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TW200741227A - Manufacturing method of semiconductor device and semiconductor device - Google Patents
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TW200741227A - Manufacturing method of semiconductor device and semiconductor device - Google Patents

Manufacturing method of semiconductor device and semiconductor device

Info

Publication number
TW200741227A
TW200741227A TW096109100A TW96109100A TW200741227A TW 200741227 A TW200741227 A TW 200741227A TW 096109100 A TW096109100 A TW 096109100A TW 96109100 A TW96109100 A TW 96109100A TW 200741227 A TW200741227 A TW 200741227A
Authority
TW
Taiwan
Prior art keywords
semiconductor device
input terminal
testing device
output terminal
manufacturing
Prior art date
Application number
TW096109100A
Other languages
English (en)
Inventor
Hiroshi Noda
Original Assignee
Renesas Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Tech Corp filed Critical Renesas Tech Corp
Publication of TW200741227A publication Critical patent/TW200741227A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318505—Test of Modular systems, e.g. Wafers, MCM's
    • G01R31/318511—Wafer Test
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31712—Input or output aspects
    • G01R31/31716—Testing of input or output with loop-back
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/02—Detection or location of defective auxiliary circuits, e.g. defective refresh counters
    • G11C29/022—Detection or location of defective auxiliary circuits, e.g. defective refresh counters in I/O circuitry
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
    • G11C2029/5602—Interface to device under test
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW096109100A 2006-03-31 2007-03-16 Manufacturing method of semiconductor device and semiconductor device TW200741227A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006098532A JP4726679B2 (ja) 2006-03-31 2006-03-31 半導体試験方法および半導体装置

Publications (1)

Publication Number Publication Date
TW200741227A true TW200741227A (en) 2007-11-01

Family

ID=38606241

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096109100A TW200741227A (en) 2006-03-31 2007-03-16 Manufacturing method of semiconductor device and semiconductor device

Country Status (5)

Country Link
US (1) US7560949B2 (zh)
JP (1) JP4726679B2 (zh)
KR (1) KR101265041B1 (zh)
CN (1) CN101047148B (zh)
TW (1) TW200741227A (zh)

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US8098073B2 (en) * 2007-09-27 2012-01-17 Lsi Corporation System for terminating high speed input/output buffers in an automatic test equipment environment to enable external loopback testing
US8026726B2 (en) * 2009-01-23 2011-09-27 Silicon Image, Inc. Fault testing for interconnections
US8533543B2 (en) 2009-03-30 2013-09-10 Infineon Technologies Ag System for testing connections between chips
US8598898B2 (en) 2010-10-05 2013-12-03 Silicon Image, Inc. Testing of high-speed input-output devices
US20120194206A1 (en) * 2011-01-28 2012-08-02 Advantest Corporation Measuring Apparatus
US9500675B2 (en) 2013-07-15 2016-11-22 Mpi Corporation Probe module supporting loopback test
US20150123697A1 (en) * 2013-11-07 2015-05-07 Qualcomm Incorporated Methods and apparatuses for ac/dc characterization
JP2015141098A (ja) * 2014-01-29 2015-08-03 日本電気株式会社 テストボード、集積回路テスト方法、集積回路装置、および、集積回路テストシステム
TWI569027B (zh) 2014-08-29 2017-02-01 明泰科技股份有限公司 射頻裝置、射頻電路的檢測電路及檢測方法
US20160065334A1 (en) * 2014-08-29 2016-03-03 R&D Circuits, Inc Structure and Implementation Method for implementing an embedded serial data test loopback, residing directly under the device within a printed circuit board
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TWI583960B (zh) * 2015-06-05 2017-05-21 Mpi Corp Probe module with feedback test function (3)
TWI583961B (zh) * 2015-06-05 2017-05-21 Mpi Corp 具回授測試功能之探針模組(一)
KR102432540B1 (ko) * 2015-10-08 2022-08-16 삼성전자주식회사 검사 회로를 갖는 반도체 칩
KR101793469B1 (ko) * 2016-01-22 2017-11-03 (주)티에스이 칩형 인덕터
US10720224B2 (en) * 2018-07-18 2020-07-21 Micron Technology, Inc. Protocol independent testing of memory devices using a loopback
JP7025026B2 (ja) * 2019-03-20 2022-02-24 Ｎｅｃプラットフォームズ株式会社 論理信号検出装置及び論理信号検出方法
US20220329071A1 (en) * 2019-07-30 2022-10-13 Sony Interactive Entertainment Inc. Electronic device
TWI855832B (zh) * 2022-09-07 2024-09-11 旺矽科技股份有限公司 探針卡、探針卡設計方法、生產/產生被測試的半導體器件的方法、利用一探針卡測試一未封裝半導體器件的方法、待測物以及探針系統
TWI877017B (zh) * 2024-05-31 2025-03-11 祥碩科技股份有限公司 可調變衰減的測試系統及其操作方法

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Also Published As

Publication number Publication date
CN101047148B (zh) 2011-05-04
KR20070098570A (ko) 2007-10-05
US7560949B2 (en) 2009-07-14
KR101265041B1 (ko) 2013-05-16
JP4726679B2 (ja) 2011-07-20
CN101047148A (zh) 2007-10-03
JP2007271496A (ja) 2007-10-18
US20070245179A1 (en) 2007-10-18

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