ultrasonic probe has a structure in which a plurality of strip-shaped piezoelectric elements are arranged on a flat surface or on a curved surface, so that it did not significantly appear in the case of a single-plate piezoelectric element. Grating lobes occur, the sound field is disturbed, and as a result, the resolution tends to decrease. Moreover, since the element area is reduced, the transmission / reception efficiency is reduced. Therefore, there is a need for a manufacturing method in which the element spacing is made as small as possible and is close to the sound field of a single plate.
電子走査型超音波探触子の構造は複雑であるため、そ
の製造方法には多くの種類が考えられるが、従来の製造
方法において共通している点は、第3図(a)の如く、
上下面に電極2,3を形成したPZTなどより成る単板の圧電
素子1を第3図(b)の如く、背面整合層あるいは音波
吸収体等のバッキング4上に接着固定したあと、第3図
(c)の如く、短冊状あるいはマトリックス状に切断
し、切断したときの素子間隔を保持したまゝ第3図
(d)の如く整合層6を形成し、探触子として作り上げ
ていることである。マトリックス状に切断したあと、樹
脂を充填し、曲面に曲げる方法も採られているが、基本
的には素子間隔は保たれたまヽと考えてよい。Since the structure of the electronic scanning ultrasonic probe is complicated, many kinds of manufacturing methods can be considered. However, the common points of the conventional manufacturing methods are as shown in FIG. 3 (a).
As shown in FIG. 3 (b), a single-plate piezoelectric element 1 made of PZT or the like having electrodes 2 and 3 formed on the upper and lower surfaces is adhered and fixed on a back matching layer or a backing 4 such as a sound absorber, and then the third As shown in FIG. 3 (c), it is cut into strips or matrixes, and the matching layer 6 is formed as shown in FIG. Is. After cutting into a matrix shape, a method of filling with resin and bending into a curved surface is also adopted, but basically it can be considered that the element spacing is maintained.
これら従来の製造方法は安定に作る点で優れている
が、素子間隔Gが、切断するときの刃(ブレード)の厚
さで決められているという欠点がある。ブレードの厚み
は、現在10μmのものも市販されているが、たとえば3.
5MHzの振動子に用いられる圧電素子の厚さは約400μm
あり、この厚さの圧電素子を安定に切断するためには50
μm以上の厚さのブレードを用いる必要があり、したが
って50μm以下の間隔で素子を配置することは困難であ
った。Although these conventional manufacturing methods are excellent in that they are stably manufactured, they have a drawback in that the element spacing G is determined by the thickness of a blade when cutting. Blades with a thickness of 10 μm are currently on the market, but for example, 3.
The thickness of the piezoelectric element used for the 5MHz oscillator is about 400μm.
Yes, 50 for stable cutting of piezoelectric elements of this thickness.
It was necessary to use a blade having a thickness of not less than μm, and therefore it was difficult to arrange elements at intervals of not more than 50 μm.
本発明の超音波探触子の製造方法は、上下面に電極2,
3を形成した単板圧電素子1を短冊状に切断したあと、
スペーサを配置し、短冊素子が嵌合する溝を有する前面
整合層を短冊素子の一方の面に接着固定したあと、背面
整合層あるいは音波吸収体を短冊素子の他方の面に接着
固定あるいは形成する工程からなる。The method for manufacturing an ultrasonic probe of the present invention includes electrodes 2 on the upper and lower surfaces,
After cutting the single-plate piezoelectric element 1 on which 3 is formed into strips,
After arranging the spacers, the front matching layer having the groove for fitting the strip element is adhered and fixed to one surface of the strip element, and then the back matching layer or the sound absorber is adhered, fixed or formed on the other surface of the strip element. Consists of steps.
実施例1 両面に電極20,30を形成した長さ120mm,幅11mm,厚さ40
μmの第1図(a)に示すPZT板10をダイシング用基板4
0に第1図(b)の如くワックス50で固定し、第1図
(c)の如く厚さ60μmのブレードで235μmピッチで
切断し、ワックス除去後長さ175μm,幅11mm,厚さ400μ
mの短冊状素子を得た。Example 1 Length of 120 mm, width of 11 mm and thickness of 40 with electrodes 20 and 30 formed on both sides
The PZT plate 10 shown in FIG.
Fix it with wax 50 at 0 as shown in Fig. 1 (b) and cut it with a blade of 60μm in thickness at 235μm pitch as shown in Fig. 1 (c). After removing the wax, length 175μm, width 11mm, thickness 400μ
m strip-shaped element was obtained.
次に第1図(d)の如く短冊状素子と厚さ25μm,長さ
20mm,幅300μmのポリイミドフィルムより成るスペーサ
60を交互に押え治具20の凹部70a内に配置する。そし
て、第1図(e)の如く、前面整合層80と接着材により
接着する。この整合層80に、短冊素子と同じ幅の溝を形
式しておくと短冊素子の間隔を正しく保持できる。接着
剤が硬化してから押え治具70より取り出し、第1図
(f)の如く音波吸収体90と接着する。Next, as shown in Fig. 1 (d), a strip-shaped element with a thickness of 25 μm and a length
Spacer made of polyimide film with a width of 20 mm and a width of 300 μm
60 are alternately arranged in the recess 70a of the holding jig 20. Then, as shown in FIG. 1 (e), the front matching layer 80 is bonded with an adhesive. If a groove having the same width as the strip element is formed in the matching layer 80, the spacing between the strip elements can be properly maintained. After the adhesive is hardened, it is taken out from the holding jig 70 and bonded to the sound wave absorber 90 as shown in FIG.
第2図は、本発明の実施例を示す図で、この実施例に
おいては、スペーサ100として、短冊状素子より高いも
のを用いる。FIG. 2 is a diagram showing an embodiment of the present invention. In this embodiment, a spacer 100 higher than the strip-shaped element is used.
そして、第2図(a)の如く、治具70の凹部70aに、
酸化鉄粉を分散させたエポキシ樹脂を流し込み、そのま
ま硬化させる。Then, as shown in FIG. 2 (a), in the recess 70a of the jig 70,
Epoxy resin in which iron oxide powder is dispersed is poured and cured as it is.
エポキシ樹脂が硬化した後押え治具から取り出し、前
面整合層80と接着剤により接着する。After the epoxy resin has hardened, it is taken out from the holding jig and bonded to the front matching layer 80 with an adhesive.
この実施例によれば、スペーサ100が押え治具にくい
込む形となるため、隣数する短冊状素子間の干渉をなく
すことが可能となる。According to this embodiment, the spacer 100 has a shape in which it is difficult to insert the holding jig, so that it is possible to eliminate interference between adjacent strip-shaped elements.
素子ピッチ200μm,素子間ギャップ25μmのこの探触
子は素子間ギャップ50μmの探触子に比べ、送受信効率
が17%増加し、又、グレーティングロブ若干少なくなっ
ていた。This probe having an element pitch of 200 μm and an element gap of 25 μm had a 17% increase in transmission / reception efficiency and a slight decrease in grating lobe, as compared with a probe having an element gap of 50 μm.
より高周波の探触子の場合、グレーティングロブの発
生を少なくするため素子ピッチを小さくしようとすると
素子間ギャップが大きいと送受信効率の低下は著しくな
るので、本発明はより高周波の場合にさらに効果があ
る。In the case of a higher frequency probe, if the element pitch is reduced in order to reduce the occurrence of grating lobes, the transmission / reception efficiency will be significantly reduced if the element gap is large.Therefore, the present invention is more effective at higher frequencies. is there.
第1図,第2図は本発明による実施例、 第3図は従来の例を示す図である。 図中10は圧電板、2,3は電極、60はスペーサ、80は前面
整合波、90は電波波吸収体である。1 and 2 show an embodiment according to the present invention, and FIG. 3 shows a conventional example. In the figure, 10 is a piezoelectric plate, 2 and 3 are electrodes, 60 is a spacer, 80 is a front matching wave, and 90 is a radio wave absorber.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 並木 文博 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 (72)発明者 渡辺 一宏 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 (72)発明者 飯田 安津夫 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 (56)参考文献 特開 昭52−101070(JP,A) 特開 昭58−120397(JP,A) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Fumihiro Namiki, 1015 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture, Fujitsu Limited (72) Inventor, Kazuhiro Watanabe 1015, Kamedotachu, Nakahara-ku, Kawasaki City, Kanagawa Prefecture, Fujitsu Limited (72) Inventor Yasuo Iida 1015 Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa, Fujitsu Limited (56) References JP-A-52-101070 (JP, A) JP-A-58-120397 (JP, A)
Claims (1)
数個の圧電素子を有する電子走査型超音波探触子の製造
方法であって、上下面に電極が形成された単板圧電素子
を短冊状に切断する工程と、該短冊素子間にスペーサを
設置する工程と、該短冊素子が嵌合する溝を有する前面
整合層を短冊素子の一方の面に接着固定する工程と、背
面整合層あるいは音波吸収体を短冊素子の他方の面に接
着固定あるいは形成する工程を含むことを特徴とする超
音波探触子の製造方法。1. A method for manufacturing an electronic scanning ultrasonic probe having a plurality of piezoelectric elements arranged on a plane or in a curved surface, the single-plate piezoelectric element having electrodes formed on the upper and lower surfaces thereof. Cutting into strips, installing spacers between the strip elements, adhering and fixing a front matching layer having a groove into which the strip elements fit to one surface of the strip elements, and back aligning A method of manufacturing an ultrasonic probe, comprising a step of adhesively fixing or forming a layer or a sound wave absorber on the other surface of the strip element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61300455A JPH0832108B2 (en) | 1986-12-16 | 1986-12-16 | Ultrasonic probe manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61300455A JPH0832108B2 (en) | 1986-12-16 | 1986-12-16 | Ultrasonic probe manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63151299A JPS63151299A (en) | 1988-06-23 |
| JPH0832108B2 true JPH0832108B2 (en) | 1996-03-27 |
Family
ID=17885000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61300455A Expired - Lifetime JPH0832108B2 (en) | 1986-12-16 | 1986-12-16 | Ultrasonic probe manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0832108B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4544285B2 (en) | 2007-09-28 | 2010-09-15 | 株式会社デンソー | Ultrasonic sensor |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52101070A (en) * | 1976-02-19 | 1977-08-24 | Furuno Electric Co | Ultrasonic transmitting*receiving device |
| JPS58120397A (en) * | 1982-01-13 | 1983-07-18 | Hitachi Medical Corp | Production of ultrasonic probe |
-
1986
- 1986-12-16 JP JP61300455A patent/JPH0832108B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63151299A (en) | 1988-06-23 |
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