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GB2249672B - A method and apparatus for recognising circuit board postion, a circuit board for use in such method, use of solder resist film in such method - Google Patents
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GB2249672B - A method and apparatus for recognising circuit board postion, a circuit board for use in such method, use of solder resist film in such method - Google Patents

A method and apparatus for recognising circuit board postion, a circuit board for use in such method, use of solder resist film in such method

Info

Publication number
GB2249672B
GB2249672B GB9123003A GB9123003A GB2249672B GB 2249672 B GB2249672 B GB 2249672B GB 9123003 A GB9123003 A GB 9123003A GB 9123003 A GB9123003 A GB 9123003A GB 2249672 B GB2249672 B GB 2249672B
Authority
GB
United Kingdom
Prior art keywords
circuit board
resist film
solder resist
fiducial mark
postion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9123003A
Other versions
GB9123003D0 (en
GB2249672A (en
Inventor
Shinjiro Kawato
Shuji Mizuno
Tatsunori Hibara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB9123003D0 publication Critical patent/GB9123003D0/en
Publication of GB2249672A publication Critical patent/GB2249672A/en
Application granted granted Critical
Publication of GB2249672B publication Critical patent/GB2249672B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0269Marks, test patterns or identification means for visual or optical inspection
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Structure Of Printed Boards (AREA)
  • Closed-Circuit Television Systems (AREA)
  • Image Analysis (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

In a circuit board, a fiducial mark (2) of the same material as that of a circuit pattern is formed on a main surface of a board (1) on which the circuit pattern is formed, and it is coated with a solder resist film (3). According to this circuit board, it is possible to carry out position recognition by irradiating infrared rays without exposing the fiducial mark (2), so that oxidation of the fiducial mark (2) or attachment of solder thereto are prevented. An apparatus for recognizing the position of a circuit board includes means (22) for picking up the image of the surface of a circuit board (20), means (23) for recognizing the position of the circuit board (20) from thus obtained image, and means (21) for irradiating infrared rays toward the circuit board (20). In another arrangement the apparatus is used to detect the position of part of the wiring pattern rather than a fiducial mark. FIG.6 <IMAGE>
GB9123003A 1990-11-07 1991-10-30 A method and apparatus for recognising circuit board postion, a circuit board for use in such method, use of solder resist film in such method Expired - Fee Related GB2249672B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2301580A JP2698213B2 (en) 1990-11-07 1990-11-07 Circuit board and circuit board position recognition method

Publications (3)

Publication Number Publication Date
GB9123003D0 GB9123003D0 (en) 1991-12-18
GB2249672A GB2249672A (en) 1992-05-13
GB2249672B true GB2249672B (en) 1994-08-31

Family

ID=17898661

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9123003A Expired - Fee Related GB2249672B (en) 1990-11-07 1991-10-30 A method and apparatus for recognising circuit board postion, a circuit board for use in such method, use of solder resist film in such method

Country Status (3)

Country Link
JP (1) JP2698213B2 (en)
DE (1) DE4136543C2 (en)
GB (1) GB2249672B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4231180C2 (en) * 1992-09-17 1994-08-18 Siemens Ag Adjustment structure for determining the position of the solder mask on a printed circuit board and method for its production
US6079098A (en) * 1998-09-08 2000-06-27 Siemens Aktiengesellschaft Method and apparatus for processing substrates
JP2002118398A (en) * 2000-10-05 2002-04-19 Fuji Mach Mfg Co Ltd Method for detecting position of printed circuit board
JP2002204041A (en) * 2000-12-27 2002-07-19 Alps Electric Co Ltd Mounting position detecting structure of electric component
DE10129760B4 (en) * 2001-06-20 2008-05-15 Friwo Gerätebau Gmbh Circuit board with fiducial and method for its production and method for quality inspection
US9253009B2 (en) 2007-01-05 2016-02-02 Qualcomm Incorporated High performance station
US7710611B2 (en) 2007-02-16 2010-05-04 Illinois Tool Works, Inc. Single and multi-spectral illumination system and method
GB2458463B (en) * 2008-03-17 2013-02-20 Dek Int Gmbh Imaging system and method
CN103037149A (en) * 2012-11-12 2013-04-10 华映视讯(吴江)有限公司 Direct energy conversion operation (DECO) 6000 equipment carrying backlight false indenter
US20250216190A1 (en) * 2023-12-28 2025-07-03 The United States Of America, As Represented By The Secretary Of The Navy Optical planar metrology mounting device and methods for abrasive cross-sectioning of electrical components

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4941256A (en) * 1988-08-19 1990-07-17 Canadian Patents & Development Ltd. Automatic visual measurement of surface mount device placement
GB2231953A (en) * 1989-05-18 1990-11-28 Dynapert Ltd Method for setting up apparatus for handling electrical or electronic components

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60241610A (en) * 1984-05-15 1985-11-30 日立電線株式会社 Refrigerant-immersed superconductor
JPH01214118A (en) * 1988-02-23 1989-08-28 Mitsubishi Electric Corp Semiconductor manufacturing apparatus
JPH01283993A (en) * 1988-05-11 1989-11-15 Hitachi Ltd Circuit printed board, its surface mounting component position recognition device and surface mounting component inspecting device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4941256A (en) * 1988-08-19 1990-07-17 Canadian Patents & Development Ltd. Automatic visual measurement of surface mount device placement
GB2231953A (en) * 1989-05-18 1990-11-28 Dynapert Ltd Method for setting up apparatus for handling electrical or electronic components

Also Published As

Publication number Publication date
DE4136543C2 (en) 2003-06-26
DE4136543A1 (en) 1992-05-14
GB9123003D0 (en) 1991-12-18
GB2249672A (en) 1992-05-13
JP2698213B2 (en) 1998-01-19
JPH04174307A (en) 1992-06-22

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Legal Events

Date Code Title Description
746 Register noted 'licences of right' (sect. 46/1977)

Effective date: 19960611

PCNP Patent ceased through non-payment of renewal fee

Effective date: 20031030