JPH08355B2 - Method and apparatus for polishing CRT panel - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method and apparatus for reversing a picture tube panel and polishing a surface to be polished of the picture tube panel during the rotating operation, and more particularly to The present invention relates to a polishing method and an apparatus effective for a cathode ray tube panel in which the major axis / minor axis ratio of the surface to be polished is large.

[Prior Art] As a conventional CRT panel polishing device, there is, for example, a device disclosed in Japanese Examined Patent Publication No. 40-28753. This is, as shown in FIG. 11, while positioning the CRT panel 12 as a work on the rotary table 11,
A polishing tool 14 is attached to the tip of a hollow drive shaft 13 that is inclined by a predetermined angle θ with respect to the rotation axis of the rotary table 11, and a panel 12 surface for a cathode ray tube and a polishing tool 14 are attached via the hollow drive shaft 13. A polishing slurry is supplied in the meantime, and the CRT panel 12 surface is polished by a polishing tool 14.

According to this type, as shown in FIG. 12, the eccentric distance l between the rotation center O1 of the cathode ray tube panel 12 and the fulcrum position (rotation axis position) O2 of the polishing tool 14 becomes constant. Therefore, while the fulcrum position O2 of the polishing tool 14 draws a circular locus relative to the rotation of the cathode ray tube panel 12, the polishing tool 14 polishes the surface of the cathode ray tube panel 12 as a whole.

[Problems to be Solved by the Invention] However, looking at the recent cathode ray tube panel 12, the spherical shape having a single curvature has been changed to an aspherical shape having a double curvature. The major axis / minor axis ratio of panels for use is increasing.

When a conventional polishing apparatus is used for such a type, as shown in FIG. 13, the eccentric distance between the rotation center O1 of the cathode ray tube panel 12 and the fulcrum position O2 of the polishing tool 14 is increased. l must be uniquely set, but at that time, so that the entire 12 surfaces of the cathode ray tube panel can be polished,
It becomes necessary to set a large value in consideration of the size between the center of rotation O1 of the cathode ray tube panel 12 and the corner position C and to set a large polishing diameter size k'of the polishing tool 14. .

In this case, since the polishing tool 14 becomes large in size, it is difficult for the polishing tool 14 to easily fit on the surface 12 of the CRT panel 12 having multiple curvatures, and the polishing tool 14 largely protrudes from the end of the CRT panel 12 during the polishing operation process. Since the polishing tool 14 that largely protrudes from the end of the cathode ray tube panel 12 gets on the edge of the panel 12 for the cathode ray tube, the polishing tool 14 strongly abuts on the edge.
There is a problem that the 12 edges are over-polished compared to other parts.

Further, since the protruding portion of the polishing tool 14 is not effectively used for polishing, the large protruding portion not only lowers the polishing efficiency, but also impairs uniform polishing of the CRT panel 12.

The present invention has been made from the above viewpoints, and is for a cathode ray tube capable of efficiently and accurately polishing a large surface to be polished or a surface having multiple curvatures with a small polishing tool. A panel polishing method and apparatus are provided.

[Means for Solving the Problem] That is, the method for polishing a panel for a cathode ray tube according to the present invention is a polishing object having a substantially rectangular shape and an aspherical shape for a panel for a cathode ray tube that is positioned and mounted on a rotary table and is in a rotating operation. When polishing a surface with one polishing tool, the fulcrum position (rotation axis position) of the polishing tool is set along the trajectory close to a similar shape that substantially matches the outer peripheral shape of the substantially rectangular surface to be polished. It is characterized in that it is relatively moved by swinging and rotating operation of the turntable.

In such a method invention, a polishing tool having a lap member fixed to a lap holder which is normally rotated by a rotating shaft is used as the polishing tool.

Then, in order to relatively move the rotation axis position of the polishing tool, the rotation axis position of the polishing tool may be moved, or the rotation center position of the cathode ray tube panel may be moved, Both may be moved at the same time, and the drive system in each case may be appropriately changed in design as long as it can perform the above-described operation.

Further, in the present invention, the rotary shaft position of the polishing tool is relatively moved along a locus close to a similar shape that substantially matches the outer peripheral shape of the surface to be polished of the cathode ray tube panel. From the viewpoint of further downsizing, the rotational axis position of the polishing tool is set along the trajectory of the polishing tool along a locus close to a shape similar to the outer peripheral shape of the surface to be polished of the cathode ray tube panel. The first polishing step in which the outer peripheral portion of the polishing target surface is intensively polished by the relative movement of the polishing tool and the rotation axis position of the polishing tool is fixed, and the central portion of the polishing target surface is fixed. It is preferable to combine with a second polishing step of polishing intensively.

Further, one apparatus invention for realizing the above method invention is a rotary table in which a panel for a cathode ray tube to be polished is positioned and mounted, and which rotates about a fixed rotation axis.
One polishing tool for polishing a substantially rectangular and aspherical surface to be polished of the cathode ray tube panel, and a polishing tool supporting means for swingably supporting the polishing tool along the surface to be polished in a substantially horizontal plane. , A polishing tool drive for swinging the polishing tool via the polishing tool support means in order to move the rotational axis position of the polishing tool along a locus close to a similar shape that substantially matches the outer peripheral shape of the surface to be polished It is equipped with a system.

In such an apparatus invention, as the polishing tool drive system, as long as it moves the rotation axis position of the polishing tool along a locus close to a similar shape substantially matching the outer peripheral shape of the surface to be polished of the cathode ray tube panel. Alternatively, for example, the polishing tool support means may be appropriately swung by controlling a hydraulic servo mechanism or the like based on a predetermined drive control signal, or the drive transmission member may be moved along a predetermined cam locus. The design may be changed as appropriate, for example, by forcibly moving the polishing tool supporting means to swing appropriately.

Further, in such an apparatus invention, it is possible to realize a polishing step using a conventional polishing method by fixing the position of the rotating shaft of the polishing tool.

[Operation] According to the technical means as described above, the position of the rotation axis of the polishing tool is a locus close to a similar shape which substantially matches the outer peripheral shape of the surface of the cathode ray tube panel that is substantially rectangular and aspherical. Since they are relatively moved along the same, the distance between the locus close to the similar shape and the outer peripheral edge of the cathode ray tube panel can be made substantially constant.

For this reason, if a trajectory close to the above-mentioned similar shape is set to a desired one, polishing with a polishing tool having a radial dimension approximately corresponding to the distance between the trajectory close to the similar shape and the outer peripheral edge of the cathode ray tube panel is used. It is possible to surely polish the entire target surface.

[Embodiment] The present invention will be described in detail below based on an embodiment shown in the accompanying drawings.

Embodiment 1 FIG. 1 is a schematic view of an embodiment in which the present invention is applied to a polishing apparatus for a cathode ray tube panel.

In this embodiment, the basic structure of the polishing apparatus is a rotary table 20 on which a cathode ray tube panel 21 (in this embodiment, one having a large major axis / minor axis ratio) is positioned and mounted, and a rotary table 20 for this cathode ray tube. Polishing tool for polishing the surface of panel 21
40, a polishing tool support means 50 for slidably supporting the polishing tool 40 along the surface of the cathode ray tube panel 21, and a polishing tool drive system 70 for swinging the polishing tool 40 based on a predetermined drive control signal. It has and.

More specifically, the rotary table 20 has a guide rail 23 laid on an installation table 22 as shown in FIGS.
23 Movable through a guide roller 25 that slides up 24
Further, a drive air cylinder 26 for advancing and retracting is attached to the movable table 24, and the movable table 24 is moved between the set position and the non-set position where the polishing operation is performed to take out the work. On the other hand, while making it easy, a rotary shaft 28 is erected on the movable table 24 via a reduction gear unit 27,
A support 29 is attached to the tip of the rotary shaft 28, and the rotary shaft 28 is rotated at a predetermined speed by an AC servomotor 30 for driving. Reference numeral 31 is for supporting the rotary table 20, and 32 is a stopper at the set position of the movable table 24.

Further, as shown in FIGS. 2 and 5, the polishing tool 40 has a predetermined angle θ with respect to the rotation axis O1 of the rotary table 20.
A lap holder that has a hollow spindle 41 in which the rotation axis O2 is inclined and is rotated by this spindle 41
A lap member 43 is fixed to 42, and a slurry as an abrasive is supplied to the lap member 43 by utilizing the hollow portion of the spindle 41. The drive system of the spindle 41 of the polishing tool 40 includes a drive induction motor 44 and the drive induction motor 44.
The drive force transmission mechanism 45 is composed of a pulley and a belt that transmit the drive force from the spindle 41 to the spindle 41.

Further, as shown in FIGS. 2 to 4, the polishing tool support means 50 pivots the first support column 51 on the installation table 22.
It is swingably supported via 52, and a position adjusting mechanism 53 is provided on one end side of the first support column 51 to regulate the swing position of the first support column 51.
While installing the shock absorber damper 54 on the other end of the first support column 51, the second support 55 is attached to the first support column 51.
And a support base 57 is attached to the upper end of the second support column 55 via a pivot 56, and a tilting hydraulic cylinder 58 is interposed between the second support column 55 and the support base 57. The posture of the support base 57 is appropriately changed, and a swing arm 59 that swings in a substantially horizontal plane is attached to the support base 57, and a bearing holder 60 is attached to the tip of the swing arm 59.
The bearing holder 60 rotatably supports the spindle 41 of the polishing tool 40. still,
Reference numeral 61 is an arm guide rail for guiding and supporting the swing arm 59.

Further, as shown in FIGS. 2 to 4, the polishing tool drive system 70 has a support bracket 71 attached to a part of the support base 57, and a guide rail is attached to the support bracket 71.
A slide base 73 that slides along the guide rails 72 is installed, and a cylinder main body 74a of a hydraulic cylinder 74 for driving is fixed to the slide base 73, and a piston rod 74b of the piston rod 74b is attached. One end is fixed to a part of the support bracket 71, while the slide base 73 and the intermediate portion of the swing arm 59 are connected by a connecting rod 75, and the hydraulic cylinder 74 is connected.
The connecting rod 75 is moved back and forth in the direction of the arrow in accordance with the driving of the above, and the swing arm 59 is appropriately swung in the direction of the arrow.

In this embodiment, as a drive system for the hydraulic cylinder 74, particularly as shown in FIGS. 3 and 6,
An AC servo motor 76 to which a drive control signal is given is arranged on a support bracket 71, a servo valve 77 is arranged on the slide base 73, and a ball nut is attached to one end of a spool 77a of the servo valve 77. Connect the ball screw 78 via 79,
A transmission belt 80b is hung between a shaft of the AC servo motor 76 and a ball screw 78 via a pulley 80a, and a sleeve 77b of the servo valve 77 communicates with a valve chamber 81, for example, four ports a (specifically, A1 to a4) are opened in two of them, and two of them, a1 and a3, are connected to the discharge pipe and pump 8 leading to the tank 82.
The oil supply pipe leading to the discharge port of 3 is connected, and the other two a2 and a4 and the cylinder body 74a of the hydraulic cylinder 74 are connected.
Connected to the pressure ports b1 and b2 located at both ends of the spool, the spool 77a is appropriately advanced and retracted with the rotation of the AC servomotor 76, the orifices of the ports a2 and a4 are appropriately adjusted, and the pressure ports b1 and b1 are adjusted. It is designed to control the flow rate to b2. In FIG. 3, reference numerals 84 and 85 are limit switches which are turned on and off following the follow-up of the ball nut 79 to regulate the movement amount of the spool 77a.

Further, the basic control system associated with the polishing operation of the polishing apparatus according to this embodiment is constructed as shown in FIG.

In the figure, reference numeral 90 is a main controller, and 91 is an AC servo motor 30 for driving the rotary table 20.
NC device, 92 is an NC device for the AC servo motor 76, 93 is an encoder that is attached to the AC servo motor 30 and sends a feedback signal to the NC device 92, and 94 drives the induction motor 44 for driving the spindle 41. It is an inverter for. The reference numerals 30a and 76a are servo motors 30,
This is an encoder for sending the rotational position information of 76 to the NC devices 91, 92.

In such a control system, the drive control signal sent from the main controller 90 to the NC device 92 is such that the fulcrum position (rotation axis position) of the polishing tool 40 is the outer peripheral shape (substantially rectangular shape) of the cathode ray tube panel 21. ), The polishing tool 40 is appropriately oscillated in synchronization with the feedback signal from the encoder 93 so as to move along a locus m (see FIG. 9) which is close to a similar shape substantially conforming to FIG. . As for the setting data of the locus m, which is similar to the similar shape, the data created arbitrarily by the external computer 95 can be NC by using the communication line.
By transferring to the device 92, it is possible to easily obtain an arbitrary trajectory.

Next, the operation of the polishing apparatus according to this embodiment will be described.

Before operating the polishing apparatus, the posture of the first support column 51 and the elevation position of the second support column 55 are adjusted in advance in accordance with the CRT panel 21 to be polished.

In this state, the main controller 90 positions the CRT panel 21 on the rotary table 20 by a robot (not shown), and then the rotary table 20.
Is set to the set position, and thereafter, the spindle 1 is rotationally driven and the piston rod of the tilting hydraulic cylinder 58 is caused to project so that the posture of the support base 57 is changed and the polishing tool 40 is moved to the above-mentioned position. The panel 21 for cathode ray tube is brought into contact with the initial position of the surface.

Then, the main controller 90 causes the NC devices 91 and 92 to
The NC devices 91 and 92 receive the drive control signal and control the AC servomotors 30 and 76.

At this time, the polishing tool 40 arranged at the initial position shown in FIG. 8 (a) first swings in the direction of arrow A along with the rotation of the cathode ray tube panel 21, and then in FIG. 8 (b). After reaching the position, it then swings in the direction of arrow B as shown in FIGS. 8 (c) to 8 (f), reaches the position of FIG. 8 (g), and is again shown in FIG. 8 (h). As described above, the CRT panel 21 swings in the direction of arrow A, and returns to the initial position (FIG. 8 (i)) while the cathode ray tube panel 21 makes one rotation. In addition, P1 to P4 in FIGS. 8A to 8I indicate respective corner positions of the cathode ray tube panel 21. By repeating such a polishing operation for a predetermined time, one polishing operation cycle is completed.

In such a polishing operation cycle, the polishing tool
The fulcrum position (rotation axis position) C ₂ of 40 moves along a locus m close to a similar shape that substantially matches the outer peripheral shape of the cathode ray tube panel 21, as shown in FIGS. 8 and 9.

At this time, as the trajectory m close to the above-mentioned similar shape, the distance s from the outer peripheral edge of the cathode ray tube panel 21 is set to be substantially constant, and this distance s is usually the rotation center O1 of the cathode ray tube panel 21. Is set to be slightly larger than the distance 1 between the locus m and the locus m which is similar to the similar shape. If the diameter k of the polishing tool 40 is selected to be slightly larger than the distance s, the polishing tool 40 will efficiently polish the entire area of the cathode ray tube panel 21 surface, and FIG. Compared with the conventional type, the amount of the polishing tool 40 protruding from the outer peripheral edge of the cathode ray tube panel 21 is sufficiently suppressed,
Therefore, the situation of defective polishing or excessive polishing of the CRT panel 21 can be effectively avoided.

Example 2 The basic structure of the polishing apparatus according to this example is substantially the same as that of Example 1, but the polishing operation cycle by the polishing tool 40 is different from that of Example 1.

That is, the polishing operation cycle in this embodiment is
As shown in FIG. 10, the polishing tool is moved along a locus m1 close to a similar shape that substantially matches the outer peripheral shape of the cathode ray tube panel 21 surface.
The first polishing step of moving the fulcrum position O2 of 40 to intensively polish the outer peripheral portion of the cathode ray tube panel 21, and the polishing tool described above.
40 fulcrum positions O2 are fixed near the center of the cathode ray tube panel 21, and the center of the cathode ray tube panel 21 surface is concentrated while drawing a circular locus m2 at the fulcrum position O2 with respect to the cathode ray tube panel 21 surface. And a second polishing step of polishing.

According to this embodiment, it is not necessary to polish the central portion of the surface of the cathode ray tube panel 21 with high precision in the first polishing step. Therefore, the diameter dimension k of the polishing tool 40 is set to that in Embodiment 1.
It is possible to make it even smaller than that of the polishing tool 40
In addition to downsizing, it is possible to make the polishing surface of the polishing tool 40 easier to adjust to the surface 21 of the double-curvature cathode ray tube panel 21.

[Effects of the Invention] As described above, according to the method for polishing a panel for a cathode ray tube and the apparatus therefor according to the present invention, the polishing trajectory of the polishing tool is devised when polishing the entire surface to be polished of the panel for a cathode ray tube. By doing so, the polishing tool is downsized and the amount of protrusion of the polishing tool from the surface to be polished is reduced, so that the polishing tool can be easily familiarized even if the surface to be polished has a double curvature. In addition, it is possible to effectively avoid defective polishing or excessive polishing due to extreme eating of the polishing tool, and the polishing accuracy of the polishing tool can be improved accordingly.

Further, according to the polishing method of claim 2, when polishing the entire surface to be polished of the cathode ray tube panel, a step centering on the outer peripheral side of the surface to be polished and a centering step on the center side of the surface to be polished Since it is divided into two parts, the polishing tool can be made smaller.

Further, according to the polishing apparatus of the third aspect, the optimum polishing path of the cathode ray tube panel can be obtained by simply swinging the polishing tool side. Therefore, the optimum polishing path of the cathode ray tube panel can be obtained. It is not necessary to incorporate a complicated cam mechanism or the like on the rotary table side, and the polishing accuracy can be improved while simplifying the device.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing an embodiment of the polishing apparatus according to the present invention, FIG. 2 is a front view of the polishing apparatus according to the embodiment, and FIG.
5 to FIG. 5 are views seen from the directions of III, IV and V in FIG. 2, FIG. 6 is an explanatory view showing the details of a polishing tool drive system used in the embodiment, and FIG. 7 is an embodiment. 8 is a block diagram showing the entire control system of the polishing apparatus used, FIGS. 8 (a) to 8 (d) are explanatory views showing polishing operation steps of the polishing apparatus according to the embodiment, and FIG. 9 is a polishing apparatus according to the embodiment. Explanatory diagram schematically showing the polishing range used, FIG. 10 is an explanatory diagram schematically showing the polishing range using another embodiment of the polishing apparatus according to the present invention, FIG. 11 is an example of a conventional polishing apparatus Explanatory diagram showing the 12th
The figure is an explanatory view schematically showing the polishing operation of a conventional polishing apparatus,
FIG. 13 is an explanatory view schematically showing the polishing operation of the polishing apparatus when polishing a panel surface for a cathode ray tube having a large major axis / minor axis ratio. [Explanation of symbols] m, m1 ...... Locus close to similar shape 20 ...... Rotating table 21 …… CRT panel (work) 40 …… Polishing tool 50 …… Polishing tool support means 70 …… Polishing tool drive system

 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-50-59896 (JP, A) JP-B-41-15392 (JP, B1)

Claims (3)

[Claims] 1. A polishing tool (40) for polishing a substantially rectangular and aspherical surface to be polished of a panel for a cathode ray tube (21) that is positioned and mounted on a rotary table (20) and is rotating. In doing so, the rotational axis position of the polishing tool (40) is moved along the swing axis of the polishing tool (40) along a locus (m) close to a similar shape that substantially matches the outer peripheral shape of the substantially rectangular surface to be polished. A method of polishing a cathode ray tube panel, characterized in that the table (20) is moved relative to the rotation of the table (20). 2. A substantially rectangular and aspherical surface to be polished of a panel (21) for rotating a cathode ray tube which is positioned and mounted on a rotary table (20) and is polished by one polishing tool (40). In doing so, the rotation axis position of the polishing tool (40) is rotated and rotated along a locus (m1) close to a shape similar to the outer peripheral shape of the substantially rectangular surface to be polished. A first polishing step in which the table (20) is relatively moved by the rotation operation to intensively polish the outer peripheral portion of the polishing target surface, and the rotation axis position of the polishing tool (40) is fixed to perform the polishing. And a second polishing step for intensively polishing the surface of the target surface close to the center portion. 3. A cathode ray tube panel (21) to be polished.
A rotary table (20) that is positioned and placed and rotates about a fixed rotation axis, and one polishing tool for polishing the substantially rectangular and aspherical surface to be polished of the cathode ray tube panel (21) ( 40), a polishing tool indicating means (50) for supporting the polishing tool (40) so as to be swingable in a substantially horizontal plane along the surface to be polished, and a similar shape that substantially matches the outer peripheral shape of the surface to be polished. A polishing tool drive system that swings the polishing tool (40) through the polishing tool support means (50) in order to move the rotational axis position of the polishing tool (40) along a close locus (m, m1). (70) A cathode ray tube panel polishing device comprising: