JPH114079A - Multilayer wiring board - Google Patents

Abstract

(57) Abstract: Separation occurs due to a difference in thermal expansion coefficient between a substrate and a multilayer wiring portion. A substrate, a plurality of organic resin insulating layers, and a plurality of thin-film wiring conductor layers attached to at least one main surface of the substrate.
Are alternately laminated, and the through-hole conductors 6 in which the thin film wiring conductor layers 3 positioned above and below are provided on the organic resin insulating layer 2 are provided.
A multi-layer wiring board comprising a multi-layer wiring portion 4 electrically connected through a substrate, wherein the substrate 1 is formed by adding an inorganic powder and / or a metal powder to an organic resin, and The surface to be attached of No. 4 is formed only of an organic resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer wiring board, and more particularly to a multilayer wiring board used for a hybrid integrated circuit device, a semiconductor element housing package for housing a semiconductor element, and the like.

[0002]

2. Description of the Related Art Hitherto, a multilayer wiring board used in a hybrid integrated circuit device, a package for accommodating a semiconductor element, or the like, has its wiring conductor formed by a thick film forming technique such as the Mo-Mn method.

[0003] This Mo-Mn method is generally used for tungsten,
Organic solvents for high melting point metal powders such as molybdenum and manganese,
A solvent is added and mixed, and a paste-like metal paste is printed and applied on the outer surface of the raw ceramic body in a predetermined pattern by a screen printing method. Then, a plurality of these are laminated and fired in a reducing atmosphere to obtain a high melting point. This is a method in which the metal powder and the raw ceramic body are sintered and integrated.

The ceramic body on which the wiring conductor is formed is usually an oxide ceramic such as an aluminum oxide sintered body or a mullite sintered body, or an aluminum nitride having an oxide film deposited on the surface. Non-oxide ceramics such as a porous sintered body and a silicon carbide sintered body are used.

However, when the wiring conductor is formed by using the Mo-Mn method, the wiring conductor is formed by screen-printing a metal paste. Had the drawback that it could not be done.

In order to solve the above-mentioned drawbacks, a multi-layer wiring board formed using a thin film forming technique capable of miniaturization instead of forming the wiring conductor by the conventional thick film forming technique is used. It has become.

[0007] A multilayer wiring board in which such wiring conductors are formed by a thin film forming technique generally comprises an epoxy formed by spin coating, thermosetting, or the like on the upper surface of an insulating substrate made of ceramics such as an aluminum oxide sintered body. An insulating layer made of an organic resin such as a resin, and a thin film wiring conductor layer formed by employing a thin film forming technique such as electroless plating or vapor deposition of a metal such as copper or aluminum and a photolithography technique. Along with laminating, it has a structure in which upper and lower thin film wiring conductor layers are electrically connected via through hole conductors attached to the inner walls of through holes provided in the organic resin insulating layer,
On the upper surface of the uppermost organic resin insulating layer, a bonding pad that is electrically connected to the thin film wiring conductor layer is formed,
Electrodes of active components such as semiconductor devices, passive components such as capacitors, resistors and the like are connected to the bonding pads via a brazing material such as solder.

In the above-mentioned multilayer wiring board, a thin-film wiring conductor layer provided between the laminated organic resin insulating layers is provided on the inner wall of the through hole provided in the organic resin insulating layer. The through holes in each organic resin insulating layer are formed by first applying a resist material on each organic resin insulating layer and exposing and developing the resist material to a predetermined position. A window having a shape is formed, and then an etchant is disposed on the window of the resist material, the organic resin insulating layer located on the window of the resist material is removed, and holes (through holes) are formed in the organic resin insulating layer. And finally removing and removing the resist material from the organic resin insulating layer.

[0009]

However, in this multilayer wiring board, the substrate is generally formed of a ceramic such as an aluminum oxide sintered body, and the ceramic such as the aluminum oxide sintered body has a coefficient of thermal expansion. Is about 5 to 10 × 10 ⁻⁶ / ° C., which is different from the coefficient of thermal expansion (about 20 to 30 × 10 ⁻⁶ / ° C.) of the organic resin insulating layer deposited on the upper surface. When heat is applied to the layers when connecting electronic components such as semiconductor elements and capacitive elements to the bonding pads and heat generated when the electronic components operate, the thermal expansion coefficient of the two at the joint between the substrate and the organic resin insulating layer , A thermal stress is generated due to the difference, and the thermal stress causes a disadvantage that the organic resin insulating layer is peeled off from the substrate. In particular, when the substrate is large and the bonding area between the substrate and the organic resin insulating layer is large, the above-described disadvantage becomes extremely significant.

In the multilayer wiring board, the aluminum oxide sintered body or the like forming the board has a hard and brittle property. Therefore, when an impact force is applied from the outside, the aluminum oxide sintered body is easily broken by the impact force. Also had the disadvantage of generating

Further, the substrate made of the aluminum oxide sintered body or the like is liable to cause warpage and dimensional variation due to uneven firing shrinkage when the substrate is baked and manufactured. In this case, the organic resin insulating layer and the thin-film wiring conductor layer cannot be accurately formed on the substrate surface.

The present invention has been devised in view of the above-mentioned drawbacks, and has as its object to approximate the thermal expansion coefficients of a substrate and an organic resin insulating layer so that they are firmly joined together and the mechanical strength of the substrate is reduced. It is an object of the present invention to provide a high-reliability multilayer wiring board which can be formed firmly and flatten a substrate to accurately form a predetermined organic resin insulating layer and a thin-film wiring conductor layer.

[0013]

According to the present invention, a substrate and a plurality of organic resin insulating layers and thin-film wiring conductor layers, which are attached to at least one principal surface of the substrate and are alternately laminated, are positioned above and below. A multi-layer wiring board comprising a thin-film wiring conductor layer and a multi-layer wiring portion electrically connected via a through-hole conductor provided in an organic resin insulating layer, wherein the substrate comprises an inorganic resin powder and / or a metal powder in an organic resin. And the surface to which the multilayer wiring portion is attached is formed only of an organic resin.

The present invention is also characterized in that the particle diameter of the inorganic powder and / or the metal powder is 0.05 μm to 10 μm.

Further, the present invention is characterized in that the content of the inorganic powder and / or the metal powder is 20% by weight to 90% by weight.

According to the multilayer wiring board of the present invention, the substrate on which the multilayer wiring portion composed of the organic resin insulating layer and the thin-film wiring conductor layer is to be adhered is made of an inorganic resin and / or a metal powder in an organic resin. % To 90% by weight, the coefficient of thermal expansion of the substrate is close to the coefficient of thermal expansion of the organic resin insulating layer. As a result, even when heat is applied to the substrate and the organic resin insulating layer, the substrate expands between the two. Does not generate stress due to the difference in the coefficient of thermal expansion between the two, and the two can be joined very firmly.

Further, according to the multilayer wiring board of the present invention, the surface to which the multilayer wiring section of the substrate is joined is made only of an organic resin and the inorganic powder and / or the metal powder are not exposed, so that the substrate and the multilayer wiring section are not exposed. The organic resin insulating layer can be bonded very firmly.

Further, according to the multilayer wiring board of the present invention, since the board is formed by incorporating an inorganic powder and / or a metal powder in an organic resin having excellent toughness, the mechanical strength of the board is increased, and Even if an impact force is applied, it is not easily broken.

Further, according to the multilayer wiring board of the present invention,
The substrate is formed by incorporating an inorganic powder and / or a metal powder into an organic resin, and the organic resin is solidified by thermosetting or photocuring, and warps due to uneven firing shrinkage due to firing because it does not involve a firing process. As a result, the substrate does not have a predetermined size with its surface flat and the organic resin insulating layer and the thin film wiring conductor layer can be accurately formed on the surface of the substrate. .

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 shows an embodiment of a multilayer wiring board according to the present invention, wherein 1 is a substrate, 2 is an organic resin insulating layer, and 3 is a thin-film wiring conductor layer.

On the upper surface of the substrate 1, there is provided a multilayer wiring portion 4 in which a large number of organic resin insulating layers 2 and thin film wiring conductor layers 3 are alternately laminated in a multilayer. Act as a supporting member.

The substrate 1 is made of an organic resin such as an epoxy resin, a polyimide resin, a fail resin, a thermosetting polyphenylene ether resin, a polyimide amide resin, a bismaleimide triazine resin, or a fluororesin, and contains silicon oxide, aluminum oxide, aluminum nitride, It contains inorganic powder or metal powder such as silicon carbide, barium titanate, strontium titanate, calcium titanate, titanium oxide, zeolite, tungsten, molybdenum, copper, etc., for example, an organic resin is an epoxy resin, and an inorganic powder is oxidized. In the case of silicon powder, a curing agent such as an amine-based curing agent, an imidazole-based curing agent, or an acid anhydride-based curing agent is added to an epoxy resin such as a bisphenol A type epoxy resin, a novolak type epoxy resin, and a glycidyl ester type epoxy resin. Paste mixed with addition Particle size 0 to epoxy resin precursor.
A silicon oxide powder of about 1 μm to 100 μm is added, and then this is formed into a sheet by employing a conventionally known doctor blade method or calender roll method. Finally, a plurality of the sheets are vertically stacked as necessary. It is manufactured by laminating, heat-treating at a temperature of about 80 ° C. to 300 ° C. for about 10 seconds to 24 hours, and thermosetting.

Since the substrate 1 is made of an organic resin such as an epoxy resin containing an inorganic powder such as silicon oxide or tungsten or a metal powder, its thermal expansion coefficient is 10 to 90 (ppm / K: 60 to 80 ° C.), and the coefficient of thermal expansion (10 to 90 ppm / K: 60) of the organic resin insulating layer 2 of the multilayer wiring portion 4 attached to the upper surface of the substrate 1 described later.
(Approximately 80 ° C.). As a result, even if heat acts on the substrate 1 and the organic resin insulating layer 2 of the multilayer wiring portion 4, a stress is generated between the two due to a difference in thermal expansion coefficient between the two. Therefore, the substrate 1 and the multilayer wiring portion 4 can be firmly joined.

At the same time, the upper surface of the substrate 1, that is, the surface to which the multilayer wiring portion 4 is bonded is made of only organic resin, and the inorganic powder and the metal powder are not exposed. The organic resin insulating layer 2 of the multilayer wiring portion 4 made of a material can be brought into contact with the substrate 1 and the multilayer wiring portion 4 to be extremely strongly bonded.

Furthermore, since the substrate 1 is made of an organic resin such as an epoxy resin solidified by thermosetting and does not involve a firing step, there is no warpage or dimensional variation due to uneven firing shrinkage accompanying firing. In addition, the substrate 1 has a predetermined size with a flat surface, and the multilayer wiring portion 4 including the organic resin insulating layer 2 and the thin film wiring conductor layer 3 can be accurately formed on the surface of the substrate 1.

Further, since the substrate 1 is formed by adding an inorganic resin such as silicon oxide or tungsten or a metal powder to an organic resin such as an epoxy resin having excellent toughness, the mechanical strength of the substrate 1 is extremely high. As a result, even if an impact force is applied to the substrate 1 from the outside, the substrate 1 is not easily damaged by the impact force.

The substrate 1 is made of silicon oxide, aluminum oxide, aluminum nitride, silicon carbide, barium titanate, strontium titanate contained in an organic resin.
Inorganic powders and metal powders such as calcium titanate, titanium oxide, zeolite, tungsten, molybdenum, copper, silver, and aluminum determine the thermal expansion coefficient of the substrate 1 by using the multilayer wiring board 4.
In addition to approximating the coefficient of thermal expansion of the organic resin insulating layer 2, there is no function of controlling the dielectric constant, thermal conductivity, water resistance, etc. of the substrate 1 to desired values. It becomes difficult to control each characteristic to a desired value.
If the content is more than 10% by weight, it tends to be difficult to obtain a substrate 1 having a predetermined shape by firmly bonding inorganic powder or metal powder with an organic resin. Therefore, it is preferable that the content of the inorganic powder and the metal powder contained in the organic resin of the substrate 1 be in the range of 20% by weight to 90% by weight.

When the particle diameter of the inorganic powder or metal powder contained in the organic resin of the substrate 1 is less than 0.05 μm, the inorganic powder or metal powder is aggregated and uniformly dispersed in the organic resin. However, as a result, the mechanical strength of the substrate 1 decreases, and if it exceeds 10 μm, large irregularities are formed on the surface of the substrate 1, and the desired multilayer wiring portion 4 can be accurately formed on the surface of the substrate 1. Tends to be difficult. Therefore, it is preferable that the particle diameter of the inorganic powder or the metal powder contained in the organic resin of the substrate 1 be in the range of 0.05 μm to 10 μm.

Further, on the upper surface of the substrate 1, a multilayer wiring portion 4 formed by alternately laminating a plurality of organic resin insulating layers 2 and thin film wiring conductor layers 3 is attached. The organic resin insulating layer 2 constituting the portion 4 functions to electrically insulate the thin film wiring conductor layers 3 located above and below, and the thin film wiring conductor layer 3 functions as a transmission path for transmitting electric signals.

The organic resin insulating layer 2 of the multilayer wiring section 4
It is made of an organic resin such as an epoxy resin, a bismaleimide triazine resin, a polyphenylene ether resin, and a fluororesin. For example, when it is made of an epoxy resin, it is amine-cured to a bisphenol A epoxy resin, a novolak epoxy resin, a glycidyl ester epoxy resin, or the like. And a curing agent such as an imidazole-based curing agent and an acid anhydride-based curing agent are added and mixed to obtain a paste-like epoxy resin precursor, and the epoxy resin precursor is applied to the upper portion of the substrate 1 by spin coating. After that, this is brought to 80 ° C. to 200 ° C.
It is formed by heat-treating with heat of 0.5 ° C. for 0.5 to 3 hours and heat curing. In this case, the surface of the substrate 1 is flat,
In addition, since the same organic resin as that of the organic resin insulating layer 2 is exposed, the organic resin insulating layer 2 and the substrate 1 are bonded very firmly, whereby the multilayer wiring portion 4 is firmly adhered on the substrate 1. I can put it.

The organic resin insulating layer 2 of the multilayer wiring section 4
Has a through hole 5 having a minimum diameter of about 1.5 times the thickness of the organic resin insulating layer 2 at each predetermined position.
And acts as a forming hole for forming a through-hole conductor 6 that electrically connects each of the thin film wiring conductor layers 3 located above and below via the through hole.

The through-holes 5 provided in the organic resin insulating layer 2 are formed by applying a well-known photolithography technique to the organic resin insulating layer 2, and specifically, applying a resist material on each organic resin insulating layer 2. A window having a predetermined shape is formed at a predetermined position by performing exposure and development thereon, and then an etchant is disposed at the window of the resist material, and an organic resin insulating layer positioned at the window of the resist material is formed. 2, a hole (through hole) is formed in the organic resin insulating layer 2, and finally, the resist material is peeled off from the organic resin insulating layer 2 and removed to form a predetermined diameter.

Further, a thin-film wiring conductor layer 3 having a predetermined pattern is formed on the upper surface of each organic resin insulating layer 2, and a through-hole conductor 6 is formed on the inner wall of the through hole 5 provided in each organic resin insulating layer 2. Each of the thin film wiring conductor layers 3 located above and below the organic resin insulating layer 2 with the through-hole conductor 6 interposed therebetween is electrically connected.

The thin-film wiring conductor layer 3 and the through-hole conductor 6 formed on the upper surface of each organic resin insulating layer 2 and the inner wall of the through-hole 5 are made of a metal material such as copper, nickel, gold, or aluminum by electroless plating. It is formed by adopting a thin film forming technique such as a vapor deposition method and a sputtering method and a photolithographic technique. For example, when it is formed of copper, the upper surface of the organic resin insulating layer 2 and the inner surface of the through hole 5 are formed. 0.06 mol / l copper sulfate, 0.3 mol / l formalin, 0.35 sodium hydroxide
Mol / l, an electroless steel plating bath consisting of 0.35 mol / l of ethylenediaminetetraacetic acid and a thickness of 1 μm.
Each of the organic resin insulating layers 2 is formed by depositing a copper layer having a thickness of 40 μm to 40 μm, and thereafter processing the copper layer into a predetermined pattern by employing photolithography technology.
The gap is formed on the inner wall of the through hole 5. in this case,
Since the thin-film wiring conductor layer 3 and the through-hole conductor 6 are formed by a thin-film forming technique, it is possible to miniaturize the wiring, whereby the thin-film wiring conductor layer 3 can be formed at an extremely high density.

The multilayer wiring portion 4 formed by alternately laminating the organic resin insulating layers 2 and the thin film wiring conductor layers 3 in multiple layers has a center line average roughness (R
By setting a rough surface of 0.05 μm ≦ Ra ≦ 5 μm in a), the bonding between the organic resin insulating layer 2 and the thin-film wiring conductor layer 3 and the bonding between the organic resin insulating layers 2 located above and below can be made strong. . Therefore, the upper surface of each organic resin insulating layer 2 of the multilayer wiring portion 4 is roughened by an etching method or the like,
Center line average roughness (Ra): 0.05 μm ≦ Ra ≦ 5 μm
It is preferable to make the surface rough.

The count value of the height (Pc) of the unevenness at a length of 2.5 mm on the surface of the organic resin insulating layer 2 is 500 when 1 μm ≦ Pc ≦ 10 μm.
2500 μm of 1 μm ≦ Pc ≦ 1 μm, 0.01 μm
If ≦ Pc ≦ 0.1 μm is set to 12,500 or more, the bonding between the organic resin insulating layer 2 and the thin-film wiring conductor layer 3 and the bonding between the organic resin insulating layers 2 located above and below become stronger. Therefore, the organic resin insulating layer 2 has a thickness of 2.5
The count value of the height (Pc) of the unevenness in the length of mm is 1 μm ≦ Pc ≦ 10 μm.
2500 or more m ≦ Pc ≦ 1 μm, 0.01 μm ≦ P
It is preferable that c ≦ 0.1 μm is set to 12,500 or more.

The count value of the center line average roughness (Ra) of the upper surface of the organic resin insulating layer 2 and the height of the unevenness (Pc) at a length of 2.5 mm are obtained by measuring the surface of the organic resin insulating layer 2 with an atomic force. Microscope (Dimensio manufactured by Digital Instruments Inc.
n 3000-Nano Scope III)
m), the surface condition was inspected and measured, and each numerical value was obtained from the measurement result.

The center line average roughness (Ra) is 0.0
5 μm ≦ Ra ≦ 5 μm, the count value of the height of unevenness (Pc) at a length of 2.5 mm is 1 μm ≦ Pc ≦ 10 μm
m is 500 or more, and 0.1 μm ≦ Pc ≦ 1 μm is 250
0 or more, 0.01 μm ≦ Pc ≦ 0.1 μm is 1250
Zero or more organic resin insulating layers 2 are subjected to a reactive ion etching process by blowing a gas such as CHF ₃ , CF ₄ , Ar, etc. onto the upper surface of the organic resin insulating layers 2, whereby the surface is roughened to a predetermined roughness. Is done.

Further, when the thickness of each of the organic resin insulating layers 2 exceeds 100 μm, the etching processing time becomes long when the through holes 5 are formed by employing photolithography technology in the organic resin insulating layers 2. It is difficult to form the through hole 5 into a desired sharp shape. If the thickness is less than 5 μm, rough surface processing for increasing the bonding strength of the organic resin insulating layer 2 located above and below the organic resin insulating layer 2 is performed. At the time of application, there is a risk that unnecessary holes may be formed in the organic resin insulating layer 2 and unnecessary electrical short circuits may be caused in the thin film wiring conductor layers 3 located above and below. Accordingly, the organic resin insulating layer 2 has a thickness of 5 μm to 100 μm.
It is preferable to set the range of m.

Further, if the thickness of each thin-film wiring conductor layer 3 of the multilayer wiring portion 4 is less than 1 μm, the electric resistance of each thin-film wiring conductor layer 3 becomes large and a predetermined value is applied to each thin-film wiring conductor layer 3. It is difficult to transmit the electric signal of
When the thickness exceeds 40 μm, a large stress is generated inside the thin-film wiring conductor layer 3 when the thin-film wiring conductor layer 3 is adhered to the organic resin insulating layer 2, and the large intrinsic stress causes the thin-film wiring conductor layer 3 to form an organic resin. It becomes easy to peel off from the insulating layer 2. Therefore, it is preferable that the thickness of each thin-film wiring conductor layer 3 of the multilayer wiring portion 4 be in the range of 1 μm to 40 μm.

The organic resin insulating layer 2 and the thin-film wiring conductor layer 3
And a bonding pad 7 electrically connected to the thin-film wiring conductor layer 3 is further formed on the uppermost organic resin insulating layer 2. The bonding pad 7 has a function of electrically connecting electrodes of the electronic component A such as a semiconductor element, a capacitor element, and a resistor to the thin film wiring conductor layer 3.

The bonding pad 7 has, for example, a circular shape with a diameter of 200 to 500 μm.
Are connected via a brazing material, the electrodes of the electronic component A such as a semiconductor element and a capacitance element are electrically connected to the thin-film wiring conductor layer 3.

The bonding pad 7 is made of the same metal material as the thin film wiring conductor layer 3, specifically, a metal material such as copper, nickel, gold, aluminum, etc., and is formed on the uppermost organic resin insulating layer 2. 3 is formed at the same time as the thin film wiring conductor layer 3 with electrical connection.

Thus, according to the above-described multilayer wiring board, the bonding pads 7 provided on the uppermost organic resin insulating layer 2 are formed.
To the electrodes of the electronic component A such as a semiconductor element and a capacitor via a brazing material made of solder or the like, and to electrically connect the electrodes of the electronic component A to the thin-film wiring conductor layer 3 via the bonding pads 7. As a result, a semiconductor device or a hybrid integrated circuit device is formed. If a part of the thin film wiring conductor layer 3 is connected to an external electric circuit, the electronic component A is connected to the external electric circuit.

It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. A multilayer wiring portion 4 formed by alternately laminating a plurality of organic resin insulating layers 2 and a plurality of thin film wiring conductor layers 3 is applied only on the side of the substrate 1. It may be provided only on the upper and lower surfaces.

In the above-described embodiment, the organic resin of the substrate 1 is formed of a thermosetting epoxy resin or the like, but it may be formed of a photocurable resin. In this case, since the organic resin of the substrate 1 is solidified by light irradiation and does not involve a firing step, there is no warpage or dimensional variation due to uneven firing shrinkage due to firing, and as a result, the substrate 1 has its surface Has a flat predetermined dimension, and it is possible to accurately form the multilayer wiring portion 4 including the organic resin insulating layer 2 and the thin film wiring conductor layer 3 on the surface of the substrate 1.

Further, in the above embodiment, a conductive layer may be formed inside and on the surface of the substrate 1. in this case,
As the conductive layer, it is preferable that a metal powder composed of copper, silver, or the like is bonded with an organic resin such as an epoxy resin, a polyimide resin, a fail resin, a thermosetting polyphenylene ether resin, a polyimide amide resin, a bismaleimide triazine resin, and a fluororesin. When the conductive layer is formed because the substrate 1 hardly shrinks during firing, the conductive layer can be formed very accurately in a predetermined pattern.

[0048]

According to the multilayer wiring board of the present invention, the substrate on which the multilayer wiring section composed of the organic resin insulating layer and the thin film wiring conductor layer is to be adhered is made by mixing the inorganic powder and / or the metal powder in the organic resin. , 20 to 90% by weight, the thermal expansion coefficient of the substrate is close to the thermal expansion coefficient of the organic resin insulating layer. As a result, even when heat is applied to the substrate and the organic resin insulating layer, There is no stress between the two due to the difference in the coefficient of thermal expansion, and the two can be joined very firmly.

Further, according to the multilayer wiring board of the present invention, the surface to which the multilayer wiring portion of the substrate is joined is made only of an organic resin and the inorganic powder and / or the metal powder are not exposed, so that the substrate and the multilayer wiring portion are not exposed. The organic resin insulating layer can be bonded very firmly.

Further, according to the multilayer wiring board of the present invention, since the board is formed by incorporating an inorganic powder and / or a metal powder in an organic resin having excellent toughness, the mechanical strength of the board is increased, and Even if an impact force is applied, it is not easily broken.

Further, according to the multilayer wiring board of the present invention,
The substrate is formed by incorporating an inorganic powder and / or a metal powder into an organic resin, and the organic resin is solidified by thermosetting or photocuring, and does not involve a sintering process. As a result, the substrate does not have a predetermined size with its surface flat, and the organic resin insulating layer and the thin-film wiring conductor layer can be accurately formed on the surface of the substrate. .

[Brief description of the drawings]

FIG. 1 is a sectional view showing one embodiment of a multilayer wiring board of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... Organic resin insulating layer 3 ... Thin film wiring conductor layer 4 ... Multilayer wiring part 5 ... Through-hole 6 ... Through-hole conductor 7 ... Bonding pad A ...・ Electronic parts

Claims (3)

[Claims] 1. A substrate and a plurality of organic resin insulating layers and a thin film wiring conductor layer which are attached to at least one main surface of the substrate and are alternately laminated, and the upper and lower thin film wiring conductor layers are organic resin insulation layers. A multilayer wiring board comprising: a multilayer wiring portion electrically connected via a through-hole conductor provided in a layer; wherein the substrate is formed by including an inorganic powder and / or a metal powder in an organic resin. A multilayer wiring board, wherein the surface of the multilayer wiring portion to be attached is formed only of an organic resin. 2. The multilayer wiring board according to claim 1, wherein the particle diameter of the inorganic powder and / or the metal powder is 0.05 μm to 10 μm. 3. The multilayer wiring board according to claim 1, wherein the content of said inorganic powder and / or metal powder is 20% by weight to 90% by weight.