Sommadossi et al., 2022 - Google Patents
Mechanical properties of Cu/In–48 Sn/Cu diffusion-soldered jointsSommadossi et al., 2022
- Document ID
- 563990164352490002
- Author
- Sommadossi S
- Huici J
- Khanna P
- Gust W
- Mittemeijer E
- Publication year
- Publication venue
- International Journal of Materials Research
External Links
Snippet
Cu/Cu joints were produced in the temperature range 200–360° C by the diffusion soldering process, using the In-Sn eutectic alloy as solder material. Two intermetallic phases (IPs) appeared in the interconnection zone, η (Cu-poor IP) and ζ (Cu-rich IP), but below 200° C …
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