JP2520122B2 - Cream solder - Google Patents
Cream solderInfo
- Publication number
- JP2520122B2 JP2520122B2 JP62036200A JP3620087A JP2520122B2 JP 2520122 B2 JP2520122 B2 JP 2520122B2 JP 62036200 A JP62036200 A JP 62036200A JP 3620087 A JP3620087 A JP 3620087A JP 2520122 B2 JP2520122 B2 JP 2520122B2
- Authority
- JP
- Japan
- Prior art keywords
- acid
- flux
- cream solder
- solder
- good
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 28
- 239000006071 cream Substances 0.000 title claims description 21
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 9
- IWYDHOAUDWTVEP-UHFFFAOYSA-N mandelic acid Chemical compound OC(=O)C(O)C1=CC=CC=C1 IWYDHOAUDWTVEP-UHFFFAOYSA-N 0.000 claims 2
- 230000004907 flux Effects 0.000 description 18
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 11
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 11
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 11
- XQXPVVBIMDBYFF-UHFFFAOYSA-N 4-hydroxyphenylacetic acid Chemical compound OC(=O)CC1=CC=C(O)C=C1 XQXPVVBIMDBYFF-UHFFFAOYSA-N 0.000 description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000012190 activator Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003925 fat Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- 235000005985 organic acids Nutrition 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexanol group Chemical group C(C)C(CO)CCCC YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 235000010233 benzoic acid Nutrition 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- LCPDWSOZIOUXRV-UHFFFAOYSA-N phenoxyacetic acid Chemical compound OC(=O)COC1=CC=CC=C1 LCPDWSOZIOUXRV-UHFFFAOYSA-N 0.000 description 2
- WLJVXDMOQOGPHL-UHFFFAOYSA-N phenylacetic acid Chemical compound OC(=O)CC1=CC=CC=C1 WLJVXDMOQOGPHL-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 230000001988 toxicity Effects 0.000 description 2
- 231100000419 toxicity Toxicity 0.000 description 2
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- FEVVTKCAZXCXEQ-UHFFFAOYSA-N 2-(4-hydroxyphenyl)pentanoic acid Chemical compound CCCC(C(O)=O)C1=CC=C(O)C=C1 FEVVTKCAZXCXEQ-UHFFFAOYSA-N 0.000 description 1
- KBDLTYNZHQRMQC-UHFFFAOYSA-N 2-(4-methoxyphenyl)propanoic acid Chemical compound COC1=CC=C(C(C)C(O)=O)C=C1 KBDLTYNZHQRMQC-UHFFFAOYSA-N 0.000 description 1
- GAXUWNPJYOWVDR-UHFFFAOYSA-N 3-(4-hydroxyphenyl)-2-phenylprop-2-enoic acid Chemical compound C=1C=CC=CC=1C(C(=O)O)=CC1=CC=C(O)C=C1 GAXUWNPJYOWVDR-UHFFFAOYSA-N 0.000 description 1
- NHUQYXSTNXLJIW-UHFFFAOYSA-N 3-(4-methoxyphenyl)-2-phenylprop-2-enoic acid Chemical compound C1=CC(OC)=CC=C1C=C(C(O)=O)C1=CC=CC=C1 NHUQYXSTNXLJIW-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- NRPFNQUDKRYCNX-UHFFFAOYSA-N 4-methoxyphenylacetic acid Chemical compound COC1=CC=C(CC(O)=O)C=C1 NRPFNQUDKRYCNX-UHFFFAOYSA-N 0.000 description 1
- FMXSYRBHGUMFBA-UHFFFAOYSA-N 6-amino-3-azaniumylidene-9-[2-carboxy-4-[6-[4-[4-[4-[4-[3-carboxy-6-[4-(trifluoromethyl)phenyl]naphthalen-1-yl]phenyl]piperidin-1-yl]butyl]triazol-1-yl]hexylcarbamoyl]phenyl]-5-sulfoxanthene-4-sulfonate Chemical compound Nc1ccc2c(-c3ccc(cc3C(O)=O)C(=O)NCCCCCCn3cc(CCCCN4CCC(CC4)c4ccc(cc4)-c4cc(cc5cc(ccc45)-c4ccc(cc4)C(F)(F)F)C(O)=O)nn3)c3ccc(=[NH2+])c(c3oc2c1S(O)(=O)=O)S([O-])(=O)=O FMXSYRBHGUMFBA-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- -1 aliphatic dicarboxylic acids Chemical class 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 235000013985 cinnamic acid Nutrition 0.000 description 1
- 229930016911 cinnamic acid Natural products 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000010485 coping Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- XWBDWHCCBGMXKG-UHFFFAOYSA-N ethanamine;hydron;chloride Chemical compound Cl.CCN XWBDWHCCBGMXKG-UHFFFAOYSA-N 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000006224 matting agent Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229960003424 phenylacetic acid Drugs 0.000 description 1
- 239000003279 phenylacetic acid Substances 0.000 description 1
- NMHMNPHRMNGLLB-UHFFFAOYSA-N phloretic acid Chemical compound OC(=O)CCC1=CC=C(O)C=C1 NMHMNPHRMNGLLB-UHFFFAOYSA-N 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明はクリームはんだに関する。TECHNICAL FIELD OF THE INVENTION The present invention relates to cream solder.
従来の技術 クリームはんだは樹脂、活性剤、粘弾性調整剤、その
他の添加剤等を溶剤に溶解分散させて得られるフラック
スに粉末はんだをクリーム状に分散させたもので、被接
合金属間に塗布後、加熱融着される。Conventional technology Cream solder is a flux obtained by dissolving and dispersing a resin, activator, viscoelasticity modifier, and other additives in a solvent, and powder solder is dispersed in a cream shape. After that, heat fusion is performed.
従来からこの種のクリームはんだは電子電気機器産業
等の分野において汎用されているが、最近の当該分野に
おいては、製品の小型化と高密度化に対応すると共に生
産性の向上をもたらす特性、即ち、粘度の経時変化がな
い、はんだボールや残渣の発生が少ない、はんだ付性が
よい、悪臭や毒性が少ない、洗浄性がよい、絶縁性がよ
い、腐食性がない、皮はりや乾燥がなく作業性がよい
（例えば、印刷可能時間、印刷後の部品搭載可能時間お
よび溶融までの放置可能時間が長い）等の特性を具備し
たクリームはんだが要請されている。Conventionally, this type of cream solder has been widely used in the field of electronic and electrical equipment industries, etc., but in the recent field concerned, it is possible to reduce the size and increase the density of products and to improve the productivity, that is, , No change in viscosity with time, less generation of solder balls or residues, good solderability, less bad odor or toxicity, good cleaning properties, good insulation, no corrosive, no peeling or drying A cream solder having characteristics such as good workability (for example, printable time, component mountable time after printing, and leaveable time before melting) is demanded.
従来からこのような問題に対応する技術として種々の
フラックス添加剤が提案されているが、未だに、上記要
請に十分に応え得る添加剤は知られていないのが当該分
野の実状である。Conventionally, various flux additives have been proposed as a technique for coping with such a problem, but it is the actual situation in the field that no additive capable of sufficiently satisfying the above-mentioned demand is known.
例えば、含窒素塩基類や有機酸類はフラックス作用の
高い添加剤であるが、次の様な欠点がある。含窒素塩基
を配合したクリームはんだはニッケルやステンレス等の
金属に対するはんだ付性を向上させるが、絶縁性が悪
く、粘弾性特性が不安定なばかりでなく、はんだボール
が増加する等の欠点がある。また、有機酸類には固有の
難点がある。例えば、蟻酸や酢酸は親水性が高く、絶縁
性が劣り、刺激臭があり、炭素原子数３〜５の有機酸は
不快臭が強く、さらに炭素原子数が増加するに伴ってフ
ラックス作用が低下する傾向があり、炭素原子数が16以
上になるとワックス状の固体となって洗浄性が低下す
る。比較的不快臭の少ない脂肪族ジカルボン酸のうち、
シュウ酸、マロン酸、コハク酸等は親水性が高いために
絶縁性が劣るだけでなく酸強度が高いために腐食の問題
があり、アジピン酸、ピメリン酸、スベリン酸、アゼラ
イン酸、セバシン酸等は洗浄性が劣る。安息香酸は適度
な酸強度と洗浄性を有するが、フラックス作用が弱い。
また、サリチル酸は安息香酸に比べてフラックス作用は
若干改良されるが、酸強度が高くなるので絶縁特性や腐
食性の点で問題がある。For example, nitrogen-containing bases and organic acids are additives having a high flux action, but have the following drawbacks. Cream solder containing a nitrogen-containing base improves solderability to metals such as nickel and stainless steel, but has drawbacks such as poor insulation, unstable viscoelastic properties, and increased solder balls. . In addition, organic acids have inherent difficulties. For example, formic acid and acetic acid have high hydrophilicity, inferior insulating properties, and have a pungent odor, organic acids having 3 to 5 carbon atoms have a strong unpleasant odor, and the flux action decreases as the number of carbon atoms further increases. If the number of carbon atoms is 16 or more, it becomes a waxy solid and the cleaning property is deteriorated. Of the aliphatic dicarboxylic acids that have relatively less unpleasant odor,
Oxalic acid, malonic acid, succinic acid, etc. are not only poor in insulation due to high hydrophilicity, but also have a problem of corrosion due to high acid strength, and adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, etc. Has poor cleanability. Benzoic acid has moderate acid strength and detergency, but has a weak flux action.
Further, salicylic acid has a slightly improved flux action as compared with benzoic acid, but since it has high acid strength, it has problems in terms of insulating properties and corrosiveness.
発明が解決しようとする問題点 本発明はこのような事情に鑑み、上記の要請に応える
ものであって、適用する製品の小型化および高密度化に
即応し得る新規なクリームはんだを提供するためになさ
れたものである。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention In view of such circumstances, the present invention provides a novel cream solder that meets the above-mentioned demands and can immediately respond to miniaturization and high density of applied products. It was done by.
問題点を解決するための手段 即ち本発明は、ｐ−ヒドロキシフェニルカルボン酸お
よびその誘導体のいずれかまたは両者をともに含有する
クリームはんだに関する。Means for Solving the Problems That is, the present invention relates to a cream solder containing either or both of p-hydroxyphenylcarboxylic acid and its derivative.
本発明に使用するｐ−ヒドロキシフェニルカルボン酸
としては、ｐ−ヒドロキシフェニル酢酸、４′,4−ビス
（４−ヒドロキシフェニル）ペンタン酸、ｐ−ヒドロキ
シフェニルプロピオン酸、ｐ−ヒドロキシフェニル桂皮
酸等が例示されるが、ｐ−ヒドロキシフェニル酢酸が特
に好ましい。Examples of the p-hydroxyphenylcarboxylic acid used in the present invention include p-hydroxyphenylacetic acid, 4 ', 4-bis (4-hydroxyphenyl) pentanoic acid, p-hydroxyphenylpropionic acid and p-hydroxyphenylcinnamic acid. Although exemplified, p-hydroxyphenylacetic acid is particularly preferable.
また、本発明に使用し得るｐ−ヒドロキシフェニルカ
ルボン酸の誘導体としてはｐ−メトキシフェニル酢酸、
ｐ−メトキシフェニルプロピオン酸、ｐ−メトキシフェ
ニル桂皮酸等が例示される。The derivative of p-hydroxyphenylcarboxylic acid that can be used in the present invention is p-methoxyphenylacetic acid,
Examples thereof include p-methoxyphenylpropionic acid and p-methoxyphenylcinnamic acid.
上記のｐ−ヒドロキシフェニルカルボン酸およびこれ
らの誘導体は所望により２種以上の混合物として使用し
てもよい。The above-mentioned p-hydroxyphenylcarboxylic acid and derivatives thereof may be used as a mixture of two or more kinds, if desired.
このようなｐ−ヒドロキシフェニルカルボン酸および
その誘導体のいずれかまたは両者をともに含む場合の両
者合計の配合量は特に限定的ではないが、通常は約0.1
〜10重量％、好ましくは約１〜３重量％である。When either or both of p-hydroxyphenylcarboxylic acid and its derivative are contained, the total amount of both is not particularly limited, but usually about 0.1
-10% by weight, preferably about 1-3% by weight.
本発明によるクリームはんだは上記のｐ−ヒドロキシ
フェニルカルボン酸およびその誘導体のいずれかまたは
両者をともに含有するフラックスと粉末はんだから構成
される。The cream solder according to the present invention is composed of a flux containing either or both of the above-mentioned p-hydroxyphenylcarboxylic acid and its derivative and powder solder.
フラックスは上記の成分のほかに他の常套の配合成
分、即ちロジンまたはロジン誘導体、および所望による
熱可塑性樹脂、油脂類（脂肪酸を含む）、酸化防止剤、
増粘剤、消泡剤、艶消剤等を溶剤に適宜配合することに
よって調製される。In addition to the above-mentioned components, the flux contains other conventional compounding components, that is, rosin or a rosin derivative, and optionally a thermoplastic resin, fats and oils (including fatty acids), an antioxidant,
It is prepared by appropriately adding a thickener, a defoaming agent, a matting agent and the like to a solvent.
このようなフラックスはロジンまたはロジン誘導体30
〜70重量部、活性剤１〜３重量部、熱可塑性樹脂および
油脂類０〜５重量部、溶剤30〜70重量部を基本成分と
し、その他の添加剤を適宜含有する。Such flux can be rosin or rosin derivative 30
.About.70 parts by weight, activators 1 to 3 parts by weight, thermoplastic resins and fats and oils 0 to 5 parts by weight, and solvents 30 to 70 parts by weight as basic components, and optionally other additives.
フラックスの粘度は、通常400〜15000cps、好ましく
は2000〜10000cpsである。The viscosity of the flux is usually 400 to 15000 cps, preferably 2000 to 10000 cps.
ロジンまたはロジン誘導体としては、従来からフラッ
クスに常用されているもの、例えばロジン、不均化ロジ
ン、水素添加ロジン、マレイン化ロジン、重合ロジン等
を使用すればよい。As the rosin or rosin derivative, those conventionally used for flux, such as rosin, disproportionated rosin, hydrogenated rosin, maleated rosin, and polymerized rosin, may be used.
活性剤としてはエチルアミンの塩酸塩等と適宜併用し
てもよい。As the activator, ethylamine hydrochloride or the like may be appropriately used in combination.
熱可塑性樹脂および油脂としては合成ワックス類、マ
レイン酸樹脂、ポリスチレン、変性アルキッド樹脂、エ
ステルガム、ポリブチラール、ポリアミド等が例示され
る。Examples of thermoplastic resins and fats and oils include synthetic waxes, maleic acid resins, polystyrene, modified alkyd resins, ester gums, polybutyral and polyamides.
フラックス用溶剤としては従来からクリームはんだに
常用されている各種の溶剤、例えばブチルカルビトール
等を適宜使用すればよいが、特に好適な溶剤は２−エチ
ルヘキサノールと酸化エチレンおよび酸化プロピレンの
いずれかまたは両者との付加物（特願昭61-293690号明
細書参照）である。As the flux solvent, various solvents that have been conventionally used for cream solders, such as butyl carbitol, may be appropriately used, and a particularly suitable solvent is 2-ethylhexanol, ethylene oxide, or propylene oxide, or It is an adduct with both (see Japanese Patent Application No. 61-293690).
上記の成分を含有するフラックスを常套の粉末はんだ
と充分に混練することによって本発明によるクリームは
んだが調製される。クリームはんだ中のフラックスの配
合量は通常約６〜20重量％、好ましくは10〜12重量％で
ある。A cream solder according to the present invention is prepared by thoroughly kneading a flux containing the above components with a conventional powder solder. The content of the flux in the cream solder is usually about 6 to 20% by weight, preferably 10 to 12% by weight.
以下、本発明を実施例によって説明する。 Hereinafter, the present invention will be described with reference to examples.
実施例１〜３ 表−１の配合処方により調製したフラックス12重量％
および粉末はんだ（Sn:63％、粒度325メッシュ）88重量
％を十分に混練してクリームはんだＡ〜Ｃを調製した。Examples 1 to 3 12% by weight of flux prepared by the formulation of Table-1
And 88% by weight of powdered solder (Sn: 63%, particle size 325 mesh) was sufficiently kneaded to prepare cream solders A to C.
得られたクリームはんだＡ〜Ｃについて以下の特性を
調べ、結果を表−２に示す。The following characteristics were examined for the obtained cream solders A to C, and the results are shown in Table-2.
（１） 溶融時の臭気： 「○」：不快臭無し、「△」：不快臭有り、「×」：悪
臭有り （２） 絶縁抵抗（JIS法）： 「○」：良、「△」：可、「×」：不良 （３） 腐食性： 「○」：非腐食、「×」腐食 （４） はんだ付性： 「○」：良好、「△」：良、「□」：可 （５） 洗浄性： 「○」：良好、「△」：良、「×」：不良 （６） はんだボールの形成： 「○」：無し、「△」：小ボール形成、「×」：大ボー
ル形成 比較例１〜９ 表−１の配合処方により調製したフラックスを用いて
実施例１と同様にしてクリームはんだａ〜ｉを調製し
た。(1) Odor during melting: "○": no unpleasant odor, "△": unpleasant odor, "x": bad odor (2) Insulation resistance (JIS method): "○": good, "△": Yes, "x": Poor (3) Corrosion: "○": Non-corrosion, "x" corrosion (4) Solderability: "○": Good, "△": Good, "□": Yes (5 ) Washability: "○": Good, "△": Good, "x": Poor (6) Solder ball formation: "○": None, "△": Small ball formation, "x": Large ball formation Comparative Examples 1 to 9 Cream solders a to i were prepared in the same manner as in Example 1 using the flux prepared according to the formulation of Table-1.
得られたクリームはんだａ〜ｉについて実施例１と同
様にして、溶融時の臭気等を調べ、結果を表−２に示
す。For the obtained cream solders a to i, the odor and the like at the time of melting were examined in the same manner as in Example 1, and the results are shown in Table 2.
表−１および表−２の結果から明らかなように、フェ
ニル酢酸はｐ−ヒドロキシフェニル酢酸に比較してフラ
ックス作用はやや劣るものの、効果は認められたが、特
有の不快臭があるだけでなく、覚醒剤原料としての取扱
い規制を受けるという難点があり、桂皮酸は特有の不快
臭があり、洗浄性とはんだ付性が劣り、また親水性の高
いフェノキシ酢酸は酢酸様の不快臭があるだけでなく絶
縁性、腐食性、はんだ付性および洗浄性が劣るという欠
点がある。As is clear from the results of Table-1 and Table-2, phenylacetic acid has a flux effect slightly inferior to p-hydroxyphenylacetic acid, but the effect was recognized, but not only it has a peculiar unpleasant odor. However, cinnamic acid has a peculiar unpleasant odor, cleaning ability and solderability are poor, and highly hydrophilic phenoxyacetic acid has an unpleasant odor like acetic acid. Insulation, corrosiveness, solderability and detergency are poor.
発明の効果 本発明による新規なクリームはんだは、粘度の経時変
化がない、はんだボールや残渣の発生が少ない、はんだ
付性がよい、悪臭や毒性が少ない、洗浄性がよい、絶縁
性がよい、腐食性がない、皮はりや乾燥がなく作業性が
よい（特に、印刷から溶融までの放置時間が長くても有
効なフラックス作用が保持される）等、クリームはんだ
に要求される諸特性を兼有するので、特に、生産性の低
下をもたらすことなく適用対象となる製品の小型化や高
密度化に即応することができる。 Advantageous Effects of Invention The novel cream solder according to the present invention has no change in viscosity with time, less generation of solder balls and residues, good solderability, less bad odor or toxicity, good cleaning property, good insulation property, It has various characteristics required for cream solder, such as no corrosiveness, good workability with no peeling or drying (especially, effective flux action is maintained even after leaving for a long time from printing to melting). Therefore, it is possible to immediately respond to the miniaturization and high density of the product to be applied, without lowering the productivity.
Claims (2)
その誘導体のいずれかまたは両者をともに含有するクリ
ームはんだ。1. A cream solder containing either or both of p-hydroxyphenylcarboxylic acid and its derivative.
ヒドロキシフェニル酢酸である第１項記載のクリームは
んだ。2. A p-hydroxyphenylcarboxylic acid is p-
The cream solder according to claim 1, which is hydroxyphenylacetic acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62036200A JP2520122B2 (en) | 1987-02-17 | 1987-02-17 | Cream solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62036200A JP2520122B2 (en) | 1987-02-17 | 1987-02-17 | Cream solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63203293A JPS63203293A (en) | 1988-08-23 |
| JP2520122B2 true JP2520122B2 (en) | 1996-07-31 |
Family
ID=12463092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62036200A Expired - Lifetime JP2520122B2 (en) | 1987-02-17 | 1987-02-17 | Cream solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2520122B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2782259B2 (en) | 1990-01-18 | 1998-07-30 | 千住金属工業株式会社 | Cream solder |
-
1987
- 1987-02-17 JP JP62036200A patent/JP2520122B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2782259B2 (en) | 1990-01-18 | 1998-07-30 | 千住金属工業株式会社 | Cream solder |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63203293A (en) | 1988-08-23 |
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