JPH0834280B2 - Semiconductor device - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a semiconductor device package in which wiring between a substrate terminal and a pin is performed.

[Conventional technology]

Conventionally, the wiring of the semiconductor device package has been provided with the wiring circuit on the same surface as the substrate terminal, so when the substrate terminal is provided in a puddle shape, the outer substrate terminal can be directly wired to the wiring circuit. The inner board terminals were wired in the wiring circuit through the outer board terminals.

[Problems to be Solved by the Invention]

In the above-described conventional wiring of the board terminals in the form of a puddle, since the inner board terminals are arranged in the wiring circuit through the outer board terminals, the outer board terminals are thinner than the inner board terminals. As a result, there are drawbacks such as a low switch yield, in which the wire drops from the substrate terminal during bonding, and a defect in which the bonding wire curls and short-circuits with the adjacent wire, and the bonding yield is low. Since it is weaker than usual, there is a drawback that the reliability is low when a test such as a temperature cycle is conducted.

An object of the present invention is to eliminate the above drawbacks and to provide a semiconductor device having improved connection reliability.

[Means for solving the problem]

The configuration of the present invention comprises an IC chip, an insulating substrate having the IC chip mounted in the central portion, and a large number of external connection pins implanted around the mounting surface of the IC chip on the substrate. Is a board terminal which is composed of a wiring portion provided on one surface of this board and is connected to each terminal of the IC chip by a wire, respectively, and each board terminal and each external connection pin on the board surface. In a semiconductor device having wiring circuits respectively disposed between them, half of the wiring circuits are provided on one surface of the substrate so that the wiring circuits are evenly arranged on both surfaces of the substrate. Directly wired between the terminal and the external connection pin, and the other half of the wiring circuit is wired to the external connection pin on the other surface of the substrate, in the vicinity of the mounting surface of the IC chip and on each of the substrates. That from the terminal It is characterized in that it is connected to the substrate terminal through a through hole or a half through hole provided inside the mount surface.

〔Example〕

 Next, the present invention will be described with reference to the drawings.

1 (a) and 1 (b) are a plan view and a longitudinal sectional view of one embodiment of the present invention. In this embodiment, board terminals are provided in a puddle shape on the plane of an electrically insulating board 1 made of glass epoxy or the like, and the board terminals 16 on the outside are wired to the through holes 3 for pin insertion by a wiring circuit 4 laid on the plane. , Pin 7
To electrically connect with.

In addition, the inner board terminal 2 is mounted on the board terminal and the mounting surface.
Connect to the wiring circuit 4 laid on the back surface through the through hole 5 for bypass of φ0.1 to φ0.4 mm provided between 11 and then connect to the through hole 3 for pin insertion to electrically connect to the pin 7. I am letting you. In this case, the width of the board terminal is outside,
The inner side is 0.25 mm, the interval is 0.15 mm and 0.4 mm pitch, and the through hole 5 for bypass is enclosed by a through hole stopper 12 such as solder.

2 (a) and 2 (b) are a rear view and a longitudinal sectional view of the second embodiment of the present invention. In this embodiment, a board terminal is provided on the back surface, and the board terminal 16 on the outside is wired to the through hole 3 for pin insertion by the wiring circuit 4 laid on the back surface and electrically connected to the pin 7. In addition, the board terminal 2 on the inner side has a diameter of 0.1 mm provided between the terminal 2 and the mounting surface 11.
It is connected to a 1-0.5 mm bypass half through hole 15.
The half through hole 15 penetrates the mount surface 11 to form a half through hole, and the wiring circuit 4 provided on the plane passes through the half surface to reach the pin insertion through hole 3 and is electrically connected to the pin 7. . The pitch of the board terminals 2 is 0.4 mm both inside and outside. A heat sink type base 13 is attached to the punched portion of the substrate 1 with an insulating resin 14 to seal the half through hole 15 and form a mount surface 11.

In this embodiment, the thermal resistance can be reduced to 1/2 or less, and the length of the bonding wire 8 can be shortened by using a half through hole, and the bonding speed and the yield can be improved.

〔The invention's effect〕

As described above, according to the present invention, a bypass through hole or a half through hole is provided between the board terminal and the mount surface, and the outer board terminal and the inner board terminal are on the front surface and the back surface, or on the back surface and the front surface. By providing the wiring circuit separately, the width of the board terminals is the same when the board terminals are of the orthogonal type and are arranged at the same interval, and the width of the board terminals is the same when the board terminals are arranged at the same distance of the radiation type. Is wider than the inner side, and the bondability (bondability) is improved. Also, since the wiring circuit is divided into two on the plane and on the back surface, if the wiring width and spacing are the same, the number of wirings can be doubled, and the number of pins and the number of terminals can be increased easily. Furthermore, in the case of the same pin and terminal, the wiring width and spacing can be doubled, so that the electrical characteristics are improved.

[Brief description of drawings]

1 (a) and 1 (b) are a plan view and a longitudinal sectional view of the first embodiment of the present invention, and FIGS. 2 (a) and 2 (b) are rear views of the second embodiment of the present invention. FIG. 3 is a vertical sectional view thereof. 1 ... Electrically insulating substrate, 2 ... Inner substrate terminal, 3 ...
Through hole for pin insertion, 4 ... Wiring circuit, 5 ... Through hole for bypass, 6 ... IC chip, 7 ... Pin, 8
...... Wire, 9 ...... IC chip terminal, 10 ...... Mounting member, 11 ...... Mounting surface, 12 ...... Through hole stopper, 13 ...
… Heat sink type base, 14… Mounting resin, 15… By-pass half through hole, 16… Outside board.

Claims (1)

[Claims] 1. An IC chip, an insulating substrate having the IC chip mounted in a central portion, and a large number of external connection pins implanted around the mounting surface of the IC chip on the substrate. Is a board terminal formed of a wiring portion provided on one surface of the board and connected to each terminal of the IC chip by a wire, and between the board terminal and the external connection pin on the board surface. In a semiconductor device having wiring circuits respectively arranged on the substrate terminals, half of the wiring circuits are arranged on one surface of the substrate so that the wiring circuits are evenly arranged on both surfaces of the substrate. And the external connection pins are directly wired, and the other half of the wiring circuit is wired to the external connection pins on the other surface of the substrate, near the mounting surface of the IC chip, and the substrate terminals. More that mau A semiconductor device, wherein the semiconductor device is connected to the substrate terminal through a through hole or a half through hole provided inside a semiconductor surface.