KR20120046493A - Printed circuit board and method for manufacturing the same - Google Patents

Abstract

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to reduce a thermal expansion coefficient difference between a circuit layer and an insulation layer. CONSTITUTION: A core layer(110) includes a conductive layer(111) and a base insulation layer(112) which is arranged on both sides of the conductive layer. A circuit wiring layer(150) has a circuit wiring(150a) which is electrically connected to the conductive layer. A through via(115) passes through the core layer and is electrically connected to the circuit wiring layer. An insulation inner wall layer(140) is interposed between the core layer and the through via. The via is connected to the circuit wiring and the conductive layer.

Description

Printed circuit board and method for manufacturing the same

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board and a method of manufacturing the same, and to a printed circuit board and a method of manufacturing the same, using a conductive layer of a core layer as ground wiring and power wiring.

Recently, due to the high portability of electronic devices, high functionality, internet, video, and high capacity data transmission, the design of printed circuit boards is more complicated, and the demand for high density and miniaturized circuits is increasing. Interest is growing.

The multilayer printed circuit board may include alternately stacked circuit wiring layers and insulating layers, and may include vias for electrically connecting the circuit wiring layers stacked on the insulating layers. At this time, by increasing the number of stacked layers of the circuit wiring layer, it is possible to simplify the design of the printed circuit board. However, according to the trend of miniaturization and thinning of electronic devices, there is a limit in increasing the number of layers of a multilayer printed circuit board.

Therefore, a research that can achieve a thinning without changing the circuit design in the printed circuit board is required.

Accordingly, the present invention has been made to solve a problem that may occur in a printed circuit board and a method of manufacturing the same. It relates to a printed circuit board and a method for manufacturing the same that can maintain the design of the thinner.

The solution for solving the problem of the present invention is to provide a printed circuit board. The printed circuit board may include a core layer having a conductive layer and a base insulating layer disposed on both surfaces of the conductive layer; A circuit wiring layer disposed on at least one surface of the core layer and having a circuit wiring electrically connected to the conductive layer; A through via penetrating through the core layer and electrically connected to the circuit wiring layer; And an insulating inner wall layer interposed between the core layer and the through via.

Here, the circuit wiring may be any one of a ground wiring and a power wiring.

In addition, the base insulating layer is disposed at the outermost and the conductive layer and the base insulating layer is stacked in plurality,

The circuit wiring may include a ground wiring connected to one of the plurality of conductive layers and a power wiring connected to another one of the plurality of conductive layers.

The conductive layer may be formed of a carbon fiber or a metal layer.

The semiconductor device may further include a via penetrating the base insulating layer to connect the circuit wiring and the conductive layer to each other.

In addition, further comprising a protective layer disposed on both sides of the core layer,

The via may further include a via penetrating the protective layer and the base insulating layer to connect the circuit wiring and the conductive layer to each other.

In addition, further comprising a protective layer disposed on both sides of the core layer,

The semiconductor device may further include a via penetrating the protective layer and contacting the base insulating layer to connect the circuit wiring and the conductive layer to each other.

The semiconductor device may further include protective layers disposed on both surfaces of the core layer, and may further include vias that pass through the protective layer and the core layer to connect the circuit wiring and the conductive layer to each other.

Another solution for solving the problems of the present invention is to provide a printed circuit board. The printed circuit board may include a core layer having a conductive layer and a base insulating layer disposed on both surfaces of the conductive layer; Protective layers disposed on both sides of the core layer; A circuit wiring layer disposed on at least one surface of the protective layer and having circuit wiring electrically connected to the conductive layer; A through via penetrating through the core layer and electrically connected to the circuit wiring layer; And an insulating inner wall layer interposed between the core layer and the through via.

Here, the circuit wiring may include at least one of a ground wiring and a power wiring.

The semiconductor device may further include vias formed in the base insulating layer and the protective layer to electrically connect the circuit wiring and the conductive layer to each other.

In addition, the protective layer may further include a via electrically connecting the circuit wiring and the conductive layer to each other.

In addition, the protective layer and the insulating inner wall layer may be formed integrally with each other.

Another solution for solving the problems of the present invention is to provide a method for manufacturing a multilayer printed circuit board. The manufacturing method includes the steps of providing a core layer having a conductive layer and a base insulating layer disposed on both sides of the conductive layer; Forming a through via hole penetrating the core layer; Forming an insulating inner wall layer on an inner wall of the through via hole; And forming a through via in the through via hole including the insulating inner wall layer, and a circuit wiring layer including a circuit wiring electrically connected to the conductive layer on at least one surface of the core layer.

Here, in the step of forming an insulating inner wall layer on the inner wall of the through via hole,

Protective layers may be further formed on both surfaces of the core layer and may have openings exposing portions of the core layer.

In addition, after the step of forming an insulating inner wall layer on the inner wall of the through via hole,

The method may further include forming a via hole in the base insulating layer corresponding to the opening.

In addition, after the step of forming an insulating inner wall layer on the inner wall of the through via hole,

The method may further include forming a via hole penetrating the protective layer and the core layer.

In addition, the step of forming an insulating inner wall layer on the inner wall of the through via hole,

Filling an insulating resin into the through via hole; And forming the insulating inner wall layer by penetrating the insulating resin inside the through via hole.

In addition, the penetration of the insulating resin may be formed through an exposure and development process.

The circuit wiring may be at least one of a ground wiring and a power wiring.

Another solution for solving the problems of the present invention is to provide a method for manufacturing a multilayer printed circuit board. The manufacturing method includes the steps of providing a core layer having a conductive layer and a base insulating layer disposed on both sides of the conductive layer; Forming a through via hole penetrating the core layer; Forming an insulating inner wall layer on an inner wall of the passivation layer and a protective layer having openings on both sides of the core layer; Forming a through via in the through via hole including the insulating inner wall layer; And forming a circuit wiring layer on at least one surface of the core layer, the circuit wiring layer including a via disposed in the opening and a circuit wiring connected to the conductive layer.

Here, the step of forming an insulating inner wall layer on the inner wall of the protective layer having openings on both sides of the core layer and the through via hole,

Filling the inside of the through via hole and applying insulating resin on both sides of the core layer; And forming the opening and the insulating inner wall layer through the insulating resin in the through via hole.

The printed circuit board of the present invention can reduce the thermal expansion coefficient difference between the circuit layer and the insulating layer by using the conductive layer of the core layer as at least one of the ground wiring and the power wiring, and can easily achieve thinness without changing the circuit design. Can be.

1 is a cross-sectional view of a printed circuit board according to a first embodiment of the present invention.
2 is a cross-sectional view of a printed circuit board according to a second exemplary embodiment of the present invention.
3 is a cross-sectional view of a printed circuit board according to a third exemplary embodiment of the present invention.
4 to 9 are cross-sectional views illustrating a method of manufacturing a printed circuit board according to a fourth embodiment of the present invention.
10 to 13 are cross-sectional views illustrating a method of manufacturing a printed circuit board according to a fifth embodiment of the present invention.
14 to 16 are cross-sectional views illustrating a manufacturing process of a printed circuit board according to a sixth embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings of a printed circuit board. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the size and thickness of an apparatus may be exaggerated for convenience. Like numbers refer to like elements throughout.

1 is a cross-sectional view of a printed circuit board according to a first embodiment of the present invention.

Referring to FIG. 1, the printed circuit board according to the first embodiment of the present invention may include a core layer 110, a circuit wiring layer 150, a through via 115, and an insulating inner wall layer 140.

The core layer 110 may include a conductive layer 111 and a base insulating layer 112 disposed on both surfaces of the conductive layer 111. The conductive layer 111 may include carbon fiber or a metal layer. Accordingly, the core layer 110 may have a thermal expansion coefficient similar to that of the copper forming the circuit wiring layer 150, thereby reducing residual stress when forming a printed circuit board, thereby eliminating defects such as peeling of the insulating layer. can do.

The base insulating layer 112 may be disposed on both surfaces of the conductive layer 111. In addition, the resin forming the base insulating layer 112 may be filled inside the carbon fiber to serve as a binder.

Conventionally, the core layer uses glass fibers to adjust the coefficient of thermal expansion, but in the present invention, the core layer uses conductive carbon fibers or metal layers instead of the conventional glass fibers, so that the conductive layer 111 of the core layer 110 is used. Can be used as part of the circuit.

Specifically, a circuit wiring layer 150 is formed on at least one surface of the core layer 110 and includes a circuit wiring 150a connected to the conductive layer 111. The circuit wiring 150a may be any one of a ground wiring and a power wiring. Accordingly, the conductive layer 111 of the core layer 110 may be used as one of ground wiring and power wiring. That is, by using the conductive layer 111 constituting the core layer 110 as the ground wiring and the power wiring, the layer for forming the ground wiring or the power wiring can be reduced. Accordingly, even if the printed circuit board of the present invention has the same circuit design as the printed circuit board manufactured using glass fiber, a part of the core layer 110 may be used as ground wiring or power wiring. That is, the printed circuit board of the present invention can reduce the number of layers of the circuit wiring layer 150 for ground wiring or power wiring without changing the circuit design, thereby making the printed circuit board thin.

In addition, since the core layer 110 includes a carbon fiber or a metal layer having a thermal expansion coefficient similar to that of the copper forming the circuit wiring layer 150, defects such as peeling of the insulating layer during the manufacturing process of the printed circuit board are performed. It can prevent occurrence.

The through via 115 may electrically connect the circuit wiring layers 150 disposed on both surfaces of the core layer 110 to each other.

The insulating inner wall layer 140 may be disposed between the core layer 110 and the through via 115 to secure electrical insulation between the through via 115 and the conductive layer 111 of the core layer 110. That is, as the insulating inner wall layer 140 is provided, a short between the core layer 110 and the through via 115 is formed even though the through via 115 is filled in the through via hole 113 of the core layer 110. Can be prevented.

The core layer 110 may be formed to have a small thickness of the base insulating layer 112 in order to be adjusted to the thermal expansion coefficient of copper. In this case, as the thickness of the base insulating layer 112 decreases, the thermal expansion coefficient may be lowered, but the insulation of the base insulating layer 112 may decrease. That is, in the process of stacking the circuit wiring layer 150 on the core layer 110, the materials forming the conductive layer 111 protrude through the base insulating layer 112, thereby forming the circuit wiring layer formed on the core layer 110. 150, in particular, may cause a short defect between the signal wiring layer and the conductive layer 111 for signal transmission.

To solve this, protective layers 120 may be further provided on both surfaces of the core layer 110. That is, the protective layer 120 may be interposed between the core layer 110 and the circuit wiring layer 150 to ensure insulation stability between the circuit wiring layer 150 and the conductive layer 111.

In this case, the protective layer 120 may have an opening 121 for electrically connecting with the ground wiring or the power wiring. Here, the via 125 may be formed to further extend in the opening 121 in the base insulating layer 112. That is, through the via 125 formed on the base insulating layer 112 and the protective layer 120, the circuit wiring 150a, that is, either the ground wiring or the power wiring and the conductive layer 111 are electrically connected to each other. Can be connected.

In addition, the opening 121 of the protective layer 120 may have a larger area than the via hole 114 formed in the base insulating layer 112. This is to prevent the occurrence of delamination due to debris, heat-affected zones (HAZ), etc. in the laser process for forming the vias 125.

Here, the protective layer 120 may be integrally formed with the insulating inner wall layer 140. Accordingly, the protective layer 120 may be formed in the process of forming the insulating inner wall layer 140.

In addition, the circuit wiring layer 150 may include a pad 155 for connecting to the outside. Here, the solder resist 170 exposing the pad 155 may be disposed on the outermost circuit wiring layer 150.

In the exemplary embodiment of the present invention, the circuit wiring layer 152 has been described as being formed in two layers on the core layer 110, but is not limited thereto. The circuit wiring layer 150 may be formed of one layer or a multilayer of two or more layers. have. In this case, the insulating layer 160 may be interposed between the stacked circuit wiring layers 150, and the stacked circuit wiring layers 150 may be electrically connected to each other through vias passing through the insulating layer.

In addition, in the embodiment of the present invention, the core layer 110 is illustrated as having one conductive layer 111, but is not limited thereto. For example, the core layer 110 may include a plurality of conductive layers 112 and a base insulating layer 111. Here, the base insulating layer 111 may be disposed at the outermost side. In this case, one of the plurality of conductive layers may be connected to the ground line, and the other of the plurality of conductive layers may be connected to the power line. Accordingly, even if the printed circuit board of the present invention has the same circuit design as the printed circuit board manufactured using glass fibers as in the prior art, part of the core layer can be used as the ground wiring and the power wiring, so that at least two circuit wirings can be used. The number of floors can be reduced.

Therefore, as in the embodiment of the present invention, by providing the conductive layer having a thermal expansion coefficient corresponding to copper in the core layer, the thermal expansion coefficient difference between the insulating layer and the circuit wiring layer can be reduced, and thus, in the process of manufacturing a printed circuit board. It is possible to prevent defects such as peeling of the insulating layer.

In addition, by using the conductive layer of the core layer as at least one of the ground wiring and the power wiring, the formation of the circuit wiring layer for forming the ground wiring and the power wiring can be reduced, and the circuit wiring layer can be reduced without changing the circuit design. That is, the printed circuit board according to the embodiment of the present invention can satisfy the simplicity and thickness of the circuit wiring layer design.

2 is a cross-sectional view of a printed circuit board according to a second exemplary embodiment of the present invention. Here, the same technical configuration as the printed circuit board according to the first embodiment described above except for the form of vias is provided, and the repeated description of the first embodiment will be omitted.

Referring to FIG. 2, a printed circuit board according to a second embodiment of the present invention may include a core layer 110 having a conductive layer 111 and a base insulating layer 112 disposed on both surfaces of the conductive layer 111. A circuit wiring layer 150 including ground wiring and power wiring disposed on at least one surface of the core layer 110, a through via 115 passing through the core layer and electrically connected to the circuit wiring layer 150; The insulation inner wall layer 140 may be interposed between the core layer 110 and the through via 115.

Here, the circuit wiring layer 150 may include a circuit wiring 150a connected to the conductive layer 111. In this case, the circuit wiring 150a may be at least one of a ground wiring and a power wiring.

The printed circuit board may further include a protective layer 120 on both sides of the core layer 110 in order to prevent short circuits between the circuit wiring layer 150 and the conductive layer 111 except for the ground wiring and the power wiring.

The conductive layer 111 and the circuit wiring 150a may be electrically connected to each other through the via 125 penetrating through the core layer 110 and the protective layer 120.

Here, the via 125 is formed to penetrate through the core layer 110, and as the conductive layer 111 of the core layer 110 is not exposed in the process of forming the via hole, the conductive layer 111 and the circuit wiring are formed. It is possible to prevent the connection failure of 150a from occurring.

Therefore, as in the embodiment of the present invention, a via for connecting the conductive layer and at least one of the ground wiring and the power wiring is formed to penetrate through the core layer, thereby forming the conductive layer 111 and the circuit wiring 150a. The occurrence of a connection failure can be prevented.

3 is a cross-sectional view of a printed circuit board according to a third exemplary embodiment of the present invention. Here, the same technical configuration as the printed circuit board according to the first embodiment described above except for the form of vias is provided, and the repeated description of the first embodiment will be omitted.

Referring to FIG. 3, a printed circuit board according to a second embodiment of the present invention may include a core layer 110 including a conductive layer 111 and a base insulating layer 112 disposed on both surfaces of the conductive layer 111. A circuit wiring layer 150 including ground wiring and power wiring disposed on at least one surface of the core layer 110, a through via 115 passing through the core layer and electrically connected to the circuit wiring layer 150; The insulation inner wall layer 140 may be interposed between the core layer 110 and the through via 115.

Here, the circuit wiring layer 150 may include a circuit wiring 150a connected to the conductive layer 111. In this case, the circuit wiring 150a may be at least one of a ground wiring and a power wiring.

The printed circuit board may further include a protective layer 120 on both sides of the core layer 110 in order to prevent short circuits between the circuit wiring layer 150 and the conductive layer 111 except for the ground wiring and the power wiring.

When the base insulating layer 112 is thinly formed to lower the coefficient of thermal expansion and thus does not function as an insulating agent, the via 125 for connecting the conductive layer 111 to at least one of the ground wiring and the power wiring is a base insulating layer. Contact 112. In this case, since the base insulating layer 112 is difficult to be uniformly formed on the entire surface of the core layer 110 in the process, the via 125 may have a relatively thin base insulating layer of the entire surface of the core layer 110 ( 112). This is because when the base insulating layer 112 is thin, the insulation of the base insulating layer 112 is deteriorated so that the via 125 and the conductive layer 111 may be electrically connected to each other. In other words, the via may be formed in the protective layer 120.

As such, since the via 125 is formed to penetrate only the protective layer 120 without penetrating to the base insulating layer 112, the via hole processing area may be reduced, and thus, debris that may occur in laser processing and The occurrence of delamination can be reduced by the heat affected zone HAZ.

Therefore, as in the embodiment of the present invention, the via for connecting the conductive layer and at least one of the ground wiring and the power wiring is formed only in the protective layer, which may occur due to laser processing by reducing the laser processing area. Defects can be reduced.

4 to 9 are cross-sectional views illustrating a method of manufacturing a printed circuit board according to a fourth embodiment of the present invention.

Referring to FIG. 4, in order to manufacture a printed circuit board, a core layer 110 is first provided. Here, the core layer 110 may include a conductive layer 111 and a base insulating layer 112 disposed on both surfaces of the conductive layer 111. The conductive layer 111 may be formed of a carbon fiber and a metal layer. In this case, when the conductive layer 111 is formed of glass fiber, the insulating resin forming the base insulating layer 112 may be further filled by filling the inside of the carbon fiber.

In the exemplary embodiment of the present invention, the core layer 110 is illustrated and described as having one conductive layer, but is not limited thereto. The core layer 110 may be insulated from each other by the base insulating layer 112 and may be formed in multiple layers.

The through via hole 113 is formed in the core layer 110. The through via hole 113 may be formed through a laser drill method or a mechanical drill method, but the embodiment is not limited thereto.

Referring to FIG. 5, after the through via hole 113 is formed in the core layer 110, an insulating resin is filled in the through via hole 113. In addition, the insulating resin may be further disposed on both surfaces of the core layer 110 to form the protective layer 120. Here, the protective layer 120 may serve to assist the insulating role of the base insulating layer 112 of the core layer 110. That is, the protective layer 120 may serve to prevent short defects between the circuit wiring layer 150 formed on the core layer 110, in particular, the signal wiring layer for signal transmission and the conductive layer 111 of the core layer 110. Can be.

Referring to FIG. 6, an exposure and development process is performed on the insulating resin filled in the through via hole 113 to form an insulating inner wall layer 140 disposed on the inner wall of the through via hole 113. Here, the insulating inner wall layer 140 may serve to secure insulation between the conductive layer 111 of the core layer 110 and the through via 115 to be described later.

In addition, when the protective layer 120 is formed on both surfaces of the core layer 110, an opening 121 exposing the core layer 110 may be formed.

Referring to FIG. 7, after forming the protective layer 120, a via hole 114 penetrating the base insulating layer 112 is formed. In addition, the through via hole 113 may be formed to extend to a part of the conductive layer 111. As a result, connection reliability between the via 125 filled in the via hole 114 and the conductive layer 111 may be increased.

An example of a method of forming the via hole 114 may be formed through a laser drill or a mechanical drill.

In addition, when the protective layer 120 is formed on both surfaces of the core layer 110, the via hole 114 may be formed to correspond to the opening 121 of the protective layer 120. In this case, the opening 121 of the protective layer 120 may have a larger area than the via hole 114 formed in the base insulating layer 112. As a result, in the laser process for forming the via hole 114, it is possible to prevent the occurrence of delamination by debris, heat-affected zones (HAZ), or the like.

Referring to FIG. 8, the through via 115 and the via 125 may be formed by filling a conductive paste into the through via hole 113 and the via hole 114.

Referring to FIG. 9, a circuit wiring layer 150 including a circuit wiring 150a electrically connected to the conductive layer 111 through a via 125 is formed on at least one surface of the core layer 110. In this case, the circuit wiring 150a connected to the conductive layer 111 may be a ground wiring or a power wiring.

In addition, when the conductive layer 111 is formed in a multilayer, any one of the multilayer conductive layers may be connected to the ground line, and the other layer of the conductive layer may be connected to the power line.

In addition, the build-up process, that is, the process of forming the insulating layer 160 and the additional circuit wiring layer 151 on the circuit wiring layer 150 may be performed at least one or more times. In this case, the outermost circuit wiring layer, for example, the additional circuit wiring layer 151 may include a pad 155 for connecting to the outside. Thereafter, a solder resist 170 may be further formed on the outermost circuit wiring layer, for example, the additional circuit wiring layer 151.

Therefore, as in the embodiment of the present invention, by using the conductive layer of the core layer as at least one of the ground wiring and the power wiring, the thermal expansion coefficient difference between the circuit layer and the insulating layer can be reduced, and the thickness can be reduced without changing the circuit design. Can be easily achieved.

10 to 13 are cross-sectional views illustrating a manufacturing process of a printed circuit board according to a fifth embodiment of the present invention. Here, except for the method of forming the via, since the manufacturing process may be performed through the same manufacturing process as the manufacturing process of the printed circuit board according to the fourth embodiment described above, the repeated description with respect to the fourth embodiment will be omitted.

Referring to FIG. 10, in order to manufacture a printed circuit board, a core layer 110 having a conductive layer 111 and a base insulating layer 112 is provided, and then through via holes 113 are formed in the core layer 110. To form.

Thereafter, the insulating inner wall layer 140 disposed on the inner wall of the through via hole 113 and the protective layer 120 disposed on both sides of the core layer 110 are formed.

Referring to FIG. 11, a via hole 114 penetrating through the core layer 110 and the protective layer 120 is formed. Here, the via hole 114 may be formed through laser processing or a mechanical drill.

As the via hole 114 is formed through the core layer 110, the conductive layer 111 of the core layer 110 may be exposed to the outside. Accordingly, in order to expose only the conductive layer 111 of the core layer 110, it may be easier than the case of forming only a portion of the base insulating layer 112 to penetrate.

In addition, as the conductive layer 111 of the core layer 110 is not exposed in the process of forming the via hole, it is possible to prevent the connection between the conductive layer 111 and the circuit wiring 150a from occurring.

Referring to FIG. 12, the conductive via may be filled in the through via hole 113 and the via hole 114 to form the through via 115 and the via 125. In this case, the via 125 may be electrically connected to the side surface of the conductive layer 111 exposed by the via hole 114.

In addition, the through via 115 may be insulated from the conductive layer 111 by the insulating inner wall layer 140.

Referring to FIG. 13, a circuit wiring layer 150 including a circuit wiring 150a connected to the conductive layer 111 is formed on at least one surface of the core layer 110. In this case, the circuit wiring layers 150 disposed on both surfaces of the core layer 110 may be electrically connected to each other through the through vias 115. In addition, the via 125 and the conductive layer 111 and the circuit wiring 150a may be electrically connected to each other. In this case, the circuit wiring 150a connected to the conductive layer 111 may be a ground wiring or a power wiring.

Therefore, as in the embodiment of the present invention, a via for connecting the conductive layer and at least one of the ground wiring and the power wiring is formed to penetrate through the core layer, thereby forming the conductive layer 111 and the circuit wiring 150a. The occurrence of a connection failure can be prevented.

14 to 16 are cross-sectional views illustrating a manufacturing process of a printed circuit board according to a sixth embodiment of the present invention. Here, except for the method of forming the via, since the manufacturing process may be performed through the same manufacturing process as the manufacturing process of the printed circuit board according to the fifth embodiment described above, repeated descriptions with respect to the fifth embodiment will be omitted.

Referring to FIG. 14, in order to manufacture a printed circuit board, a core layer 110 having a conductive layer 111 and a base insulating layer 112 is provided, and then through via holes 113 are formed in the core layer 110. To form.

Thereafter, the insulating inner wall layer 140 disposed on the inner wall of the through via hole 113 and the opening 121 exposing a part of the core layer 110 and the protective layer 120 disposed on both sides of the core layer 110. To form.

Here, the opening 121 of the protective layer 120 may be formed to correspond to the thinnest region on the front surface of the core layer 110.

Referring to FIG. 15, the through via 115 is formed by filling a conductive paste into the through via hole 113 including the insulating inner wall layer 140. In this case, the through via 115 and the conductive layer 111 of the core layer 110 may be insulated from each other by the insulating inner wall layer 140.

Referring to FIG. 16, a circuit wiring layer 150 including a circuit wiring 150a connected to the conductive layer 111 is formed on at least one surface of the core layer 110. In this case, the circuit wiring layers 150 disposed on both surfaces of the core layer 110 may be electrically connected to each other through the through vias 115.

The circuit wiring 150a connected to the conductive layer 111 may be a ground wiring or a power wiring.

Vias formed in the openings may be further formed in the process of forming the circuit wiring layer 150. Accordingly, the via 125 may be in contact with the base insulating layer 112 of a relatively thin region of the front surface of the core layer. That is, since the base insulating layer 112 of the core layer 110 is difficult to be uniformly formed on the entire surface of the core layer 110, the base insulating layer 112 is formed to have a thin thickness compared to other areas, thereby making it insulative. As the layers and vias are electrically connected to each other, the via hole processing area for forming the vias 125 may be reduced, so that the interlayer separation may be performed by debris and heat affected zones (HAZ), etc., which may occur in laser processing. The occurrence of delamination can be reduced.

Therefore, as in the embodiment of the present invention, by forming a via in the protective layer for connecting at least one of the ground wiring and the power wiring with the conductive layer, the at least one of the ground wiring and the power wiring and the core layer are formed. The contact stability between conductive layers can be improved.

110: core layer 111: conductive layer
112: base insulating layer 115: through via
120: protective layer 140: insulating inner wall layer
150: circuit wiring layer 150a: circuit wiring
160: insulating layer 170: solder resist

Claims (22)

A core layer having a conductive layer and a base insulating layer disposed on both surfaces of the conductive layer;
A circuit wiring layer disposed on at least one surface of the core layer and having a circuit wiring electrically connected to the conductive layer;
A through via penetrating through the core layer and electrically connected to the circuit wiring layer; And
An insulating inner wall layer interposed between the core layer and the through via;
Printed circuit board comprising a.
The method of claim 1,
The circuit wiring is any one of a ground wiring and a power wiring.
The method of claim 1,
The base insulating layer is disposed on the outermost side and the conductive layer and the base insulating layer is stacked in plurality,
The circuit wiring board includes a ground wiring connected to one of the plurality of conductive layers and a power wiring connected to another one of the plurality of conductive layers.
The method of claim 1,
The conductive layer is a printed circuit board formed of a carbon fiber or a metal layer.
The method of claim 1,
And a via penetrating the base insulating layer to connect the circuit wiring and the conductive layer to each other.
The method of claim 1,
Further provided with a protective layer disposed on both sides of the core layer,
And a via penetrating the protective layer and the base insulating layer to connect the circuit wiring and the conductive layer to each other.
The method of claim 1,
Further provided with a protective layer disposed on both sides of the core layer,
And a via penetrating the protective layer and in contact with the base insulating layer to connect the circuit wiring and the conductive layer to each other.
The method of claim 1,
Further provided with a protective layer disposed on both sides of the core layer,
And a via penetrating the protective layer and the core layer to connect the circuit wiring and the conductive layer to each other.
A core layer having a conductive layer and a base insulating layer disposed on both surfaces of the conductive layer;
Protective layers disposed on both sides of the core layer;
A circuit wiring layer disposed on at least one surface of the protective layer and having circuit wiring electrically connected to the conductive layer;
A through via penetrating through the core layer and electrically connected to the circuit wiring layer; And
An insulating inner wall layer interposed between the core layer and the through via;
Printed circuit board comprising a.
The method of claim 9,
The circuit wiring is at least one of the ground wiring and the power wiring.
The method of claim 9,
And a via formed in the base insulating layer and the protective layer to electrically connect the circuit wiring and the conductive layer to each other.
The method of claim 9,
And a via formed in the protective layer to electrically connect the circuit wiring and the conductive layer to each other.
The method of claim 9,
The protective layer and the insulating inner wall layer formed integrally with each other.
Providing a core layer having a conductive layer and a base insulating layer disposed on both sides of the conductive layer;
Forming a through via hole penetrating the core layer;
Forming an insulating inner wall layer on an inner wall of the through via hole;
Forming a circuit wiring layer including a through via in the through via hole including the insulating inner wall layer and a circuit wiring electrically connected to the conductive layer on at least one surface of the core layer;
And a step of forming the printed circuit board.
15. The method of claim 14,
In the step of forming an insulating inner wall layer on the inner wall of the through via hole,
And a protective layer disposed on both sides of the core layer and having a opening exposing a portion of the core layer.
The method of claim 15,
After forming an insulating inner wall layer on the inner wall of the through via hole,
And forming a via hole in the base insulating layer corresponding to the opening.
15. The method of claim 14,
After forming an insulating inner wall layer on the inner wall of the through via hole,
And forming a via hole penetrating through the protective layer and the core layer.
15. The method of claim 14,
Forming an insulating inner wall layer on the inner wall of the through via hole is
Filling an insulating resin into the through via hole; And
Forming the insulating inner wall layer through the insulating resin inside the through via hole;
And a step of forming the printed circuit board.
The method of claim 18,
The penetration of the insulating resin is a manufacturing method of a printed circuit board is formed through the exposure and development process.
15. The method of claim 14,
The circuit wiring is at least one of a ground wiring and a power wiring manufacturing method of a printed circuit board.
Providing a core layer having a conductive layer and a base insulating layer disposed on both sides of the conductive layer;
Forming a through via hole penetrating the core layer;
Forming an insulating inner wall layer on an inner wall of the passivation layer and a protective layer having openings on both sides of the core layer;
Forming a through via in the through via hole including the insulating inner wall layer; And
Forming a circuit wiring layer on at least one surface of the core layer, the circuit wiring layer including a via disposed in the opening and a circuit wiring connected to the conductive layer;
And a step of forming the printed circuit board.
The method of claim 21,
Forming a protective layer having openings on both sides of the core layer and an insulating inner wall layer on an inner wall of the through via hole;
Filling the inside of the through via hole and applying insulating resin on both sides of the core layer; And
Penetrating the insulating resin in the through via hole to form the opening and the insulating inner wall layer;
And a step of forming the printed circuit board.

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