Shalaby et al., 2020 - Google Patents
Effect of nano-Al2O3 particles on the microstructure and mechanical performance of melt-spun process Sn–3.5 Ag composite solderShalaby et al., 2020
View PDF- Document ID
- 7802251024352895830
- Author
- Shalaby R
- Elzanaty H
- Publication year
- Publication venue
- Journal of Materials Science: Materials in Electronics
External Links
Snippet
The addition of Al2O3 nanoparticles with 0.01, 0.03, 0.05, 0.07, and 0.1 wt% to eutectic solder Sn–3.5 Ag was studied so as to be aware of the influence of Al2O3 addition as the particulate reinforcement to the microstructure, microhardness, and mechanical properties …
- 229910000679 solder 0 title abstract description 77
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C45/00—Amorphous alloys
- C22C45/04—Amorphous alloys with Ni or Co as the major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1036—Alloys containing non-metals starting from a melt
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Shalaby et al. | Effect of nano-Al2O3 particles on the microstructure and mechanical performance of melt-spun process Sn–3.5 Ag composite solder | |
| Zeng et al. | Recent advances on Sn–Cu solders with alloying elements | |
| Jiang et al. | Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder | |
| El-Taher et al. | Controlling Ag3Sn plate formation and its effect on the creep resistance of Sn–3.0 Ag–0.7 Cu lead-free solder by adding minor alloying elements Fe, Co, Te and Bi | |
| Tian et al. | Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn–0.7 Cu solder joints | |
| Hu et al. | Effect of Cu6Sn5 nanoparticle on thermal behavior, mechanical properties and interfacial reaction of Sn3. 0Ag0. 5Cu solder alloys | |
| Shalaby | Effect of rapid solidification on mechanical properties of a lead free Sn–3.5 Ag solder | |
| Gumaan et al. | Copper effects in mechanical, thermal and electrical properties of rapidly solidified eutectic Sn–Ag alloy | |
| Lai et al. | Interfacial microstructure evolution and shear strength of Sn0. 7Cu–x Ni/Cu solder joints | |
| Cai et al. | Deformation mechanism of various Sn-x Bi alloys under tensile tests | |
| Gumaan | Chromium improvements on the mechanical performance of a rapidly solidified eutectic Sn–Ag alloy | |
| Kamaruzzaman et al. | Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review | |
| Eid et al. | Influence of nano-metric Al2O3 particles addition on thermal behavior, microstructural and tensile characteristics of hypoeutectic Sn-5.0 Zn-0.3 Cu Pb-free solder alloy | |
| Shalaby | Development of holmium doped eutectic Sn-Ag lead-free solder for electronic packaging | |
| Peng et al. | An investigation on the ZnO retained ratio, microstructural evolution, and mechanical properties of ZnO doped Sn3. 0Ag0. 5Cu composite solder joints | |
| Yang et al. | Effect of BaTiO3 on the microstructure and mechanical properties of Sn1. 0Ag0. 5Cu lead-free solder | |
| Chen et al. | Effects of rare earth Ce on properties of Sn–9Zn lead-free solder | |
| Tikale et al. | Effect of multiple reflow cycles and Al2O3 nanoparticles reinforcement on performance of SAC305 lead-free solder alloy | |
| Fathy et al. | Development of hypoeutectic SnBi alloy solder reinforced with WO3 nanoparticles for connecting Cu substrates via thermal bonding | |
| Lai et al. | Effect of cooling method and aging treatment on the microstructure and mechanical properties of Sn–10Bi solder alloy | |
| Kao et al. | Bismuth-induced microstructural evolution and dissolution during aging: Enhancing mechanical properties, thermal stability, and wettability of Sn-9Zn alloy | |
| Shen et al. | Effects of rare earth additions on the microstructural evolution and microhardness of Sn30Bi0. 5Cu and Sn35Bi1Ag solder alloys | |
| Wu et al. | Unravelling the synergistic enhancement effect of Ag3Sn phase and graphene nanosheets addition on the thermal cycling reliability of Sn–x Ag–0.7 Cu solder joint | |
| Chen et al. | Influence of minor Bi additions on the interfacial morphology between Sn–Zn–x Bi solders and a Cu layer | |
| Abbas et al. | Chromium effects on the microstructural, mechanical and thermal properties of a rapidly solidified eutectic Sn-Ag alloy |