JPH088436B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and an electronic component mounting method, and relates to an edge part at four corners of a chip that is sucked by a nozzle of a transfer head and transferred to a substrate. Are simultaneously observed to detect the positional deviation of this chip.

(Prior Art) A mounting device for electronic parts (hereinafter referred to as a chip) such as a QFP, a capacitor chip, a resistance chip, etc. sucks a chip of a chip supply unit such as a tray, a tape feeder, or a tube feeder to a nozzle of a transfer head. Then, the substrate is transferred and mounted on the substrate positioned by the positioning unit. In this case, the chip sucked by the nozzle has a positional shift in the XYθ directions, and after being corrected, the chip is transferred and mounted on the substrate.

FIG. 7 shows a conventional position shift observing means for a chip (QFP) P, in which 100 is a nozzle and 101 is a camera. The nozzle 100 that has adsorbed the chip P of the chip supply unit is
The chip P is transferred above the camera 101, and its positional deviation in the XYθ directions is observed. And the displacement in the XY direction is
It is corrected by adjusting the stroke of the nozzle 100 in the XY direction, and the positional deviation in the θ direction (rotational direction) is corrected by rotating the nozzle 100 around the axis center by a motor.

By the way, for example, a large number of leads L are provided in four directions.
Since QFP and the like require extremely high mounting accuracy, it is desirable to accurately detect the positional deviation by increasing the magnification of the camera 101 and observing the edge portions at the four corners. However, if you increase the magnification, the camera
The field of view of 101 becomes so small that it becomes difficult to simultaneously observe the four corners. Therefore, conventionally, if the chip P is transferred above the camera 101, the nozzle 100 and the camera 101 are relatively moved in the XY directions.
The edges e1 to e4 at the four corners were placed in the visual field a of the camera 101 for observation (see FIG. 6).

(Problems to be Solved by the Invention) However, as described above, the nozzle 100 and the camera 101 are connected to each other.
The means for sequentially observing the edge portions e1 to e4 while moving in the XY directions requires a considerable observation time because the transfer head or the camera 101 must be repeatedly moved and stopped, and thus the mounting speed of the chip P. There was a problem that did not go up.

Therefore, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method provided with means for collectively observing edge portions at four corners of a chip.

To this end, the present invention provides a chip supply unit, a substrate positioning unit, and a transfer head that chucks a chip of the chip supply unit to a nozzle and transfers and mounts the chip on the substrate of the positioning unit. In an electronic component mounting apparatus including: an optical element for refracting light radiated from above to a chip chucked by the nozzle from four directions is provided below a transfer path of the transfer head; Four cameras are provided on the four sides to observe the edge portions at the four corners of the chip when the light refracted in the four directions is incident.

(Operation) In the above configuration, the light radiated onto the chip chucked by the nozzle from above is refracted in four directions by the optical element, and the refracted light in the four directions is observed by the camera, respectively. The edge portions of are observed together and the positional deviation is detected.

Example 1 Next, an example of the present invention will be described with reference to the drawings.

FIG. 1 is an overall view of an electronic component mounting apparatus, in which 1 is a main body box, and 2 is a drive unit box provided on the upper part thereof. A positioning portion 4 for clamping and positioning the substrate 3 is provided on the upper surface of the body case 1. Reference numerals 5 and 6 are conveyors that carry out the substrate 3 with the substrate 3 carried into the positioning portion 4. On the front side of the positioning unit 4, a chip supply unit 7 including a tray is provided. Reference numeral 10 denotes a transfer head vertically mounted on the drive unit box 2, which is driven by an XY direction moving device incorporated in the drive unit box 2 to reciprocate between the chip supply unit 7 and the substrate 3, The chip of the supply unit 7 is adsorbed by the nozzle 9 and transferred and mounted on the substrate 3. Reference numeral 8 is a monitor camera. Reference numeral 11 denotes an optical element for detecting the positional deviation of the chip, which is provided in the transfer path of the transfer head 10 between the tray 7 and the substrate 3, and its details will be described below with reference to FIGS. 2 and 3. To do.

The optical element 11 is configured by integrally forming four prisms 11a to 11d, and each prism 11a to 11d refracts light emitted from above to the outside. Each prism 11a-1
A camera 13 in which refracted light is incident on the lower 4 side of 1d
a to 13d are provided, and the light irradiated to the optical element 11 is refracted in four directions by the prisms 11a to 11d, respectively, so that the edge portions at the four corners of the chip P are collectively observed. This chip P is a QFP having a large number of leads L in four directions, and high mounting accuracy is required in order to mount each lead L so as to exactly match the bond applied to the substrate 3. In FIG. 3, reference numeral 12 is a ring-shaped light source provided below the transfer head 10.

The present invention is configured as described above, and the operation will be described next.

When the substrate 3 is carried into the positioning unit 4 and positioned by the conveyor 5, the transfer head 10 starts moving in the XY directions. The transfer head 10 first moves above the chip supply unit 7, and the nozzle 9 moves up and down to adsorb the chip P and take it up, and moves to above the optical element 11. Then, the observation stage above the optical element 11 is stopped, and the chip P is irradiated with light at this observation stage, and the edge portion of the chip P is
Observe e1 to e4 (see FIG. 6). In this case, as described above, the light radiated on the edge portions e1 to e4 of the chip P is refracted in four directions by the prisms 11a to 11d, and each of the cameras 13a.
.. 13d, the edge portions e1 to e4 at the four corners are collectively observed, and the position shift of the chip P in the XY.theta. Direction is detected by the well-known image processing means.

Of the positional deviations in the XYθ directions, the positional deviations in the XY directions are corrected by adjusting the stroke of the transfer head 10 in the XY directions. The position in the θ direction is corrected by rotating the nozzle 9 in the θ direction by the motor built in the transfer head 10. In this way, the displacement in the XYθ directions is corrected, and the transfer head 10 moves above the substrate 3 positioned by the positioning unit 4 to mount the chip P on the substrate 3.

(Example 2) In FIGS. 4 and 5, 14 is an optical element. This optical element 14 has four mirror parts that reflect light obliquely upward.
14a to 14d are formed in a quadrangular pyramid shape, and cameras 13a to 13d are provided obliquely above the respective mirror portions 14a to 14d. Therefore, also in this device, the chip P is transferred above the optical element 14, and the light is irradiated from above to refract the light toward the cameras 13a to 13d, and the chip P
Edges e1 to e4 at the four corners can be collectively observed.

(Effects of the Invention) According to the present invention, 4 of chips chucked to the nozzle
It is possible to observe the edge portions of the corners collectively, and therefore the time required for observation can be greatly shortened compared to the conventional method,
As a result, the chip mounting speed can be increased. In particular, the present invention exerts its advantage as a QFP position deviation observing means in which the magnification of the camera must be increased and the edge portions at the four corners of the chip must be precisely observed because the required mounting accuracy is high.

[Brief description of drawings]

FIG. 1 shows an embodiment of the present invention. FIG. 1 is a perspective view of an electronic component mounting apparatus, FIGS. 2 and 3 are perspective views and side views during observation, and FIGS. Is a perspective view and a side view during observation of another embodiment, FIG. 6 is a plan view of the field of view of the camera, and FIG. 7 is a perspective view of a conventional apparatus. 3 ... Substrate 4 ... Positioning part 7 ... Chip supply part 9 ... Nozzle 10 ... Transfer head 11,14 ... Optical element 12 ... Light source part 13a to 13d ... Camera

Claims (2)

[Claims] 1. A transfer path of a transfer head in an electronic component mounting apparatus comprising a chip supply unit, a substrate positioning unit, and a transfer head for chucking a chip onto a nozzle and transferring and mounting the chip on the substrate of the positioning unit. An optical element for refracting the light emitted from above to the chip in four directions is provided below the chip, and the light refracted in the four directions is incident on four sides of the optical element. An electronic component mounting apparatus, which is provided with four cameras for collectively observing corner edge portions. 2. A step of moving a transfer head above a chip supply section to chuck the chip by a nozzle to take it up, a step of transferring the chip to an observation stage by the transfer head, and the chip in this observation stage. By irradiating light from above toward the light, refracting the radiated light in four directions by the optical element and making it incident on four cameras provided on four sides of the optical element, the four corners of the chip are edged. Electronic device characterized by including a step of collectively obtaining a partial image and a step of correcting the position of the chip based on the obtained image and then mounting the chip on the substrate by the transfer head. Parts mounting method.