JPH0834232B2 - Substrate transfer method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention uses an autoloader capable of mounting a transported object from a cassette accommodating the transported object to a processing device such as an ion implantation device and vice versa. The present invention relates to a substrate transfer method.

[Background of the Invention]

As shown in FIG. 2, the conventional autoloader sequentially moves the wafer cassette 1 to the wafer cassette 2 by the vertical movement of the ball screw 4 of the mechanism unit and the movement of the belt 5 of the drive unit by the motor 3 of the drive unit. The wafer 2 is taken out, and then the wafer 2 is mounted on the ion implantation device 6 by the motor 3 and the ball screw 4. Also, the reverse operation of collecting the wafers in the wafer cassette is performed.

The present autoloader has a drawback in that there is a possibility that foreign matter may drop onto the wafer because the autoloader has the ball screw 4 although it is covered on the wafer transfer.

In addition, the present autoloader is very large, and if the autoloader fails, the autoloader becomes an obstacle, making it difficult for the operator to perform manual work.

The ion implanter and the wafer autoloader are electronic material separate volume 1984 "VLSI manufacturing / testing equipment" 1983
It is introduced on pages 81-86 published by the Industrial Research Society on November 15, 2012.

Furthermore, in the conventional photolithography coating process, the presence of foreign matter is transferred to the pattern as it is, resulting in a defect. Then
The portion where impurities were not implanted due to the presence of foreign matter was also an impurity region having a low concentration. Therefore, in the ion implantation process, attention has not been paid so much to measures against foreign matter.

[Object of the Invention]

One object of the present invention is to reduce the adhesion of foreign matter on the wafer.

Another object of the present invention is to make the autoloader compact,
Even if the autoloader fails, the ion implanter can be operated without disturbing the manual operation of the operator.

[Outline of Invention]

According to one embodiment of the present invention, a drive system for transporting the wafer with the wafer 2 as the uppermost position is provided to reduce foreign matter drop on the wafer.

Example of Invention

FIG. 1 shows a side view of the autoloader 7 used in the present invention.

In the substrate transfer system of the present invention, an autoloader, a plurality of storage cassettes, a substrate lifter, and a substrate transfer section in a clean room are arranged on only one side of the substrate processing apparatus. First, a plurality of wafer cassettes 1 each containing a wafer 2 are placed on the autoloader 7. Thereafter, the wafers 2 which are sequentially designated from the specific wafer cassette 1 are carried by the wafer lifter 9 having the vertical and in-plane moving functions, and lifted.
At this position, the wafer 2 is transferred to the wafer transfer unit 8 having a rotating function.

After that, the wafer 2 is mounted on the ion implanter 6 by the wafer transfer unit 8.

As shown in FIG. 1, through these operations, the object to be transported is located above the drive unit of the transport unit and the mechanism unit connected thereto.

 The recovery of the wafer 2 is the reverse of the above.

〔The invention's effect〕

1. Since there is no drive unit of the transport unit and a mechanism unit connected to the transport unit above the transported object, foreign matter falling on the upper surface of the transported object is reduced, and the yield is improved.

2. Compact size allows workers to work without stopping the ion implanter even if the autoloader fails.

[Brief description of drawings]

FIG. 1 is a side view showing an ion implanter autoloader used in the present invention, and FIG. 2 is a conventional ion implanter autoloader. 1 ... Wafer cassette, 2 ... Wafer, 3 ... Motor,
4 ... Ball screw, 5 ... Belt, 6 ... Ion implanting device, 7 ... Auto loader, 8 ... Wafer transfer part, 9 ...
... wafer lifter.

Claims (2)

[Claims] 1. An autoloader has a substrate transfer section and a substrate lifter, and has a plurality of storage cassettes mounted thereon and is arranged to face a substrate processing apparatus.
The plurality of storage cassettes, the substrate lifter, the substrate transfer unit, and the substrate processing apparatus are located in this order, and the substrate lifter drives vertically and forward and backward, and sequentially takes out the substrates from the storage cassette. Alternatively, the substrates are sequentially placed in the storage cassette, and the substrates are transferred to and from the substrate transfer unit outside the storage cassette and at a raised position. , Which is driven in rotation, sequentially takes out substrates from the substrate processing apparatus, or sequentially puts substrates in the substrate processing apparatus, and raises the substrate lifter outside the storage cassette. At a predetermined position, the substrate is transferred to and from the substrate lifter, and the surface of the substrate is a device that drives a mechanism unit that drives the substrate lifter and a substrate transport unit. Substrate transfer method, characterized in that located above the part. 2. The substrate transfer method according to claim 1, wherein the processing device is an ion implantation device.