JPH088275B2 - Three-dimensional wire bonding wiring device - Google Patents

Description

The present invention relates to a wire bonding and wiring apparatus, and a first three-dimensional wire bonding and wiring apparatus that is capable of performing wire bonding between two surfaces that are tilted by a predetermined angle with respect to each other. A three-dimensional wire bonding wiring device for performing work bonding on the first and second surfaces of a work having a front surface and a second surface, wherein a wire to be bonded is inserted and a vertically movable bonding tool, and the work. Around the work rotation center
It comprises a work rotating means for rotating 0 ° -θ ° and a work indexing means for indexing the wire bonding position of the work.

TECHNICAL FIELD The present invention relates to a wire bonding wiring device.

Bonding is a general term for a connection method for incorporating a semiconductor chip into a package, and is roughly classified into a wire bonding method and a wireless bonding method. In the case of the wire bonding method, first, die bonding is performed to fix the chip upward at a predetermined position of the package, and then wire bonding is performed to connect the electrodes of the chip to the leads. The wire bonding includes a thermocompression bonding method, an ultrasonic bonding method, a thermosonic bonding method, and the like, and a versatile wire bonding method that is not affected by the shape of a work is desired.

2. Description of the Related Art FIG. 4 is an explanatory view of conventional wire bonding. The conventional wire bonding is to connect two electrodes on a plane with a wire as shown in FIG. 4 (A), or two electrodes on a plane with a step as shown in FIG. 4 (B). It is configured for the purpose of connecting between the wires. In FIG. 4 (A), 1 is a work, and electrodes 4 and 5 to be connected are formed on this work. Reference numeral 2 is a bonding tool (capillary). A bonding wire 3 such as a gold wire is inserted into the bonding tool 2 so that its tip comes out of the tip of the bonding tool 2.

In the bonding step, first, as shown in (a), the bonding tool 2 is lowered onto the electrode 4 and the tip of the bonding wire 3 is heated by a burner or arc discharge to form a ball.
The first bonding is performed by pressing the bonding tool onto the electrode 4 while applying ultrasonic waves to the electrode 4. Then, the bonding tool 2 is moved while being lifted as shown in (b), the bonding tool 2 is lowered onto the electrode 5 as shown in (c), and the bonding wire 3 is also heated by a burner or arc discharge to perform bonding. Second bonding is performed by pressing the bonding tool against the electrode 5 while applying ultrasonic waves or the like to the tool 2. After this second bonding is performed, the bonding tool 2 is laterally displaced to cut the bonding wire 3 into a wedge shape, and the bonding tool 2 is again moved to the position shown in (a) to perform the above-described first bonding.

FIG. 4 (B) shows a case where the work 1'has two flat surfaces with steps, and the electrodes 6 and 7 formed on the two flat surfaces.
Shows a state in which the bonding wires 3 are connected to each other.
The bonding work process is the same as that shown in FIG.

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention As described above, since the conventional wire bonding apparatus is configured for the purpose of connecting the two electrodes on the plane or the plane having the step with the bonding wire, the two wires tilted at a predetermined angle from each other. There is a problem that wire bonding cannot be performed between the electrodes. In order to achieve such three-dimensional wire bonding, it is conceivable to use a conventional bonding tool in a desired direction, but this structure is not practical because the bonding tool moving means is complicated.

The present invention has been made in view of these points,
It is an object of the invention to provide a three-dimensional wire bonding wiring device capable of wire bonding between two surfaces inclined with each other by a predetermined angle.

Means for Solving the Problems In a three-dimensional wire bonding apparatus, it is necessary to position the work (substrate) electrode surface at an optimum position each time bonding is performed. The optimum position of the work electrode (target bonding position) with respect to the bonding tool satisfies all of the following.

The bonding tool should make vertical contact with the electrode surface.

Complete bonding within the effective stroke of the bonding tool.

The bonding tool can be repeatedly positioned at the target bonding position.

Do not damage the bonding wire due to the movement trajectory of the bonding tool from the first bonding to the second bonding.

As an apparatus that satisfies all the above conditions, the present invention is configured so that the angle of the bonding tool is fixed as it is and the work surface can be positioned at the optimum angle each time.

That is, according to the present invention, as shown in the principle diagram of FIG. 1, wire bonding is performed on the first surface 10a and the second surface 10b of the work 10 having the first surface 10a and the second surface 10b inclined with respect to each other by θ °. A three-dimensional wire bonding wiring device, in which a wire 15 to be bonded is inserted and a vertically movable bonding tool 12, and a work rotating means 1 for rotating a work 10 by 180 ° -θ ° around a work rotation center.
3 and work indexing means 14 for indexing the wire bonding position of the work 10 are provided.

Function The present invention is configured such that the angle of the bonding tool is fixed and the work surface to be bonded is rotated by a predetermined angle by the work rotating means, so that the conventional accumulation technique can be utilized and the above-mentioned conditions are satisfied. It is possible to provide a three-dimensional wire bonding wiring device that satisfies all requirements.

That is, first, in the first bonding, the work 10 and the bonding tool 12 are arranged in the positional relationship shown in FIG. The electrode to be bonded on the first surface 10a of the work 10 is indexed by the work indexing means 14, and the bonding tool 12 is moved from the upper side to the lower side in the same manner as the conventional planar bonding to perform the first bonding. After that, the bonding tool 12 escapes upward, and the workpiece 10 rotates 180 ° about the workpiece rotation center.
The bonding tool 12 is positioned right above the second bonding point by rotating θ ° (90 ° in FIG. 1). During that time, the forming of the wire is controlled by the amount of upward clearance of the bonding tool 12 to form an appropriate shape. When the bonding tool 12 just above the second bonding point moves downward and is second bonded as it is, the bonding wire 15 is connected to the electrode formed on the second surface 10b, and the wire is cut to complete one step.

Next, the work 10 is placed in the first bonding position 18
After being returned by 0 ° -θ °, it is indexed by the work indexing means 14 and advanced by one pitch, and the preparation for the first bonding is completed. By repeating this process, three-dimensional wire bonding is performed.

As described above, according to the present invention, since the work to be bonded is rotated, the bonding tool can be repeatedly positioned at the target bonding position and the bonding tool is not rotated so that the bonding wire is not damaged.

Embodiment Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 2 is a perspective view of a work to be wire-bonded according to the embodiment of the present invention. The work is composed of an inner cylinder on which an infrared detecting element is mounted and an annular ceramic substrate. The inner cylinder 16 is made of Kovar glass and has a large number of gold patterns on its circumferential surface and upper end surface.
16a is formed. Further, a bonding electrode for wire bonding is formed on each gold pattern 16a on the circumferential surface. An infrared detecting element 24 is bonded to the upper end surface of the inner cylinder 16, and the infrared detecting element 24 and the gold pattern 16a of the inner cylinder 16 are bonded and connected by a bonding wire 25 such as gold. 22 is a ring-shaped ceramic substrate, the inner cylinder
It is fixed so as to be perpendicular to the axis of 16, and a gold thick film pattern 16a is formed on the surface thereof. The gold pattern 16a of the inner cylinder 16 and the gold thick film pattern 22a of the annular ceramic substrate 22 are wired by the three-dimensional wire bonding wiring device of the embodiment of the present invention described in detail below. 27 is a bonding wire of gold or the like wired in this way.

The inner cylinder 16 and the annular ceramic substrate 22 configured as described above
The assembly of and is housed in an outer cylinder (not shown) formed of Kovar or the like and vacuum-sucked, and the container thus vacuum-sucked is mounted on, for example, a helium circulation cooler,
The infrared detecting element 24 is cooled to the liquid nitrogen temperature by this cooler.

FIG. 3 shows a perspective view of an embodiment of a three-dimensional wire bonding wiring device according to the present invention. In the figure, reference numeral 30 denotes an apparatus main body, a block 32 is fixed to the apparatus main body 30, and a support fitting 34 is fixed to the block 32. An L-shaped metal fitting 36 is rotatably attached to the support metal fitting 34, and the L-shaped metal fitting 36 is rotated by rotating the handle 38. 39 and 41 are stoppers, and the handle 38 is rotated until it comes into contact with these stoppers 39 and 41,
The L-shaped bracket 36 is rotated 90 °. 42 is a workpiece fixing member rotatably attached to the L-shaped metal fitting 36, and is a rotary indexing device.
The angle is indexed by 40. Reference numeral 44 is a work having a cylindrical surface 44a and a flat surface 44b orthogonal to the axis of the cylinder, and predetermined patterns and electrodes to be bonded and connected are formed on the cylindrical surface 44a and the flat surface 44b, respectively.

46 is a bonding tool, through which a bonding wire 48 made of gold is inserted. The bonding wire 48 is wound around the bobbin 50 and is supplied while being guided by the guide 52. Reference numeral 54 denotes an ultrasonic arm, the tip of which is open to the bonding tool 46, and ultrasonic bonding is performed while the bonding tool 46 is vibrated by ultrasonic waves. Reference numeral 56 is a microscope for enlarging the indexing position. Since the pattern width and the diameter of the bonding wire are as small as several tens of μm, the microscope 56
The indexing device 40 is used for indexing while expanding with 56. Reference numeral 58 is an illuminating device for illuminating the indexing position enlarged by the microscope 56.

However, the handle 38 is rotated to abut the stopper 39 as shown in FIG. 3, and the microscope 56 is enlarged while illuminating the indexing position with the illumination 58, and the indexing device 40 is used to position the cylindrical surface 44a of the workpiece 44. The bonding tool 46 is used to identify the cylindrical pattern and electrodes to be fast-bonded.
Be located directly below. Fast bonding is performed by moving the bonding tool 46 downward from above. After that, while letting the bonding tool 46 escape upward by means not shown, the handle 38 is stopped by the stopper 41.
The workpiece 44 is rotated 90 ° by rotating until it comes into contact with the bonding tool 46, and the bonding tool 46 is positioned right above the second bonding point. Meanwhile, the bonding tool 46
The forming amount of the bonding wire 48 is controlled by the amount of the upward escape of the bonding wire 48, and the bonding wire 48 is formed into an appropriate shape. The bonding tool 46 immediately above the second bonding point is moved downward as it is to perform the second bonding, the bonding wire 48 is connected to the electrode of the plane pattern, the bonding wire is cut, and one step is completed.

Then, by rotating the handle 38 until it abuts against the stopper 39, the work 44 is rotated 90 ° and brought into the state shown in FIG. 3, and then the microscope 58 enlarges it while illuminating the indexing position with the illumination 58, The cylinder axis is indexed by the indexing device 40 and advanced by one pitch, and the preparation for the first bonding is completed. By repeating this process, right-angled three-dimensional wire bonding of the work as shown in FIG. 2 can be achieved.

Although the above-described embodiment has described the wire bonding on two surfaces inclined by 90 ° to each other, the present invention is not limited to this, and the bonding position condition is selected by the combination of the work rotation center selection and the rotation angle. By arranging the two, it becomes possible to perform three-dimensional wire bonding on the two surfaces inclined with respect to each other by a predetermined angle.

EFFECTS OF THE INVENTION Since the present invention has been achieved as described above in detail, it is possible to perform three-dimensional wire bonding on two surfaces inclined by a predetermined angle while maintaining and utilizing the performance of conventional wire bonding. Play. Further, the forming of the bonding wire can be optimally controlled by the work movement trajectory.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a principle view of the present invention, and FIG. 2 is a perspective view of an inner cylinder equipped with an infrared detection element suitable for wire bonding by the device of the present invention and a ceramic substrate. FIG. 4 is a perspective view of an embodiment of the present invention, and FIG. 4 is an explanatory view of conventional wire bonding. 10,44 ... Work, 12,46 ... Bonding tool, 13 ... Work rotating means, 14 ... Work indexing means, 15,48 ... Bonding wire, 38 ... Handle, 40 ... Indexing device, 54 ... Ultrasonic arm, 56 … Microscope, 58… Lighting equipment.

Claims (1)

[Claims] 1. A first (10a) of a work (10) having a first surface (10a) and a second surface (10b) inclined with respect to each other by θ °.
And a three-dimensional wire bonding wiring device for wire bonding to the second surface (10b), in which a wire (15) to be bonded is inserted and a vertically movable bonding tool (12) and a work (10). A three-dimensional wire comprising work rotating means (13) for rotating the workpiece around the work rotation center by 180 ° -θ ° and work indexing means (14) for determining the wire bonding position of the work (10). Bonding wiring device.