JP2921074B2 - Substrate observation device - Google Patents
Substrate observation deviceInfo
- Publication number
- JP2921074B2 JP2921074B2 JP2244350A JP24435090A JP2921074B2 JP 2921074 B2 JP2921074 B2 JP 2921074B2 JP 2244350 A JP2244350 A JP 2244350A JP 24435090 A JP24435090 A JP 24435090A JP 2921074 B2 JP2921074 B2 JP 2921074B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- substrate
- light source
- measured
- transmitting body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims description 21
- 238000005286 illumination Methods 0.000 claims description 17
- 238000007747 plating Methods 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
Landscapes
- Investigating Or Analysing Materials By Optical Means (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は基板の観察装置に関し、詳しくは、基板認識
マーク、半田ランド、回路パターンのような基板上の被
測定物を明瞭に観察するための装置に関する。Description: BACKGROUND OF THE INVENTION The present invention relates to a board observation apparatus, and more particularly to a board observation mark, a solder land, and a circuit pattern for clearly observing an object to be measured on the board. Device.
（従来の技術） 電子部品が実装される基板には、基板の位置ずれ観察
の基準点となる基板認識マークや、電子部品を実装する
為の半田ランド、回路パターンなどが形成されており、
基板に電子部品を実装する際には、これらのマークは半
田ランド等をカメラにより観察することが行われる。(Prior art) A board on which electronic components are mounted is provided with a board recognition mark serving as a reference point for observing a displacement of the board, a solder land for mounting the electronic components, a circuit pattern, and the like.
When mounting electronic components on a substrate, these marks are observed by observing solder lands and the like with a camera.
第３図は従来の観察装置を示すものであって、100は
カメラであり、その下部の鏡筒101には、リング状の光
源部102が装着されている。103は光ファイバのような光
源である。104は基板であり、その上面には、基板認識
マーク105が形成されている。光源103から照射された光
は、マーク105の上面に反射され、その反射光をカメラ1
00により観察し、その画像から、基板の位置ずれを検出
する。FIG. 3 shows a conventional observation apparatus, in which 100 is a camera, and a ring-shaped light source 102 is mounted on a lens barrel 101 below the camera. 103 is a light source such as an optical fiber. A substrate 104 has a substrate recognition mark 105 formed on an upper surface thereof. Light emitted from the light source 103 is reflected on the upper surface of the mark 105, and the reflected light is
Observation is performed by 00, and the displacement of the substrate is detected from the image.
（発明が解決しようとする課題） マーク105が、半田メッキなどにより形成されている
場合、その表面は粗面であることから、このマーク105
に照射された光のうちのかなりの部分ａは、カメラ100
へ向って反射され、明瞭に観察できる。ところが、マー
ク105が金メッキなどの光沢のある材料から成る場合、
マーク105に入射した光ｂは、斜上方に反射されてカメ
ラ100には殆ど入射しないことから、マーク105を明瞭に
観察できない問題があった。(Problem to be Solved by the Invention) When the mark 105 is formed by solder plating or the like, since the surface is rough,
A considerable part a of the light irradiated to the camera 100
It is reflected toward and can be clearly observed. However, when the mark 105 is made of a shiny material such as gold plating,
Since the light b incident on the mark 105 is reflected obliquely upward and hardly enters the camera 100, there is a problem that the mark 105 cannot be clearly observed.
したがって本発明は、基板上の被測定物を、明瞭に観
察することができる基板の観察装置を提供することを目
的とする。Therefore, an object of the present invention is to provide a substrate observing apparatus capable of clearly observing an object to be measured on the substrate.
（課題を解決するための手段） 本発明は、基板上に形成された金メッキなどの光沢の
ある材料から成る被測定物と半田メッキなどの表面が粗
面である被測定物とを観察する基板の観察装置であっ
て、カメラと、カメラの光軸が通る孔部が形成され且つ
その上面が傾斜面である光透過体と、前記孔部を通して
基板上の被測定物に照明光を垂直に照射する第１の光源
と、前記傾斜面へ照明光を照射し、この照明光を前記光
透過体の内部で内方に屈折させて基板上の被測定物に斜
上方から照射する第２の光源とから基板の観察装置を構
成している。(Means for Solving the Problems) The present invention provides a substrate for observing an object to be measured made of a glossy material such as gold plating formed on the substrate and an object to be measured having a rough surface such as solder plating. An observation apparatus, wherein a camera, a hole through which the optical axis of the camera passes, and a light transmitting body having an inclined upper surface, and illuminating light perpendicularly to an object to be measured on a substrate through the hole. A first light source for irradiation, and a second light source for irradiating the inclined surface with illumination light, refracting the illumination light inward inside the light transmitting body, and irradiating the object to be measured on the substrate from obliquely above. A light source and a light source constitute a substrate observation device.
（作用） 上記構成において、金メッキなどの光沢のある被測定
物を観察する場合には、第１の光源から照射された照射
光は光透過体の孔部を通ってこの被測定物に垂直に照射
され、その反射光は再び孔部を通ってカメラに入射す
る。また半田メッキなどの表面が粗面である被測定物を
観察する場合には、第２の光源から照射された照明光
は、光透過体の傾斜面から光透過体の内部に入射し、光
透過体により内方に屈折されて、斜上方からこの被測定
物に入射し、その反射光は孔部を通ってカメラに入射す
る。(Operation) In the above configuration, when observing a glossy measurement object such as gold plating, the irradiation light emitted from the first light source passes through the hole of the light transmitting body and is perpendicular to the measurement object. Irradiated and the reflected light again enters the camera through the hole. Further, when observing an object to be measured having a rough surface such as solder plating, the illumination light emitted from the second light source enters the inside of the light transmitting body from the inclined surface of the light transmitting body, and The light is refracted inward by the transmission body, enters the object from obliquely above, and the reflected light enters the camera through the hole.
（実施例） 次に、図面を参照しながら本発明の実施例を説明す
る。Example Next, an example of the present invention will be described with reference to the drawings.
第１図において、１はカメラ、２は鏡筒であり、鏡筒
２の下部には、円筒状のカバー体３が装着されている。
鏡筒２の内部には、ハーフミラー４が設けており、また
この鏡筒２の側部には、このハーフミラー４へ向って照
明光を照射する第１の光源５が複数個設けられている。
また上記カバー体３の内部には、第２の光源６が複数個
設けられている。10は基板、11はこの基板10の上面に形
成された基板認識マークである。In FIG. 1, reference numeral 1 denotes a camera, 2 denotes a lens barrel, and a cylindrical cover body 3 is mounted below the lens barrel 2.
A half mirror 4 is provided inside the lens barrel 2, and a plurality of first light sources 5 for irradiating the half mirror 4 with illumination light are provided on a side portion of the lens barrel 2. I have.
A plurality of second light sources 6 are provided inside the cover body 3. Reference numeral 10 denotes a substrate, and 11 denotes a substrate recognition mark formed on the upper surface of the substrate 10.
カバー体３の下部には、光透過体７が設けられてい
る。この光透過体７の中央部には、上記カメラ１の光軸
が通る孔部８が形成されている（第２図も参照）。上記
第１の光源５から照射された照明光ａは、上記ハーフミ
ラー４で下方に反射され、この孔部８を通って、マーク
11に垂直に照射され、その反射光は、孔部８を通ってカ
メラに入射する。またこの光透過体７の上面は傾斜面９
であって、上記第２の光源６から照射された照明光ｂ
は、この傾斜面９から光透過体７の内部に入射に、光透
過体７により内方に屈折されて、マーク11に斜方向から
照射される。A light transmitting body 7 is provided below the cover 3. A hole 8 through which the optical axis of the camera 1 passes is formed in the center of the light transmitting body 7 (see also FIG. 2). Illumination light a emitted from the first light source 5 is reflected downward by the half mirror 4 and passes through the hole 8 to form a mark.
The light is perpendicularly illuminated to 11, and the reflected light enters the camera through the hole 8. The upper surface of the light transmitting body 7 is an inclined surface 9.
And the illumination light b emitted from the second light source 6
Is incident on the inside of the light transmitting body 7 from the inclined surface 9, is refracted inward by the light transmitting body 7, and irradiates the mark 11 obliquely.
上記構成において、第１の光源５から照射された照明
光ａは、ハーフミラー４に反射されて、マーク11に垂直
に入射する。また第２の光源６から照射された照明光ｂ
は、光透過体７により内方に屈折されて、マーク11に斜
上方から入射する。In the above configuration, the illumination light “a” emitted from the first light source 5 is reflected by the half mirror 4 and vertically enters the mark 11. Also, the illumination light b emitted from the second light source 6
Is refracted inward by the light transmitting body 7 and enters the mark 11 from obliquely above.
したがってマーク11が例えば金メッキなどの光沢のあ
る材料により形成されている場合、第１の光源５から照
射されて垂直に入射した光ａが、垂直に上方へ反射され
てカメラ１に入射し、カメラ１に明瞭に観察される。Therefore, when the mark 11 is formed of a glossy material such as gold plating, the light a emitted from the first light source 5 and vertically incident is reflected vertically upward and enters the camera 1, and 1 clearly observed.
またマーク11が例えば半田メッキなどにより形成され
て、その表面が粗面である場合、第２の光源６から照射
された光ｂは、光透過体７により内方に屈折されて、斜
上方からマーク11に入射し、上方へ反射されてカメラ１
に入射することから、明瞭に観察される。When the mark 11 is formed by, for example, solder plating and the surface is rough, the light b emitted from the second light source 6 is refracted inward by the light transmitting body 7 and obliquely from above. The camera 1 enters the mark 11 and is reflected upward.
, And are clearly observed.
すなわち、本手段によれば、第１の光源５のみを点灯
させれば、被測定物に垂直に照明光を照射でき、また第
２の光源６のみを点灯させれば、斜方向から照射光を照
射でき、また両光源5,6を同時に点灯させれば、広角度
θから、照明光を照射できるものであり、したがって各
光源5,6を個別に制御することにより、被測定物の材質
や形状等に応じて、所望方向から照射光を照射すること
ができる。That is, according to the present means, the illumination light can be emitted vertically to the device under test if only the first light source 5 is turned on, and the illumination light can be emitted from an oblique direction if only the second light source 6 is turned on. If both light sources 5 and 6 are turned on at the same time, illumination light can be emitted from a wide angle θ. Therefore, by controlling each light source 5 and 6 individually, the material of the DUT Irradiation light can be emitted from a desired direction according to the shape, shape, and the like.
なお上記実施例は、基板認識マーク11を観察する場合
を例にとって説明したが、本発明は、基板に形成される
半田ランドや、回路パターンなどの観察にも使用でき
る。In the above embodiment, the case where the board recognition mark 11 is observed has been described as an example. However, the present invention can also be used for observing solder lands, circuit patterns, and the like formed on the board.
（発明の効果） 以上説明したように本発明によれば、金メッキなどの
光沢のある被測定物を観察する場合には、第１の光源か
ら照射された照明光は光透過体の孔部を通ってこの被測
定物に垂直に照射され、その反射光は再び孔部を通って
カメラに入射し、また半田メッキなどの表面が粗面であ
る被測定物を観察する場合には、第２の光源から照射さ
れた照明光は、光透過体の傾斜面から光透過体の内部に
入射し、光透過体により内方に屈折されて、斜上方から
この被測定物に入射し、その反射光は孔部を通ってカメ
ラに入射するので、いずれの被測定物もカメラで明瞭に
観察することができる。(Effects of the Invention) As described above, according to the present invention, when observing a glossy measurement object such as gold plating, the illumination light emitted from the first light source passes through the hole of the light transmitting body. When the object to be measured has a rough surface such as a solder plating, the reflected light is incident on the camera again through the hole. Illumination light emitted from the light source enters the inside of the light transmitting body from the inclined surface of the light transmitting body, is refracted inward by the light transmitting body, enters the object to be measured from obliquely above, and reflects the light. Since the light enters the camera through the hole, any object to be measured can be clearly observed with the camera.
図は本発明の実施例を示すものであって、第１図は基板
の観察装置の正面図、第２図は光透過体の斜視図、第３
図は従来装置の側面図である。 １……カメラ ５……第１の光源 ６……第２の光源 ７……光透過体 ８……孔部 ９……傾斜面 10……基板 11……被測定物1 shows an embodiment of the present invention. FIG. 1 is a front view of an apparatus for observing a substrate, FIG. 2 is a perspective view of a light transmitting body, and FIG.
The figure is a side view of the conventional device. DESCRIPTION OF SYMBOLS 1 ... Camera 5 ... 1st light source 6 ... 2nd light source 7 ... Light-transmitting body 8 ... Hole 9 ...... Slope 10 ... Board 11 ... DUT
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｈ０５Ｋ 13/08 Ｈ０５Ｋ 13/08 Ｃ ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification code FI H05K 13/08 H05K 13/08 C
Claims (1)
ある材料から成る被測定物と半田メッキなどの表面が粗
面である被測定物とを観察する基板の観察装置であっ
て、カメラと、カメラの光軸が通る孔部が形成され且つ
その上面が傾斜面である光透過体と、前記孔部を通して
基板上の被測定物に照明光を垂直に照射する第１の光源
と、前記傾斜部へ照明光を照射し、この照明光を前記光
透過体の内部で内方に屈折させて基板上の被測定物に斜
上方から照射する第２の光源とを備え、前記第１の光源
及び／または前記第２の光源を点灯させることにより、
被測定物に応じて照明光を照射するようにしたことを特
徴とする基板の観察装置。1. A substrate observing apparatus for observing an object to be measured made of a glossy material such as gold plating formed on a substrate and an object to be measured having a rough surface such as solder plating, comprising: A light transmitting body in which a hole through which the optical axis of the camera passes is formed and the upper surface of which is an inclined surface, a first light source for vertically irradiating an object to be measured on the substrate with the illumination light through the hole, A second light source for irradiating the inclined portion with illumination light, refracting the illumination light inward inside the light transmitting body, and irradiating the object to be measured on the substrate from obliquely above; By turning on the light source and / or the second light source,
An observation apparatus for a substrate, wherein illumination light is emitted according to an object to be measured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2244350A JP2921074B2 (en) | 1990-09-14 | 1990-09-14 | Substrate observation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2244350A JP2921074B2 (en) | 1990-09-14 | 1990-09-14 | Substrate observation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04122840A JPH04122840A (en) | 1992-04-23 |
| JP2921074B2 true JP2921074B2 (en) | 1999-07-19 |
Family
ID=17117394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2244350A Expired - Lifetime JP2921074B2 (en) | 1990-09-14 | 1990-09-14 | Substrate observation device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2921074B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3668383B2 (en) | 1998-02-27 | 2005-07-06 | 松下電器産業株式会社 | Electronic component mounting equipment |
| JP2011233674A (en) * | 2010-04-27 | 2011-11-17 | Hitachi High-Tech Instruments Co Ltd | Method for mounting electronic component and electronic component mounter |
| TW201215845A (en) * | 2010-10-05 | 2012-04-16 | Machvision Inc | Illumination system for automatic optical inspection and assembly of it and camera system |
| JP6014386B2 (en) * | 2012-06-26 | 2016-10-25 | 中村留精密工業株式会社 | Glass plate lighting device and processing device |
-
1990
- 1990-09-14 JP JP2244350A patent/JP2921074B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04122840A (en) | 1992-04-23 |
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