JPH11263309A - Film packaging method and apparatus for cutting plate lot - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To ensure the wraparound of a film to the lower surface of a skid plate and reliably perform rust prevention. SOLUTION: A means for winding a heat-shrinkable film F around a side surface of a cutting plate lot including a skid plate S and a cutting plate C stacked thereon, a unit for heating the film, and a portion below the skid plate of the film F A film packaging apparatus provided with a wind nozzle 2 for forcibly cooling a portion.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of stacking cut plates such as steel plates on a skid plate for each lot (hereinafter referred to as "cut plate lot"), and wrapping a heat-shrinkable film on a side surface for rust prevention. TECHNICAL FIELD The present invention relates to a method and an apparatus for packaging a film of a cutting board lot to be packaged in a package.

[0002]

2. Description of the Related Art Conventionally, cut plates such as steel plates are stacked on a skid plate for each lot and packaged with a heat-shrinkable resin film impermeable to moisture for rust prevention. FIG. 3 is a perspective view showing an example of the packing appearance of a packing lot, where S is a skid plate, C is a cutting plate, and F is a heat-shrinkable film. The skid plate S is provided with a leg for inserting a transfer fork or transferring it on a conveyor below a bottom plate serving as a bottom sheet on which the cut plates C are stacked.

As shown in Japanese Patent Application Laid-Open No. H5-262328, the heat-shrinkable film F is kept covered with a skid plate S as a material to be packed and a cut plate C stacked thereon, or a cut plate lot. It is heated to near the melting point while being wound around the four sides of the side (including covering with a ring-shaped film in advance), shrinks uniformly as it cools, and adheres tightly to the surface of the packing material to prevent moisture from entering. Prevents and performs rust prevention.

Incidentally, such a packing method is disclosed in
As described in Japanese Patent Application Laid-Open No. 5-262328, the conventional shrinkable film packaging apparatus includes only a means for covering a film and a means for heating, and cooling after heating is naturally cooled by outside air or atmosphere. In the case of cut plate packaging, even if the lower end of the film hangs down below the skid plate at first, there is a case where the amount of film wrapping around the lower surface of the skid cannot be secured due to the shrinkage of the film, and moisture from the lower surface of the skid occurs. However, there is a problem that rust is generated on the cut plate due to intrusion.

[0005] This situation will be described with reference to FIG. FIG. 4 is a cross-sectional view showing a packing lot. Even if the top of the cutting plate C is entirely covered with a film, the film is easily damaged during cargo handling and rust cannot be avoided. It is common to stack one board that is not called a product. Therefore, as shown in FIGS. 3 and 4, the film F is wound so as to cover the side surface from the side surface of the lot to the periphery of the upper surface of the lot and the side surface from the side surface of the lot to the lower surface of the skid plate below the lot. This state is shown by a virtual line in FIG.

[0006] Then, the film is shrunk by heating, but if the film is simply heated and then allowed to cool as in the prior art, the entire film shrinks uniformly as shown by the solid line, so that the film goes around the lower surface of the skid plate S. This causes a case where the power part is retracted due to the contraction, and the wraparound amount cannot be secured.

[0007]

SUMMARY OF THE INVENTION The present invention solves such a problem and provides a method and an apparatus for packaging a shrink film of a cut sheet lot in which the film is ensured to go to the lower surface of the skid plate S. It is intended to be realized.

[0008]

SUMMARY OF THE INVENTION According to the present invention, there is provided a film packaging method for a cutting board lot, which comprises winding a heat-shrinkable film around a side face of a cutting board lot comprising at least a skid board and a cutting board stacked thereon. In a film packaging method for a cut sheet lot to be heated, a portion of the film below the skid plate is forcibly cooled immediately after the heating step.

Further, the film packaging apparatus for a cutting board lot according to the present invention comprises means for winding a heat-shrinkable film around a side face of a cutting board lot comprising at least a skid board and a cutting board stacked thereon, A heating means for heating and a cooling means for forcibly cooling a portion of the film below the skid plate are provided.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the present invention, a nozzle for blowing air toward the lower surface of a skid plate, preferably in the immediate vicinity of a delivery side, of a packaging apparatus main body that heats a heat-shrinkable film around a cut plate lot. Before cooling the whole film, forcibly cool the part of the film below the skid plate (below the part where the skid plate is in contact with the film) and shrink before the other part of the film. As a result, the amount of the film wrapping around the lower surface of the skid plate is ensured, and the rust prevention effect is stably exhibited.

It is preferable that the forced cooling be performed substantially only on a portion of the film below the skid plate by adjusting a nozzle or installing a shielding plate, but the other portions may be slightly cooled. It does not reduce the effects of the present invention. When packing with the heat-shrinkable film F, together with the skid plate S and the cut plate C, a cushioning material and a top plate for protecting the cut plate C, and rust-proof paper for more reliably preventing rust, etc. It is a matter of course that both may be packed together.

[0012]

An embodiment of the present invention will be described with reference to FIGS. Components common to those in FIG. 3 are denoted by the same reference numerals. FIG. 1 is a front view showing a film packaging apparatus for a cutting board lot. Reference numeral 1 denotes a packaging apparatus body having a means for winding a heat-shrinkable film around the surface of a lot of cutting boards C and a heating means for heating the film. The nozzle 3 is a conveyor for transferring the cutting plate lot in the direction of the arrow.

In the main body 1 of the packaging apparatus, a heat-shrinkable film is wound around the side surface of the cut sheet lot on the conveyor,
Heat for about 20-60 seconds at ° C. The heat-shrinkable film hangs 40 to 50 mm below the skid plate. These conditions are the same as in the prior art. The wind nozzle 2
Immediately outside the packaging device main body 1, it is installed slightly downward from the skid plate S of the cutting plate lot to be transferred on the conveyor 3. According to the experiments of the present inventors, in order to shrink only the portion below the skid plate of the film hanging in a very soft state near the melting point, a wind of a pressure of 1 to 5 kg / cm ² and a temperature of 10 to 50 ° C. It is good to spray toward the lower surface of the skid plate. When the pressure is below the above, the blowing action is insufficient, and when the pressure is above the above, good results cannot be obtained because the film is broken or vibrated. With respect to the temperature below, there is a concern that the side of the cut sheet laminate (lot side) may be rapidly cooled and dew condensation may occur on the side of the lot, causing rust. Above the above, the film on the side of the lot is easily cooled, and shrinkage of the side of the lot may occur. This occurs early and the amount of wraparound of the lower surface of the skid cannot be secured.

FIG. 2 is a cross-sectional view showing a packaging lot of cut plates packaged by the shrinkable film packaging apparatus. Conventionally, the wraparound amount a of the film on the lower surface of the skid plate S is 0 to the same amount of sag at the winding stage indicated by the imaginary line.
On the other hand, in the present invention, only the portion of the film below the skid plate was forcibly cooled prior to the natural cooling of the entire film, but the lower surface of the skid plate S as shown by the solid line was obtained. A of film wrap around
Was constant within the range of 20 to 40 mm, and a reliable rust-preventing effect was obtained.

[0015]

According to the present invention, there is an excellent effect that the amount of wraparound of the film to the lower surface of the skid plate is secured and rust is reliably prevented from being generated.

[Brief description of the drawings]

FIG. 1 is a front view showing an embodiment of a film packaging apparatus of the present invention.

FIG. 2 is a sectional view showing a packing lot according to the present invention.

FIG. 3 is a perspective view showing a packing lot according to the present invention.

FIG. 4 is a cross-sectional view showing a packing lot according to the related art.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Packaging apparatus main body 2 Wind nozzle 3 Conveyor C Cutting board F Heat-shrinkable film S Skid board

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Motohiro Yoshimura 1 Kawasaki-cho, Chuo-ku, Chiba City, Chiba Prefecture Inside the Chiba Works of Kawasaki Steel Corp. (72) Inventor Tadaaki Octagon 1 Kawasaki-cho, Chuo-ku, Chiba City, Chiba Prefecture (72) Inventor Hironori Maehara 3-1-1, Tamano-shi, Tamano-shi, Okayama Mitsui Engineering & Shipbuilding Co., Ltd. (72) Inventor Kohei Iida 278 Kamiida-cho, Izumi-ku, Yokohama-shi, Kanagawa Prefecture Inside Electric Co., Ltd.

Claims (2)

[Claims] In a film packaging method for heating a cut sheet lot after winding a heat-shrinkable film around a side face of a cut sheet lot composed of at least a skid sheet and cut sheets stacked thereon, immediately after a heating step And a method of forcibly cooling a portion of the film below the skid plate, the method comprising: 2. A means for winding a heat-shrinkable film (F) around a side surface of a cutting plate lot comprising at least a skid plate (S) and a cutting plate (C) stacked thereon, and heating for heating the film. And a cooling means (2) for forcibly cooling a portion of the film below the skid plate.