JPH089745B2 - Copper-based alloy for terminals - Google Patents
Copper-based alloy for terminalsInfo
- Publication number
- JPH089745B2 JPH089745B2 JP3018337A JP1833791A JPH089745B2 JP H089745 B2 JPH089745 B2 JP H089745B2 JP 3018337 A JP3018337 A JP 3018337A JP 1833791 A JP1833791 A JP 1833791A JP H089745 B2 JPH089745 B2 JP H089745B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- stress relaxation
- terminals
- based alloy
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910045601 alloy Inorganic materials 0.000 title claims description 40
- 239000000956 alloy Substances 0.000 title claims description 40
- 239000010949 copper Substances 0.000 title claims description 35
- 229910052802 copper Inorganic materials 0.000 title claims description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 26
- 239000012535 impurity Substances 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 3
- 150000002736 metal compounds Chemical class 0.000 claims 2
- 229910018104 Ni-P Inorganic materials 0.000 claims 1
- 229910018536 Ni—P Inorganic materials 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 description 22
- 238000012360 testing method Methods 0.000 description 15
- 230000000694 effects Effects 0.000 description 10
- 229910001369 Brass Inorganic materials 0.000 description 8
- 238000005452 bending Methods 0.000 description 8
- 239000010951 brass Substances 0.000 description 8
- 229910000906 Bronze Inorganic materials 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 239000010974 bronze Substances 0.000 description 5
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 5
- 229910018886 Sn—Fe—P Inorganic materials 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229920006395 saturated elastomer Polymers 0.000 description 4
- 238000005097 cold rolling Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229910009038 Sn—P Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000005098 hot rolling Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910020900 Sn-Fe Inorganic materials 0.000 description 1
- 229910019314 Sn—Fe Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Description
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【０００１】[0001]
【産業上の利用分野】本発明は、自動車等のコネクタ用
端子に用いられる銅基合金およびその端子に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper-based alloy used for a connector terminal of an automobile or the like and a terminal thereof.
【０００２】[0002]
【従来の技術】自動車等の端子用銅基合金については、
従来は黄銅およびリン青銅、さらにはＣｕ−Ｓｎ−Ｆｅ
−Ｐ系等の銅基合金が使用されていた。2. Description of the Related Art Regarding copper-based alloys for terminals such as automobiles,
Conventionally brass and phosphor bronze, and also Cu-Sn-Fe
Copper-based alloys such as -P series have been used.
【０００３】[0003]
【発明が解決しようとする課題】自動車等コネクタ用端
子は、最近のエレクトロニクスの発達に伴い、高密度
化、小型化、軽量化、そして信頼性向上が求められるよ
うになってきている。またさらに、エンジンの高性能化
に伴い、エンジンルーム内の温度も上昇してきている。
それに伴い、そこに使用される導電材料である端子用銅
基合金も、より高信頼性および耐熱性が要求されるよう
になってきている。しかしながら、端子用銅基合金とし
て従来用いられてきた黄銅は安価ではあるが導電率が低
く、例えばＣ2600で27％IACSであり、さらに耐食性や応
力緩和特性にも問題があった。また、リン青銅は強度は
優れているが導電率が低く、例えばＣ5210で12％IACS程
度であり、耐応力緩和特性にも問題があり、さらに価格
的にも高く経済的でなかった。Ｃｕ−Ｓｎ−Ｆｅ−Ｐ系
合金は、これら２つの合金の欠点を補うために開発され
たものである。例えばＣｕ−2.0 Ｓｎ−0.1 Ｆｅ−0.03
Ｐで導電率は35％IACSで、強度にも優れているが、耐応
力緩和特性については端子用合金としては十分満足して
いるとは言えなかった。With the recent development of electronics, there has been a demand for higher density, smaller size, lighter weight, and improved reliability of terminals for automobiles and the like. In addition, the temperature inside the engine room has risen as engine performance has increased.
Along with this, the copper-based alloy for terminals, which is a conductive material used therein, is also required to have higher reliability and heat resistance. However, brass, which has been conventionally used as a copper-based alloy for terminals, is inexpensive but has a low electrical conductivity, for example, C2600 has 27% IACS, and further has problems in corrosion resistance and stress relaxation characteristics. Further, phosphor bronze is excellent in strength but low in electric conductivity, for example, C5210 is about 12% IACS, and there is a problem in stress relaxation resistance, and it is expensive and not economical. The Cu-Sn-Fe-P-based alloy was developed to compensate for the drawbacks of these two alloys. For example, Cu-2.0 Sn-0.1 Fe-0.03
The conductivity of P is 35% IACS and the strength is excellent, but it cannot be said that the stress relaxation resistance is sufficiently satisfactory as an alloy for terminals.
【０００４】また特に自動車用端子として信頼性を向上
させるためには、そこに用いられる銅基合金が、強度、
ばね限界値、導電率に優れ、さらに長時間の使用に対し
ても応力緩和、腐食等を起こさないことが必要である
が、従来の黄銅、リン青銅、さらにＣｕ−Ｓｎ−Ｆｅ−
Ｐ系合金はいずれも上記特性を満足するものではなかっ
た。Further, in order to improve the reliability as a terminal for automobiles in particular, the copper-based alloy used therefor is
It is necessary to have excellent spring limit value, conductivity, and stress relaxation and corrosion even when used for a long time, but conventional brass, phosphor bronze, and Cu-Sn-Fe-
None of the P-based alloys satisfied the above characteristics.
【０００５】さらにこれらの端子用銅基合金を用いて製
造された端子についても、これらの材料の特性がそのま
ま端子としての特性に結びついていた。黄銅、リン青
銅、Ｃｕ−Ｓｎ−Ｆｅ−Ｐ系合金を用いた端子では、導
電率、耐応力緩和特性の両特性を兼ね備えていないた
め、端子の自己発熱により酸化、メッキ剥離、応力緩
和、回路の電圧降下、ハウジングの軟化や変形が生じる
可能性を有する。Further, with respect to terminals manufactured using these copper-based alloys for terminals, the characteristics of these materials are directly linked to the characteristics as terminals. Since terminals using brass, phosphor bronze, and Cu-Sn-Fe-P alloy do not have both conductivity and stress relaxation resistance characteristics, oxidation, plating peeling, stress relaxation, circuit There is a possibility of voltage drop, softening and deformation of the housing.
【０００６】したがって、本発明は、引張強さ、ばね限
界値、導電率および耐応力緩和特性のすべてに優れた端
子用銅基合金を提供すること、並びに、少なくともこの
合金により構成されたばね部を有している低電圧低電流
抵抗値、耐応力緩和特性に優れた端子を提供することを
目的としている。Therefore, the present invention provides a copper base alloy for terminals which is excellent in all of tensile strength, spring limit value, electrical conductivity and stress relaxation resistance, and at least a spring portion made of this alloy. It is an object of the present invention to provide a terminal having excellent low voltage and low current resistance and excellent stress relaxation resistance.
【０００７】[0007]
【課題を解決するための手段】本発明者らは、上記目的
を達成すべく、前記の課題について鋭意検討の結果、該
銅基合金としてＣｕ−Ｎｉ−Ｓｎ−Ｐ系銅基合金および
それにさらにＺｎを添加したＣｕ−Ｎｉ−Ｓｎ−Ｐ−Ｚ
ｎ系合金について試験研究を重ね、その成分組成を選ぶ
ことにより、引張強度、導電率、さらには応力緩和率に
ついて満足すべき特性が得られることを見出し、また、
この銅基合金から作製されたばねを内蔵するか、または
ばねを含めての全体をその銅基合金で一体的に製作した
端子は優れた性能を兼ね備えていることを見い出し本発
明に到達した。In order to achieve the above object, the inventors of the present invention have made earnest studies on the above-mentioned problems, and as a result, as the copper-based alloy, a Cu-Ni-Sn-P-based copper-based alloy and further Cu-Ni-Sn-P-Z with Zn added
It was found that satisfactory properties can be obtained with respect to tensile strength, conductivity, and stress relaxation rate by repeatedly conducting test research on n-based alloys and selecting the component composition thereof.
The inventors have found that a terminal having a built-in spring made of this copper-based alloy or integrally made of the whole of the spring including the spring has excellent performance, and has reached the present invention.
【０００８】すなわち本発明は第一に、重量％で、Ｎ
ｉ：0.5 〜3.0 ％、Ｓｎ：0.5 〜2.0 ％、Ｐ：0.005 〜
0.20％を含有し、残部がＣｕと不可避不純物からなる組
成を有し、引張り強さが50kgf/mm2 以上、ばね限界値が
40kgf/mm2 以上、応力緩和率が10％以下および導電率30
％IACS以上の特性を持つことを特徴とする端子用銅基合
金を提供する。本発明は第二に、重量％で、Ｎｉ：0.5
〜3.0 ％、Ｓｎ：0.5 〜2.0 ％、Ｐ：0.005 〜0.20％、
Ｚｎ：0.01〜2.0 ％を含有し、残部がＣｕと不可避不純
物からなる組成を有し、引張強さが50kgf/mm2 以上、ば
ね限界値が40kgf/mm2 以上、応力緩和率10％以下および
導電率30％IACS以上の特性を持つことを特徴とする端子
用銅基合金を提供する。本発明は第三に、重量％で、Ｎ
ｉ：0.5 〜3.0 ％、Ｓｎ：0.5 〜2.0 ％、Ｐ：0.005 〜
0.20％を含有し、残部がＣｕと不可避不純物からなる組
成の銅基合金から溶製され、熱間および冷間圧延を経て
加工されたばね材でつくったばねを内蔵するか、または
このばね材でばねを含めた全体を一体的に構成した端子
を提供する。本発明は第四に、重量％で、Ｎｉ： 0.5〜
3.0 ％、Ｓｎ：0.5 〜2.0 ％、Ｐ：0.005 〜0.20％、Ｚ
ｎ：0.01〜2.0 ％を含有し、残部がＣｕと不可避不純物
からなる組成の銅基合金から溶製され、熱間および冷間
圧延を経て加工されたばね材でつくったばねを内蔵する
か、またはこのばね材でばねを含めた全体を一体的に構
成した端子を提供する。That is, the present invention is as follows.
i: 0.5-3.0%, Sn: 0.5-2.0%, P: 0.005-
It has a composition of 0.20% and the balance of Cu and inevitable impurities, and has a tensile strength of 50 kgf / mm 2 or more and a spring limit value.
40kgf / mm 2 or more, stress relaxation rate of 10% or less and conductivity of 30
Provided is a copper-based alloy for terminals, which has characteristics of% IACS or more. The present invention secondly comprises, by weight, Ni: 0.5
~ 3.0%, Sn: 0.5-2.0%, P: 0.005-0.20%,
Zn: contains 0.01% to 2.0%, have the balance consisting of Cu and unavoidable impurities, the tensile strength of 50 kgf / mm 2 or more, the spring limit value 40 kgf / mm 2 or more, 10% or less stress relaxation ratio, and Provided is a copper-based alloy for terminals, which has a characteristic of conductivity of 30% IACS or more. The present invention thirdly provides, by weight%, N
i: 0.5-3.0%, Sn: 0.5-2.0%, P: 0.005-
Incorporates a spring made of a spring material containing 0.20%, the balance being Cu and an unavoidable impurity, and processed by hot and cold rolling, or by using this spring material. Provided is a terminal integrally configured including the above. Fourthly, the present invention is, in wt%, Ni: 0.5 to
3.0%, Sn: 0.5-2.0%, P: 0.005-0.20%, Z
n: 0.01 to 2.0%, the balance being melted from a copper-based alloy having a composition consisting of Cu and inevitable impurities, and incorporating a spring made of a spring material processed through hot and cold rolling, or (EN) Provided is a terminal in which the whole of a spring material including a spring is integrally formed.
【０００９】[0009]
【作用】次に本発明におけるＣｕ−Ｎｉ−Ｓｎ−Ｐ系お
よびＣｕ−Ｎｉ−Ｓｎ−Ｐ−Ｚｎ系銅基合金の添加元素
の作用および成分範囲の限定理由について説明する。Next, the function of the additive elements of the Cu-Ni-Sn-P type and Cu-Ni-Sn-P-Zn type copper-based alloys in the present invention and the reason for limiting the component range will be described.
【００１０】ＮｉはＣｕマトリックス中に固溶して、強
度、ばね限界値および耐応力緩和特性を向上させ、さら
にＰと化合物を形成して分散析出することにより、導電
率を向上させ、しかもさらに強度、ばね限界値および耐
応力緩和特性を向上させる。ただし、 0.5％未満では所
望の効果が得られず、 3.0％を超えると効果が飽和して
しまうので、好ましいＮｉの範囲としては、 0.5〜3.0
wt％である。Ni forms a solid solution in the Cu matrix to improve the strength, the spring limit value and the stress relaxation resistance, and further forms a compound with P to disperse and precipitate, thereby improving the conductivity and further. Improves strength, spring limit and stress relaxation resistance. However, if it is less than 0.5%, the desired effect cannot be obtained, and if it exceeds 3.0%, the effect is saturated, so the preferable range of Ni is 0.5 to 3.0.
wt%.
【００１１】ＳｎはＣｕマトリックス中に固溶して強
度、ばね限界値および耐食性を向上させる。ただし、
0.5％未満では所望の効果が得られず、 2.0％を超える
と効果が飽和してしまうので、好ましいＳｎの範囲とし
ては、 0.5〜2.0 wt％である。Sn forms a solid solution in the Cu matrix to improve strength, spring limit value and corrosion resistance. However,
If it is less than 0.5%, the desired effect cannot be obtained, and if it exceeds 2.0%, the effect is saturated, so the preferable range of Sn is 0.5 to 2.0 wt%.
【００１２】Ｐは溶湯の脱酸剤として作用すると共に、
Ｎｉと化合物を形成して分散析出することにより、導電
率を向上させ、かつ強度並びに耐応力緩和特性を向上さ
せる。ただし、 0.005％未満では所望の効果が得られ
ず、0.20％を超えると効果が飽和してしまうので、好ま
しいＰの範囲としては、 0.005〜0.20wt％である。P acts as a deoxidizer for the molten metal, and
By forming a compound with Ni and dispersing and precipitating it, conductivity is improved, and strength and stress relaxation resistance are improved. However, if it is less than 0.005%, the desired effect cannot be obtained, and if it exceeds 0.20%, the effect is saturated, so the preferable range of P is 0.005 to 0.20 wt%.
【００１３】副成分として添加することができるＺｎ
は、メッキ耐候性を向上させる効果がある。ただし、0.
01％未満では所望の効果が得られず、2.0 ％を超えると
効果が飽和してしまうので、好ましいＺｎの範囲として
は、0.01〜2.0 wt％である。Zn which can be added as an accessory component
Has the effect of improving the plating weather resistance. However, 0.
If it is less than 01%, the desired effect cannot be obtained, and if it exceeds 2.0%, the effect is saturated, so the preferable range of Zn is 0.01 to 2.0 wt%.
【００１４】次に、本発明における端子の特性について
説明する。Next, the characteristics of the terminals in the present invention will be described.
【００１５】挿抜力は端子において雄ターミナルと雌タ
ーミナルの結合の力を示すものであるが、あまり強すぎ
ると雄ターミナルを簡単に挿入することが困難である。
特に高集積化に伴いターミナルの数が増加すると、通常
の組み立て作業に支障をきたすことになる。また逆にあ
まり弱すぎると、接触荷重が低いため振動等によって酸
化皮膜が生成し易く接触抵抗が不安定となり、コネクタ
として電気的信頼性に欠けるものとなる。The insertion / removal force indicates the force of connection between the male terminal and the female terminal at the terminal, but if it is too strong, it is difficult to easily insert the male terminal.
In particular, if the number of terminals increases as the degree of integration increases, normal assembly work will be hindered. On the other hand, if it is too weak, the contact load is low, so that an oxide film is likely to be generated due to vibration and the like, and the contact resistance becomes unstable, resulting in a lack of electrical reliability as the connector.
【００１６】したがって初期の挿抜力としては0.2kgf以
上3kgf以下が望ましく、そのためにはそこに用いられる
端子材料としては引張強さ50kgf/mm2 以上、ばね限界値
が40kgf/mm2 以上、応力緩和率10％以下の材料を用いる
ことが必要である。[0016] Thus the following is desirable 3kgf than 0.2kgf as initial insertion force, therefore the tensile strength of 50 kgf / mm 2 or more as a terminal material to be used therein, the spring limit value 40 kgf / mm 2 or more, the stress relaxation It is necessary to use materials with a rate of 10% or less.
【００１７】さらに初期の低電圧低電流抵抗値について
は小さい方が望ましく３ｍΩ以下が良い。接触電気抵抗
値の大きさは、熱サイクルによる結合部の接触荷重の減
少の大きさに影響されるが、材料の自己発熱によって生
じる応力緩和、さらに自動車内のエンジンルーム内や排
ガス系周辺の温度の影響により生じる応力緩和によって
も接触荷重が減少してしまい、それに伴い接触電気抵抗
値も増加してしまう。Further, it is desirable that the initial low-voltage low-current resistance value is small, and 3 mΩ or less is preferable. The magnitude of the contact electric resistance value is affected by the magnitude of the reduction of the contact load of the joint due to the thermal cycle, but the stress relaxation caused by the self-heating of the material, the temperature in the engine room of the automobile and the temperature around the exhaust gas system The contact load also decreases due to the stress relaxation caused by the influence of, and the contact electric resistance value also increases accordingly.
【００１８】そのためには材料自体の応力緩和率が 150
℃×1,000 時間で10％以下であり、さらに引張強さ50kg
f/mm2 以上、ばね限界値40kgf/mm2 以上であることが必
要であり、さらに材料の導電率は30％IACS以上が好まし
く、バネに加工後の応力緩和率が20％以下であることが
好ましい。以下、本発明を実施例により、さらに具体的
に説明する。For that purpose, the stress relaxation rate of the material itself is 150
10% or less at 1,000 ° C for 1,000 hours, and tensile strength of 50 kg
f / mm 2 or more, spring limit value 40 kgf / mm 2 or more, moreover, the conductivity of the material is preferably 30% IACS or more, and the stress relaxation rate after processing the spring is 20% or less. Is preferred. Hereinafter, the present invention will be described more specifically by way of examples.
【００１９】[0019]
【実施例１】表１に示す組成の合金を高周波溶解炉を用
いて溶製し、850 ℃に加熱した後、厚さ 5.0mmまで熱間
圧延した。次に表面の面削により 4.8mmとし冷間圧延と
熱処理を繰り返し、最終加工率67％、板厚 0.2mmの板材
を得た。Example 1 Alloys having the compositions shown in Table 1 were melted in a high frequency melting furnace, heated to 850 ° C., and then hot rolled to a thickness of 5.0 mm. Next, the surface was trimmed to 4.8 mm, and cold rolling and heat treatment were repeated to obtain a plate material having a final working ratio of 67% and a plate thickness of 0.2 mm.
【００２０】次に、上記材料について引張強さ、伸び、
ばね限界値を測定すると共に、曲げ加工性、応力緩和特
性等を調査した。これらの結果を従来使用されている黄
銅、リン青銅およびＣｕ−Ｓｎ−Ｐ−Ｆｅ合金と比較し
て表１に示した。Next, the tensile strength, elongation, and
In addition to measuring the spring limit value, bending workability and stress relaxation characteristics were investigated. These results are shown in Table 1 in comparison with the conventionally used brass, phosphor bronze and Cu-Sn-P-Fe alloy.
【００２１】引張強さ、導電率、ばね限界値の測定はJI
S H 2241、JIS H 0505、JIS H 3130に準拠した。JI can be used to measure tensile strength, conductivity, and spring limit.
Compliant with SH 2241, JIS H 0505, JIS H 3130.
【００２２】曲げ加工性については90°Ｗ曲げ加工試験
で評価した。試験はＣＥＳ−Ｍ0002−6 に準拠し、Ｒ＝
0.1mm の治具で90°Ｗ曲げ加工し、中央部山表面の状況
を調べて、割れが発生したものを×、シワが発生したも
のを△、良好なものを○と評価した。ただし、曲げ軸は
圧延方向に対して平行（Bad Way)とした。The bending workability was evaluated by a 90 ° W bending work test. The test complies with CES-M0002-6 and R =
Bending was performed at 90 ° W with a jig of 0.1 mm, the condition of the central mountain surface was examined, and those with cracks were evaluated as x, those with wrinkles as Δ, and good ones as ○. However, the bending axis was parallel to the rolling direction (Bad Way).
【００２３】また、応力緩和試験は試験片の中央部の応
力が40kgf/mm2 となるようにアーチ曲げを行い、150 ℃
の温度で 1,000時間保持後の曲げぐせを応力緩和率とし
て次式により算出した。 応力緩和率（％）＝｛（Ｌ1 −Ｌ2 ）／（Ｌ1 −Ｌ0 ）｝×100 （ただし、Ｌ0 ：治具の長さ（mm）、 Ｌ1 ：開始時の試料長さ（mm） Ｌ2 ：処理後の試料端間の水平距離（mm）) In the stress relaxation test, arch bending was performed so that the stress at the center of the test piece was 40 kgf / mm 2, and the temperature was 150 ° C.
The stress relaxation rate was calculated as the stress relaxation rate after bending for 1,000 hours at the above temperature. Stress relaxation rate (%) = {(L 1 −L 2 ) / (L 1 −L 0 )} × 100 (where L 0 : jig length (mm), L 1 : sample length at the start (Mm) L 2 : Horizontal distance between sample ends after processing (mm))
【００２４】以上の結果から、本発明による試料 No.１
〜４の合金はいずれも引張強さ50kgf/mm2 、ばね限界値
40kgf/mm2 、導電率30％以上を示し、かつ曲げ加工性も
良好である。そしてさらに応力緩和率が10％以下で耐応
力緩和特性に優れている。したがって、自動車等の端子
用銅基合金として非常に優れた合金であることがわか
る。From the above results, sample No. 1 according to the present invention
All of alloys up to 4 have tensile strength of 50kgf / mm 2 , spring limit value
It exhibits 40 kgf / mm 2 , conductivity of 30% or more, and good bending workability. Furthermore, the stress relaxation rate is 10% or less, which is excellent in stress relaxation resistance. Therefore, it can be seen that it is an extremely excellent alloy as a copper-based alloy for terminals of automobiles and the like.
【００２５】[0025]
【表１】 [Table 1]
【００２６】[0026]
【実施例２】さらに本発明の銅基合金を用いた端子特性
について実施例により具体的に説明する。Example 2 Further, the terminal characteristics using the copper-based alloy of the present invention will be specifically described by way of examples.
【００２７】端子としての評価のため、本発明材料にて
プレス加工し、本発明材の狙いである応力緩和特性につ
いて評価を行った。For the evaluation as a terminal, the material of the present invention was pressed and the stress relaxation characteristics, which is the aim of the material of the present invention, were evaluated.
【００２８】本発明合金を用いて図１に示すばね部２を
備えた雌端子１にプレス加工した。今回の材料はプレス
加工後、ばね性を良好にするために熱処理を行った。Using the alloy of the present invention, a female terminal 1 having a spring portion 2 shown in FIG. 1 was pressed. This material was heat-treated after pressing to improve its springiness.
【００２９】熱処理条件は、端子の表面処理としてＳｎ
メッキを施すため、表面劣化を考慮し、180 ℃×30分の
処理を行った後、応力緩和特性の評価試験を実施した。
なお、従来品との比較のため、Ｃｕ−Ｓｎ−Ｆｅ−Ｐ系
および黄銅材料の雌端子も同一条件の熱処理を施し、同
時に評価テストを行った。The heat treatment conditions are Sn for surface treatment of terminals.
In order to perform plating, the surface deterioration was taken into consideration, and after a treatment of 180 ° C for 30 minutes, the stress relaxation characteristic evaluation test was performed.
For comparison with the conventional product, the Cu-Sn-Fe-P-based and brass material female terminals were also subjected to heat treatment under the same conditions, and simultaneously evaluated.
【００３０】初期の端子の挿抜力は、共に 0.5〜0.6kg
f、初期の低電圧低電流抵抗値は 1.5〜2.0 ｍΩであっ
た。The initial insertion and removal force of the terminals are both 0.5 to 0.6 kg.
f, the initial low-voltage low-current resistance value was 1.5 to 2.0 mΩ.
【００３１】応力緩和特性試験として雌端子に雄端子を
篏合した後、耐熱試験を行い、試験前後の接触荷重の測
定を行った。なお、耐熱条件としては 120℃、 300時間
の条件である。応力緩和率は次式により算出した。 応力緩和率（％）＝｛（Ｆ1 −Ｆ2 ）／Ｆ1 ｝×100 （Ｆ1 ：初期の接触荷重（gf）；Ｆ2 ：試験後の接触荷重（gf））As a stress relaxation characteristic test, after a male terminal was fitted to a female terminal, a heat resistance test was conducted and contact loads before and after the test were measured. The heat resistance conditions are 120 ° C and 300 hours. The stress relaxation rate was calculated by the following formula. Stress relaxation rate (%) = {(F 1 −F 2 ) / F 1 } × 100 (F 1 : initial contact load (gf); F 2 : contact load after test (gf))
【００３２】試験結果を図３に示す。従来品のＣｕ−Ｓ
ｎ−Ｆｅ−Ｐ系の雌端子の応力緩和率は、本発明材の雌
端子より接触荷重の低下が大きく約30％であり、黄銅材
のそれについては、約50％であった。一方、本発明材は
約12％であり、応力緩和率20％以下を満足し、優位性が
認められた。また、電気性能試験は上記と同一のサンプ
ルを用いて 120℃× 300時間の放置試験を行い、試験前
後の低電圧低電流抵抗値を測定した。その結果を図４に
示す。以上の結果より、明らかに本発明材料は電気性能
においても、従来品のＣｕ−Ｓｎ−Ｆｅ−Ｐ系や黄銅材
に比較して優位性が認められた。The test results are shown in FIG. Conventional Cu-S
The stress relaxation rate of the n-Fe-P type female terminal was about 30%, which was larger than that of the female terminal of the material of the present invention, and was about 50% of that of the brass material. On the other hand, the material of the present invention was about 12%, which satisfied the stress relaxation rate of 20% or less, and the superiority was recognized. In the electrical performance test, the same sample as above was used and left standing test at 120 ° C for 300 hours to measure the low-voltage and low-current resistance value before and after the test. The result is shown in FIG. From the above results, it is apparent that the material of the present invention is superior in electric performance to the conventional Cu—Sn—Fe—P-based materials and brass materials.
【００３３】本発明の端子用銅基合金を用いたばね部２
を内蔵する雌端子１を図２の如く成形し、図１の端子の
場合と同様の試験を行ったところ、図１の端子の場合と
同等の試験結果が得られた。Spring portion 2 using the copper-based alloy for terminals of the present invention
When a female terminal 1 having a built-in connector was molded as shown in FIG. 2 and the same test as in the case of the terminal of FIG. 1 was conducted, the same test result as that of the terminal of FIG. 1 was obtained.
【００３４】以上により、本発明による端子は自動車等
の端子として非常に優れていることがわかる。From the above, it can be seen that the terminal according to the present invention is very excellent as a terminal for automobiles and the like.
【００３５】なお、本発明の端子用銅基合金およびそれ
を用いた端子は自動車用以外に航空機、船舶等にも同様
に利用できるものである。The copper-based alloy for terminals and the terminal using the same according to the present invention can be used not only for automobiles but also for aircrafts, ships and the like.
【００３６】[0036]
【発明の効果】本発明の端子用銅基合金は、引張強さ、
ばね限界値、導電率が優れており、かつ耐応力緩和特性
にも優れており、さらに上記合金により構成され内部に
ばねを持つ端子は、低電圧低電流抵抗値、応力緩和特性
に優れており、工業上顕著な効果を有するものである。The copper-based alloy for terminals of the present invention has tensile strength,
The spring limit value and conductivity are excellent, and the stress relaxation resistance is also excellent.Furthermore, the terminal made of the above alloy and having a spring inside has excellent low voltage and low current resistance value and stress relaxation characteristics. It has a remarkable industrial effect.
【００３７】すなわち、本発明によれば、導電率が少な
くとも30％IACSで、引張強度、ばね限界値いずれもが高
く、かつ応力緩和率が10％以下というような特性を兼ね
備えた端子用銅基合金が得られると共に、さらにその銅
基合金により構成されるばねを内蔵して、またはばねを
含めての全体を、その銅基合金で製作した初期性能とし
て挿抜力が適正な0.2kgf以上3kgf以下、低電圧低電流抵
抗３ｍΩ以下、応力緩和率20％以下等の特性を持つ端子
が得られる。That is, according to the present invention, a copper base material for terminals having electrical conductivity of at least 30% IACS, high tensile strength and high spring limit, and a stress relaxation rate of 10% or less. An alloy is obtained, and a spring composed of the copper-based alloy is built in, or the entire spring including the spring is manufactured from the copper-based alloy. , Low voltage and low current resistance 3mΩ or less, stress relaxation rate 20% or less.
【図１】本発明の端子の一例についての斜視図である。FIG. 1 is a perspective view of an example of a terminal of the present invention.
【図２】本発明の端子の別の一例についての斜視図であ
る。FIG. 2 is a perspective view of another example of the terminal of the present invention.
【図３】本発明の端子および従来品における応力緩和特
性を示すグラフである。FIG. 3 is a graph showing stress relaxation characteristics of the terminal of the present invention and a conventional product.
【図４】本発明の端子および従来品における電気特性を
示すグラフである。FIG. 4 is a graph showing electrical characteristics of the terminal of the present invention and a conventional product.
１‥‥雌端子 ２‥‥ばね部 1 Female terminal 2 Spring part
───────────────────────────────────────────────────── フロントページの続き (72)発明者 竹之内 賢二 静岡県榛原郡榛原町布引原206−１ 矢崎 部品株式会社内 (72)発明者 西畑 三樹男 東京都杉並区久我山３−45−17 (72)発明者 浅野 敏夫 東京都杉並区阿佐谷北６−８−14 (72)発明者 菅原 章 東京都八王子市犬目町２−１ (56)参考文献 特開 昭63−286544（ＪＰ，Ａ) 特開 昭62−199741（ＪＰ，Ａ) 特開 平１−242742（ＪＰ，Ａ) 特開 平３−6341（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Kenji Takenouchi Kenji Takenouchi 206-1 Nunobikibara, Hara-cho, Haibara-gun, Shizuoka Prefecture Yazaki Parts Co., Ltd. (72) Mikio Nishihata 3-45-17 Kugayama, Suginami-ku, Tokyo (72) Inventor Toshio Asano 6-8-14 Asayakita, Suginami-ku, Tokyo (72) Inventor Akira Sugawara 2-1 Inumecho, Hachioji, Tokyo (56) Reference JP-A-63-286544 (JP, A) 62-199741 (JP, A) JP-A-1-242742 (JP, A) JP-A-3-6341 (JP, A)
Claims (2)
5〜2.0％、Ｐ：0.005〜0.20％を含有し、残部がＣｕと
不可避的不純物からなる組成を有する銅基合金であっ
て、Ｎｉ／Ｐの重量百分率の比率が２０〜３５の範囲と
なる相対量で添加されているＮｉとＰとの一部がＮｉ−
Ｐ系の金属化合物となってマトリックス中に均一微細に
析出した組織を有していることによって、引張り強さが
５０kgf/mm2以上、ばね限界値が４０kgf/mm2 以上、応
力緩和率１０％以下および導電率３０％IACS以上の特性
を有していることを特徴とする端子用銅基合金。1. By weight%, Ni: 0.5 to 3.0%, Sn: 0.0.
It is a copper-based alloy containing 5 to 2.0% and P: 0.005 to 0.20%, with the balance being Cu and inevitable impurities.
And the Ni / P weight percentage ratio is in the range of 20 to 35.
Part of Ni and P added in a relative amount
It becomes a P-based metal compound and is uniformly and finely distributed in the matrix.
By having the precipitated tissue, tensile strength of 50 kgf / mm 2 or more, the spring limit value 40 kgf / mm 2 or more, a stress relaxation ratio of 10% or less and conductivity 30% IACS or more properties terminal for copper based alloys, characterized in that there.
5〜2.0％、Ｐ：0.005〜0.20％、Ｚｎ：0.01〜2.0％を含
有し、残部がＣｕと不可避的不純物からなる組成を有す
る銅基合金であって、Ｎｉ／Ｐの重量百分率の比率が２
０〜３５の範囲となる相対量で添加されているＮｉとＰ
との一部がＮｉ−Ｐ系の金属化合物となってマトリック
ス中に均一微細に析出した組織を有していることによっ
て、引張り強さが５０kgf/mm2 以上、ばね限界値が４０
kgf/mm2 以上、応力緩和率１０％以下および導電率３０
％IACS以上の特性を有していることを特徴とする端子用
銅基合金。2. Ni: 0.5 to 3.0% and Sn: 0.
5~2.0%, P: 0.005~0.20%, Zn: contains 0.01% to 2.0%, having a composition the balance being Cu and unavoidable impurities
Copper-based alloy having a Ni / P weight percentage ratio of 2
Ni and P added in relative amounts ranging from 0 to 35
Part of and becomes a Ni-P type metal compound
Due to the fact that it has a uniformly and finely
The tensile strength is 50 kgf / mm 2 or more, and the spring limit value is 40
kgf / mm 2 or higher, stress relaxation rate 10% or lower, and conductivity 30
A copper-based alloy for terminals, which has characteristics of% IACS or higher.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3018337A JPH089745B2 (en) | 1991-01-17 | 1991-01-17 | Copper-based alloy for terminals |
| US08/036,489 US5387293A (en) | 1991-01-17 | 1993-03-24 | Copper base alloys and terminals using the same |
| US08/036,490 US5322575A (en) | 1991-01-17 | 1993-03-24 | Process for production of copper base alloys and terminals using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3018337A JPH089745B2 (en) | 1991-01-17 | 1991-01-17 | Copper-based alloy for terminals |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04236736A JPH04236736A (en) | 1992-08-25 |
| JPH089745B2 true JPH089745B2 (en) | 1996-01-31 |
Family
ID=11968839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3018337A Expired - Lifetime JPH089745B2 (en) | 1991-01-17 | 1991-01-17 | Copper-based alloy for terminals |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH089745B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4810703B2 (en) * | 2005-09-30 | 2011-11-09 | Ｄｏｗａメタルテック株式会社 | Copper alloy production method |
| JP4550791B2 (en) * | 2005-11-24 | 2010-09-22 | 古河電気工業株式会社 | Aluminum stranded wire crimp terminal and aluminum stranded wire terminal structure to which the crimp terminal is connected |
| JP4680765B2 (en) * | 2005-12-22 | 2011-05-11 | 株式会社神戸製鋼所 | Copper alloy with excellent stress relaxation resistance |
| JP4934785B2 (en) * | 2006-03-31 | 2012-05-16 | Ｄｏｗａメタルテック株式会社 | Sn-plated copper alloy material and manufacturing method thereof |
| JP5466879B2 (en) | 2009-05-19 | 2014-04-09 | Ｄｏｗａメタルテック株式会社 | Copper alloy sheet and manufacturing method thereof |
| JP6155405B2 (en) | 2015-04-24 | 2017-06-28 | 古河電気工業株式会社 | Copper alloy material and method for producing the same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62199741A (en) * | 1986-02-25 | 1987-09-03 | Kobe Steel Ltd | Copper alloy for terminal and connector having superior migration resistance |
| JPS63286544A (en) * | 1987-05-18 | 1988-11-24 | Mitsubishi Electric Corp | Copper alloy for multipolar connector |
| JPH01242742A (en) * | 1988-03-23 | 1989-09-27 | Mitsubishi Electric Corp | Copper alloy for electronic equipment |
| JPH036341A (en) * | 1989-06-02 | 1991-01-11 | Dowa Mining Co Ltd | High strength and high conductivity copper-base alloy |
-
1991
- 1991-01-17 JP JP3018337A patent/JPH089745B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04236736A (en) | 1992-08-25 |
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