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JPH088218B2 - Method for forming compound semiconductor thin film - Google Patents
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JPH088218B2 - Method for forming compound semiconductor thin film - Google Patents

Method for forming compound semiconductor thin film

Info

Publication number
JPH088218B2
JPH088218B2 JP5274187A JP27418793A JPH088218B2 JP H088218 B2 JPH088218 B2 JP H088218B2 JP 5274187 A JP5274187 A JP 5274187A JP 27418793 A JP27418793 A JP 27418793A JP H088218 B2 JPH088218 B2 JP H088218B2
Authority
JP
Japan
Prior art keywords
thin film
region
semiconductor thin
compound semiconductor
flat region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP5274187A
Other languages
Japanese (ja)
Other versions
JPH06224522A (en
Inventor
康仁 高橋
基次 小倉
亘康 長谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP5274187A priority Critical patent/JPH088218B2/en
Publication of JPH06224522A publication Critical patent/JPH06224522A/en
Publication of JPH088218B2 publication Critical patent/JPH088218B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Semiconductor Lasers (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、段差を有する化合物
半導体基板上に量子井戸構造を有する化合物半導体薄膜
を積層するエピタキシャル成長方法に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epitaxial growth method for laminating a compound semiconductor thin film having a quantum well structure on a compound semiconductor substrate having a step.

【0002】[0002]

【従来の技術】最近の光情報処理分野において、光ディ
スク等の光学的記録再生装置が用いられるようになって
いる。この光学的記録再生装置には、データの書き込
み、読み出し、消去用の半導体レーザが用いられる。そ
して、用途により、書き込みの後すぐに読み出したい場
合とか、消去しつつその後に書き込み、読み出しを行な
いたい場合がある。この場合、書き込み用の半導体レー
ザ光の波長(λWとする)と読み出し用の半導体レーザ
光の波長(λRとする)は異なる方がよい(λW
λ R)。何故ならばこれらの半導体レーザは近接して配
置されているので、読み出し時に書き込み時の信号が混
ざることをさけるためであり、読み出し時の信号を正確
にするため、読み出し用レーザ光のスポット径を小さく
する(波長を短くする)ためでもある。
2. Description of the Related Art Recently, in the field of optical information processing, optical
Optical recording and reproducing devices such as discs have come to be used
There is. Writing data to this optical recording / reproducing device
A semiconductor laser for reading, erasing and erasing is used. So
Depending on the application, if you want to read immediately after writing,
Write or read while erasing
There are times when you want to stay. In this case, the semiconductor laser for writing
The wavelength of light (λWAnd a semiconductor laser for reading
Wavelength of light (λRShould be different (λW>
λ R). Because these laser diodes are placed close to each other.
Since it is placed, the signals at the time of writing are mixed at the time of reading.
This is to avoid the evil, and the signal when reading is accurate
Therefore, the spot diameter of the laser light for reading is reduced.
This is also to (to shorten the wavelength).

【0003】他には高品位テレビ画像を記録する場合に
も、輝度信号とカラー信号を別々の波長の2種類のレー
ザ光で書き込みたい要望がある。このような状況におい
て、近年、波長の異なる複数個の半導体レーザを1チッ
プ化したい要望がますます強くなってきている。又、複
数のレーザ光を放射する半導体レーザ装置は、大容量通
信を行うための光多重通信の光源としても強く要望され
ている。
In addition, even when recording a high-definition television image, there is a desire to write a luminance signal and a color signal with two types of laser beams having different wavelengths. Under such circumstances, in recent years, there has been an increasing demand for integrating a plurality of semiconductor lasers having different wavelengths into one chip. Further, a semiconductor laser device that emits a plurality of laser beams is strongly desired as a light source for optical multiplex communication for performing large capacity communication.

【0004】従来、複数のレーザ光を放射できる1チッ
プの半導体レーザとして図4に示すような通常のダブル
ヘテロ構造を2度積層し、上部のダブルヘテロ構造の一
部を除去して、下部のダブルヘテロ構造に対する半導体
レーザ用の電極を形成したものがある(Shiro Sakai;El
ectronics Lett.1817(1982))。
Conventionally, as a one-chip semiconductor laser capable of emitting a plurality of laser beams, a normal double hetero structure as shown in FIG. 4 is laminated twice, a part of the upper double hetero structure is removed, and the lower double hetero structure is removed. There is one in which electrodes for a semiconductor laser for a double hetero structure are formed (Shiro Sakai; El
ectronics Lett. 18 17 (1982)).

【0005】この半導体レーザは、活性層1に対して電
極5、活性層3に対して電極4が各々レーザ駆動用の電
極となっている。電極3は共通電極であり、今A領域の
半導体レーザを駆動させると発振波長λ1のレーザ光が
出射され、B領域の半導体レーザを駆動させると発振波
長λ2のレーザ光が出射される仕組になっていた(λ1
λ2)。
In this semiconductor laser, the electrode 5 for the active layer 1 and the electrode 4 for the active layer 3 are electrodes for driving the laser, respectively. The electrode 3 is a common electrode, and when the semiconductor laser in the area A is driven, the laser light having the oscillation wavelength λ 1 is emitted, and when the semiconductor laser in the area B is driven, the laser light having the oscillation wavelength λ 2 is emitted. (Λ 1
λ 2 ).

【0006】[0006]

【発明が解決しようとする課題】しかし、このような構
造のものではA領域の電極4の材料(例えばAu/S
n)とB領域の電極2の材料(Au/Zn)とは異なる
ので少なくとも3度の電極形成工程を必要とし、また各
半導体レーザの活性領域が異なるエピタキシャル層で構
成される等のプロセスが複雑となる難点があった。
However, in such a structure, the material of the electrode 4 in the A region (for example, Au / S) is used.
n) and the material (Au / Zn) of the electrode 2 in the B region require at least three electrode formation steps, and the process such that the active region of each semiconductor laser is composed of different epitaxial layers is complicated. There was a difficulty that became.

【0007】そこで、本発明はこれらの難点を解決する
化合物半導体薄膜の形成方法を提供するものである。
Therefore, the present invention solves these difficulties.
A method for forming a compound semiconductor thin film is provided.

【0008】[0008]

【課題を解決するための手段】上記問題点を解決する本
発明の技術的な手段は、少なくとも第1の平坦領域と、
前記第1の平坦領域より段差領域を介して前記基板寄り
に形成した第2の平坦領域とを有する化合物半導体基板
に、1回のエピタキシャル成長により、前記第1の平
坦領域と前記第2の平坦領域とに、2元系あるいは3元
系以上の組成の異なった2種類以上の化合物半導体薄膜
を積層して量子井戸層構造になるようエピタキシャル成
することで、前記第1の平坦領域上の化合物半導体薄
膜の膜厚は、前記第2の平坦領域上の化合物半導体薄膜
の膜厚とは異なるようにエピタキシャル成長できる化合
物半導体薄膜の形成方法とする。
The technical means of the present invention for solving the above-mentioned problems is to provide at least a first flat area,
A compound semiconductor substrate having a second flat region formed closer to the substrate than the first flat region via a step region.
On top of that, by performing one epitaxial growth,
In the tongue area and said second flat regions, two or more compound semiconductor thin film having different binary or ternary or more compositions are laminated by epitaxially grown so that the quantum well layer structure, the second The compound semiconductor thin film on the first flat region has a thickness different from that of the compound semiconductor thin film on the second flat region.
A method for forming a semiconductor thin film .

【0009】また段差領域上の化合物半導体薄膜の膜厚
は、第1の平坦領域の化合物半導体薄膜の膜厚と前記第
2の平坦領域の化合物半導体薄膜の膜厚との間である。
The film thickness of the compound semiconductor thin film on the step region is between the film thickness of the compound semiconductor thin film in the first flat region and the film thickness of the compound semiconductor thin film in the second flat region.

【0010】[0010]

【作用】この技術的手段による作用は次のようになる。
発明者らは、研究の結果、段差構造を有する基板上にエ
ピタキシャル成長した場合、平坦領域および段差領域に
おいて成長速度が異なることを見出した。つまり結果的
には、各領域において各成長層の層厚が異なることにな
るのである。
The function of this technical means is as follows.
As a result of research, the inventors have found that when epitaxially grown on a substrate having a step structure, the growth rate is different between the flat region and the step region. That is, as a result, the layer thickness of each growth layer is different in each region.

【0011】基板上に超薄膜を交互に積み重ねた単一量
子井戸(Single-quantum well,SQW)あるいは多重量子
井戸(multi-quantum well,MQW)は、超薄膜である量子
井戸層の膜厚が異なることになる。つまり、一回の成長
工程で膜厚の異なる、量子井戸構造を有する化合物半導
体層をエピタキシャル成長できる。
A single-quantum well (SQW) or a multi-quantum well (MQW) in which ultrathin films are alternately stacked on a substrate has a quantum well layer which is an ultrathin film. It will be different. That is, a compound semiconductor layer having a quantum well structure having a different film thickness can be epitaxially grown in one growth step.

【0012】[0012]

【実施例】以下、本発明のエピタキシャル成長方法を用
いて、半導体レーザ装置を製造した実施例について図1
〜図3にもとづき説明する。
EXAMPLE An example in which a semiconductor laser device is manufactured by using the epitaxial growth method of the present invention will be described below with reference to FIG.
~ It demonstrates based on FIG.

【0013】(実施例1)本発明の第1の実施例を示す
図1において、GaAs等化合物半導体基板6をエッチ
ングによって段差を設け、この段差付き半導体基板6上
にバッファ層GaAs7、第1のクラッド層であるAl
xGa1-xAs(x0.4)層8と、膜厚が10〜20
0Åの組成の異なる2種類以上の化合物半導体を交互に
3層以上積み重ねた薄膜多層領域、たとえばAlyGa
1-yAs(y0.3)層とGaAs層で構成される薄
膜多層領域(SQW層またはMQW層)9、第2のクラ
ッド層であるAlxGa1-xAs(x0.4)層10、
キャップ層GaAs11を順次エピタキシャル成長法に
より形成する。第1および第2のクラッド層8,10の
半導体の禁制帯幅は、薄膜多層領域の最も広い禁制帯幅
と同じか、それ以上広いものである。
(Embodiment 1) In FIG. 1 showing a first embodiment of the present invention, a step is formed on a compound semiconductor substrate 6 such as GaAs by etching, and a buffer layer GaAs 7 and a first layer are formed on the stepped semiconductor substrate 6. Al that is the clad layer
x Ga 1-x As (x to 0.4) layer 8 and film thickness 10 to 20
A thin-film multilayer region in which two or more kinds of compound semiconductors having different compositions of 0 Å are alternately stacked to form three or more layers, for example, Al y Ga.
1-y As (y to 0.3) layer and a GaAs layer, a thin film multilayer region (SQW layer or MQW layer) 9, and a second cladding layer of Al x Ga 1-x As (x to 0. 4) Layer 10,
The cap layer GaAs11 is sequentially formed by the epitaxial growth method. The forbidden band width of the semiconductor of the first and second cladding layers 8 and 10 is the same as or wider than the widest forbidden band width of the thin film multilayer region.

【0014】段差領域はプロントン照射あるいはエッチ
ングによる該当領域の除去あるいは前記エッチング除去
領域に窒化シリコンあるいは酸化シリコンあるいはポリ
イミドを埋めることにより電気的絶縁分離領域14と
し、平坦領域を半導体レーザの活性領域として用いる。
平坦領域にはP型金属電極たとえばAu/Zu層12、
基板側にはn型金属電極たとえばAn/Sn層13をそ
れぞれ設け段差方向に垂直に劈開して反射面とすること
により図1に示すような半導体レーザ装置となる。
The step region is used as an electrically insulating isolation region 14 by removing the corresponding region by Protonton irradiation or etching or by filling the etching removed region with silicon nitride, silicon oxide or polyimide, and using the flat region as the active region of the semiconductor laser. .
In the flat region, a P-type metal electrode such as Au / Zu layer 12,
An n-type metal electrode, for example, an An / Sn layer 13 is provided on the substrate side and is cleaved perpendicularly to the step direction to form a reflection surface, whereby a semiconductor laser device as shown in FIG. 1 is obtained.

【0015】前述したようにエピタキシャル成長層の成
長速度が上部平坦領域,段差領域,下部平坦領域の順で
遅くなり結果的には図3に示すように、この順で量子井
戸層の層厚が薄くなるため、発振波長は上部平坦領域に
おける発振波長λ3>段差領域における発振波長λ5>下
部平坦領域における発振波長λ4なる関係になり、各領
域で波長の異なった多波長半導体レーザ装置が得られ
る。図1に示す半導体レーザ装置は段差領域を電気的絶
縁分離領域として用いているので、発振波長はλ 3,λ4
の2種類となる。
As described above, the epitaxial growth layer is formed.
Long velocity is in the order of upper flat area, step area, and lower flat area.
As a result, the quantum wells are delayed in this order, as shown in Figure 3.
Since the thickness of the door layer is thin, the oscillation wavelength is in the upper flat region.
Oscillation wavelength λ3> Oscillation wavelength λ in step regionFive> Below
Wavelength λ in flat areaFourBecome a relationship,
A multi-wavelength semiconductor laser device with different wavelengths in
It The semiconductor laser device shown in FIG.
Since it is used as an edge separation region, the oscillation wavelength is λ 3, ΛFour
There are two types.

【0016】(実施例2)この発明の第2の実施例を図
2に基づいて述べる。エピタキシャル成長層の構成は第
1の実施例と同じであるが、平坦領域,段差領域共に半
導体レーザの活性領域とし、各領域の境界近傍を第1の
実施例と同様な方法で電気的に絶縁分離し、電極を形成
する。この実施例では、単一段差に対して、一回のエピ
タキシャル成長で3種類の波長の異なった半導体レーザ
ができることになる。更に複数の段差を形成した基板上
に本発明の構成を適用すれば更に多波長の半導体レーザ
が一度に形成できることは明らかである。
(Second Embodiment) A second embodiment of the present invention will be described with reference to FIG. The structure of the epitaxial growth layer is the same as that of the first embodiment, but the flat region and the step region are both active regions of the semiconductor laser, and the vicinity of the boundary between the regions is electrically isolated by the same method as in the first embodiment. Then, the electrodes are formed. In this embodiment, three kinds of semiconductor lasers having different wavelengths can be formed by a single epitaxial growth for a single step. By applying the configuration of the present invention on a substrate having a plurality of steps formed thereon, it is apparent that semiconductor lasers having more wavelengths can be formed at one time.

【0017】第1,第2の実施例に示す半導体レーザ装
置はAlxGa1-xAs/GaAs系はもちろんのことI
nGaAsP/InP系に対しても適用できる。第2の
実施例において、段差領域における出射パターンは段差
の角度を自由に変えられるので、例えば、直角段差では
平坦領域における出射パターンに対し、段差領域では9
0゜回転した出射パターンも容易に得られる。又、薄膜
多層領域等は有機金属気相成長法(MOCVD:metal
organic chemical vopor deposition)で形成してもよ
いし、他の知られた成長方法、例えばMBE(Molecula
r Beam Epitaxy)法でも形成可能である。
The semiconductor laser devices shown in the first and second embodiments are, of course, Al x Ga 1 -x As / GaAs type and I type.
It can also be applied to the nGaAsP / InP system. In the second embodiment, since the emitting pattern in the step region can freely change the angle of the step, for example, in the step region, the angle is 9 in the flat region as compared with the emitting pattern in the flat region.
An emission pattern rotated by 0 ° can be easily obtained. In addition, the thin-film multi-layer region and the like are formed by metal organic chemical vapor deposition (MOCVD:
Organic chemical vapor deposition) or other known growth methods such as MBE (Molecula).
It can also be formed by the r Beam Epitaxy method.

【0018】[0018]

【発明の効果】以上のように、本発明によれば、1回の
エピタキシャル成長工程で基板上に膜厚の異なった、量
子井戸構造を有する化合物半導体薄膜が形成できるの
で、この方法を用いれば、作製プロセスが簡単でしかも
極めて優れた特性のデバイスを再現性よく製造できる。
As described above, according to the present invention, a compound semiconductor thin film having a quantum well structure having a different film thickness can be formed on a substrate by a single epitaxial growth step. A device with a simple manufacturing process and extremely excellent characteristics can be manufactured with good reproducibility.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明を用いた一実施例である半導体レーザ装
置の構成を示す図
FIG. 1 is a diagram showing a configuration of a semiconductor laser device which is an embodiment using the present invention.

【図2】本発明を用いた一実施例である半導体レーザ装
置の構成を示す図
FIG. 2 is a diagram showing a configuration of a semiconductor laser device which is an embodiment using the present invention.

【図3】平坦領域、段差領域の各領域における薄膜多層
領域の層厚と発振波長との関係を説明するための図
FIG. 3 is a diagram for explaining a relationship between a layer thickness of a thin film multilayer region and an oscillation wavelength in each of a flat region and a step region.

【図4】従来の多波長半導体レーザ装置の構成を示す図FIG. 4 is a diagram showing a configuration of a conventional multiwavelength semiconductor laser device.

【符号の説明】[Explanation of symbols]

6 n型GaAs基板 8 第1のクラッド層 9 SQWまたはMQW層 10 第2のクラッド層 12 電極 13 電極 14 電気的絶縁分離領域 6 n-type GaAs substrate 8 first cladding layer 9 SQW or MQW layer 10 second cladding layer 12 electrode 13 electrode 14 electrically insulating isolation region

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 少なくとも第1の平坦領域と、前記第1
の平坦領域より段差領域を介して前記基板寄りに形成し
た第2の平坦領域とを有する化合物半導体基板に、1回のエピタキシャル成長により、前記第1の平坦領域
と前記第2の平坦領域とに、 2元系あるいは3元系以上
の組成の異なった2種類以上の化合物半導体薄膜を積層
して量子井戸層構造になるようエピタキシャル成長する
ことで、前記第1の平坦領域上の化合物半導体薄膜の膜
厚は、前記第2の平坦領域上の化合物半導体薄膜の膜厚
とは異なるようにエピタキシャル成長できることを特徴
とする化合物半導体薄膜の形成方法
1. At least a first flat region and the first flat region.
Through the step region from a flat region on a compound semiconductor substrate and a second flat region formed on the substrate side of the, by a single epitaxial growth, the first flat region
And the said second flat regions, two or more compound semiconductor thin film having different binary or ternary or more compositions are laminated to epitaxially so that the quantum well layer structure
It is the first compound film thickness of the semiconductor thin film on the flat area, formed of the compound semiconductor thin film characterized by be epitaxially grown as different from the thickness of the compound semiconductor thin film on the second flat region Way .
【請求項2】 段差領域上の化合物半導体薄膜の膜厚
は、第1の平坦領域上の化合物半導体薄膜の膜厚と
2の平坦領域上の化合物半導体薄膜の膜厚との間である
ことを特徴とする特許請求の範囲第1項記載の化合物
半導体薄膜の形成方法
2. A compound thickness of the semiconductor thin film on the stepped region is between a film thickness of the compound semiconductor thin film on the first flat region, with a second compound film thickness of the semiconductor thin film on the flat region The compound according to claim 1, characterized in that
Method for forming semiconductor thin film .
JP5274187A 1993-11-02 1993-11-02 Method for forming compound semiconductor thin film Expired - Lifetime JPH088218B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5274187A JPH088218B2 (en) 1993-11-02 1993-11-02 Method for forming compound semiconductor thin film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5274187A JPH088218B2 (en) 1993-11-02 1993-11-02 Method for forming compound semiconductor thin film

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2550885A Division JPH0638538B2 (en) 1985-02-13 1985-02-13 Multi-wavelength semiconductor laser device

Publications (2)

Publication Number Publication Date
JPH06224522A JPH06224522A (en) 1994-08-12
JPH088218B2 true JPH088218B2 (en) 1996-01-29

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JPH0638538B2 (en) * 1985-02-13 1994-05-18 松下電器産業株式会社 Multi-wavelength semiconductor laser device
JPH0638538A (en) * 1992-07-17 1994-02-10 Meidensha Corp Three-phase output voltage balanced system for uninterruptible power source

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